EP2775787B1 - Appareil de cuisson - Google Patents

Appareil de cuisson Download PDF

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Publication number
EP2775787B1
EP2775787B1 EP14401011.3A EP14401011A EP2775787B1 EP 2775787 B1 EP2775787 B1 EP 2775787B1 EP 14401011 A EP14401011 A EP 14401011A EP 2775787 B1 EP2775787 B1 EP 2775787B1
Authority
EP
European Patent Office
Prior art keywords
sensor
cooking
radiation
here
designed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14401011.3A
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German (de)
English (en)
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EP2775787A1 (fr
Inventor
Volker Backherms
Dominic Beier
Bastian Michl
Sonja Schöning
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
Original Assignee
Miele und Cie KG
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Publication date
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Publication of EP2775787A1 publication Critical patent/EP2775787A1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H05B6/062—Control, e.g. of temperature, of power for cooking plates or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/082—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/0252—Domestic applications
    • H05B1/0258—For cooking
    • H05B1/0261—For cooking of food
    • H05B1/0266—Cooktops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07—Heating plates with temperature control means

Definitions

  • the present invention relates to a cooking device comprising a hob with a cooking surface and provided for heating at least one cooking area heating device.
  • a prerequisite for an automatic operation of a cooking device is sometimes an accurate detection of various parameters that are characteristic of the cooking process, such. As the temperature of the cookware or Gargut employers or the food. Depending on the detected parameters, the heating source is automatically controlled in an automatic function of a cooking device, for. B. to avoid overheating of the food.
  • the reproducibility and the accuracy of the recorded parameters is therefore important for the functionality of the automatic function and thus an important quality feature of a modern cooking appliance with automatic functions.
  • Cooking devices have also become known in the state of the art which determine the temperature of a cooking pot in a contactless manner above the cooktop panel.
  • a hob sensor is described which the temperature at the Outside of a cooking pot standing on a cooktop determined without contact. Since the hob sensor is located above the hob, other objects or other pots should not be in the way when detecting the temperatures.
  • the cooktop sensor can also be perceived as an obstacle in cooking operation, as it restricts the freedom of movement of the user.
  • Another possibility for determining temperature during cooking and cooking processes is for example a temperature sensor integrated in the food container.
  • a temperature sensor integrated in the food container.
  • the user must use special food containers and could not use his previous cookware.
  • a temperature sensor which is placed with the food in the cookware, since the sensor must be "fished out” of the food later and should not be eaten by mistake.
  • the cooking device comprises at least one hob with at least one cooking point and at least one heating device which is provided for heating at least one cooking area.
  • At least one sensor device is provided for detecting at least one physical variable in a detection area.
  • the hob has at least one carrier device which is suitable and designed for positioning at least one Gargut matterers.
  • the sensor device is arranged in the installation position of the hob at least partially below the support means.
  • At least one sealing device is provided for thermal insulation. At least a part of the sealing device is arranged between at least part of the carrier device and at least part of the sensor device.
  • the cooking device according to the invention has many advantages.
  • a significant advantage is that the sensor device is sealed to the carrier device.
  • the sensor device is also protected from dust and possible ambient humidity.
  • the sensor device is protected from heat z.
  • the sealing device effects a thermal insulation, so that the sensor device or its sensor unit are protected against adverse effects of heat.
  • the sealing device consists at least partially of a material with low heat conduction or comprises such.
  • the sealing device consists at least partially of at least one mineral material and / or of at least one silicate material and in particular of at least one mica material or comprises at least one such material.
  • at least one induction device is provided for or as a heating device.
  • the sensor device comprises at least one magnetic shielding device, wherein the magnetic shielding device is designed and suitable for shielding electromagnetic interactions and in particular for shielding from the electromagnetic field of the induction device.
  • the magnetic shielding device is particularly advantageous because the interior of the magnetic shielding device is kept free of substantial magnetic fields of the induction device. Such induced fields can cause significant ring currents in metallic components, which can lead to considerable and undesirable heating. Due to the effective magnetic shielding, the sensor device can be reliably protected against such unwanted thermal effects.
