EP3140853A4 - Pulsed-mode direct-write laser metallization - Google Patents

Pulsed-mode direct-write laser metallization Download PDF

Info

Publication number
EP3140853A4
EP3140853A4 EP15776752.6A EP15776752A EP3140853A4 EP 3140853 A4 EP3140853 A4 EP 3140853A4 EP 15776752 A EP15776752 A EP 15776752A EP 3140853 A4 EP3140853 A4 EP 3140853A4
Authority
EP
European Patent Office
Prior art keywords
pulsed
write laser
mode direct
laser metallization
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15776752.6A
Other languages
German (de)
French (fr)
Other versions
EP3140853A1 (en
Inventor
Michael Zenou
Zvi Kotler
Jonathan ANKRI
Abraham ROTNEMER
Oleg ERMAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of EP3140853A1 publication Critical patent/EP3140853A1/en
Publication of EP3140853A4 publication Critical patent/EP3140853A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
EP15776752.6A 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization Pending EP3140853A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461977766P 2014-04-10 2014-04-10
PCT/IB2015/052476 WO2015155662A1 (en) 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization

Publications (2)

Publication Number Publication Date
EP3140853A1 EP3140853A1 (en) 2017-03-15
EP3140853A4 true EP3140853A4 (en) 2018-01-17

Family

ID=54287371

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15776752.6A Pending EP3140853A4 (en) 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization

Country Status (7)

Country Link
EP (1) EP3140853A4 (en)
JP (1) JP6635313B2 (en)
KR (1) KR102345450B1 (en)
CN (1) CN106133891B (en)
IL (1) IL247946B (en)
TW (1) TWI661752B (en)
WO (1) WO2015155662A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106575077A (en) 2014-08-07 2017-04-19 奥宝科技有限公司 Lift printing system
US10193004B2 (en) 2014-10-19 2019-01-29 Orbotech Ltd. LIFT printing of conductive traces onto a semiconductor substrate
WO2016116924A1 (en) 2015-01-19 2016-07-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
WO2017006306A1 (en) 2015-07-09 2017-01-12 Orbotech Ltd Control of lift ejection angle
EP3377290B1 (en) 2015-11-22 2023-08-02 Orbotech Ltd. Control of surface properties of printed three-dimensional structures
TW201901887A (en) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 Electrical interconnection circuit components on the substrate without prior patterning
KR102040530B1 (en) * 2018-04-25 2019-11-05 성균관대학교산학협력단 Method of forming redistribution layer using photo―sintering
ES2966467T3 (en) * 2018-05-08 2024-04-22 Seco Tools Ab A method of manufacturing a sintered body

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290796A (en) * 1985-06-19 1986-12-20 沖電気工業株式会社 Manufacture of thick film hybrid integrated circuit board
JPS63209193A (en) * 1987-02-25 1988-08-30 松下電器産業株式会社 Method of forming conductor pattern
JPH11307914A (en) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd Pattern forming method of thick film wiring board
US6921626B2 (en) * 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7682970B2 (en) * 2003-07-16 2010-03-23 The Regents Of The University Of California Maskless nanofabrication of electronic components
US7294449B1 (en) 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
JP2006038999A (en) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd Method for forming conductive circuit by using laser irradiation, and conductive circuit
TWI324423B (en) * 2005-11-01 2010-05-01 Cymer Inc Laser system
US20070105395A1 (en) 2005-11-04 2007-05-10 Edward Kinzel Laser functionalization and patterning of thick-film inks
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US20090120924A1 (en) * 2007-11-08 2009-05-14 Stephen Moffatt Pulse train annealing method and apparatus
US8476552B2 (en) 2008-03-31 2013-07-02 Electro Scientific Industries, Inc. Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
JP2009290112A (en) * 2008-05-30 2009-12-10 Fujifilm Corp Conductive inorganic film, method for manufacturing thereof, wiring board, and semiconductor device
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR101114256B1 (en) * 2010-07-14 2012-03-05 한국과학기술원 Method of fabricating pattern
TW201339279A (en) * 2011-11-24 2013-10-01 Showa Denko Kk Conductive-pattern formation method and composition for forming conductive pattern via light exposure or microwave heating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
TWI661752B (en) 2019-06-01
EP3140853A1 (en) 2017-03-15
CN106133891A (en) 2016-11-16
IL247946B (en) 2022-08-01
KR102345450B1 (en) 2021-12-29
JP6635313B2 (en) 2020-01-22
JP2017513040A (en) 2017-05-25
IL247946A0 (en) 2016-11-30
KR20160144985A (en) 2016-12-19
WO2015155662A1 (en) 2015-10-15
TW201543978A (en) 2015-11-16
CN106133891B (en) 2020-03-03

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