EP3499119A1 - Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung - Google Patents

Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung Download PDF

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Publication number
EP3499119A1
EP3499119A1 EP17207887.5A EP17207887A EP3499119A1 EP 3499119 A1 EP3499119 A1 EP 3499119A1 EP 17207887 A EP17207887 A EP 17207887A EP 3499119 A1 EP3499119 A1 EP 3499119A1
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EP
European Patent Office
Prior art keywords
heat
bis
heat dissipation
acid
dissipation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP17207887.5A
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German (de)
English (en)
French (fr)
Inventor
Erfindernennung liegt noch nicht vor Die
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Covestro Deutschland AG
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Covestro Deutschland AG
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Filing date
Publication date
Application filed by Covestro Deutschland AG filed Critical Covestro Deutschland AG
Priority to EP17207887.5A priority Critical patent/EP3499119A1/de
Priority to CN201880079738.8A priority patent/CN111465804B/zh
Priority to EP18814630.2A priority patent/EP3728944A1/de
Priority to PCT/EP2018/084473 priority patent/WO2019121197A1/de
Priority to US16/769,806 priority patent/US11085629B2/en
Priority to JP2020533244A priority patent/JP2021507466A/ja
Priority to KR1020207020458A priority patent/KR20200096634A/ko
Publication of EP3499119A1 publication Critical patent/EP3499119A1/de
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the subject of the present invention is a device for dissipating heat from a heat source.
  • This device comprises a heat pipe, a heat input element, and a heat decoupling element, also called a heat sink, the heat sink essentially consisting of a thermally conductive thermoplastic composition with a heat conductivity in plane of 1 to 50 W / (m * K), preferably 2 to 30 W / (m * K) is preferably 4 to 20 W / (m * K), and the quotient of outside diameter to wall thickness of the heat pipe from 10: 1 to 4: 1.
  • the subject matter of the present invention is also a luminaire which comprises the device according to the invention.
  • a heat pipe is a heat exchanger that allows a high heat flux density using the heat of vaporization of a working fluid, d. H.
  • a working fluid d. H.
  • heatpipes can be used only in a limited temperature range, for example in the range of 0 to 250 ° C for copper heatpipes with water as the working medium, but in this they have a thermal resistance, which is significantly smaller than that of metals.
  • the behavior of the heat pipes therefore comes very close to the isothermal state change. There is an almost constant temperature over the length of the heat pipe. For the same transmission capacity much lighter construction methods than conventional heat exchangers are possible under the same conditions of use.
  • Heatpipes contain a hermetically encapsulated volume in the form of a tube, each with a heat source facing the end and a heat sink facing the end.
  • the tube is filled with a working medium, for example water or ammonia, which fills the volume to a small extent in liquid, for the most part in the vapor state.
  • a working medium for example water or ammonia
  • the pressure in the vapor space is increased locally above the liquid level, which leads to a low pressure gradient within the heat pipe.
  • the resulting vapor therefore flows to a location of lower temperature, ie the end facing the heat sink, where it condenses.
  • the temperature increases due to the released heat of condensation.
  • the previously absorbed latent heat is released to the environment.
  • the now liquid working medium returns by capillary forces back to the point at which the heat is introduced.
  • heatpipes can be designed to be very thin, with these properties they are well suited for dissipating the heat of a heat source in space-constrained conditions.
  • US20040252502A1 an LED reflector, where the waste heat of the LEDs is dissipated by a heat pipe.
  • the reflector contains a thermally conductive plastic and serves at the same time as a heat input element, wherein the heat pipe is encapsulated with the thermally conductive plastic, so as to ensure improved heat transfer from the reflector to the heat pipe.
  • Use finds in the US20040252502A1 disclosed device for example, in vehicle headlights, vehicle rear lights, flashing lights or other lighting devices that have LEDs.
  • thermally conductive plastic as a component of a heat coupling element is not very effective, since due to the thermal conductivity of metals such as copper (240 to 401 W / (m * K), depending on the purity) or aluminum ( 75 to 236 W / (m * K), depending on the purity) significantly lower thermal conductivity in plane of thermally conductive plastics (1 to 50 W / (m * K)) an effective transfer of the heat emitted by the heat source to the heat pipe is not guaranteed can be. In this case, it is also unhelpful to increase the area of the heat-conducting plastic element containing a thermally conductive plastic.
  • the object of the present invention is therefore to provide a device which overcomes the disadvantages of the prior art.
  • object of the present invention is therefore to provide a device comprising a heat pipe for dissipating heat from a heat source available that dissipates heat from this heat source reliably and effectively.
  • the heat pipe should be suitable to be encapsulated with a plastic, without collapse, sansplatzen, or even to be damaged so far that an effective heat dissipation is hindered.
  • the ability of the heat pipe for heat dissipation after encapsulation should be at least 80%, preferably at least 90%, particularly preferably at least 95%, in particular at least 98% of the heat dissipation capability of the non-encapsulated heat pipe, ie the heat pipe before encapsulation.