  • the sealing device is arranged at least partially between the carrier device and the magnetic shielding device.
  • the sealing device which is designed in particular as a seal, is made thin so that a passage of an electromagnetic field between the magnetic shielding device and the carrier device is avoided.
  • a thickness of the seal between the magnetic shielding means and the support means is less than five times and preferably less than twice the thickness of the support means.
  • a thickness of the seal is smaller than the thickness of the carrier device.
  • the thickness is preferably less than 20 mm and in particular less than 10 mm and particularly preferably in a range between approximately 0.5 mm and 5 mm. In advantageous embodiments, the thickness is less than 3 mm and in particular less than 2 mm.
  • the sealing device is also arranged at least partially between the carrier device and the induction device.
  • the sealing device can be designed as a continuous sealing device and be arranged both between the magnetic shielding device and the carrier device and between the induction device and the carrier device.
  • the sealing device has at least one recess.
  • at least one damping device is provided for the resilient arrangement of the sensor device.
  • at least part of the sensor device is attached to the damping device.
  • the damping device is designed and suitable for preloading at least part of the sensor device resiliently against the sealing device.
  • the sensor device comprises in particular at least one sensor unit.
  • At least one sensor unit is preferably suitable for non-contact detection of at least one characteristic parameter for temperatures.
  • the sensor device has at least one radiation source which can emit at least one signal, in particular in the wavelength range of the infrared light and / or visible light, and in particular emits if required.
  • Sealing means between the magnetic shielding means and the support means contribute to heat insulation.
  • the sealing device significantly reduces heat flow from a hot glass ceramic plate into the magnetic shielding device and / or into the optical shielding device. This reduces additional heat radiation to the sensor units.
  • the sealing device further contributes to a mechanical insulation.
  • the sealing device additionally mechanically insulates the glass-ceramic plate from the magnetic shielding device, in particular as a ferrite ring, and thus has a damping effect. If the sealing device is missing, there is possibly the possibility that the glass-ceramic plate or glass-ceramic pane is damaged if, in particular in the area of the magnetic shielding device, an object falls onto the glass-ceramic plate. Therefore, the sealing device increases the impact resistance. At the same time the seal serves as a dust seal.
  • the sealing device also prevents any existing ambient light or ambient heat radiation from the region of the hob from the sensor units.
  • the magnetic shielding device in combination with a sealing device provided between the magnetic shielding device and the carrier device, protects the sensor device as a whole and in particular the sensor units, filter devices and the optical shielding device from possibly occurring ambient atmospheric moisture.
  • a sealing device there are various materials for such a sealing device in question.
  • a silicone ring can be used.
  • Such a sealing ring preferably has a small contact surface.
  • a Sealer made of micanite or a Mikanitin to use. It is also possible to use other materials with a low heat conduction.
  • the FIG. 1 shows a cooking device 1 according to the invention, which is designed here as part of a cooking appliance 100.
  • the cooking appliance 1 or the cooking appliance 100 can be designed both as a built-in appliance and as a self-sufficient cooking appliance 1 or stand-alone cooking appliance 100.
  • the cooking device 1 here comprises a hob 11 with four cooking zones 21.
  • Each of the cooking zones 21 here has at least one heatable cooking area 31 for cooking food.
  • a heating device 2 not shown here, is provided in total for each hotplate 21.
  • the heating devices 2 are designed as induction heating sources and each have an induction device 12 for this purpose. But it is also possible that a cooking area 31 is not associated with any particular cooking area 21, but represents any location on the hob 11. In this case, the cooking area 31 may have a plurality of induction devices 12 and in particular a plurality of induction coils and be formed as part of a so-called full-surface induction unit.
  • a pot can be placed anywhere on the hob 11, wherein during cooking only the corresponding induction coils are driven in the pot or are active.
  • other types of heaters 2 are also possible, such as e.g. Gas, infrared or resistance heating sources.
