EP2973659A4 - Mehrzonen-heizer - Google Patents

Mehrzonen-heizer

Info

Publication number
EP2973659A4
EP2973659A4 EP14764068.4A EP14764068A EP2973659A4 EP 2973659 A4 EP2973659 A4 EP 2973659A4 EP 14764068 A EP14764068 A EP 14764068A EP 2973659 A4 EP2973659 A4 EP 2973659A4
Authority
EP
European Patent Office
Prior art keywords
multiple zone
zone heater
heater
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14764068.4A
Other languages
English (en)
French (fr)
Other versions
EP2973659A1 (de
Inventor
Brent D Elliot
Frank Balma
Alfred Grant Elliot
Alexander Veytser
Dennis G Rex
Richard E Schuster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watlow Electric Manufacturing Co
Original Assignee
Component Re Engineering Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/831,670 external-priority patent/US9984866B2/en
Application filed by Component Re Engineering Co Inc filed Critical Component Re Engineering Co Inc
Publication of EP2973659A1 publication Critical patent/EP2973659A1/de
Publication of EP2973659A4 publication Critical patent/EP2973659A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Surface Heating Bodies (AREA)
EP14764068.4A 2013-03-15 2014-03-14 Mehrzonen-heizer Withdrawn EP2973659A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/831,670 US9984866B2 (en) 2012-06-12 2013-03-15 Multiple zone heater
PCT/US2014/028937 WO2014144502A1 (en) 2012-06-12 2014-03-14 Multiple zone heater

Publications (2)

Publication Number Publication Date
EP2973659A1 EP2973659A1 (de) 2016-01-20
EP2973659A4 true EP2973659A4 (de) 2016-11-09

Family

ID=53040011

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14764068.4A Withdrawn EP2973659A4 (de) 2013-03-15 2014-03-14 Mehrzonen-heizer

Country Status (5)

Country Link
EP (1) EP2973659A4 (de)
JP (1) JP6382295B2 (de)
KR (1) KR102171734B1 (de)
CN (1) CN105518825B (de)
TW (2) TWI632589B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461150B1 (ko) 2015-09-18 2022-11-01 삼성전자주식회사 3차원 반도체 메모리 장치
TWI791057B (zh) 2017-10-24 2023-02-01 美商瓦特隆電子製造公司 用於真空腔室的電饋通及製作絕緣電饋通或電終端單元的方法
US11961747B2 (en) * 2018-03-28 2024-04-16 Kyocera Corporation Heater and heater system
KR102608397B1 (ko) * 2018-10-16 2023-12-01 주식회사 미코세라믹스 미들 영역 독립 제어 세라믹 히터
JP6775099B1 (ja) * 2018-12-20 2020-10-28 日本碍子株式会社 セラミックヒータ
JP7240341B2 (ja) 2020-02-03 2023-03-15 日本碍子株式会社 セラミックヒータ及び熱電対ガイド
JP7202322B2 (ja) * 2020-02-03 2023-01-11 日本碍子株式会社 セラミックヒータ
JP7360992B2 (ja) * 2020-06-02 2023-10-13 京セラ株式会社 端子付構造体
KR102242589B1 (ko) * 2020-09-09 2021-04-21 주식회사 미코세라믹스 세라믹 히터

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080093315A1 (en) * 2004-10-29 2008-04-24 Epicrew Corporation Support for Semiconductor Substrate
US20110005686A1 (en) * 2008-03-11 2011-01-13 Tokyo Electron Limited Loading table structure and processing device
JP2012080103A (ja) * 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法
US20120211933A1 (en) * 2010-09-24 2012-08-23 Ngk Insulators, Ltd. Semiconductor manufacturing apparatus member

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP4098112B2 (ja) * 2003-02-14 2008-06-11 日本発条株式会社 ヒータユニット
JP4238772B2 (ja) * 2003-05-07 2009-03-18 東京エレクトロン株式会社 載置台構造及び熱処理装置
JP2005166354A (ja) * 2003-12-01 2005-06-23 Ngk Insulators Ltd セラミックヒーター
JP4787568B2 (ja) * 2004-11-16 2011-10-05 日本碍子株式会社 接合剤、窒化アルミニウム接合体及びその製造方法
JP4640842B2 (ja) * 2006-10-11 2011-03-02 日本碍子株式会社 加熱装置
JP5791412B2 (ja) * 2010-07-26 2015-10-07 日本碍子株式会社 セラミックヒーター
JP5855402B2 (ja) * 2010-09-24 2016-02-09 日本碍子株式会社 サセプター及びその製法
US20120211484A1 (en) * 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080093315A1 (en) * 2004-10-29 2008-04-24 Epicrew Corporation Support for Semiconductor Substrate
US20110005686A1 (en) * 2008-03-11 2011-01-13 Tokyo Electron Limited Loading table structure and processing device
US20120211933A1 (en) * 2010-09-24 2012-08-23 Ngk Insulators, Ltd. Semiconductor manufacturing apparatus member
JP2012080103A (ja) * 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法

Also Published As

Publication number Publication date
TW201506989A (zh) 2015-02-16
CN105518825B (zh) 2018-02-06
EP2973659A1 (de) 2016-01-20
KR102171734B1 (ko) 2020-10-29
TWI632589B (zh) 2018-08-11
TWM644795U (zh) 2023-08-11
JP6382295B2 (ja) 2018-08-29
KR20150132515A (ko) 2015-11-25
CN105518825A (zh) 2016-04-20
JP2016522881A (ja) 2016-08-04

Similar Documents

Publication Publication Date Title
GB201316088D0 (en) Heating method
HK1218950A1 (zh) 加熱循環器
EP3068192A4 (de) Heizungskocher
HK1219250A1 (zh) 快速聚合酶鏈反應加熱
EP2966359A4 (de) Heizungskocher
EP2973659A4 (de) Mehrzonen-heizer
SG11201509664YA (en) Heating implement
EP3009049A4 (de) Sitzwärmer
EP2951414A4 (de) Hydroaktivierte thermostate
GB2536154B (en) Heating device
PL2778560T3 (pl) Armatura grzewcza
HK1204535A1 (en) Heating cooker
GB201307489D0 (en) Radiant burner
GB201315698D0 (en) Heat detector
PL3042365T3 (pl) Czujnik temperatury
GB201316770D0 (en) Heating Equipment
GB201315399D0 (en) Heater
EP2982923A4 (de) Durchlauferhitzungsofen
PT2881673T (pt) Dispositivo elétrico de aquecimento, em particular piso radiante
GB2511538B (en) Heating Appliance
LT2789926T (lt) Ventiliatorinis šildytuvas
GB201407106D0 (en) Heating appliance
LU92342B1 (en) Heating device
EP2966390A4 (de) Durchlauferhitzungsofen
GB201318099D0 (en) Heater exchangers

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20150903

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20161010

RIC1 Information provided on ipc code assigned before grant

Ipc: H05B 3/28 20060101ALI20161004BHEP

Ipc: H01L 21/67 20060101AFI20161004BHEP

Ipc: H01L 21/687 20060101ALI20161004BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210216

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: WATLOW ELECTRIC MANUFACTURING COMPANY

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20240306