  • the device should have a heat input element that ensures an effective transfer of the heat emitted by the heat source to the heat pipe.
  • the device should have a heat input element containing a thermally conductive plastic.
  • the device should also be capable of utilizing the heat derived from the heat source at another point in a beneficial manner.
  • a device having a heat pipe, a heat input element, and a heat coupling element, wherein the arrangementkkoppelement consists of at least 50 wt .-% of a thermally conductive thermoplastic composition, and wherein the heat pipe, in particular the heat decoupling element facing the end of the heat pipe , is overmolded with the thermally conductive thermoplastic composition of the heat extraction element, and wherein the quotient of outside diameter to wall thickness of the heat pipe from 10: 1 to 4: 1.
  • the heat decoupling element to at least 65 wt .-%, preferably at least 80 wt .-%, more preferably at least 95 wt .-% of a thermally conductive thermoplastic composition.
  • a functional element may be attached to the heat sink, for example a fastening element or a housing.
  • This functional element may also be a thermoplastic composition and be sprayed.
  • the thermoplastic composition of the functional element does not need a thermally conductive thermoplastic composition However, it can be in the sense of the present invention. Also, this functional element is not considered within the meaning of the present invention as part of the heat sink.
  • This thermally conductive thermoplastic composition preferably has a thermal conductivity in plane of from 1 to 50 W / (m * K), preferably 2 to 30 W / (m * K), preferably 4 to 20 W / (m * K).
  • thermal conductivity in plane it is meant according to ASTM E 1461-01 at 23 ° C certain thermal conductivity.
  • the quotient of the outside diameter to the wall thickness of the heat pipe is preferably from 10: 1 to 4: 1, more preferably from 8: 1 to 4: 1, particularly preferably from 7: 1 to 5: 1.
  • Preferred working medium of the heat pipe is water, possibly water with additives.
  • the heat pipe is prevented from collapsing, bursting or otherwise damaged during encapsulation with the thermally conductive thermoplastic composition of the heat decoupling element, and, on the other hand, the ability to dissipate heat effectively is not reduced.
  • the ability of the heat pipe for heat dissipation after encapsulation is at least 80%, preferably at least 90%, particularly preferably at least 95%, in particular at least 98% of the ability to heat dissipate the heat pipe before encapsulation.
  • the heat dissipation system is formed as part of a lamp, preferably a headlight, particularly preferably a vehicle headlight or vehicle tail light, hereinafter referred to collectively as vehicle headlights.
  • the heat decoupling element is preferably designed as part of the housing of a vehicle headlight, in particular of a vehicle front headlamp or vehicle tail light.
  • a vehicle headlight in particular of a vehicle front headlamp or vehicle tail light.
  • LEDs in these headlamps there is the problem that the windows of these headlights are hardly heated by the waste heat of the LEDs.
  • LEDs generate locally in operation a waste heat with high temperature, which must be effectively dissipated, as already described above, but the total amount of heat emitted by an LED heat energy compared to, for example, halogen lamps with the same light output for a much lower, on the other hand
  • the resulting heat almost exclusively on the back and not given off in the form of heat radiation in the direction of the lens.
  • the heat decoupling element may be formed as a heat sink, which is inside or outside, preferably inside, more preferably inside down, on the vehicle headlamp and this heated, in particular by convection, but also by heat conduction and heat radiation.
  • the heat sink is preferably designed as a body with a structured surface for enlarging the same.
  • it can be designed as a substantially flat body, for example as a disk, or as a body with planar projections, such as cooling ribs; other shapes that have an enlarged surface but are also possible according to the invention.
  • the heat sink can also be designed as a cuboid, cylinder, sphere, cone or any other shape that serves the purpose of the heat sink.
  • the vehicle headlamp disc is freed of fogging or frost after a short time in cold weather when the light is switched on.
  • LED light emitting diode, in the majority of LEDs
  • the quotient of the outside diameter to the wall thickness of the heat pipe is preferably from 8: 1 to 4: 1, particularly preferably from 7: 1 to 5: 1.
  • the heat pipe of the heat dissipation system is encapsulated with the thermally conductive thermoplastic composition of the heat extraction element.
  • the ability of the heat pipe to dissipate heat after encapsulation is preferably at least 80%, preferably at least 90%, particularly preferably at least 95%, in particular at least 98%, of the heat dissipation capability of the non-encapsulated heat pipe.
  • the thermally conductive thermoplastic composition is preferably a composition containing a polycarbonate.
  • the heat source is preferably a light source, preferably an LED.
  • the heat dissipation system is preferably a component of a luminaire, particularly preferably a headlamp, very particularly preferably a vehicle headlamp, in particular particularly preferably a vehicle headlight or rear vehicle headlamp.
  • the heat extraction element is designed as a heat sink, which is located on the inside of the vehicle headlamp and this heats.
  • This lamp is preferably a headlight, particularly preferably a vehicle headlight.
  • thermoplastic compositions of the invention have a minimum thermal conductivity (in plane) of preferably ⁇ 9 W / (m * K), a heat resistance of ⁇ 100 ° C and a melt volume flow rate at 330 ° C and 2.16 kg load of ⁇ 10 cm 3/10 min.
