EP3246766B1 - Method for manufacturing a timepiece provided with a raised casing element - Google Patents

Method for manufacturing a timepiece provided with a raised casing element Download PDF

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Publication number
EP3246766B1
EP3246766B1 EP16170378.0A EP16170378A EP3246766B1 EP 3246766 B1 EP3246766 B1 EP 3246766B1 EP 16170378 A EP16170378 A EP 16170378A EP 3246766 B1 EP3246766 B1 EP 3246766B1
Authority
EP
European Patent Office
Prior art keywords
substrate
metal layer
layer
insulating layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16170378.0A
Other languages
German (de)
French (fr)
Other versions
EP3246766A1 (en
Inventor
Pascal Grossenbacher
Stewes Bourban
Pierry Vuille
Yves Winkler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swatch Group Research and Development SA
Original Assignee
Swatch Group Research and Development SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swatch Group Research and Development SA filed Critical Swatch Group Research and Development SA
Priority to CH00646/16A priority Critical patent/CH712474A2/en
Priority to EP16170378.0A priority patent/EP3246766B1/en
Priority to JP2017089534A priority patent/JP6310595B2/en
Priority to US15/591,138 priority patent/US11027574B2/en
Priority to CN201710352353.1A priority patent/CN107402513B/en
Publication of EP3246766A1 publication Critical patent/EP3246766A1/en
Priority to HK18105942.8A priority patent/HK1246413A1/en
Application granted granted Critical
Publication of EP3246766B1 publication Critical patent/EP3246766B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00—Cases
    • G04B37/22—Materials or processes of manufacturing pocket watch or wrist watch cases
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0002—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe
    • G04D3/0043—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms
    • G04D3/0048—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms for dials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/10—Applying flat materials, e.g. leaflets, pieces of fabrics
    • B44C1/14—Metallic leaves or foils, e.g. gold leaf
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/04—Hands; Discs with a single mark or the like
    • G04B19/042—Construction and manufacture of the hands; arrangements for increasing reading accuracy
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/12—Selection of materials for dials or graduations markings
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/18—Graduations on the crystal or glass, on the bezel, or on the rim
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/28—Adjustable guide marks or pointers for indicating determined points of time
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B45/00—Time pieces of which the indicating means or cases provoke special effects, e.g. aesthetic effects
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C27/00—Making jewellery or other personal adornments

