EP3606699A1 - Poliermaschine und verfahren zum polieren von lichtwellenleitern - Google Patents
Poliermaschine und verfahren zum polieren von lichtwellenleiternInfo
- Publication number
- EP3606699A1 EP3606699A1 EP17718841.4A EP17718841A EP3606699A1 EP 3606699 A1 EP3606699 A1 EP 3606699A1 EP 17718841 A EP17718841 A EP 17718841A EP 3606699 A1 EP3606699 A1 EP 3606699A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing
- plate
- rinsing liquid
- polishing table
- polishing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B19/226—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground of the ends of optical fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
- B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
Definitions
- the invention relates to a polishing machine and a method for polishing optical fibers, comprising a polishing plate with a connector receptacle for holding a plug with a Lichtwellenlei- ter, a polishing table for receiving a polishing agent, a positioning device for Relativpo sitioning of the polishing plate and the polishing table between a polishing position and a Einrichtposition, and a driving device for performing a relative polishing movement between the polishing tables and the polishing receptacle in the polishing position, wherein the positioning device comprises a holding device for releasably holding the polishing plate.
- Such polishing machines and methods are well known and are regularly used for polishing optical waveguides or one end of an optical fiber of an optical waveguide.
- the end of the optical fiber is received in a connector or plug for releasable connection of optical fibers or fiber optic cables.
- These connectors are used to form a male-to-male connection or a male-female connection of optical fibers.
- the plugs should have the lowest possible signal attenuation and a high return loss, which is why the Ends of the respective optical fibers, optionally together with the j e election connector ends, are polished.
- the known polishing machines always have a polishing plate forming a polishing holder with fixing devices for the detachable fastening of plugs.
- An attached to an optical fiber connector can be releasably secured by means of the fixing device to the polishing plate in a defined position, wherein during polishing, the polishing plate is arranged and moved relative to an abrasive layer of the polishing device.
- the abrasive layer may be a polishing agent disposed on a polishing table of the polishing machine.
- the polishing agent may be a paper or plastic web or a sheet having abrasive particles thereon.
- the end of the optical fiber in the plug then contacts an abrasive layer on the polishing table and is polished by the relative movement of the polishing plate, regularly with the addition of a rinsing fluid.
- the rinsing liquid is used inter alia for cooling the optical waveguide or plug and prevents rapid wear of the polishing agent or the abrasive layer by residues of abrasion of the plug and the optical waveguide, ensures removal of detached from the abrasive layer abrasive particles and verbes sert so a quality polished surface of an optical waveguide.
- this can hold a plurality of plugs on a polishing plate in order to polish them at the same time and thus be able to carry out a polishing process economically.
- the polishing plate can therefore also a plurality of connector receptacles with through holes for receiving an optical fiber or.
- a plug may be formed with an optical fiber of an optical waveguide.
- a polishing machine is first set up in such a way that a number of plugs are manually fastened to a polishing plate by means of in each case optical waveguides, wherein a polishing pad is attached to a polishing pad
- Polishing a abrasive polishing or a polishing film or web with abrasive particles, optionally with a polishing plate
- the polishing process may be carried out in such a way that the polishing machine transfers the polishing plate from the set-up position to a polishing position via a positioning device in which the fiber ends or the polishing table are moved relative to the polishing plate by means of a drive device in that a polishing movement of the fiber ends on the polishing table is carried out with the polishing film.
- the polishing table is transferred to the setting position, and the polishing agent or the polishing film with abrasive particles on the polishing table is manually replaced.
- the polishing plate and the polishing table is regularly wiped by the operator with a cloth, in particular to prevent larger abrasive particles remain at the plug ends, and thus a clean and level bearing surface is available on the polishing table.
- a polishing plate is again placed manually with a polishing agent with finer abrasive grains on the polishing table and again triggered a polishing process after an addition of rinsing liquid. This polishing process is repeated several times, whereby always a polishing agent with comparatively finer abrasive grains, relative to a previous polishing process, is used.
- a hardness of the polishing plate can be varied. Between the respective polishing operations therefore always takes place in the Einrichtpo position Change of the polishing agent, a wiping of the polishing plate and the polishing table and an addition of Spülflüs fluidity.
- the present invention is therefore based on the object of proposing a polishing machine and a method for polishing optical waveguides, which allows polishing of optical waveguides with low cost and high quality.