  • the cooking device 1 can be operated here via the operating devices 105 of the cooking appliance 100.
  • the cooking device 1 can also be designed as a self-sufficient cooking device 1 with its own operating and control device. Also possible is an operation via a touch-sensitive surface or a touch screen or remotely via a computer, a smartphone or the like.
  • the cooking appliance 100 is here designed as a stove with a cooking chamber 103, which can be closed by a cooking chamber door 104.
  • the cooking chamber 104 can be heated by various heating sources, such as a Um Kunststoffsagenmaschine.
  • Other heating sources such as a top heat radiator and a bottom heat radiator and a microwave heat source or a vapor source and the like may be provided.
  • the sensor device 3 can detect a variable, via which the temperature of a pot can be determined, which is turned off in the cooking area 31.
  • each cooking area 31 and / or each cooking place 21 can be assigned a sensor device 3.
  • the sensor device 3 is here with a Control device 106 operatively connected.
  • the control device 106 is designed to control the heating devices 2 as a function of the parameters detected by the sensor device 3.
  • the cooking device 1 is preferably designed for an automatic cooking operation and has various automatic functions.
  • a soup can be boiled briefly and then kept warm, without a user having to supervise the cooking process or set a heating level.
  • he sets the pot with the soup on a hob 21 and selects the corresponding automatic function via the operating device 105, here z.
  • the operating device 105 here z.
  • the temperature of the pot bottom is determined during the cooking process.
  • the control device 106 sets the heating power of the heating device 2 accordingly.
  • the temperature of the bottom of the pot is monitored continuously, so that when the desired temperature or when boiling the soup, the heating power is regulated down.
  • the automatic function it is also possible by the automatic function to perform a longer cooking process at one or more different desired temperatures, for. B. to slowly let rice pudding draw.
  • a cooking device 1 is shown in a sectional side view very schematic.
  • the cooking device 1 here has a carrier device 5 designed as a glass ceramic plate 15.
  • the glass ceramic plate 15 may in particular be designed as a ceramic hob or the like or at least comprise such. Also possible are other types of support means 5.
  • On the glass ceramic plate 15 is here a cookware or food containers 200, such as a pot or a pan, in which food or food can be cooked.
  • a sensor device 3 is provided which detects heat radiation in a detection region 83 here.
  • the detection area 83 is provided in the installed position of the cooking device 1 above the sensor device 3 and extends upward through the glass ceramic plate 15 to the food container 200 and beyond, if there is no food container 200 is placed there.
  • an induction device 12 for heating the cooking area 31 is attached below the glass ceramic plate 15, an induction device 12 for heating the cooking area 31 is attached.
  • the induction device 12 is here annular and has in the middle a recess in which the sensor device 3 is mounted.
  • Such an arrangement of the sensor device 3 has the advantage that it is still in the detection range 83 of the sensor device even if the food container 200 is not centered on the cooking point 21.
  • the sensor device 3 may also not be arranged centrally in the induction device. If an induction device has, for example, a dual-circuit induction coil, then at least a sensor device 3 may be arranged in a space provided between the two induction coils of the induction device.
  • the FIG. 3 shows a schematic cooking device 1 in a sectional side view.
  • the cooking device 1 has a glass ceramic plate 15, below which the induction device 12 and the sensor device 3 are mounted.
  • the sensor device 3 has a first sensor unit 13 and another sensor unit 23. Both sensor units 13, 23 are suitable for non-contact detection of thermal radiation and designed as a thermopile or thermopile.
  • the sensor units 13, 23 are each equipped with a filter device 43, 53 and provided for detecting heat radiation emanating from the cooking area 31.
  • the thermal radiation emanates, for example, from the bottom of a food container 200, penetrates the glass ceramic plate 15 and reaches the sensor units 13, 23.
  • the sensor device 3 is advantageously mounted directly underneath the glass ceramic plate 15 in order to maximize the proportion of heat radiation emanating from the cooking region 31 without great losses to be able to capture.
