EP2973659A4 - Mehrzonen-heizer - Google Patents
Mehrzonen-heizerInfo
- Publication number
- EP2973659A4 EP2973659A4 EP14764068.4A EP14764068A EP2973659A4 EP 2973659 A4 EP2973659 A4 EP 2973659A4 EP 14764068 A EP14764068 A EP 14764068A EP 2973659 A4 EP2973659 A4 EP 2973659A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- multiple zone
- zone heater
- heater
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/037—Heaters with zones of different power density
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Surface Heating Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/831,670 US9984866B2 (en) | 2012-06-12 | 2013-03-15 | Multiple zone heater |
PCT/US2014/028937 WO2014144502A1 (en) | 2012-06-12 | 2014-03-14 | Multiple zone heater |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2973659A1 EP2973659A1 (de) | 2016-01-20 |
EP2973659A4 true EP2973659A4 (de) | 2016-11-09 |
Family
ID=53040011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14764068.4A Withdrawn EP2973659A4 (de) | 2013-03-15 | 2014-03-14 | Mehrzonen-heizer |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2973659A4 (de) |
JP (1) | JP6382295B2 (de) |
KR (1) | KR102171734B1 (de) |
CN (1) | CN105518825B (de) |
TW (2) | TWI632589B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102461150B1 (ko) | 2015-09-18 | 2022-11-01 | 삼성전자주식회사 | 3차원 반도체 메모리 장치 |
TWI791057B (zh) | 2017-10-24 | 2023-02-01 | 美商瓦特隆電子製造公司 | 用於真空腔室的電饋通及製作絕緣電饋通或電終端單元的方法 |
US11961747B2 (en) * | 2018-03-28 | 2024-04-16 | Kyocera Corporation | Heater and heater system |
KR102608397B1 (ko) * | 2018-10-16 | 2023-12-01 | 주식회사 미코세라믹스 | 미들 영역 독립 제어 세라믹 히터 |
JP6775099B1 (ja) * | 2018-12-20 | 2020-10-28 | 日本碍子株式会社 | セラミックヒータ |
JP7240341B2 (ja) | 2020-02-03 | 2023-03-15 | 日本碍子株式会社 | セラミックヒータ及び熱電対ガイド |
JP7202322B2 (ja) * | 2020-02-03 | 2023-01-11 | 日本碍子株式会社 | セラミックヒータ |
JP7360992B2 (ja) * | 2020-06-02 | 2023-10-13 | 京セラ株式会社 | 端子付構造体 |
KR102242589B1 (ko) * | 2020-09-09 | 2021-04-21 | 주식회사 미코세라믹스 | 세라믹 히터 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080093315A1 (en) * | 2004-10-29 | 2008-04-24 | Epicrew Corporation | Support for Semiconductor Substrate |
US20110005686A1 (en) * | 2008-03-11 | 2011-01-13 | Tokyo Electron Limited | Loading table structure and processing device |
JP2012080103A (ja) * | 2010-10-01 | 2012-04-19 | Ngk Insulators Ltd | サセプター及びその製法 |
US20120211933A1 (en) * | 2010-09-24 | 2012-08-23 | Ngk Insulators, Ltd. | Semiconductor manufacturing apparatus member |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
JP3897563B2 (ja) * | 2001-10-24 | 2007-03-28 | 日本碍子株式会社 | 加熱装置 |
JP4098112B2 (ja) * | 2003-02-14 | 2008-06-11 | 日本発条株式会社 | ヒータユニット |
JP4238772B2 (ja) * | 2003-05-07 | 2009-03-18 | 東京エレクトロン株式会社 | 載置台構造及び熱処理装置 |
JP2005166354A (ja) * | 2003-12-01 | 2005-06-23 | Ngk Insulators Ltd | セラミックヒーター |
JP4787568B2 (ja) * | 2004-11-16 | 2011-10-05 | 日本碍子株式会社 | 接合剤、窒化アルミニウム接合体及びその製造方法 |
JP4640842B2 (ja) * | 2006-10-11 | 2011-03-02 | 日本碍子株式会社 | 加熱装置 |
JP5791412B2 (ja) * | 2010-07-26 | 2015-10-07 | 日本碍子株式会社 | セラミックヒーター |
JP5855402B2 (ja) * | 2010-09-24 | 2016-02-09 | 日本碍子株式会社 | サセプター及びその製法 |
US20120211484A1 (en) * | 2011-02-23 | 2012-08-23 | Applied Materials, Inc. | Methods and apparatus for a multi-zone pedestal heater |
-
2014
- 2014-03-14 TW TW103109558A patent/TWI632589B/zh active
- 2014-03-14 KR KR1020157029798A patent/KR102171734B1/ko active IP Right Grant
- 2014-03-14 TW TW112200700U patent/TWM644795U/zh not_active IP Right Cessation
- 2014-03-14 EP EP14764068.4A patent/EP2973659A4/de not_active Withdrawn
- 2014-03-14 CN CN201480020826.2A patent/CN105518825B/zh active Active
- 2014-03-14 JP JP2016502941A patent/JP6382295B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080093315A1 (en) * | 2004-10-29 | 2008-04-24 | Epicrew Corporation | Support for Semiconductor Substrate |
US20110005686A1 (en) * | 2008-03-11 | 2011-01-13 | Tokyo Electron Limited | Loading table structure and processing device |
US20120211933A1 (en) * | 2010-09-24 | 2012-08-23 | Ngk Insulators, Ltd. | Semiconductor manufacturing apparatus member |
JP2012080103A (ja) * | 2010-10-01 | 2012-04-19 | Ngk Insulators Ltd | サセプター及びその製法 |
Also Published As
Publication number | Publication date |
---|---|
TW201506989A (zh) | 2015-02-16 |
CN105518825B (zh) | 2018-02-06 |
EP2973659A1 (de) | 2016-01-20 |
KR102171734B1 (ko) | 2020-10-29 |
TWI632589B (zh) | 2018-08-11 |
TWM644795U (zh) | 2023-08-11 |
JP6382295B2 (ja) | 2018-08-29 |
KR20150132515A (ko) | 2015-11-25 |
CN105518825A (zh) | 2016-04-20 |
JP2016522881A (ja) | 2016-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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17P | Request for examination filed |
Effective date: 20150903 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20161010 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05B 3/28 20060101ALI20161004BHEP Ipc: H01L 21/67 20060101AFI20161004BHEP Ipc: H01L 21/687 20060101ALI20161004BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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17Q | First examination report despatched |
Effective date: 20210216 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: WATLOW ELECTRIC MANUFACTURING COMPANY |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
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18W | Application withdrawn |
Effective date: 20240306 |