- the polishing machine for polishing optical fibers comprises a polishing plate with a connector receptacle for holding a connector with an optical fiber, a polishing table for receiving a polishing agent, a positioning device for relative positioning of the polishing plate and the polishing table between a polishing position and a Einrichtposition, and a drive device for execution a relative polishing movement between the polishing table and the polishing receptacle in the polishing position, wherein the positioning device comprises a holding device for releasably holding the polishing plate, wherein the polishing machine has a metering device for applying a Spülflüs fluid on the polishing table, wherein in the polishing plate, a through hole is formed through through which the rinsing liquid can be metered by means of the metering device on the polishing table.
- the polishing table is designed to receive an abrasive polishing agent, for example a paper sheet or a plastic film with abrasive particles adhering thereto.
- an abrasive polishing agent for example a paper sheet or a plastic film with abrasive particles adhering thereto.
- the rinsing liquid can now be applied to the polishing table with the polishing agent applied thereon, wherein the polishing agent can also be arranged together with a polishing plate on the polishing table.
- the flushing fluid it is also possible for the flushing fluid to be applied directly to the polishing table if no polishing agent is arranged on it.
- a passage opening is formed in the polishing plate, through which the Spülflüs fluid from the Do siervorraum devise can be metered or applied to the polishing table.
- the passage opening is explicitly not designed as a passage opening for receiving a plug or as a passage opening of a connector receptacle, but as a through opening differing therefrom. This makes it possible not only in the Einrichtpo position to apply the rinsing liquid on the polishing table and thus also the polishing agent, but also in the polishing position, even if a polishing movement between the polishing table and the polishing recording is performed.
- the actual polishing process can be used to apply the flushing liquid by means of the metering device, so that this process can be dispensed with during the setting up of the polishing machine.
- the rinsing liquid can be applied through the through hole on the polishing table or on the polishing table arranged on the polishing agent, an amount of Spülflüs fluid can be dispensed dosed during the entire polishing process of the metering device. As a result, it can be ensured that a sufficient amount of rinsing liquid is always present on the polishing agent or polishing table during the polishing process.
- the metering device may have a liquid reservoir, a dosing pump, a supply line, a metering valve and a control device for a Spülflüs fluidity.
- the liq stechniksreservoir can serve to store Spülflüs fluid.
- the supply line can be ruled out to the metering pump, so that via the supply line Spülflüs fluid can be directed to the metering valve or directly to the polishing table.
- a discharge amount of Spülflüs fluid can be regulated.
- the control device can serve to control and regulate the modules described above.
- the control device can also be formed by a control device which is present anyway for controlling the polishing machine.
- the liquid reservoir, the metering pump, the supply line and the metering valve can form a modular metering unit, which is removably arranged outside or inside a housing of the polishing machine.
- the positioning device may comprise a holding device, wherein the holding device may have a receptacle for releasably holding the polishing plate, wherein the recording with a magnet for kraftschlüs sigen and / or sigen with a clutch for formschlüs
- the positioning device may comprise an arm or a boom, at the end of the holding device is formed.
- the arm or the cantilever may be such that a pressing force of the polishing plate on the polishing table is determined. This can, for example, via a bending beam with strain gauges strip in the boom, so that a Dead weight of the polishing plate can be measured.
- a force can then be detected with which the positioning presses the polishing plate on the polishing table. From this, a polishing force can be calculated and regulated as needed.
- the holding device it is possible to disassemble and replace the polishing plate as needed on the positioning device or the arm or boom.
- the recording can be formed for example by magnets that hold the polishing plate kraftschlüs sig.
- the magnet may be a permanent magnet or an electromagnet.
- the polishing plate itself can have a magnet or consist of a ferromagnetic material.
- the recording may be a clutch for formschlüs sigen holder of the polishing plate.
- the polishing plate can be inserted with an axis disposed thereon in the recording. The axle can then lock in the receptacle or coupling or optionally also clamped or clamped, so that the clutch can hold the axis kraftschlüs sig.
- a feed line can also be guided to or through the receptacle to the polishing plate.
- the receptacle may allow an inclination of the polishing plate at an angle of up to 2 ° relative to the polishing table, wherein the positioning device comprises a force measuring device for determining a pressing force of the polishing plate on the polishing table.
- the polishing plate can therefore be mounted pendulum on the recording by the angle. Thus, it can be ensured that the polishing plate always aligns with the polishing table and results in a uniform distribution of a polishing force on the polishing plate.
- the force measuring device can strip within the holding device, for example, by a bending beam with Dehstedsmes, be formed.
