EP3560111A4 - Drahtloskommunikationstechnologie, vorrichtungen und verfahren - Google Patents
Drahtloskommunikationstechnologie, vorrichtungen und verfahren Download PDFInfo
- Publication number
- EP3560111A4 EP3560111A4 EP17884259.7A EP17884259A EP3560111A4 EP 3560111 A4 EP3560111 A4 EP 3560111A4 EP 17884259 A EP17884259 A EP 17884259A EP 3560111 A4 EP3560111 A4 EP 3560111A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- apparatuses
- methods
- wireless communication
- communication technology
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 title 1
- 238000005516 engineering process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/10—Polarisation diversity; Directional diversity
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
- H01L23/4855—Overhang structure
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- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
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- H01L2924/3025—Electromagnetic shielding
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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- 2017-12-20 CN CN201780079484.5A patent/CN110447146A/zh active Pending
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US20200091608A1 (en) | 2020-03-19 |
US11424539B2 (en) | 2022-08-23 |
TWI782936B (zh) | 2022-11-11 |
JP7441269B2 (ja) | 2024-02-29 |
JP2024059722A (ja) | 2024-05-01 |
TW201838352A (zh) | 2018-10-16 |
CN118117305A (zh) | 2024-05-31 |
US20240243477A1 (en) | 2024-07-18 |
TW202345532A (zh) | 2023-11-16 |
KR20190089955A (ko) | 2019-07-31 |
JP2020507230A (ja) | 2020-03-05 |
EP3560111A2 (de) | 2019-10-30 |
JP7089519B2 (ja) | 2022-06-22 |
US11955732B2 (en) | 2024-04-09 |
DE112017006442T5 (de) | 2019-09-19 |
JP2022130459A (ja) | 2022-09-06 |
CN110447146A (zh) | 2019-11-12 |
KR102635791B1 (ko) | 2024-02-08 |
WO2018119153A2 (en) | 2018-06-28 |
US20220384956A1 (en) | 2022-12-01 |
WO2018119153A3 (en) | 2019-03-14 |
US20230145401A1 (en) | 2023-05-11 |
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Inventor name: THAKUR, JAYPRAKASH Inventor name: CHOUDHURY, DEBABANI Inventor name: NAREVSKY, NATHAN G. Inventor name: SHOR, GADI Inventor name: KAO, TE YU Inventor name: ALPMAN, ERKAN Inventor name: GOLDBERGER, EYAL Inventor name: AZADET, KAMERAN Inventor name: LEVINGER, RUN Inventor name: KANG, SHINWON Inventor name: COHEN, EMANUEL Inventor name: THAKKAR, CHINTAN S. Inventor name: HAGN, JOSEF Inventor name: MONTOYA MORENO, RESTI Inventor name: LAHTI, SAKU Inventor name: YEPES, ANA M. Inventor name: SOVER, RA'ANAN Inventor name: LANDSBERG, NAFTALI Inventor name: DEGANI, OFIR Inventor name: TEPLIPTSKY, MOSHE Inventor name: DATTA, KUNAL Inventor name: SHAKEDD, LIOR Inventor name: VERHELST, MARIAN Inventor name: GENOSSAR, MICHAEL Inventor name: CHAKRABARTI, ANANDAROOP Inventor name: GORDON, ESHEL Inventor name: BRENNA, STEFANO Inventor name: DALMIA, SIDHARTH Inventor name: SASOGLU, EREN Inventor name: CHANCE, GREGORY Inventor name: TANZI, NEBIL Inventor name: FREIMAN, AMIT Inventor name: GORDON, MEIR Inventor name: ORHAN, ONER Inventor name: RAVID, SHMUEL Inventor name: DANESHGAR ASL, SAEID Inventor name: PONGRATZ, RON Inventor name: CASPER, BRYAN K. Inventor name: PALASKAS, GEORGIOS Inventor