  • Particularly preferred thermoplastic compositions of the invention have a heat resistance of ⁇ 110 °.
  • thermoplastic compositions are also characterized by a length shrinkage of ⁇ 0.14% and an E-modulus of ⁇ 6500 N / mm 2 , whereby the thermoplastic compositions have sufficient resistance to externally applied elastic deformation without too rigid behavior to show.
  • component A polycarbonates are used.
  • polycarbonate according to the invention are meant both homopolycarbonates as well as copolycarbonates and polyestercarbonates.
  • thermoplastic polycarbonates including the thermoplastic aromatic polyester carbonates have average molecular weights M w (determined by measuring the relative viscosity at 25 ° C in CH 2 Cl 2 and a concentration of 0.5 g per 100 ml CH 2 Cl 2 ) of 20,000 g / mol to 32,000 g / mol, preferably from 23,000 g / mol to 31,000 g / mol, in particular from 24,000 g / mol to 31,000 g / mol.
  • a portion, up to 80 mole%, preferably from 20 mole% to 50 mole%, of the carbonate groups in the polycarbonates used in this invention may be replaced by aromatic dicarboxylic acid ester groups.
  • aromatic polyester carbonates Such polycarbonates, which contain both acid residues of carbonic acid and acid residues of aromatic dicarboxylic acids incorporated into the molecular chain, are referred to as aromatic polyester carbonates. They are subsumed in the context of the present invention under the generic term of the thermoplastic, aromatic polycarbonates.
  • the preparation of the polycarbonates is carried out in a known manner from diphenols, carbonic acid derivatives, optionally chain terminators and optionally branching agents, wherein for the production of polyester carbonates, a part of the carbonic acid derivatives is replaced by aromatic dicarboxylic acids or derivatives of dicarboxylic acids, depending on the extent to be replaced in the aromatic polycarbonates Carbonate structural units by aromatic dicarboxylic ester structural units.
  • dihydroxyaryl compounds examples include dihydroxybenzenes, dihydroxydiphenyls, bis (hydroxyphenyl) alkanes, bis (hydroxyphenyl) -cycloalkanes, bis (hydroxyphenyl) -aryls, bis (hydroxyphenyl) ethers, bis (hydroxyphenyl) - ketones, bis (hydroxyphenyl) sulfides, bis (hydroxyphenyl) sulfones, bis (hydroxyphenyl) sulfoxides, 1,1'-bis (hydroxyphenyl) diisopropylbenzenes and their nuclear alkylated and ring-halogenated compounds.
  • Diphenols suitable for the preparation of the polycarbonates to be used according to the invention are, for example, hydroquinone, resorcinol, dihydroxydiphenyl, bis (hydroxyphenyl) alkanes, bis (hydroxyphenyl) cycloalkanes, bis (hydroxyphenyl) sulfides, bis (hydroxyphenyl) ethers, bis - (hydroxyphenyl) ketones, bis (hydroxyphenyl) sulfones, bis (hydroxyphenyl) sulfoxides, ⁇ , ⁇ '-bis (hydroxyphenyl) diisopropylbenzenes and their alkylated, nuclear-alkylated and ring-halogenated compounds.
  • Preferred diphenols are 4,4'-dihydroxydiphenyl, 2,2-bis (4-hydroxyphenyl) -1-phenyl-propane, 1,1-bis (4-hydroxyphenyl) -phenylethane, 2,2-bis (4 -hydroxyphenyl) propane, 2,4-bis (4-hydroxyphenyl) -2-methylbutane, 1,3-bis [2- (4-hydroxyphenyl) -2-propyl] benzene (bisphenol M), 2,2- Bis (3-methyl-4-hydroxyphenyl) -propane, bis (3,5-dimethyl-4-hydroxyphenyl) -methane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) -propane, Bis- (3,5-dimethyl-4-hydroxyphenyl) sulfone, 2,4-bis (3,5-dimethyl-4-hydroxyphenyl) -2-methylbutane, 1,3-bis- [2- (3, 5-dimethyl-4-hydroxyphenyl) -2-prop
  • diphenols are 4,4'-dihydroxydiphenyl, 1,1-bis (4-hydroxyphenyl) -phenyl-ethane, 2,2-bis (4-hydroxyphenyl) -propane, 2,2-bis (3,5 -dimethyl-4-hydroxyphenyl) -propane, 1,1-bis (4-hydroxyphenyl) cyclohexane and 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane (bisphenol TMC).
  • the monofunctional chain terminators required to control the molecular weight such as phenols or alkylphenols, in particular phenol, p-tert. Butylphenol, iso-octylphenol, cumylphenol, their chlorocarbonic acid esters or acid chlorides of monocarboxylic acids or mixtures of these chain terminators are either added to the bisphenolate or the bisphenolates of the reaction or added at any time during the synthesis, as long as phosgene or Chlorkohlenquipreend phenomenon in the reaction mixture are present, or in the case of acid chlorides and chloroformate as a chain terminator, as long as enough phenolic end groups of the forming polymer are available.