- the polishing plate can sen a connection extension, which is detachably connectable to the receptacle.
- the connection extension can in the Art be formed of an axle which is fixed to the polishing plate. The axle can then simply be plugged into the receptacle.
- a channel for the passage of a rinsing liquid can be formed to the through hole of the polishing plate.
- the channel can also connect to the connection extension and be guided therethrough to the passage opening of the polishing plate.
- the channel can also terminate at the receptacle without being directly connected to the polishing plate.
- the polishing plate can then be positioned in the receptacle so that the channel always always ends above the passage opening of the polishing plate.
- an atomizer valve of the metering device can be arranged.
- a nebulizer Spülflüs fluid can be sprayed over a larger surface area of the polishing table.
- the polishing agent completely with the
- the polishing plate can also be formed a plurality of through holes through which the rinsing liquid can be metered by means of the metering device on the polishing table. This is particularly advantageous when a dosage of Spülflüs fluid in the Polierpo position should be done, since then a uniform distribution of Spülflüs fluidity on the polishing table or the polishing agent is possible.
- the polishing machine can additionally a cleaning device for
- the cleaning device applies the dry ice to the respective surfaces, wherein the dry ice on the surface in question sublimated due to the much higher temperature of the surface, and due to a volume expansion in the transition to the gaseous phase any impurities are removed and eliminated.
- the dry ice can consist of solid particles of carbon dioxide (C0 2 ).
- the solid particles may be crystals.
- the dry ice can also be so-called C0 2 snow.
- the dry ice can then be applied by means of a compressed air jet at a temperature of -78, 9 ° C on the surfaces to be cleaned.
- a layer formed from impurities on the relevant surface is then locally cooled and embrittled.
- the solid particles of the carbon dioxide penetrate into the layer and sublimate, so that a volume of the carbon dioxide increased as a result of the transition into the gaseous phase breaks up the layer and explosively ablö from the surface in question.
- the carbon dioxide volatilizes in gaseous form in an ambient air. Damage to surfaces does not occur because the dry ice is comparatively soft.
- the cleaning device may include a teat for dry ice, wherein dioxide by means of the application nozzle from FLÜS Sigem coal and air pressure, a directed core jet of solid C0 2 ⁇ particles and a core beam coaxially surrounding sheath beam can be formed from the compressed air.
- the application nozzle may be a nozzle, which is fed centrally with liquid carbon dioxide, which is then discharged via a central nozzle opening to an environment.
- an annular gap may be formed for discharging compressed air, the s of the thus formed coat jet entrains the FLÜS SiGe carbon dioxide, which will freeze at its expansion by means of the nozzle and converted into C0 2 "particles or crystals.
- the sheath beam may then focusing the core jet on a surface, ie collimating and directing it towards the surface, significantly improves the cleaning action of the core steel or dry ice, and the compressed air of the sheath jet can be used to discharge dissolved impurities into an environment Mantelstrahl can alternatively be formed with nitrogen (N 2 ).
- a further passage opening may be formed, through which the dry ice can be metered by means of the cleaning device to the polishing table.
- the polishing plate and / or the polishing table may be at least partially coated with an amorphous carbon layer.
- the amorphous carbon layer may be applied by a DLC coating method, wherein a surface of the polishing plate and / or the polishing table may be completely coated with the amorphous carbon layer.
- Such a coating has a smooth surface with a high abrasion resistance.
- such a coating may have a hardness of about 2,500 to 3,000 HV. representation
- the coating has a black color, so that s possible damage or wear of the coating can be easily detected. A service life of the polishing plate and / or the polishing table can be significantly extended.
- the polishing machine may comprise a changing device, wherein the changing device may include a plurality of polishing plates, each with a polishing agent, wherein the polishing agent may be different from each other, wherein the polishing plate stored with the polishing agents in a magazine device of the changing device and by means of a handling device of the changing device respectively can be arranged on the polishing table or be removable from this.
- the polishing plates may also be formed differently from each other, if the polishing plates are made of rubber and have different hardnesses.
- the polishing agents may differ in abrasive particle size or grain size and be positioned on the respective polishing plates.
- the magazine device can store a large number of polishing plates, each with polishing agents.
- the magazine device may be formed as a circulating B and or a chain in the manner of a paternoster, in which the polishing plates are stored or held with the polishing agents.
- the handling device may be a robot arm, a treadmill or other suitable means by which a change of a polishing plate located on the polishing table with a polishing agent against a polishing plate with a polishing agent in the Magazine device can be done.