  • the sensor units 13, 23 are provided close to the glass ceramic plate 15.
  • a magnetic shielding device 4 which consists of a ferrite body 14 here.
  • the ferrite body 14 is essentially designed here as a hollow cylinder and surrounds the sensor units 13, 23 in an annular manner.
  • the magnetic shielding device 4 shields the sensor device 3 against electromagnetic interactions and in particular against the electromagnetic field of the induction device 12. Without such shielding, the magnetic field generated by induction device 12 during operation could undesirably heat parts of sensor device 3 as well, resulting in unreliable temperature sensing and inferior measurement accuracy.
  • the magnetic shielding device 4 thus considerably improves the accuracy and reproducibility of the temperature detection.
  • the magnetic shielding device 4 may also consist at least in part of at least one at least partially magnetic material and an at least partially electrically non-conductive material.
  • the magnetic material and the electrically non-conductive material may be arranged alternately and in layers. Also possible are other materials or materials which have at least partially magnetic properties and also have electrically insulating properties or at least low electrical conductivity.
  • the sensor device 3 has at least one optical screen device 7, which is provided to shield radiation influences and in particular heat radiation, which act on the sensor units 13, 23 from outside the detection zone 83.
  • This is the optical shield device 7 is formed here as a tube or a cylinder 17, wherein the cylinder 17 is hollow and surrounds the sensor units 13, 23 approximately annular.
  • the cylinder 17 is made of stainless steel here. This has the advantage that the cylinder 17 has a reflective surface which reflects a large proportion of the much heat radiation or absorbs as little heat radiation as possible. The high reflectivity of the surface on the outside of the cylinder 17 is particularly advantageous for the shielding against thermal radiation.
  • the high reflectivity of the surface on the inside of the cylinder 17 is also advantageous in order to direct thermal radiation from (and in particular only out) the detection area 83 to the sensor units 13, 23.
  • the optical screen device 7 can also be configured as a wall, which surrounds the sensor device 13, 23 at least partially and preferably annularly.
  • the cross section may be round, polygonal, oval or rounded. Also possible is a configuration as a cone.
  • an insulation device 8 for thermal insulation is provided, which is arranged between the optical shield device 7 and the magnetic shielding device 4.
  • the insulation device 8 consists here of an air layer 18, which is between the ferrite 14 and the cylinder 17.
  • the insulation device 8 in particular a heat conduction from the ferrite 14 to the cylinder 17 is counteracted.
  • the insulation device 8 has, in particular, a thickness of between approximately 0.5 mm and 5 mm and preferably a thickness of 0.8 mm to 2 mm and particularly preferably a thickness of approximately 1 mm.
  • the isolation device 8 may also be at least one medium with a correspondingly low heat conduction, such. B. include a foam material and / or a polystyrene plastic or other suitable insulating material.
  • the sensor units 13, 23 are arranged here in a thermally conductive manner on a thermal compensation device 9 and in particular are coupled in a thermally conductive manner to the thermal compensation device 9.
  • the thermal compensation device 9 has for this purpose two coupling devices 29, which are formed here as depressions, in which the sensor units 13, 23 are embedded accurately. This will ensure that the Sensor units 13, 23 are at a common and relatively constant temperature level.
  • the thermal compensation device 9 ensures a homogeneous temperature of the sensor unit 13, 23, when it heats up during operation of the cooking device 1. An unequal own temperature can lead to artefacts during the detection, in particular in the case of sensor units 13, 23 designed as thermopiles.
  • a spacing between cylinder 17 and thermal compensation device 9 is provided.
  • the copper plate 19 may also be provided as the bottom 27 of the cylinder 17.
  • the thermal compensation device 9 is designed here as a solid copper plate 19.
  • the thermal compensation device 9 is also possible at least in part another material with a correspondingly high heat capacity and / or a high thermal conductivity.
  • the sensor device 3 here has a radiation source 63, which can be used to determine the reflection properties of the measuring system or the emissivity of a food container 200.
