EP3029733A1 - Dispositif d'affichage électroluminescent organique - Google Patents
Dispositif d'affichage électroluminescent organique Download PDFInfo
- Publication number
- EP3029733A1 EP3029733A1 EP15197945.7A EP15197945A EP3029733A1 EP 3029733 A1 EP3029733 A1 EP 3029733A1 EP 15197945 A EP15197945 A EP 15197945A EP 3029733 A1 EP3029733 A1 EP 3029733A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrode
- organic light
- light emitting
- shield unit
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims abstract description 137
- 239000003990 capacitor Substances 0.000 claims abstract description 93
- 239000004065 semiconductor Substances 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 150
- 230000001808 coupling effect Effects 0.000 description 44
- 230000003071 parasitic effect Effects 0.000 description 43
- 230000003247 decreasing effect Effects 0.000 description 39
- 238000009413 insulation Methods 0.000 description 19
- 239000000758 substrate Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 11
- 230000005684 electric field Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000007667 floating Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Definitions
- the driving thin film transistor 120 includes an active layer 121, a gate electrode 122 overlapping the active layer 121, and an input electrode 123 and an output electrode 124 connected with the active layer 121.
- the active layer 121 may refer to a channel or a semiconductor layer.
- the shield unit includes a semiconductive portion overlapping the first electrode and/or the gate electrode.
- a distance between the shield unit and the data line is smaller than a distance between the second electrode and the data line. That is, the shield unit may extend further towards the data line than the second electrode.
- the shield unit 580 includes a plurality of shielding areas corresponding to at least each of the data line 251 and the VDD line 252.
- a data line may overlap the shield unit as a portion of the patterned semiconductor layer is disposed.
- a distance between an edge of the first electrode and an edge of the adjacent shield unit may be set to be greater than a distance between the edge of the first electrode and an edge of the adjacent data line.
- a portion of the shield unit may have semiconductive characteristic.
- the active layer overlapping the first pattern electrode may have semiconductive characteristic.
- a portion of the shield unit which is further extended than the first pattern electrode and exposed i may have conductive characteristic.
- the anode contact part of the second pattern electrode may be connected with the shield unit and the output electrode.
- a first shield capacitance which varies on the basis of a data voltage (image signal) may be generated between the patterned semiconductor layer and the first pattern electrode.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20140174509 | 2014-12-06 | ||
KR1020150092696A KR102454728B1 (ko) | 2014-12-06 | 2015-06-30 | 유기 발광 표시 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3029733A1 true EP3029733A1 (fr) | 2016-06-08 |
EP3029733B1 EP3029733B1 (fr) | 2020-03-04 |
Family
ID=54783447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15197945.7A Active EP3029733B1 (fr) | 2014-12-06 | 2015-12-04 | Dispositif d'affichage électroluminescent organique |
Country Status (2)
Country | Link |
---|---|
US (1) | US9978826B2 (fr) |
EP (1) | EP3029733B1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3316309A1 (fr) * | 2016-10-31 | 2018-05-02 | LG Display Co., Ltd. | Afficheur électroluminescent organique |
EP3751616A1 (fr) * | 2019-06-14 | 2020-12-16 | Samsung Display Co., Ltd. | Dispositif d'affichage et son procédé de fabrication |
JP2021500588A (ja) * | 2017-08-31 | 2021-01-07 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | アレイ基板、表示装置およびアレイ基板の製造方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102325191B1 (ko) * | 2015-01-05 | 2021-11-10 | 삼성디스플레이 주식회사 | 표시 장치 |
US9520421B1 (en) * | 2015-06-29 | 2016-12-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for manufacturing LTPS TFT substrate and LTPS TFT substrate |
KR102528296B1 (ko) * | 2015-11-18 | 2023-05-04 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20180066937A (ko) * | 2016-12-09 | 2018-06-20 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102531126B1 (ko) * | 2017-06-14 | 2023-05-11 | 삼성디스플레이 주식회사 | 단위 화소 및 이를 포함하는 유기 발광 표시 장치 |