  • the chain terminator (s) are added after phosgenation at one point or at a time when phosgene is no longer present but the catalyst has not yet been metered or are added in front of the catalyst, together with the catalyst or in parallel.
  • any branching or debranching compounds to be used are added to the synthesis, but usually before the chain terminators.
  • trisphenols, quarterphenols or acid chlorides of tri- or tetracarboxylic acids are used, or mixtures of polyphenols or acid chlorides.
  • branching compounds having three or more than three phenolic hydroxyl groups include, for example, phloroglucinol, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -hepten-2, 4,6-dimethyl-2, 4,6-tri- (4-hydroxyphenyl) -heptane, 1,3,5-tris- (4-hydroxyphenyl) -benzene, 1,1,1-tri- (4-hydroxyphenyl) -ethane, tris (4 -hydroxyphenyl) -phenylmethane, 2,2-bis [4,4-bis (4-hydroxyphenyl) -cyclohexyl] -propane, 2,4-bis (4-hydroxyphenyl-isopropyl) -phenol, tetra- (4 hydroxyphenyl) methane.
  • trifunctional compounds are 2,4-dihydroxybenzoic acid, trimesic acid, cyanuric chloride and 3,3-bis (3-methyl-4-hydroxyphenyl) -2-oxo-2,3-dihydroindole.
  • Preferred branching agents are 3,3-bis (3-methyl-4-hydroxyphenyl) -2-oxo-2,3-dihydroindole and 1,1,1-tri (4-hydroxyphenyl) -ethane.
  • the amount of optionally used branching agent is 0.05 mol% to 2 mol%, based in turn on moles of diphenols used in each case.
  • the branching agents may either be initially charged with the diphenols and the chain terminators in the aqueous alkaline phase or may be added dissolved in an organic solvent prior to phosgenation.
  • aromatic dicarboxylic acids are, for example, orthophthalic acid, terephthalic acid, isophthalic acid, tert-butylisophthalic acid, 3,3'-diphenyldicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4-Benzophenondicarbonklare, 3,4'-Benzophenondicarbonklare, 4.4 'Diphenyl ether dicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 2,2-bis- (4-carboxyphenyl) -propane, trimethyl-3-phenylindane-4,5'-dicarboxylic acid.
  • aromatic dicarboxylic acids terephthalic acid and / or isophthalic acid are particularly preferably used.
  • dicarboxylic acids are the dicarboxylic acid dihalides and the dicarboxylic acid dialkyl esters, in particular the dicarboxylic acid dichlorides and the dimethyl dicarboxylates.
  • Substitution of the carbonate groups by the aromatic dicarboxylic ester groups is essentially stoichiometric and also quantitative, so that the molar ratio of the reactants is also found in the finished polyester carbonate.
  • the incorporation of the aromatic dicarboxylic acid ester groups can be carried out both statistically and in blocks.
  • Preferred methods of preparation of the polycarbonates to be used according to the invention, including the polyestercarbonates, are the known interfacial process and the known melt transesterification process (cf. WO 2004/063249 A1 . WO 2001/05866 A1 . WO 2000/105867 . US 5,340,905 A . US 5,097,002 A . US Pat. No. 5,717,057 A ).
  • the first case serve as acid derivatives preferably phosgene and optionally dicarboxylic acid dichlorides, in the latter case preferably diphenyl carbonate and optionally dicarboxylic.
  • Catalysts, solvents, work-up, reaction conditions, etc., for the production of polycarbonate or production of polyester carbonate are adequately described and known in both cases.
  • the polycarbonates, polyester carbonates and polyesters can be worked up in a known manner and processed to form any shaped articles, for example by extrusion or injection molding.
  • the individual basal planes of the graphite are separated by a special treatment, resulting in an increase in volume of the graphite, preferably by a factor of 200 to 400 results.
  • the production of expanded graphites is among others in the writings US 1,137,373 A .
  • US 1,191,383 A such as US 3,404,061 A described.
  • Graphites are used in the form of fibers, rods, spheres, hollow spheres, platelets, in powder form, both in aggregated and in agglomerated form, preferably in platelet form, in the compositions.
  • the platelet-shaped structure is understood in the present invention to mean a particle which has a flat geometry.
  • the height of the particles is usually significantly lower compared to the width or length of the particles.
  • Such flat particles may in turn be agglomerated or aggregated into entities.
  • the height of the platelet-shaped primary particles is less than 500 nm, preferably less than 200 nm and particularly preferably less than 100 nm. Due to the small sizes of these primary particles, the shape of the particles may be bent, curved, wavy or otherwise deformed.
  • the length dimensions of the particles can be determined by standard methods, for example electron microscopy.
  • Graphite is in the inventive thermoplastic compositions in amounts of from 15.0 to 60.0 wt .-%, preferably 20.0 to 45.0 wt .-%, particularly preferably 20.0 to 35.0 wt .-%, all particularly preferably 30.0 to 35 wt .-% used to obtain a good thermal conductivity of the thermoplastic compositions while ensuring a high processing width.