  • the radiation source 63 is embodied here as a lamp 111, which emits a signal in the wavelength range of the infrared light and the visible light.
  • the radiation source 63 may also be formed as a diode or the like.
  • the lamp 111 is used here in addition to the reflection determination for signaling the operating state of the cooking device 1.
  • a region of the thermal compensation device 9 or the copper plate 19 is formed as a reflector 39.
  • the copper plate 19 has a concave-shaped depression, in which the lamp 111 is arranged.
  • the copper plate 19 is also coated with a gold-containing coating to increase the reflectivity.
  • the gold-containing layer has the advantage that it also protects the thermal compensation device 9 from corrosion.
  • the thermal compensation device 9 is attached to a holding device 10 designed as a plastic holder.
  • the holding device 10 has a connecting device 20, not shown here, by means of which the holding device 10 can be latched to a support means 30.
  • the support device 30 is formed here as a printed circuit board 50. On the support means 30 and the circuit board 50 also other components may be provided, such. B electronic components, control and computing devices and / or mounting or mounting elements.
  • a sealing device 6 is provided, which is designed here as a micanite layer 16.
  • the micanite layer 16 serves for thermal insulation, so that the induction device 12 is not is heated by the heat of the cooking area 31.
  • a micanite layer 16 for thermal insulation between the ferrite body 14 and the glass-ceramic plate 15 is provided here. This has the advantage that the heat transfer from the hot in the glass ceramic plate 15 to the ferrite 14 is severely limited. As a result, hardly any heat emanates from the ferrite body 14, which could be transmitted to the insulation device 8 or the optical screen device. The micanite layer 16 thus counteracts an undesirable heat transfer to the sensor device 3, which increases the reliability of the measurements.
  • the microlayer 16 seals the sensor device 3 dust-tight against the remaining regions of the cooking device 1.
  • the micanite layer 16 has a thickness between about 0.2 mm and 4 mm, preferably from 0.2 mm to 1.5 mm and particularly preferably a thickness of 0.3 mm to 0.8 mm.
  • the cooking device 1 has on the underside a cover 41, which is designed here as an aluminum plate and covers the Indu Vietnameseseicardi 12.
  • the covering device 41 is connected to a housing 60 of the sensor device 3 via a screw connection 122.
  • the sensor device 3 is arranged elastically relative to the glass ceramic plate 15.
  • a damping device 102 is provided which has a spring device 112 here.
  • the spring device 112 is connected at a lower end to the inside of the housing 60 and at an upper end to the printed circuit board 50.
  • the spring device 112 presses the printed circuit board 50 with the ferrite body 14 and the micanite layer 16 mounted thereon upwards against the glass ceramic plate 15.
  • Such an elastic arrangement is particularly advantageous since the sensor device 3 should be arranged as close as possible to the glass ceramic plate 15 for metrological reasons , This directly adjacent arrangement of the sensor device 3 on the glass ceramic plate 15 could cause damage to the glass ceramic plate 15 in the event of impacts or impacts. Due to the elastic reception of the sensor device 3 relative to the carrier device 5, shocks or impacts are damped on the glass ceramic plate 15 and thus reliably prevent such damage.
  • the first sensor unit 13 is equipped with a filter device 43 which is very permeable to radiation in this wavelength range, while the filter device 43 substantially reflects radiation from other wavelength ranges.
  • the filter devices 43, 53 are here each formed as an interference filter 433 and in particular designed as a bandpass filter or as a long-pass filter.
  • a detection of the radiation in the wavelength range between 3 .mu.m and 5 .mu.m and in particular in the range of 3.1 .mu.m to 4.2 .mu.m be provided, wherein the respective sensor unit and filter device is then respectively formed or adapted accordingly.
  • the determination of a temperature from a specific radiant power is a known method.
  • the decisive factor is that the emissivity of the body is known, from which the temperature is to be determined. In the present case, therefore, the emissivity of the pot bottom must be known or determined for a reliable temperature determination.