CN109326624B (zh) * | 2017-08-01 | 2021-12-24 | 京东方科技集团股份有限公司 | 像素电路、其制造方法及显示装置 |
KR102349280B1 (ko) | 2017-08-08 | 2022-01-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 디스플레이 장치 및 이의 제조 방법 |
CN108878494B (zh) * | 2018-06-29 | 2020-12-04 | 上海天马有机发光显示技术有限公司 | 有机发光显示面板和显示装置 |
KR20200047834A (ko) * | 2018-10-24 | 2020-05-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102592957B1 (ko) * | 2018-10-31 | 2023-10-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN109449169B (zh) * | 2018-12-06 | 2021-04-13 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
KR102606687B1 (ko) * | 2018-12-12 | 2023-11-28 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN109755281B (zh) | 2019-01-14 | 2021-07-06 | 深圳市华星光电半导体显示技术有限公司 | Oled显示面板及其制作方法 |
KR20200098803A (ko) * | 2019-02-12 | 2020-08-21 | 삼성디스플레이 주식회사 | 표시 패널 |
KR20210070462A (ko) * | 2019-12-04 | 2021-06-15 | 삼성디스플레이 주식회사 | 표시장치 |
CN111129003B (zh) * | 2019-12-18 | 2022-07-29 | 重庆康佳光电技术研究院有限公司 | 一种电致发光器件的覆晶结构和显示装置 |
KR20210113531A (ko) * | 2020-03-06 | 2021-09-16 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20220022920A (ko) * | 2020-08-19 | 2022-03-02 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2022052008A1 (fr) * | 2020-09-10 | 2022-03-17 | 京东方科技集团股份有限公司 | Substrat d'affichage et panneau d'affichage |
CN112736143B (zh) * | 2020-12-23 | 2022-08-23 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
KR20220125902A (ko) * | 2021-03-05 | 2022-09-15 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
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US20040263710A1 (en) * | 2003-06-24 | 2004-12-30 | Song Hong Sung | Liquid crystal display panel |
JP2006030635A (ja) * | 2004-07-16 | 2006-02-02 | Sony Corp | 表示装置 |
US20100079419A1 (en) * | 2008-09-30 | 2010-04-01 | Makoto Shibusawa | Active matrix display |
EP2498242A1 (fr) * | 2011-03-10 | 2012-09-12 | Seiko Epson Corporation | Dispositif électro-optique et appareil électronique |
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KR20070049742A (ko) * | 2005-11-09 | 2007-05-14 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이기판과 그 제조방법 |
US9869908B2 (en) | 2012-03-06 | 2018-01-16 | Apple Inc. | Pixel inversion artifact reduction |
US9208601B2 (en) | 2012-06-10 | 2015-12-08 | Apple Inc. | Computing plausible road surfaces in 3D from 2D geometry |
KR101903741B1 (ko) | 2012-06-12 | 2018-10-04 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
US9276050B2 (en) * | 2014-02-25 | 2016-03-01 | Lg Display Co., Ltd. | Organic light emitting display device |
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2015
- 2015-12-04 EP EP15197945.7A patent/EP3029733B1/fr active Active
- 2015-12-04 US US14/960,024 patent/US9978826B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20040263710A1 (en) * | 2003-06-24 | 2004-12-30 | Song Hong Sung | Liquid crystal display panel |
JP2006030635A (ja) * | 2004-07-16 | 2006-02-02 | Sony Corp | 表示装置 |
US20100079419A1 (en) * | 2008-09-30 | 2010-04-01 | Makoto Shibusawa | Active matrix display |
EP2498242A1 (fr) * | 2011-03-10 | 2012-09-12 | Seiko Epson Corporation | Dispositif électro-optique et appareil électronique |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3316309A1 (fr) * | 2016-10-31 | 2018-05-02 | LG Display Co., Ltd. | Afficheur électroluminescent organique |
US10468477B2 (en) | 2016-10-31 | 2019-11-05 | Lg Display Co., Ltd. | Organic light-emitting display device |
JP2021500588A (ja) * | 2017-08-31 | 2021-01-07 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | アレイ基板、表示装置およびアレイ基板の製造方法 |
EP3688807A4 (fr) * | 2017-08-31 | 2021-05-19 | BOE Technology Group Co., Ltd. | Substrat de matrice, appareil d'affichage et procédé de fabrication du substrat de matrice |
US11239297B2 (en) | 2017-08-31 | 2022-02-01 | Boe Technology Group Co., Ltd. | Array substrate with capacitor including conductive part of active layer and method of fabricating thereof |
EP3751616A1 (fr) * | 2019-06-14 | 2020-12-16 | Samsung Display Co., Ltd. | Dispositif d'affichage et son procédé de fabrication |
US11049929B2 (en) | 2019-06-14 | 2021-06-29 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
US11678547B2 (en) | 2019-06-14 | 2023-06-13 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
EP3029733B1 (fr) | 2020-03-04 |
US20160163780A1 (en) | 2016-06-09 |
US9978826B2 (en) | 2018-05-22 |
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