  • a graphite having a relatively high specific surface determined as the BET surface area by means of nitrogen adsorption according to ASTM D3037.
  • the D (0.5) of the graphite determined by sieve analysis according to DIN 51938, is ⁇ 1.2 mm.
  • the graphites have a particle size distribution which is characterized by the D (0,9) of at least 1 mm, preferably of at least 1.2 mm, more preferably of at least 1.4 mm and even more preferably of at least 1.5 mm ,
  • the graphites have a particle size distribution characterized by the D (0.5) of at least 400 microns, preferably at least 600 microns, more preferably at least 750 microns and even more preferably at least 850 microns.
  • the graphites preferably have a particle size distribution which is characterized by the D (0,1) of at least 100 ⁇ m, preferably of at least 150 ⁇ m, more preferably of at least 200 ⁇ m and even more preferably of at least 250 ⁇ m.
  • the graphites used have a density, determined with xylene, in the range from 2.0 g / cm 3 to 2.4 g / cm 3 , preferably from 2.1 g / cm 3 to 2.3 g / cm 3, and more preferably from 2.2 g / cm 3 to 2.27 g / cm 3 .
  • the carbon content of the graphites used according to the invention is preferably ⁇ 90%, more preferably ⁇ 95% and even more preferably ⁇ 98%.
  • the residual moisture content of the graphites used according to the invention is preferably ⁇ 5%, more preferably ⁇ 3% and even more preferably ⁇ 2%.
  • the thermal conductivity of the graphites used according to the invention before processing is parallel to the basal planes between 250 and 400 W / (m * K) and perpendicular to the basal planes between 6 to 8 W (m * K).
  • the electrical resistance of the graphites used according to the invention before processing is parallel to the basal planes about 0.001 ⁇ * cm and is perpendicular to the basal planes less than 0.1 ⁇ * cm.
  • the bulk density of the graphites is usually between 50 g / l and 250 g / l, preferably between 65 g / l and 220 g / l and more preferably between 100 g / l and 200 g / l.
  • thermoplastic compositions which have a leachable chlorine ion content of less than 100 ppm.
  • thermoplastic compositions which have a content of nitrates and nitrites less than 50 ppm.
  • graphites which satisfy all these limits, i. for the sulfur, the chloride ion, the nitrate and the nitrite content.
  • Components C in the sense of the invention are selected from the group of mono- and phosphoric and phosphoric esters, wherein mixtures of a plurality of components, selected from one or more of these groups, can also be used as component C.
  • R 1 , R 2 , R 3 and R 4 independently of one another are branched or unbranched C 1 - to C 4 -alkyl, phenyl, naphthyl or phenyl substituted by C 1 - to C 4 -alkyl.
  • aromatic groups R 1 , R 2 , R 3 and / or R 4 these in turn may be substituted by halogen and / or alkyl groups, preferably chlorine, bromine and / or C 1 - to C 4 -alkyl, branched or unbranched ,
  • aryl radicals are cresyl, phenyl, xylenyl, propylphenyl or butylphenyl and the corresponding brominated and chlorinated derivatives thereof.
  • X in the formula (V) is preferably derived from diphenols.
  • n in the formula (V) is preferably equal to 1.
  • X in formula V is particularly preferred for or their chlorinated and / or brominated derivatives.
  • X (with the adjacent oxygen atoms) is derived from hydroquinone, bisphenol A or diphenylphenol.
  • X is derived from resorcinol.
  • X is particularly preferably derived from bisphenol A.
  • Phosphorus compounds of the formula (V) are, in particular, tributyl phosphate, triphenyl phosphate, tricresyl phosphate, diphenyl cresyl phosphate, diphenyl octyl phosphate, diphenyl 2-ethyl cresyl phosphate, tri (isopropylphenyl) phosphate, resorcinol bridged oligophosphate and bisphenol A bridged oligophosphate.
  • the use of oligomeric phosphoric acid esters of the formula (V) derived from bisphenol A is particularly preferred.
  • component C is bisphenol A-based oligophosphate according to formula (Va).
  • oligophosphates analogous to the formula (Va), in which q is between 1.0 and 1.2.
  • the phosphorus compounds according to component C are known (cf., for example EP 0 363 608 A1 . EP 0 640 655 A2 ) or can be prepared by known methods in an analogous manner (eg Ullmanns Enzyklopadie der ischen Chemie, Vol. 18, p. 301 ff., 1979 ; Houben-Weyl, Methods of Organic Chemistry, Vol. 12/1, p. 43 ; Beilstein Vol. 6, p. 177 ).
  • the mean q value is determined by determining the composition of the phosphorus compound mixture (molecular weight distribution) by means of high pressure liquid chromatography (HPLC) at 40 ° C. in a mixture of acetonitrile and water (50:50) and from this the mean values for q are calculated ,
  • compositions according to the invention contain 4.5 to 10% by weight, preferably 6.0 to 10.0% by weight, particularly preferably 6.0 to 9.0% by weight of component C.