Definitions

  • the invention relates to a method of manufacturing a piece such as a timepiece, a piece of jewelry or a piece of jewelry, for example a watch dial, a bezel, a bracelet, etc.
  • the method more particularly makes it possible to produce a covering element on said piece, such as an hour indicator, a decorative element, etc.
  • a watch dial comprising through T-shaped through openings. Then, a mask is affixed to the dial. The mask has openings arranged to communicate with the openings in the dial. Then, the openings are filled, by electroplating, by pressing of an amorphous material or by injection of metal, so as to form covering elements. Finally, the thickness of the filling material protruding from the mask is removed, and the mask is removed.
  • a drawback of this process is that it does not make it possible to produce covering elements formed integrally with the dial, the dial being covered with a layer of different color in order to produce the desired two-tone appearance.
  • Another drawback is the limitation in the shape of the covering elements.
  • the method does not make it possible to form covering elements which are raised relative to the dial, i.e. elements whose underside (the face facing the dial) is not fully pressed against the dial, that is to say covering elements comprising a head surmounting a narrower part, the part narrow being linked to the dial.
  • Another drawback is that the method does not make it possible to produce covering elements with textured heads, for example guilloche.
  • Another drawback is that the method does not make it possible to produce covering elements formed from a non-metallic material.
  • the purpose of the present invention is to overcome all or part of the drawbacks mentioned above.
  • the method according to the first embodiment makes it possible to manufacture a part provided with a relief covering element.
  • This dressing element consists of the portion of the volume filling the pattern at the end of the covering step, it is therefore impossible to separate the covering element from the part.
  • the covering element is of shape corresponding to the imprint of the pattern, it is understood that the recess can take any desired shape.
  • the covering element is the color of the base material of the part, which forms a contrast with the color of the metallic layer arranged around the covering element.
  • the part formed by the method according to the second embodiment differs from the part formed by the method according to the first embodiment in that the covering element has a recess, that is to say an elevation, by compared to the metallic layer.
  • the metal layer is curved around the covering element.
  • the periphery of the lower face of the covering element rests on the metal layer in the first embodiment, which is not the case in the second embodiment. All this gives different aesthetic aspects to the two rooms.
  • the manufacturing method according to the first or second embodiment may include one or more of the characteristics below, according to all technically possible combinations.
  • the pattern comprises a background having a texture, for example a guilloche.
  • the base material is an amorphous metal or a polymer
  • the covering step being carried out by pressing a block of base material on the assembly comprising the substrate and the metal layer.
  • the base material is metallic, the covering step being carried out by galvanic growth of the base material on the assembly comprising the substrate and the layer metallic.
  • the metal layer consists of gold, silver or nickel.
  • the insulating layer consists of resin.
  • the method according to the invention comprises the following steps.
  • an electrically conductive substrate SB also called master in the molding environment.
  • the SB substrate is advantageously made of brass, but can be made of another material, for example stainless steel, aluminum, nickel, a cermet composite, a ceramic or a rendered polymer. conductor (by electrolytic deposition or plasma treatment for example), etc.
  • the substrate SB comprises a hollow pattern MT opening onto an upper surface SP of the substrate SB. In one embodiment, the pattern MT was obtained by machining the substrate SB.
  • the pattern MT has a flat bottom ST extending parallel to the upper surface SP of the substrate SB, and flanks FC extending substantially orthogonally to said bottom ST, but this shape is not limiting.
  • the flanks FC could be inclined relative to the upper surface SP at an angle ⁇ ′ less than 90 °, the bottom ST could not be entirely parallel to the upper surface SP, etc.
  • the upper surface SP of the substrate SB and the bottom ST of the pattern MT have optionally undergone surface machining to create a particular texture that one wishes to give to the part, for example a guillochis, as seen on the figure 1a .
  • an insulating layer CI is deposited in the pattern MT, up to the level of the upper surface SP.
  • the deposition step Md_Cis is for example carried out by baking a resin in viscous form deposited in the pattern MT.
  • the excess is removed by surfacing.
  • this surfacing also makes it possible to create or recreate a texture at the level of the upper surface SP.
  • a metal layer CM is deposited on the upper surface SP (electrically conductive) of the substrate SB by galvanic growth.
  • the substrate SB and the insulating layer CI are thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy which can be deposited in a relatively thick layer.
  • the metal deposit grows not only orthogonally to the upper surface SP, but also laterally, that is to say in the direction of the insulating layer CI.
  • the metal layer CM therefore comprises lateral ends EL which rest on the insulating layer CI.
  • the metal layer CM is machined to reduce its thickness E and / or structure or polish its surface.
  • step Md_Dis shown at figure 1d , the insulating layer CI is dissolved. There then remains only an assembly ES formed by the substrate SB and the metal layer CM.
  • a surface treatment of this ES assembly is carried out.
  • This treatment is for example the application of a release agent or a passivation treatment.
  • the interest of this step appears in the following text.
  • this assembly ES is covered with a volume VL of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES.
  • the base material is amorphous or partially amorphous metal, which is advantageous for its mechanical properties.
  • the base material is a polymer. In these two cases, a block of amorphous or partially amorphous metal, or of polymer, is pressed on the ES assembly at a temperature at which it has a pasty consistency, which allows it to deform to conform to the shapes of the ES assembly, and in particular those of the metallic layer CM and of the pattern MT.
  • the base material is any other metal or metal alloy, for example nickel, gold, etc., and the covering is carried out by galvanic growth of said metal.
  • the volume VL of basic material has a portion EH of a shape corresponding to the imprint of the pattern MT, as well as a narrow portion BA corresponding to the filling of the space between the lateral ends EL of the metal layer CM.
  • the volume VL of base material and the metal layer CM are separated from the substrate SB.
  • the substrate SB is for example immersed in a selective acid bath in which it is dissolved.
  • the separation is carried out by demolding by force. Having previously carried out a surface treatment of the ES assembly then facilitates demolding.
  • the volume VL of base material has a covering element EH in relief of shape corresponding to the imprint of the pattern MT, and an upper face SF covered with the metallic layer CM.
  • the metal layer CM extends on either side of the narrow portion BA, between the upper face SF of the volume VL and a lower face FF of the covering element EH. It is noted that the entire lower face FF of the covering element EH is in contact with the layer metallic CM: the lower face FF of the covering element is an extension of the upper surface of the metallic layer CM.
  • the method according to the invention comprises the steps Md_Sub to Md_Cis previously described, followed by the following steps.
  • an intermediate metallic layer CT is deposited on the upper surface SP (metallic) of the substrate SB by galvanic growth.
  • the substrate SB and the insulating layer CI are thus immersed in a galvanic bath suitable for the deposition of a metal such as nickel.
  • the metal deposit grows not only orthogonally to the upper surface SP, but also laterally, that is to say in the direction of the insulating layer CI.
  • the intermediate layer CT therefore comprises lateral ends EL "which rest on the insulating layer CI.
  • a metallic layer CM ′ is deposited on the intermediate layer CT (metallic) by galvanic growth.
  • the metal is for example gold or silver, but can be any other metal or metal alloy which can be deposited in a relatively thick layer.
  • the metal layer CM ' covers the intermediate layer CT.
  • the metal layer CM ′ therefore comprises lateral ends EL ′ which cover the lateral ends EL ′′ of the intermediate layer CT, and which rest on the insulating layer CI.
  • the metal layer CM ' is machined to reduce its thickness E' and / or structure or polish its surface.
  • step Md'_Dis shown at figure 2c , the insulating layer CI is dissolved. There then remains only an assembly ES ′ formed of the substrate SB, of the intermediate layer CT and of the metal layer CM ′.
  • a surface treatment of this set ES ′ is carried out.
  • This treatment is for example the application of an oil or a passivation.
  • the interest of this step appears in the following text.
  • the assembly ES ' is covered with a volume VL' of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES.
  • the base material is amorphous metal, which is advantageous for its mechanical properties.
  • the base material is a polymer. In these two cases, a block of amorphous or partially amorphous metal or of polymer is pressed onto the assembly ES 'at a temperature at which it has a pasty consistency, which allows it to deform to conform to the shapes of the assembly. ES ', and in particular that of the MT motif.
  • the base material is any other metal, for example nickel, gold, etc., and the covering is carried out by galvanic growth of said metal.
  • the volume VL 'of base material has a portion EH' of a shape corresponding to the imprint of the pattern MT, as well as a narrow portion BA ' corresponding to the filling of the space between the lateral ends EL 'of the metal layer CM'.
  • the volume VL ′ of base material, the intermediate layer CT and the metal layer CM ′ are separated from the substrate SB.
  • the substrate SB is for example immersed in a selective acid bath in which it is dissolved.
  • the separation is carried out by demolding by force. Having previously carried out a surface treatment of the ES 'assembly then makes it easier to demold.
  • the intermediate layer CT is dissolved.
  • the volume VL 'of base material then has a covering element EH' in relief of shape corresponding to the imprint of the pattern MT, and an upper face SF 'covered with the metallic layer CM'.
  • the metal layer CM ′ extends on either side of the narrow portion BA, matching the curved shape of said narrow portion BA. Only a part of the lower face FF of the covering element EH 'is in contact with the metal layer CM', contrary to what is the case in the first embodiment.
  • the first and the second embodiment therefore make it possible to manufacture a PC, PC 'two-color part comprising a covering element EH, EH' in relief, the color transition between the base material and the metallic layer CM, CM 'being net.
  • the covering element EH, EH ' cannot be separated from the rest of the part PC, PC' because it is an integral part of the volume VL, VL 'of base material.
  • the upper surface SP of the substrate SB and the background ST of the pattern MT may have previously undergone surface machining to create a particular texture, for example a guilloche. In this case, by impression effect, the metal layer CM, CM 'and the head of the covering element EH, EH' also have this texture.
  • the metal layer CM, CM ' is dissolved.
  • the narrow portion BA, BA ' is then visible from the outside, making a different aesthetic appearance.

Description

Domaine de l'inventionField of the invention

L'invention se rapporte à un procédé de fabrication d'une pièce telle qu'une pièce d'horlogerie, de joaillerie ou de bijouterie, par exemple un cadran de montre, une lunette, un bracelet, etc. Le procédé permet plus particulièrement de réaliser un élément d'habillage sur ladite pièce, tel qu'un indicateur des heures, un élément décoratif, etc.The invention relates to a method of manufacturing a piece such as a timepiece, a piece of jewelry or a piece of jewelry, for example a watch dial, a bezel, a bracelet, etc. The method more particularly makes it possible to produce a covering element on said piece, such as an hour indicator, a decorative element, etc.