name: SOFFER, MENASHE Inventor name: YAMADA, SHUHEI Inventor name: OSAF, OMER Inventor name: AMADJIKPE, ARNAUD LUCRES Inventor name: PELLERANO, STEFANO Inventor name: MUSAH, TAWFIQ Inventor name: KOMULAINEN, MIKKO S. Inventor name: DAVIS, BRANDON Inventor name: DA SILVA, CLAUDIO Inventor name: TALWAR, SHILPA Inventor name: BARYAKH, MIROSLAV Inventor name: BANIN, ROTEM Inventor name: KUSHNIR, IGAL YEHUDA Inventor name: DASGUPTA, KAUSHIK Inventor name: LAMPINEN, MIKKO M. Inventor name: SINGH, BALJIT Inventor name: KOGAN, NOAM Inventor name: TSFATI, YOSSI Inventor name: WEISMAN, NIR Inventor name: BAZOV, ANAT Inventor name: NIKOPOUR, HOSEIN Inventor name: RAVI, ASHOKE Inventor name: TSARFATI, AVI Inventor name: KITCHIN, DUNCAN Inventor name: MOLINA, ALBERT Inventor name: LEE, WOOK BONG Inventor name: GERSON, ERAN Inventor name: SAGAZIO, PETER ANDREW |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: KITCHIN, DUNCAN Inventor name: HAGN, JOSEF Inventor name: DATTA, KUNAL Inventor name: KOGAN, NOAM Inventor name: SASOGLU, EREN Inventor name: KAO, TE YU Inventor name: GERSON, ERAN Inventor name: LANDSBERG, NAFTALI Inventor name: CASPER, BRYAN K. Inventor name: MUSAH, TAWFIQ Inventor name: SOVER, RA'ANAN Inventor name: VERHELST, MARIAN Inventor name: TSARFATI, AVI Inventor name: LAHTI, SAKU Inventor name: SINGH, BALJIT Inventor name: WEISMAN, NIR Inventor name: SAGAZIO, PETER ANDREW Inventor name: CHOUDHURY, DEBABANI Inventor name: NAREVSKY, NATHAN G. Inventor name: ORHAN, ONER Inventor name: DASGUPTA, KAUSHIK Inventor name: KOMULAINEN, MIKKO S. Inventor name: SHAKEDD, LIOR Inventor name: YEPES, ANA M. Inventor name: SOFFER, MENASHE Inventor name: DAVIS, BRANDON Inventor name: THAKKAR, CHINTAN S. Inventor name: MOLINA, ALBERT Inventor name: DA SILVA, CLAUDIO Inventor name: DEGANI, OFIR Inventor name: BAZOV, ANAT Inventor name: KUSHNIR, IGAL YEHUDA Inventor name: BRENNA, STEFANO Inventor name: PALASKAS, GEORGIOS Inventor name: YAMADA, SHUHEI Inventor name: AMADJIKPE, ARNAUD LUCRES Inventor name: AZADET, KAMERAN Inventor name: LEVINGER, RUN Inventor name: TEPLIPTSKY, MOSHE Inventor name: GENOSSAR, MICHAEL Inventor name: FREIMAN, AMIT Inventor name: DALMIA, SIDHARTH Inventor name: PONGRATZ, RON Inventor name: OSAF, OMER Inventor name: PELLERANO, STEFANO Inventor name: RAVI, ASHOKE Inventor name: ALPMAN, ERKAN Inventor name: NIKOPOUR, HOSEIN Inventor name: LAMPINEN, MIKKO M. Inventor name: GORDON, MEIR Inventor name: THAKUR, JAYPRAKASH Inventor name: BARYAKH, MIROSLAV Inventor name: TANZI, NEBIL Inventor name: CHAKRABARTI, ANANDAROOP Inventor name: KANG, SHINWON Inventor name: BANIN, ROTEM Inventor name: TSFATI, YOSSI Inventor name: GOLDBERGER, EYAL Inventor name: MONTOYA MORENO, RESTI Inventor name: COHEN, EMANUEL Inventor name: SHOR, GADI Inventor name: GORDON, ESHEL Inventor name: TALWAR, SHILPA Inventor name: CHANCE, GREGORY Inventor name: LEE, WOOK BONG Inventor name: RAVID, SHMUEL Inventor name: DANESHGAR ASL, SAEID |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H04B 15/04 20060101ALI20200724BHEP Ipc: H01Q 1/38 20060101ALI20200724BHEP Ipc: H01Q 25/00 20060101ALI20200724BHEP Ipc: H04B 1/00 20060101ALI20200724BHEP Ipc: H01Q 1/24 20060101ALI20200724BHEP Ipc: H04B 1/3827 