  • compositions according to the invention contain from 5.0 to 7.0% by weight of component C.
  • the ethylene / alkyl (meth) acrylate copolymer may be a random, block or multiblock copolymer or mixtures of these structures.
  • branched and unbranched ethylene / alkyl (meth) acrylate copolymers particularly preferably linear ethylene / alkyl (meth) acrylate copolymers, are used.
  • the melt flow index (MFR) of the ethylene / alkyl (meth) acrylate copolymer is preferably in the range of 2.5-40.0 g / (10 min), more preferably in the range from 3.0-10.0 g / (10 min), most preferably in the range of 3.0-8.0 g / (10 min).
  • Elvaloy® 1820 AC DuPont
  • compositions according to the invention contain from 0.01 to 5% by weight, preferably from 2 to 4.5% by weight, very particularly preferably from 3 to 4% by weight of component D.
  • the polycarbonate compositions can also be added to the conventional thermoplastics customary additives such as flame retardants, fillers, heat stabilizers, antistatic agents, colorants and pigments, mold release agents, UV absorbers and IR absorber in the usual amounts.
  • customary additives such as flame retardants, fillers, heat stabilizers, antistatic agents, colorants and pigments, mold release agents, UV absorbers and IR absorber in the usual amounts.
  • compositions according to the invention contain no further flame retardants in addition to component C.
  • the compositions according to the invention are also free of fluorine-containing anti-dripping agents, such as PTFE (polytetrafluoroethylene).
  • the amount of further additives is preferably up to 5 wt .-%, particularly preferably 0.01 to 3 wt .-%, based on the total composition.
  • Suitable additives are described, for example, in “ Additives for Plastics Handbook, John Murphy, Elsevier, Oxford 1999”, in the “ Plastics Additives Handbook, Hans Zweifel, Hanser, Kunststoff 2001 ".
  • Suitable antioxidants or thermal stabilizers are, for example alkylated monophenols, alkylthiomethylphenols, hydroquinones and alkylated hydroquinones, tocopherols, hydroxylated thiodiphenyl ethers, alkylidenebisphenols, O, N and S benzyl compounds, hydroxybenzylated malonates, hydroxybenzyl aromatic compounds, triazine compounds, acylaminophenols, esters of ⁇ - (3,5-di-tert-butyl) butyl-4-hydroxyphenyl) propionic acid, esters of ⁇ - (5-tert-butyl-4-hydroxy-3-methylphenyl) propionic acid, esters of ⁇ - (3,5-dicyclohexyl-4-hydroxyphenyl) propionic acid, esters of 3, 5-di-tert-butyl-4-hydroxyphenylacetic acid, amides of ⁇ - (3,5-di-tert-butyl-4-hydroxy
  • organic phosphites such as triphenylphosphine, tritoluylphosphine or (2,4,6-tri-t-butylphenyl) - (2-butyl-2-ethyl-propane-1,3-diyl) -phosphite, phosphonates and phosphanes, usually those in which the organic radicals consist entirely or partially of optionally substituted aromatic radicals.
  • IRGANOX® 1076 octadecyl-3,5-di (tert-butyl) 4-hydroxyhydrocinnamate, CAS No. 2082-79-3
  • TPP triphenylphosphine
  • Suitable mold release agents are, for example, the esters or partial esters of monohydric to hexahydric alcohols, in particular of glycerol, pentaerythritol or Guerbet alcohols.
  • Monohydric alcohols include stearyl alcohol, palmityl alcohol and Guerbet alcohols.
  • a dihydric alcohol is, for example, glycol; a trihydric alcohol is, for example, glycerol; tetrahydric alcohols are, for example, pentaerythritol and mesoerythritol; pentahydric alcohols are, for example, arabitol, ribitol and xylitol; Hexahydric alcohols include mannitol, glucitol (sorbitol) and dulcitol.
  • the esters are preferably the monoesters, diesters, triesters, tetraesters, pentaesters and hexaesters or mixtures thereof, in particular random mixtures, of saturated, aliphatic C 10 - to C 36 -monocarboxylic acids and optionally hydroxymonocarboxylic acids, preferably with saturated, aliphatic C 14 - 32 -monocarboxylic acids and optionally hydroxymonocarboxylic acids.
  • the commercially available fatty acid esters in particular of pentaerythritol and of glycerol, may contain ⁇ 60% of different partial esters as a result of the preparation.
  • Saturated, aliphatic monocarboxylic acids having 10 to 36 carbon atoms are, for example, capric, lauric, myristic, palmitic, stearic, hydroxystearic, arachidic, behenic, lignoceric, cerotic and montan acids.
  • Suitable IR absorbers are, for example, in EP 1 559 743 A1 . EP 1 865 027 A1 . DE 10022037 A1 . DE 10006208 A1 as well as in the Italian patent applications RM2010A000225 . RM2010A000227 such as RM2010A000228 disclosed.
  • boride- and tungstate-based composites in particular cesium tungstate or zinc-doped cesium tungstate, and absorbers based on ITO and ATO and combinations thereof are preferred.