Arrière-plan de l'inventionInvention background

Dans le domaine de l'horlogerie, la joaillerie ou la bijouterie, il est classique de réaliser des éléments d'habillage de couleur différente de celle du support desdits éléments. On connaît notamment de l'art antérieur la demande EP2549341 A1 qui décrit un procédé pour implanter un décor dans un élément d'habillage, le décor formant relief sur un cadran. On connaît encore la demande de brevet EP2380864A1 , qui décrit un procédé de fabrication d'un élément céramique incrusté d'un élément d'habillage. Cependant, ce procédé ne permet pas de fabriquer un élément d'habillage en relief. En revanche, on connait la demande de brevet EP2192454A1 , qui décrit un procédé de fabrication d'un élément d'habillage formant relief sur un cadran. Selon le troisième mode de réalisation décrit dans cette demande, on réalise un cadran de montre comportant des ouvertures traversantes en forme de T. Puis, un masque est apposé sur le cadran. Le masque comporte des ouvertures disposées de sorte à communiquer avec les ouvertures du cadran. Ensuite, les ouvertures sont remplies, par galvanoplastie, par pressage d'un matériau amorphe ou par injection de métal, de sorte à former des éléments d'habillage. Enfin, l'épaisseur du matériau de remplissage dépassant du masque est supprimée, et le masque est retiré.In the field of watchmaking, jewelry or jewelry, it is conventional to produce trim elements of a color different from that of the support for said elements. The application is known in particular from the prior art EP2549341 A1 which describes a process for setting up a decoration in a covering element, the decoration forming a relief on a dial. We still know the patent application EP2380864A1 , which describes a method of manufacturing a ceramic element inlaid with a covering element. However, this process does not make it possible to manufacture a relief covering element. On the other hand, we know the patent application EP2192454A1 , which describes a method of manufacturing a covering element forming a relief on a dial. According to the third embodiment described in this application, a watch dial is produced comprising through T-shaped through openings. Then, a mask is affixed to the dial. The mask has openings arranged to communicate with the openings in the dial. Then, the openings are filled, by electroplating, by pressing of an amorphous material or by injection of metal, so as to form covering elements. Finally, the thickness of the filling material protruding from the mask is removed, and the mask is removed.

Un inconvénient de ce procédé est qu'il ne permet pas de réaliser des éléments d'habillage formés d'un seul tenant avec le cadran, le cadran étant recouvert d'une couche de couleur différente afin de produire l'aspect bicolore recherché. Un autre inconvénient est la limitation dans la forme des éléments d'habillage. Par exemple, le procédé ne permet pas de former des éléments d'habillage surélevés par rapport au cadran, c'est-à-dire des éléments dont la face inférieure (la face en vis-à-vis du cadran) n'est pas intégralement plaquée contre le cadran, c'est-à-dire des éléments d'habillage comprenant une tête surmontant une partie plus étroite, la partie étroite étant liée au cadran. Un autre inconvénient est que le procédé ne permet pas de réaliser des éléments d'habillage à têtes texturées, par exemple guillochées. Un autre inconvénient est que le procédé ne permet pas de réaliser des éléments d'habillage formés d'un matériau non métallique.A drawback of this process is that it does not make it possible to produce covering elements formed integrally with the dial, the dial being covered with a layer of different color in order to produce the desired two-tone appearance. Another drawback is the limitation in the shape of the covering elements. For example, the method does not make it possible to form covering elements which are raised relative to the dial, i.e. elements whose underside (the face facing the dial) is not fully pressed against the dial, that is to say covering elements comprising a head surmounting a narrower part, the part narrow being linked to the dial. Another drawback is that the method does not make it possible to produce covering elements with textured heads, for example guilloche. Another drawback is that the method does not make it possible to produce covering elements formed from a non-metallic material.

Résumé de l'inventionSummary of the invention

Le but de la présente invention est de pallier en tout ou en partie les inconvénients évoqués précédemment.The purpose of the present invention is to overcome all or part of the drawbacks mentioned above.

A cet effet, selon un premier mode de réalisation, l'invention se rapporte à un procédé de fabrication d'une pièce dotée d'un élément d'habillage, comportant les étapes suivantes :

  • Se munir d'un substrat électriquement conducteur comprenant une surface supérieure et un motif formant un évidemment dans ladite surface supérieure
  • Déposer une couche électriquement isolante dans le motif, de sorte que la couche isolante s'étende jusqu'à la surface supérieure
  • Déposer une couche métallique sur la surface supérieure du substrat par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique repose en partie sur la couche isolante
  • Dissoudre la couche isolante
  • Recouvrir un ensemble comprenant le substrat et la couche métallique, par un volume d'un matériau de base de la pièce, le volume formant une empreinte de l'ensemble
  • Séparer le volume et la couche métallique, du substrat, le volume présentant alors un élément d'habillage de forme correspondante à l'empreinte du motif.
To this end, according to a first embodiment, the invention relates to a method of manufacturing a part provided with a covering element, comprising the following steps:
  • Provide an electrically conductive substrate comprising an upper surface and a pattern forming a recess in said upper surface
  • Place an electrically insulating layer in the pattern, so that the insulating layer extends to the upper surface
  • Deposit a metallic layer on the upper surface of the substrate by galvanic growth, so that at the end of this step, the metallic layer rests partly on the insulating layer
  • Dissolve the insulating layer
  • Cover an assembly comprising the substrate and the metallic layer, with a volume of a base material of the part, the volume forming an imprint of the assembly
  • Separate the volume and the metal layer from the substrate, the volume then having a covering element of shape corresponding to the imprint of the pattern.

Le procédé selon le premier mode de réalisation permet de fabriquer une pièce dotée d'un élément d'habillage en relief. Cet élément d'habillage est constitué de la portion du volume remplissant le motif à l'issue de l'étape de recouvrement, il est donc impossible de désolidariser l'élément d'habillage de la pièce. De plus, puisque l'élément d'habillage est de forme correspondante à l'empreinte du motif, on comprend que l'évidement peut prendre toute forme souhaitée. Par ailleurs, l'élément d'habillage est de la couleur du matériau de base de la pièce, ce qui forme un contraste avec la couleur de la couche métallique disposée autour de l'élément d'habillage. Enfin, par effet d'empreinte, les textures de la surface supérieure et du fond du motif sont transférées sur la couche métallique et la tête de l'élément d'habillage.The method according to the first embodiment makes it possible to manufacture a part provided with a relief covering element. This dressing element consists of the portion of the volume filling the pattern at the end of the covering step, it is therefore impossible to separate the covering element from the part. In addition, since the covering element is of shape corresponding to the imprint of the pattern, it is understood that the recess can take any desired shape. Furthermore, the covering element is the color of the base material of the part, which forms a contrast with the color of the metallic layer arranged around the covering element. Finally, by impression effect, the textures of the upper surface and the bottom of the pattern are transferred to the metal layer and the head of the covering element.

Selon un deuxième mode de réalisation, l'invention se rapporte à un procédé de fabrication d'une pièce dotée d'un élément d'habillage, comportant les étapes suivantes :

  • Se munir d'un substrat électriquement conducteur comprenant une surface supérieure et un motif formant un évidement dans ladite surface supérieure
  • Déposer une couche électriquement isolante dans le motif, de sorte que la couche isolante s'étende jusqu'à la surface supérieure
  • Déposer une couche intermédiaire métallique sur la surface supérieure du substrat par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche intermédiaire repose en partie sur la couche isolante
  • Déposer une couche métallique sur la couche intermédiaire par croissance galvanique
  • Dissoudre la couche isolante
  • Recouvrir un ensemble comprenant le substrat, la couche intermédiaire et la couche métallique, par un volume d'un matériau de base de la pièce, le volume formant une empreinte de l'ensemble
  • Séparer le volume, la couche intermédiaire et la couche métallique, du substrat, le volume présentant alors un élément d'habillage de forme correspondante à l'empreinte du motif
  • Dissoudre la couche intermédiaire.
According to a second embodiment, the invention relates to a method of manufacturing a part provided with a covering element, comprising the following steps:
  • Providing an electrically conductive substrate comprising an upper surface and a pattern forming a recess in said upper surface
  • Place an electrically insulating layer in the pattern, so that the insulating layer extends to the upper surface
  • Deposit a metallic intermediate layer on the upper surface of the substrate by galvanic growth, so that at the end of this step, the intermediate layer rests partly on the insulating layer
  • Deposit a metallic layer on the intermediate layer by galvanic growth
  • Dissolve the insulating layer
  • Cover an assembly comprising the substrate, the intermediate layer and the metallic layer, with a volume of a base material of the part, the volume forming an imprint of the assembly
  • Separate the volume, the intermediate layer and the metal layer, from the substrate, the volume then having a covering element of a shape corresponding to the imprint of the pattern
  • Dissolve the middle layer.