20150101ALI20200724BHEP Ipc: H01Q 9/04 20060101ALI20200724BHEP Ipc: H04B 7/10 20170101AFI20200724BHEP Ipc: H04B 1/40 20150101ALI20200724BHEP Ipc: H01Q 1/22 20060101ALI20200724BHEP Ipc: H01Q 1/48 20060101ALI20200724BHEP Ipc: H01Q 1/52 20060101ALI20200724BHEP Ipc: H01Q 21/24 20060101ALI20200724BHEP Ipc: H04L 25/02 20060101ALI20200724BHEP |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: PALASKAS, GEORGIOS Inventor name: YAMADA, SHUHEI Inventor name: KITCHIN, DUNCAN Inventor name: SHAKEDD, LIOR Inventor name: YEPES, ANA M. Inventor name: SHOR, GADI Inventor name: CHAKRABARTI, ANANDAROOP Inventor name: TSFATI, YOSSI Inventor name: BRENNA, STEFANO Inventor name: ORHAN, ONER Inventor name: CHANCE, GREGORY Inventor name: FREIMAN, AMIT Inventor name: AMADJIKPE, ARNAUD LUCRES Inventor name: TALWAR, SHILPA Inventor name: MOLINA, ALBERT Inventor name: THAKKAR, CHINTAN S. Inventor name: HAGN, JOSEF Inventor name: LANDSBERG, NAFTALI Inventor name: CASPER, BRYAN K. Inventor name: PONGRATZ, RON Inventor name: ALPMAN, ERKAN Inventor name: KOMULAINEN, MIKKO S. Inventor name: SOFFER, MENASHE Inventor name: LEVINGER, RUN Inventor name: KUSHNIR, IGAL YEHUDA Inventor name: DA SILVA, CLAUDIO Inventor name: BARYAKH, MIROSLAV Inventor name: PELLERANO, STEFANO Inventor name: KOGAN, NOAM Inventor name: DALMIA, SIDHARTH Inventor name: CHOUDHURY, DEBABANI Inventor name: WEISMAN, NIR Inventor name: KAO, TE YU Inventor name: MUSAH, TAWFIQ Inventor name: DASGUPTA, KAUSHIK Inventor name: TANZI, NEBIL Inventor name: VERHELST, MARIAN Inventor name: DANESHGAR ASL, SAEID Inventor name: TEPLIPTSKY, MOSHE Inventor name: NIKOPOUR, HOSEIN Inventor name: RAVI, ASHOKE Inventor name: NAREVSKY, NATHAN G. Inventor name: SINGH, BALJIT Inventor name: GENOSSAR, MICHAEL Inventor name: LAMPINEN, MIKKO M. Inventor name: GERSON, ERAN Inventor name: TSARFATI, AVI Inventor name: LAHTI, SAKU Inventor name: LEE, WOOK BONG Inventor name: OSAF, OMER Inventor name: THAKUR, JAYPRAKASH Inventor name: GORDON, ESHEL Inventor name: AZADET, KAMERAN Inventor name: KANG, SHINWON Inventor name: SASOGLU, EREN Inventor name: SOVER, RA'ANAN Inventor name: MONTOYA MORENO, RESTI Inventor name: GOLDBERGER, EYAL Inventor name: DEGANI, OFIR Inventor name: DATTA, KUNAL Inventor name: BAZOV, ANAT Inventor name: BANIN, ROTEM Inventor name: SAGAZIO, PETER ANDREW Inventor name: RAVID, SHMUEL Inventor name: COHEN, EMANUEL Inventor name: DAVIS, BRANDON Inventor name: GORDON, MEIR |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20201102 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H04B 1/00 20060101ALI20201027BHEP Ipc: H01Q 1/22 20060101ALI20201027BHEP Ipc: H04B 1/40 20150101ALI20201027BHEP Ipc: H01Q 21/24 20060101ALI20201027BHEP Ipc: H04B 15/04 20060101ALI20201027BHEP Ipc: H04B 1/3827 20150101ALI20201027BHEP Ipc: H01Q 1/48 20060101ALI20201027BHEP Ipc: H01Q 1/38 20060101ALI20201027BHEP Ipc: H01Q 1/24 20060101ALI20201027BHEP Ipc: H01Q 1/52 20060101ALI20201027BHEP Ipc: H01Q 25/00 20060101ALI20201027BHEP Ipc: H04B 7/10 20170101AFI20201027BHEP Ipc: H01Q 9/04 20060101ALI20201027BHEP Ipc: H04L 25/02 20060101ALI20201027BHEP |
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17Q | First examination report despatched |
Effective date: 20221013 |