  • Suitable UV absorbers from the class of the benzotriazoles are, for example, Tinuvin® 171 (2- [2-hydroxy-3-dodecyl-5-methylbenzyl) phenyl] -2H-benzotriazole ( CAS-No. 125304-04-3 )), Tinuvin® 234 (2- [2-hydroxy-3,5-di (1,1-dimethylbenzyl) phenyl] -2H-benzotriazole ( CAS-No. 70321-86-7 )), Tinuvin® 328 (2-2 [hydroxy-3,5-di-tert-amyl-phenyl] -2H-benztriazole ( CAS-No. 25973-55-1 )).
  • Suitable UV absorbers from the oxalanilide class are, for example, Sanduvor® 3206 (N- (2-ethoxyphenyl) -ethanediamide ( CAS-No. 82493-14-9 )) of Clariant or N- (2-ethoxyphenyl) -N '- (4-dodecylphenyl) oxamide ( CAS-No. 79102-63-9 ).
  • Suitable UV absorbers from the class of hydroxybenzophenones are, for example, Chimasorb® 81 (2-benzoyl-5-octyloxyphenol ( CAS-No. 1843-05-6 )) from BASF SE, 2,4-dihydroxybenzophenone ( CAS-No. 131-56-6 ), 2-hydroxy-4- (n-octyloxy) benzophenone ( CAS-No. 1843-05-6 ), 2-hydroxy-4-dodecyloxybenzophenone ( CAS-No. 2985-59-3 ).
  • Suitable UV absorbers from the class of the triazines are, for example, 2- [2-hydroxy-4- [3- (2-ethylhexyl-1-oxy) -2-hydroxypropyloxy] phenyl] -4,6-bis (2,4-) dimethylphenyl) -1,3,5-triazine ( CAS-No. 137658-79-8 ) also known as Tinuvin® 405 (BASF SE) and 2,4-diphenyl-6- [2-hydroxy-4- (hexyloxy) phenyl] -1,3,5-triazine ( CAS-No. 147315-50-2 ), available as Tinuvin® 1577 (BASF SE).
  • 2- [2-hydroxy-4- [3- (2-ethylhexyl-1-oxy) -2-hydroxypropyloxy] phenyl] -4,6-bis (2,4-) dimethylphenyl) -1,3,5-triazine also known as Tinuvin® 405 (BASF SE)
  • the compound 2- [2-hydroxy-4- [(octyloxycarbonyl) ethylidenoxy] phenyl] -4,6-di (4-phenyl) phenyl-1,3,5-triazine has the CAS-No. 204848-45-3 and is available from BASF SE under the name Tinuvin® 479.
  • the compound 2- [2-hydroxy-4 - [(2-ethylhexyl) oxylphenyl] -4,6-di (4-phenyl) phenyl-1,3,3,5-triazine has the CAS-No. 204583-39-1 and is available from BASF SE under the names CGX-UVA006 and Tinuvin® 1600, respectively.
  • UV absorbers are generally used in an amount of 0.01 to 5 wt .-%, preferably 0.01 to 2 wt .-%, particularly preferably 0.01 to 0.05 wt .-%, based on the total composition ,
  • the polycarbonate composition may be added to organic and inorganic fillers in conventional amounts.
  • organic and inorganic materials are suitable for this purpose. These may e.g. have particulate, flaky or fibrous character.
  • Preferred inorganic fillers are finely divided (nanoscale) inorganic compounds of one or more metals of the 1st to 5th main group and 1st to 8th subgroup of the Periodic Table, preferably from the 2nd to 5th main group, more preferably on the 3rd to 5th Main group, or on the 4th to 8th subgroup, with the elements oxygen, sulfur, boron, phosphorus, carbon, nitrogen, hydrogen and / or silicon.
  • Examples of preferred compounds are oxides, hydroxides, hydrous / basic oxides, sulfates, sulfites, sulfides, carbonates, carbides, nitrates, nitrites, nitrides, borates, silicates, phosphates and hydrides.
  • colorants or pigments for example, organic or inorganic pigments or organic dyes or the like can be used.
  • Coloring agents or pigments for the purposes of the present invention are sulfur-containing pigments such as cadmium red or cadmium yellow, iron cyanide-based pigments such as Berlin Blue, oxide pigments such as titanium dioxide, zinc oxide, red iron oxide, black iron oxide, chromium oxide, titanium yellow, zinc-iron-based brown , Titanium-cobalt-based green, cobalt blue, copper-chromium-based black and copper-iron-based black, or chromium-based pigments such as chrome yellow, phthalocyanine-derived dyes such as copper phthalocyanine blue or copper phthalocyanine green, condensed polycyclic Dyes and pigments such as azo-based (eg nickel-azo yellow), sulfur indigo dyes, perinone-based, perylene-based, quinacridone-derived, dioxazine-based, isoindolinone-based and quinophthalone-derived derivatives, anthraquinone based, heterocyclic systems.