La pièce formée par le procédé selon le deuxième mode de réalisation diffère de la pièce formée par le procédé selon le premier mode de réalisation en ce que l'élément d'habillage présente un décrochement, c'est-à-dire une surélévation, par rapport à la couche métallique. Dans le deuxième mode de réalisation, la couche métallique est courbée autour de l'élément d'habillage. Ainsi, la périphérie de la face inférieure de l'élément d'habillage repose sur la couche métallique dans le premier mode de réalisation, ce qui n'est pas le cas dans le deuxième mode de réalisation. Tout ceci donne des aspects esthétiques différents aux deux pièces.The part formed by the method according to the second embodiment differs from the part formed by the method according to the first embodiment in that the covering element has a recess, that is to say an elevation, by compared to the metallic layer. In the second embodiment, the metal layer is curved around the covering element. Thus, the periphery of the lower face of the covering element rests on the metal layer in the first embodiment, which is not the case in the second embodiment. All this gives different aesthetic aspects to the two rooms.

En outre, le procédé de fabrication selon le premier ou le deuxième mode de réalisation peut comprendre une ou plusieurs des caractéristiques ci-dessous, selon toutes les combinaisons techniquement possibles.In addition, the manufacturing method according to the first or second embodiment may include one or more of the characteristics below, according to all technically possible combinations.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante :

  • Dissoudre la couche métallique.
In a nonlimiting embodiment, the method according to the first or the second embodiment comprises the following step:
  • Dissolve the metallic layer.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante, réalisée avant l'étape de dépôt de la couche isolante :

  • Usiner la surface supérieure du substrat de sorte à créer une texture, par exemple un guillochis.
In a nonlimiting embodiment, the method according to the first or the second embodiment comprises the following step, carried out before the step of depositing the insulating layer:
  • Machine the top surface of the substrate to create a texture, such as a guilloche.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le motif comporte un fond présentant une texture, par exemple un guillochis.In a non-limiting embodiment of the method according to the first or the second embodiment, the pattern comprises a background having a texture, for example a guilloche.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante, réalisée après l'étape de dépôt de la couche métallique :

  • Usiner la couche métallique de sorte à réduire son épaisseur.
In a nonlimiting embodiment, the method according to the first or the second embodiment comprises the following step, carried out after the step of depositing the metal layer:
  • Machine the metal layer so as to reduce its thickness.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le matériau de base est un métal amorphe ou un polymère, l'étape de recouvrement étant réalisée par pressage d'un bloc de matériau de base sur l'ensemble comprenant le substrat et la couche métallique.In a nonlimiting embodiment of the method according to the first or second embodiment, the base material is an amorphous metal or a polymer, the covering step being carried out by pressing a block of base material on the assembly comprising the substrate and the metal layer.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le matériau de base est métallique, l'étape de recouvrement étant réalisée par croissance galvanique du matériau de base sur l'ensemble comprenant le substrat et la couche métallique.In a non-limiting embodiment of the method according to the first or second embodiment, the base material is metallic, the covering step being carried out by galvanic growth of the base material on the assembly comprising the substrate and the layer metallic.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, la couche métallique est constituée d'or, d'argent ou de nickel.In a non-limiting embodiment of the method according to the first or the second embodiment, the metal layer consists of gold, silver or nickel.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, la couche isolante est constituée de résine.In a non-limiting embodiment of the method according to the first or the second embodiment, the insulating layer consists of resin.

Description sommaire des dessinsBrief description of the drawings

D'autres particularités et avantages ressortiront clairement de la description qui en est faite ci-après, à titre indicatif et nullement limitatif, en référence aux dessins annexés, dans lesquels :

  • les figures 1a à 1f sont des représentations schématiques d'étapes du procédé de fabrication d'une pièce dotée d'un élément d'habillage, selon un premier mode de réalisation de l'invention
  • les figures 2a à 2f sont des représentations schématiques d'étapes du procédé de fabrication d'une pièce dotée d'un élément d'habillage selon un deuxième mode de réalisation de l'invention
  • la figure 3 est une représentation schématique d'une étape supplémentaire optionnelle du procédé selon le premier ou le deuxième mode de réalisation de l'invention.
Other particularities and advantages will emerge clearly from the description given below, by way of indication and in no way limitative, with reference to the appended drawings, in which:
  • the Figures 1a to 1f are schematic representations of steps in the process for manufacturing a part provided with a covering element, according to a first embodiment of the invention
  • the Figures 2a to 2f are schematic representations of steps in the process for manufacturing a part provided with a covering element according to a second embodiment of the invention
  • the figure 3 is a schematic representation of an optional additional step of the method according to the first or the second embodiment of the invention.

Description détaillée des modes de réalisation préférésDetailed description of preferred embodiments

Selon un premier mode de réalisation illustré aux figures 1a à 1f, le procédé selon l'invention comporte les étapes suivantes.According to a first embodiment illustrated in Figures 1a to 1f , the method according to the invention comprises the following steps.

Selon une étape Md_Sub, montrée à la figure 1a, on se munit d'un substrat SB électriquement conducteur, aussi appelé master dans le milieu du moulage. Le substrat SB est avantageusement constitué de laiton, mais peut être constitué d'un autre matériau, par exemple de l'inox, de l'aluminium, du nickel, d'un composite cermet, d'une céramique ou d'un polymère rendu conducteur (par dépôt électrolytique ou traitement plasma par exemple), etc. De plus, le substrat SB comporte un motif MT creux débouchant sur une surface supérieure SP du substrat SB. Dans un mode de réalisation, le motif MT a été obtenu par usinage du substrat SB.According to a step Md_Sub, shown at figure 1a , we provide an electrically conductive substrate SB, also called master in the molding environment. The SB substrate is advantageously made of brass, but can be made of another material, for example stainless steel, aluminum, nickel, a cermet composite, a ceramic or a rendered polymer. conductor (by electrolytic deposition or plasma treatment for example), etc. In addition, the substrate SB comprises a hollow pattern MT opening onto an upper surface SP of the substrate SB. In one embodiment, the pattern MT was obtained by machining the substrate SB.