- a rinsing liquid water, preferably distilled water, or a mixture of water and alcohol may be used.
- water preferably distilled water, or a mixture of water and alcohol
- the Spülflüs fluid can be dosed continuously or at intervals on the polishing table during execution of a polishing movement.
- a sequential dosage of Spülflüs fluid can be provided on the polishing table.
- rinsing liquid present on the polishing agent is not excessively contaminated or contaminated. Dirt is enriched by the polishing process.
- the flushing fluid flows from one center to one edge of the polishing table.
- a rinsing fluid flow can be formed from the center to the edge.
- a control device of the polishing machine By means of a control device of the polishing machine, a relative positioning of the polishing plate and the polishing table, a change of polishing plates, the execution of the polishing movement and / or a dosing of the Spülflüs fluid can be controlled.
- the control device can in principle also serve to control other functions of the polishing machines. By using the control device, it becomes possible to perform a polishing process or a sequence of polishing operations completely automatically.
- a dosage of Spülflüs fluid may be provided to dose Spülflüs fluid to obtain high quality polished surfaces.
- the polishing machine has a cleaning device
- application of dry ice can take place before and / or after execution of a polishing movement, preferably in the set-up position. This makes it possible, after performing a polishing operation, the polishing agent or. to clean the polishing table as well as the polishing plate, for example, in preparation for a subsequent polishing operation.
- the control device can then also serve to control a cleaning function of the polishing machines.
- the figure shows a polishing machine 10 for polishing optical waveguides with a housing 1 1 and a control device 12 for controlling a function of the polishing machine 10.
- the polishing machine has in particular a polishing plate 13 with a plurality of Steckeraufnah- 14 on.
- the polishing plate 13 is opposite a polishing table
- a polishing pad not shown here, can be placed with a polishing agent.
- a positioning device 17 of the polishing machine 10 has a linearly movable column 18 with an arm 19 and a holding device 20 for holding the polishing table 15.
- the holding device 20 forms a Receiving 21 for releasably holding the polishing plate 13 from.
- an axis 22 is formed, which is inserted into the receptacle 21.
- the polishing machine 10 has a dosing device, not shown here, can be dosed with the rinse liquid on the polishing table 15 with the then placed thereon polishing agent.
- a supply of Spülflüs fluid takes place through a through hole also not shown here in the polishing table 15, so that an application of Spülflüs fluid can also be done during a polishing process.
- the polishing machine 10 can continue via a not shown here
- Cleaning device for applying dry ice on the polishing table 15 and / or the polishing plate 13 have.
- the cleaning device it is possible in the set-up position 16 shown here possibly on the polishing plate 13 and the polishing table 15 adhering residues to eliminate residue.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/057884 WO2018184657A1 (de) | 2017-04-03 | 2017-04-03 | Poliermaschine und verfahren zum polieren von lichtwellenleitern |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3606699A1 true EP3606699A1 (de) | 2020-02-12 |
Family
ID=58609356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17718841.4A Withdrawn EP3606699A1 (de) | 2017-04-03 | 2017-04-03 | Poliermaschine und verfahren zum polieren von lichtwellenleitern |
Country Status (3)
Country | Link |
---|---|
US (1) | US20210122003A1 (de) |
EP (1) | EP3606699A1 (de) |
WO (1) | WO2018184657A1 (de) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6102785A (en) * | 1998-02-27 | 2000-08-15 | Ciena Corporation | Polishing apparatus for optical fibers having a pressure transducer and a magnetically attached leveling device |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
JP2000354948A (ja) * | 1999-06-14 | 2000-12-26 | Matsushita Electronics Industry Corp | 基板研磨方法および基板研磨装置 |
AU2003259535A1 (en) * | 2002-12-20 | 2004-07-14 | Sagitta Engineering Solutions Ltd. | A system and a method for polishing optical connectors |
JP6065802B2 (ja) * | 2013-10-03 | 2017-01-25 | 信越半導体株式会社 | 研磨布の洗浄方法及びウェーハの研磨方法 |
-
2017
- 2017-04-03 EP EP17718841.4A patent/EP3606699A1/de not_active Withdrawn
- 2017-04-03 WO PCT/EP2017/057884 patent/WO2018184657A1/de unknown
- 2017-04-03 US US16/499,343 patent/US20210122003A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20210122003A1 (en) | 2021-04-29 |
WO2018184657A1 (de) | 2018-10-11 |
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