  • sulfur-containing pigments such
  • MACROLEX® Blue RR MACROLEX® Violet 3R
  • MACROLEX® Violet B Lixess AG, Germany
  • Sumiplast® Violet RR Sumiplast® Violet B
  • Sumiplast® Blue OR (Sumitomo Chemical Co., Ltd.)
  • Diaresin® Violet D Diaresin® Blue G, Diaresin® Blue N (Mitsubishi Chemical Corporation), Heliogen® Blue or Heliogen® Green (BASF AG, Germany).
  • cyanine derivatives quinoline derivatives, anthraquinone derivatives, phthalocyanine derivatives are preferred.
  • the melt flow index of component D is at least 2.5 g / 10 min, determined according to ASTM D1238 (at 190 ° C and 2.16 kg).
  • the preparation of the polymer compositions according to the invention containing the abovementioned components is carried out by customary incorporation methods by combining, mixing and homogenizing the individual constituents, wherein in particular the homogenization preferably takes place in the melt under the action of shearing forces.
  • the merging and mixing takes place before the melt homogenization using powder premixes.
  • premixes which have been prepared from solutions of the mixture components in suitable solvents, if appropriate homogenizing in solution and subsequently removing the solvent.
  • compositions according to the invention can be introduced by known methods or as a masterbatch.
  • masterbatches are particularly preferred for introducing the additives, in particular masterbatches based on the respective polymer matrix being used.
  • the composition can be combined, mixed, homogenized and then extruded in conventional equipment such as screw extruders (for example twin-screw extruder, ZSK), kneaders, Brabender or Banbury mills. After extrusion, the extrudate can be cooled and comminuted. It is also possible to premix individual components and then to add the remaining starting materials individually and / or likewise mixed.
  • thermally conductive thermoplastic compositions also useful in the present invention are disclosed, for example, in U.S. Pat WO2012 / 174574A2 , the WO2017 / 005735A1 , the WO2017 / 005738A1 and the WO2017005736A1 , where in the WO2017 / 005735A1 disclosed thermally conductive thermoplastic compositions of the invention are particularly suitable.
  • those in the WO2017 / 005735A1 disclosed diglycerol esters as flow improvers in connection with the thermally conductive thermoplastic compositions of the invention particularly suitable.
  • the diglycerol esters used as flow improvers are esters of carboxylic acids with diglycerol. In this case, esters based on various carboxylic acids are suitable. Also, different isomers of diglycerol can form base for the esters. In addition to monoesters and multiple esters of diglycerol can be used. Instead of pure compounds and mixtures can be used.
  • Isomers of diglycerol which form the basis for the diglycerol esters used according to the invention, are the following:
  • diglycerol esters used according to the invention it is possible to use those isomers of these formulas which have been singly or multiply esterified.
  • Mixtures which can be used as flow aids consist of the diglycerol educts and ester end products derived therefrom, for example with the molecular weights 348 g / mol (monolauryl ester) or 530 g / mol (dilauryl ester).
  • the diglycerol esters according to the invention contained in the composition are preferably derived from saturated or unsaturated monocarboxylic acids having a chain length of 6 to 30 carbon atoms.
  • Suitable monocarboxylic acids are, for example, caprylic acid (C 7 H 15 COOH, octanoic acid), capric acid (C 9 H 19 COOH, decanoic acid), lauric acid (C 11 H 23 COOH, dodecanoic acid), myristic acid (C 13 H 27 COOH, tetradecanoic acid), palmitic acid ( C 15 H 31 COOH, hexadecanoic acid), margaric acid (C 16 H 33 COOH, heptadecanoic acid), stearic acid (C 17 H 35 COOH, octadecanoic acid), arachidic acid (C 19 H 39 COOH, eicosanoic acid), behenic acid (C 21 H 43 COOH, Docosanoic acid), lignoceric acid
  • Table 1 shows by way of example with reference to various heat pipes made of different materials and with different outer diameters and wall thicknesses, that the quotient of outer diameter to wall thickness of the heat pipe is critical so that the heat pipe withstands the loads occurring during encapsulation, without the invention being limited to these examples.
  • an injection pressure of about 1000 bar was applied during injection molding with a holding pressure of 600 bar.
  • ⁇ b> Table 1 ⁇ / b> material outer diameter Wall thickness Injured injection process without damage?

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EP17207887.5A 2017-12-18 2017-12-18 Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung Ceased EP3499119A1 (de)

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CN201880079738.8A CN111465804B (zh) 2017-12-18 2018-12-12 用于热源散热的装置以及所述装置的用途
EP18814630.2A EP3728944A1 (de) 2017-12-18 2018-12-12 Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung
PCT/EP2018/084473 WO2019121197A1 (de) 2017-12-18 2018-12-12 Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung
US16/769,806 US11085629B2 (en) 2017-12-18 2018-12-12 Device for dissipating heat from a heat source, and use thereof
JP2020533244A JP2021507466A (ja) 2017-12-18 2018-12-12 熱源からの熱を放散するためのデバイス、および前記デバイスの使用
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