Dans l'exemple de la figure 1a, le motif MT présente un fond ST plat s'étendant parallèlement à la surface supérieure SP du substrat SB, et des flancs FC s'étendant sensiblement orthogonalement audit fond ST, mais cette forme n'est pas limitative. Les flancs FC pourraient être inclinés par rapport à la surface supérieure SP selon un angle α'inférieur à 90°, le fond ST pourrait ne pas être tout à fait parallèle à la surface supérieure SP, etc.In the example of the figure 1a , the pattern MT has a flat bottom ST extending parallel to the upper surface SP of the substrate SB, and flanks FC extending substantially orthogonally to said bottom ST, but this shape is not limiting. The flanks FC could be inclined relative to the upper surface SP at an angle α ′ less than 90 °, the bottom ST could not be entirely parallel to the upper surface SP, etc.

On note que la surface supérieure SP du substrat SB et le fond ST du motif MT ont éventuellement subi un usinage de surface pour créer une texture particulière que l'on souhaite donner à la pièce, par exemple un guillochis, comme on le voit sur la figure 1a.It is noted that the upper surface SP of the substrate SB and the bottom ST of the pattern MT have optionally undergone surface machining to create a particular texture that one wishes to give to the part, for example a guillochis, as seen on the figure 1a .

Selon une étape Md_Cis, montrée à la figure 1b, on dépose une couche isolante CI, avantageusement une résine, dans le motif MT, jusqu'au niveau de la surface supérieure SP. L'étape de dépôt Md_Cis est par exemple réalisée par étuvage d'une résine sous forme visqueuse déposée dans le motif MT. En pratique, si la couche isolante CI est déposée sur une épaisseur E amenant la couche isolante CI au-delà de la surface supérieure SP du substrat SB, l'excès est retiré par surfaçage. Eventuellement, ce surfaçage permet aussi de créer ou recréer une texture au niveau de la surface supérieure SP.According to a Md_Cis step, shown at figure 1b , an insulating layer CI, advantageously a resin, is deposited in the pattern MT, up to the level of the upper surface SP. The deposition step Md_Cis is for example carried out by baking a resin in viscous form deposited in the pattern MT. In practice, if the insulating layer CI is deposited over a thickness E bringing the insulating layer CI beyond the upper surface SP of the substrate SB, the excess is removed by surfacing. Optionally, this surfacing also makes it possible to create or recreate a texture at the level of the upper surface SP.

Selon une étape Md_Cga, montrée à la figure 1c, on dépose une couche métallique CM sur la surface supérieure SP (électriquement conductrice) du substrat SB par croissance galvanique. Le substrat SB et la couche isolante CI sont ainsi plongés dans un bain galvanique adapté à la déposition d'un métal tel que l'or, l'argent, le nickel, ou tout autre métal ou alliage métallique pouvant se déposer en couche relativement épaisse. Etant donné la configuration de la couche isolante CI par rapport au substrat SB, le dépôt métallique croit non seulement orthogonalement à la surface supérieure SP, mais également latéralement, c'est-à-dire en direction de la couche isolante CI. A l'issue de l'étape Md_Cga, la couche métallique CM comporte donc des extrémités latérales EL qui reposent sur la couche isolante CI.According to a step Md_Cga, shown at figure 1c , a metal layer CM is deposited on the upper surface SP (electrically conductive) of the substrate SB by galvanic growth. The substrate SB and the insulating layer CI are thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy which can be deposited in a relatively thick layer. . Given the configuration of the insulating layer CI with respect to the substrate SB, the metal deposit grows not only orthogonally to the upper surface SP, but also laterally, that is to say in the direction of the insulating layer CI. At the end of the step Md_Cga, the metal layer CM therefore comprises lateral ends EL which rest on the insulating layer CI.

Selon une étape optionnelle, on usine la couche métallique CM pour réduire son épaisseur E et/ou structurer ou polir sa surface.According to an optional step, the metal layer CM is machined to reduce its thickness E and / or structure or polish its surface.

Selon une étape Md_Dis, montrée à la figure 1d, on dissout la couche isolante CI. Il ne reste alors plus qu'un ensemble ES formé du substrat SB et de la couche métallique CM.According to a step Md_Dis, shown at figure 1d , the insulating layer CI is dissolved. There then remains only an assembly ES formed by the substrate SB and the metal layer CM.

Selon une étape optionnelle, on réalise un traitement de surface de cet ensemble ES. Ce traitement est par exemple l'application d'un agent de démoulage ou un traitement de passivation. L'intérêt de cette étape apparaît dans la suite du texte.According to an optional step, a surface treatment of this ES assembly is carried out. This treatment is for example the application of a release agent or a passivation treatment. The interest of this step appears in the following text.

Selon une étape Md_Enr, montrée à la figure 1e, on recouvre cet ensemble ES par un volume VL d'un matériau de base de la pièce à fabriquer, de sorte que le volume VL forme une empreinte de l'ensemble ES. Dans un mode de réalisation, le matériau de base est du métal amorphe ou partiellement amorphe, intéressant pour ses propriétés mécaniques. Dans un autre mode de réalisation, le matériau de base est un polymère. Dans ces deux cas, un bloc de métal amorphe ou partiellement amorphe, ou de polymère, est pressé sur l'ensemble ES à une température à laquelle il a une consistance pâteuse, ce qui lui permet de se déformer pour épouser les formes de l'ensemble ES, et notamment celles de la couche métallique CM et du motif MT. Dans un autre mode de réalisation, le matériau de base est tout autre métal ou alliage métallique, par exemple du nickel, de l'or, etc., et le recouvrement est réalisé par croissance galvanique dudit métal. On remarque qu'à l'issue de l'étape Md_Enr, le volume VL de matériau de base présente une portion EH d'une forme correspondante à l'empreinte du motif MT, ainsi qu'une portion étroite BA correspondant au remplissage de l'espace entre les extrémités latérales EL de la couche métallique CM.According to a step Md_Enr, shown at figure 1e , this assembly ES is covered with a volume VL of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES. In one embodiment, the base material is amorphous or partially amorphous metal, which is advantageous for its mechanical properties. In another embodiment, the base material is a polymer. In these two cases, a block of amorphous or partially amorphous metal, or of polymer, is pressed on the ES assembly at a temperature at which it has a pasty consistency, which allows it to deform to conform to the shapes of the ES assembly, and in particular those of the metallic layer CM and of the pattern MT. In another embodiment, the base material is any other metal or metal alloy, for example nickel, gold, etc., and the covering is carried out by galvanic growth of said metal. It is noted that at the end of the step Md_Enr, the volume VL of basic material has a portion EH of a shape corresponding to the imprint of the pattern MT, as well as a narrow portion BA corresponding to the filling of the space between the lateral ends EL of the metal layer CM.

Selon une étape Md_Dem, montrée à la figure 1f, on sépare le volume VL de matériau de base et la couche métallique CM, du substrat SB. Pour ce faire, le substrat SB est par exemple plongé dans un bain acide sélectif au sein duquel il est dissout. Alternativement, la séparation est réalisée par démoulage en force. Avoir préalablement réalisé un traitement de surface de l'ensemble ES permet alors de faciliter le démoulage.According to a step Md_Dem, shown at figure 1f , the volume VL of base material and the metal layer CM are separated from the substrate SB. To do this, the substrate SB is for example immersed in a selective acid bath in which it is dissolved. Alternatively, the separation is carried out by demolding by force. Having previously carried out a surface treatment of the ES assembly then facilitates demolding.

A l'issue de l'étape Md_Dem, le volume VL de matériau de base présente un élément d'habillage EH en relief de forme correspondante à l'empreinte du motif MT, et une face supérieure SF recouverte de la couche métallique CM. La couche métallique CM s'étend de part et d'autre de la portion étroite BA, entre la face supérieure SF du volume VL et une face inférieure FF de l'élément d'habillage EH. On note que la totalité de la face inférieure FF de l'élément d'habillage EH est en contact avec la couche métallique CM : la face inférieure FF de l'élément d'habillage se trouve dans le prolongement de la surface supérieure de la couche métallique CM.At the end of step Md_Dem, the volume VL of base material has a covering element EH in relief of shape corresponding to the imprint of the pattern MT, and an upper face SF covered with the metallic layer CM. The metal layer CM extends on either side of the narrow portion BA, between the upper face SF of the volume VL and a lower face FF of the covering element EH. It is noted that the entire lower face FF of the covering element EH is in contact with the layer metallic CM: the lower face FF of the covering element is an extension of the upper surface of the metallic layer CM.

Selon un deuxième mode de réalisation illustré aux figures 2a à 2e, le procédé selon l'invention comporte les étapes Md_Sub à Md_Cis précédemment décrites, suivies des étapes suivantes.According to a second embodiment illustrated in Figures 2a to 2e , the method according to the invention comprises the steps Md_Sub to Md_Cis previously described, followed by the following steps.

Selon une étape Md'_Gct, montrée à la figure 2a, on dépose une couche intermédiaire CT métallique sur la surface supérieure SP (métallique) du substrat SB par croissance galvanique. Le substrat SB et la couche isolante CI sont ainsi plongés dans un bain galvanique adapté à la déposition d'un métal tel que du nickel. Etant donné la configuration de la couche isolante CI par rapport au substrat SB, le dépôt métallique croit non seulement orthogonalement à la surface supérieure SP, mais également latéralement, c'est-à-dire en direction de la couche isolante CI. A l'issue de l'étape Md_Gct, la couche intermédiaire CT comporte donc des extrémités latérales EL" qui reposent sur la couche isolante CI.According to a step Md'_Gct, shown in figure 2a , an intermediate metallic layer CT is deposited on the upper surface SP (metallic) of the substrate SB by galvanic growth. The substrate SB and the insulating layer CI are thus immersed in a galvanic bath suitable for the deposition of a metal such as nickel. Given the configuration of the insulating layer CI with respect to the substrate SB, the metal deposit grows not only orthogonally to the upper surface SP, but also laterally, that is to say in the direction of the insulating layer CI. At the end of the step Md_Gct, the intermediate layer CT therefore comprises lateral ends EL "which rest on the insulating layer CI.

Selon une étape Md'_Cga, montrée à la figure 2b, on dépose une couche métallique CM' sur la couche intermédiaire CT (métallique) par croissance galvanique. Le métal est par exemple de l'or ou de l'argent, mais peut être tout autre métal ou alliage métallique pouvant se déposer en couche relativement épaisse. A l'issue de l'étape Md'_Cga, la couche métallique CM' recouvre la couche intermédiaire CT. La couche métallique CM' comporte donc des extrémités latérales EL' qui recouvrent les extrémités latérales EL" de la couche intermédiaire CT, et qui reposent sur la couche isolante CI.According to a step Md'_Cga, shown at figure 2b , a metallic layer CM ′ is deposited on the intermediate layer CT (metallic) by galvanic growth. The metal is for example gold or silver, but can be any other metal or metal alloy which can be deposited in a relatively thick layer. At the end of step Md'_Cga, the metal layer CM 'covers the intermediate layer CT. The metal layer CM ′ therefore comprises lateral ends EL ′ which cover the lateral ends EL ″ of the intermediate layer CT, and which rest on the insulating layer CI.

Selon une étape optionnelle, on usine la couche métallique CM' pour réduire son épaisseur E' et/ou structurer ou polir sa surface.According to an optional step, the metal layer CM 'is machined to reduce its thickness E' and / or structure or polish its surface.

Selon une étape Md'_Dis, montrée à la figure 2c, on dissout la couche isolante CI. Il ne reste alors plus qu'un ensemble ES' formé du substrat SB, de la couche intermédiaire CT et de la couche métallique CM'.According to a step Md'_Dis, shown at figure 2c , the insulating layer CI is dissolved. There then remains only an assembly ES ′ formed of the substrate SB, of the intermediate layer CT and of the metal layer CM ′.

Selon une étape optionnelle, on réalise un traitement de surface de cet ensemble ES'. Ce traitement est par exemple l'application d'une huile ou une passivation. L'intérêt de cette étape apparaît dans la suite du texte.According to an optional step, a surface treatment of this set ES ′ is carried out. This treatment is for example the application of an oil or a passivation. The interest of this step appears in the following text.

Selon une étape Md'_Enr, montrée à la figure 2d, on recouvre l'ensemble ES' par un volume VL' d'un matériau de base de la pièce à fabriquer, de sorte que le volume VL forme une empreinte de l'ensemble ES. Dans un mode de réalisation, le matériau de base est du métal amorphe, intéressant pour ses propriétés mécaniques. Dans un autre mode de réalisation, le matériau de base est un polymère. Dans ces deux cas, un bloc de métal amorphe ou partiellement amorphe ou de polymère est pressé sur l'ensemble ES' à une température à laquelle il a une consistance pâteuse, ce qui lui permet de se déformer pour épouser les formes de l'ensemble ES', et notamment celle du motif MT. Dans un autre mode de réalisation, le matériau de base est tout autre métal, par exemple du nickel, de l'or, etc., et le recouvrement est réalisé par croissance galvanique dudit métal. On remarque qu'à l'issue de l'étape Md'_Enr, le volume VL' de matériau de base présente une portion EH' d'une forme correspondante à l'empreinte du motif MT, ainsi qu'une portion étroite BA' correspondant au remplissage de l'espace entre les extrémités latérales EL' de la couche métallique CM'.According to a step Md'_Enr, shown in figure 2d , the assembly ES 'is covered with a volume VL' of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES. In one embodiment, the base material is amorphous metal, which is advantageous for its mechanical properties. In another embodiment, the base material is a polymer. In these two cases, a block of amorphous or partially amorphous metal or of polymer is pressed onto the assembly ES 'at a temperature at which it has a pasty consistency, which allows it to deform to conform to the shapes of the assembly. ES ', and in particular that of the MT motif. In another embodiment, the base material is any other metal, for example nickel, gold, etc., and the covering is carried out by galvanic growth of said metal. Note that at the end of step Md'_Enr, the volume VL 'of base material has a portion EH' of a shape corresponding to the imprint of the pattern MT, as well as a narrow portion BA ' corresponding to the filling of the space between the lateral ends EL 'of the metal layer CM'.

Selon une étape Md'_Dem, montrée à la figure 2e, on sépare le volume VL' de matériau de base, la couche intermédiaire CT et la couche métallique CM', du substrat SB. Pour ce faire, le substrat SB est par exemple plongé dans un bain acide sélectif au sein duquel il est dissout. Alternativement, la séparation est réalisée par démoulage en force. Avoir préalablement réalisé un traitement de surface de l'ensemble ES' permet alors de faciliter le démoulage.According to a step Md'_Dem, shown at figure 2e , the volume VL ′ of base material, the intermediate layer CT and the metal layer CM ′ are separated from the substrate SB. To do this, the substrate SB is for example immersed in a selective acid bath in which it is dissolved. Alternatively, the separation is carried out by demolding by force. Having previously carried out a surface treatment of the ES 'assembly then makes it easier to demold.

Selon une étape Md'_Grf, montrée à la figure 2f, on dissout la couche intermédiaire CT. Le volume VL' de matériau de base présente alors un élément d'habillage EH' en relief de forme correspondante à l'empreinte du motif MT, et une face supérieure SF' recouverte de la couche métallique CM'. La couche métallique CM' s'étend de part et d'autre de la portion étroite BA, épousant la forme courbée de ladite portion étroite BA. Seule une partie de la face inférieure FF de l'élément d'habillage EH' est en contact avec la couche métallique CM', contrairement à ce qui est le cas dans le premier mode de réalisation.According to a step Md'_Grf, shown at figure 2f , the intermediate layer CT is dissolved. The volume VL 'of base material then has a covering element EH' in relief of shape corresponding to the imprint of the pattern MT, and an upper face SF 'covered with the metallic layer CM'. The metal layer CM ′ extends on either side of the narrow portion BA, matching the curved shape of said narrow portion BA. Only a part of the lower face FF of the covering element EH 'is in contact with the metal layer CM', contrary to what is the case in the first embodiment.

Le premier et le deuxième mode de réalisation permettent donc de fabriquer une pièce PC, PC' bicolore comportant un élément d'habillage EH, EH' en relief, la transition de couleur entre le matériau de base et la couche métallique CM, CM' étant nette. Naturellement, l'élément d'habillage EH, EH' ne peut pas se désolidariser du reste de la pièce PC, PC' car il est partie intégrante du volume VL, VL' de matériau de base. De plus, on rappelle que la surface supérieure SP du substrat SB et le fond ST du motif MT peuvent avoir préalablement subi un usinage de surface pour créer une texture particulière, par exemple un guillochis. Dans ce cas, par effet d'empreinte, la couche métallique CM, CM' et la tête de l'élément d'habillage EH, EH' présentent également cette texture.The first and the second embodiment therefore make it possible to manufacture a PC, PC 'two-color part comprising a covering element EH, EH' in relief, the color transition between the base material and the metallic layer CM, CM 'being net. Naturally, the covering element EH, EH 'cannot be separated from the rest of the part PC, PC' because it is an integral part of the volume VL, VL 'of base material. In addition, it is recalled that the upper surface SP of the substrate SB and the background ST of the pattern MT may have previously undergone surface machining to create a particular texture, for example a guilloche. In this case, by impression effect, the metal layer CM, CM 'and the head of the covering element EH, EH' also have this texture.

Eventuellement, selon une étape optionnelle supplémentaire Md_Dtt montrée à la figure 3, on dissout la couche métallique CM, CM'. La portion étroite BA, BA' est alors visible de l'extérieur, rendant un aspect esthétique différent.Optionally, according to an additional optional step Md_Dtt shown in the figure 3 , the metal layer CM, CM 'is dissolved. The narrow portion BA, BA 'is then visible from the outside, making a different aesthetic appearance.

La géométrie de l'élément d'habillage EH, EH' et de la partie étroite BA, BA' dépend de plusieurs paramètres :

  • La largeur L du motif MT, montrée à la figure 1a
  • La hauteur H du motif MT, montrée à la figure 1a
  • L'inclinaison α des flancs FC du motif MT, montrée à la figure 1a
  • La largeur G, G' des extrémités latérales EL, EL' de la couche métallique CM, CM', montrées aux figures 1c et 2c
  • La largeur G" des extrémités latérales EL" de la couche intermédiaire CT, montrée à la figure 2c
  • L'épaisseur P, P' desdites extrémités latérales EL, EL' de la couche métallique CM, CM' (qui est égale à leur largeur G, G' à moins que la couche métallique CM, CM' n'ait été usinée), montrée aux figures 1c et 2b
  • L'épaisseur E, E' de couche isolante CI, CI' déposée à l'étape Md_Cis ou Md'_Cis, montrée aux figures 1b et 2b.
The geometry of the covering element EH, EH 'and of the narrow part BA, BA' depends on several parameters:
  • The width L of the motif MT, shown at figure 1a
  • The height H of the motif MT, shown at figure 1a
  • The inclination α of the flanks FC of the motif MT, shown at figure 1a
  • The width G, G 'of the lateral ends EL, EL' of the metal layer CM, CM ', shown at figures 1c and 2c
  • The width G "of the lateral ends EL" of the intermediate layer CT, shown in the figure 2c
  • The thickness P, P 'of said lateral ends EL, EL' of the metal layer CM, CM '(which is equal to their width G, G' unless the metal layer CM, CM 'has been machined), shown to figures 1c and 2b
  • The thickness E, E 'of insulating layer CI, CI' deposited in step Md_Cis or Md'_Cis, shown in Figures 1b and 2b .

Bien entendu, la présente invention ne se limite pas à l'exemple illustré mais est susceptible de diverses variantes et modifications qui apparaîtront à l'homme de l'art.Of course, the present invention is not limited to the example illustrated but is capable of various variants and modifications which will appear to those skilled in the art.

Claims (10)

  1. Process for the production of a part (PC) provided with an external element (EH) comprising the following steps:
    - provide (Md_Sub) an electrically conductive substrate (SB) having an upper surface (SP) and a pattern (MT) forming a recess in said upper surface (SP)
    - deposit (Md_Cis) an electrically insulating layer (CI) into the pattern (MT) so that the insulating layer (CI) extends as far as the upper surface (SP), the process being characterized by the following steps:
    - deposit (Md_Cga) a metal layer (CM) onto the upper surface (SP) of the substrate (SB) by galvanic growth so that at the end of this step the metal layer (CM) partly rests on the insulating layer (CI)
    - dissolve (Md_Dis) the insulating layer (CI)
    - cover (Md_Enr) an assembly (ES) comprising the substrate (SB) and the metal layer (CM) with a mass (VL) of a base material of the part (PC), wherein the mass (VL) forms an imprint of the assembly (ES)
    - separate (Md_Dem) the mass (VL) and the metal layer (CM) from the substrate (SB), wherein the mass (VL) then exhibits an external element (EH) with a shape corresponding to the imprint of the pattern (MT).
  2. Process for the production of a part (PC') provided with an external element (EH) comprising the following steps:
    - provide (Md_Sub) an electrically conductive substrate (SB) having an upper surface (SP) and a pattern (MT) forming a recess in said upper surface (SP)
    - deposit (Md_Cis) an electrically insulating layer (CI) into the pattern (MT) so that the insulating layer (CI) extends as far as the upper surface (SP), the process being characterized by the following steps:
    - deposit (Md'_Gct) a metal intermediate layer (CT) onto the upper surface (SP) of the substrate (SB) by galvanic growth so that at the end of this step the intermediate layer (CT) partly rests on the insulating layer (CI)
    - deposit (Md'_Cga) a metal layer (CM') onto the intermediate layer (CT) by galvanic growth
    - dissolve (Md'_Dis) the insulating layer (CI)
    - cover (Md'_Enr) an assembly (ES') comprising the substrate (SB), the intermediate layer (CT) and the metal layer (CM') with a mass (VL') of a base material of the part (PC'), wherein the mass (VL') forms an imprint of the assembly (ES')
    - separate (Md'_Dem) the mass (VL'), the intermediate layer (CT) and the metal layer (CM') from the substrate (SB), wherein the mass (VL) then exhibits an external element (EH') with a shape corresponding to the imprint of the pattern (MT)
    - dissolve (Md'_Dis) the intermediate layer (CT).
  3. Production process according to one of the preceding claims including the following step:
    - dissolve (Md_Dtt) the metal layer (CM, CM').
  4. Production process according to one of the preceding claims including the following step implemented before the step of depositing (Md_Cis) the insulating layer (CI):
    - machine the upper surface (SP) of the substrate (SB) so as to create a texture, e.g. an engraving.
  5. Production process according to one of the preceding claims, in which the pattern (MT) has a base (ST) that has a texture, e.g. an engravment.
  6. Production process according to one of the preceding claims including the following step implemented after the step of depositing (Md_Cga, Md'_Cga) the metal layer (CM, CM'):
    - machine the metal layer (CM, CM') so as to reduce its thickness (E, E').
  7. Production process according to one of the preceding claims, wherein the base material is an amorphous metal or a polymer, and the covering step (Md_Enr, MD'_Enr) is performed by pressing a block of base material onto the assembly (ES, ES') comprising the substrate (SB) and the metal layer (CM, CM').
  8. Production process according to one of claims 1 to 6, wherein the base material is metallic, and the covering step (Md_Enr, MD'_Enr) is performed by galvanic growth of the base material on the assembly (ES, ES') comprising the substrate (SB) and the metal layer (CM, CM').
  9. Production process according to one of the preceding claims, wherein the metal layer (CM, CM') is formed from gold, silver or nickel.
  10. Production process according to one of the preceding claims, wherein the insulating layer (CI) is formed from resin.
EP16170378.0A 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a raised casing element Active EP3246766B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH00646/16A CH712474A2 (en) 2016-05-19 2016-05-19 A method of manufacturing a timepiece with a raised cladding element.
EP16170378.0A EP3246766B1 (en) 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a raised casing element
JP2017089534A JP6310595B2 (en) 2016-05-19 2017-04-28 Method for manufacturing a timer with raised outer elements
US15/591,138 US11027574B2 (en) 2016-05-19 2017-05-10 Process for the production of a timepiece provided with a raised external element
CN201710352353.1A CN107402513B (en) 2016-05-19 2017-05-18 Method for manufacturing a timepiece provided with a raised external element
HK18105942.8A HK1246413A1 (en) 2016-05-19 2018-05-08 Process for the production of a timepiece provided with a raised external element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16170378.0A EP3246766B1 (en) 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a raised casing element

Publications (2)

Publication Number Publication Date
EP3246766A1 EP3246766A1 (en) 2017-11-22
EP3246766B1 true EP3246766B1 (en) 2020-01-29

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EP16170378.0A Active EP3246766B1 (en) 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a raised casing element

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US (1) US11027574B2 (en)
EP (1) EP3246766B1 (en)
JP (1) JP6310595B2 (en)
CN (1) CN107402513B (en)
CH (1) CH712474A2 (en)
HK (1) HK1246413A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3674817A1 (en) * 2018-12-24 2020-07-01 Meco S.A. Method for manufacturing a decorative item
EP3951512B1 (en) * 2020-08-04 2023-03-01 Comadur S.A. Method for manufacturing a part comprising at least one three-dimensional metallised pattern

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Publication number Priority date Publication date Assignee Title
CN1899002A (en) * 2003-12-26 2007-01-17 三井金属矿业株式会社 Printed-circuit board, its manufacturing method and circuit device
DE102008034616A1 (en) * 2008-07-25 2010-02-04 Leonhard Kurz Stiftung & Co. Kg Embossed film for producing e.g. antenna structure, has peel-off layer designed as metallic peel-off layer formed from aluminum, silver, gold or combination of alloys, and metal layer formed from copper
EP2182096A1 (en) * 2008-10-28 2010-05-05 Nivarox-FAR S.A. Heterogeneous LIGA method
EP2192454A1 (en) 2008-11-28 2010-06-02 The Swatch Group Research and Development Ltd. Three-dimensional decoration method
EP2383244A1 (en) * 2010-04-23 2011-11-02 Omega SA Ceramic element inlaid with at least one metal decoration
US8354729B2 (en) * 2010-12-27 2013-01-15 Industrial Technology Research Institute Gas sensor and manufacturing method thereof
EP2549340B1 (en) * 2011-07-20 2018-09-19 The Swatch Group Research and Development Ltd. Method for attaching a trim to a clock casing element and casing element manufactured according to said method
EP2549341A1 (en) * 2011-07-20 2013-01-23 The Swatch Group Research and Development Ltd. Method for implanting a decoration in a clock casing element deposited by electroplating and casing element manufactured according to said method
JP2015026771A (en) * 2013-07-29 2015-02-05 株式会社フジクラ Circuit board manufacturing method
US10370769B2 (en) * 2014-12-12 2019-08-06 Citizen Watch Co., Ltd. Method of manufacturing electroformed components
EP3035125B1 (en) * 2014-12-19 2018-01-10 Rolex Sa Method for manufacturing a multi-level clock component

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Also Published As

Publication number Publication date
JP6310595B2 (en) 2018-04-11
US20170334236A1 (en) 2017-11-23
US11027574B2 (en) 2021-06-08
JP2017207479A (en) 2017-11-24
CN107402513B (en) 2020-04-10
EP3246766A1 (en) 2017-11-22
HK1246413A1 (en) 2018-09-07
CH712474A2 (en) 2017-11-30
CN107402513A (en) 2017-11-28

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