  • the sensor device 3 here has the advantage that it is designed to determine the emissivity of a Gargut variousers 200. This is particularly advantageous, since thus any cookware can be used and not just a specific food container whose emissivity must be known in advance.
  • the lamp 111 emits a signal, in particular a light signal, which has a proportion of heat radiation in the wavelength range of the infrared light.
  • the radiant power or thermal radiation of the lamp 111 passes through the glass ceramic plate 15 on the bottom of the pot and is partially reflected there and partially absorbed.
  • the radiation reflected from the bottom of the pot passes through the glass ceramic plate 15 back to the sensor device 3, where they is detected by the first sensor unit 13.
  • the own thermal radiation of the pot bottom and the thermal radiation of the glass ceramic plate 15 reach the first sensor unit 13.
  • the lamp 111 is switched off and only the heat radiation of the pot bottom and the glass ceramic plate 15 is detected .
  • the proportion of the reflected signal radiation, from which the emissivity of the pot bottom can be determined, then results in principle as the difference between the previously detected total radiation with the lamp 111 switched on minus the heat radiation of the pot bottom and the glass ceramic plate with the lamp 111 switched off.
  • At least one reference value with regard to reflected radiation and the associated emissivity is deposited in a memory unit which cooperates with the sensor device and is not shown in the figures, wherein the memory unit can be arranged, for example, on the printed circuit board 50.
  • the respective actual emissivity of the pot bottom can then be determined based on a comparison of the reflected signal radiation with the at least one reference value.
  • the proportion of the signal radiation absorbed by the bottom of the pot is determined. This results according to methods known per se from the radiation power emitted by the lamp 111 less the signal radiation reflected from the bottom of the pot.
  • the radiation power of the lamp 111 is either fixed and thus known or is determined for example by a measurement with the other sensor unit 23.
  • the other sensor unit 23 detects a wavelength range of the signal radiation, which is almost completely reflected by the glass ceramic plate 15.
  • the emitted radiation power can be determined in a very suitable approximation, whereby inter alia a wavelength dependence of the radiation line or the spectrum of the lamp 111 must be taken into account.
  • the degree of absorption of the pot bottom can be determined in a known manner. Since the absorption capacity of a body corresponds in principle to the emissivity of a body, the desired emissivity can be derived from the degree of absorption of the pot bottom. With the knowledge of the emissivity and the amount of thermal radiation, which emanates from the bottom of the pot, the temperature of the pot bottom can be determined very reliably.
  • the emissivity is preferably continuously redefined in the shortest possible intervals. This has the advantage that a subsequent change in the emissivity does not lead to a falsified measurement result.
  • a change in the emissivity may occur, for example, when the cookware bottom has different emissivities and is displaced on the cooking surface 21. Different emissivities are very common in cookware trays observed because z. B. already light soiling, corrosion or Even different coatings or coatings can have a major impact on the emissivity.
  • the lamp 111 is also used here for signaling the operating state of the cooking device 1 in addition to the determination of the emissivity or the determination of the reflection behavior of the measuring system.
  • the signal of the lamp 111 also includes visible light, which is perceptible by the glass-ceramic plate 15.
  • the lamp 111 indicates to a user that an automatic function is in operation.
  • Such an automatic function can, for. B. be a cooking operation, in which the heater 2 is controlled automatically in dependence of the determined pot temperature. This is particularly advantageous because the lighting up of the lamp 111 does not confuse the user. The user knows from experience that the lighting is an operation indicator and belongs to the normal appearance of the cooking device 1.
  • a flash of the lamp 111 is not a malfunction and the cooking device 1 may not work properly.
  • the lamp 111 may also light up in a certain duration and at certain intervals. It is possible z. B. also that different operating states can be output via different flashing frequencies. Different signals are also possible via different on / off sequences.
  • a sensor device 3 with a radiation source 63 which is suitable for displaying at least one operating state, is provided for each cooking point 21 or each (possible) cooking region 31.
  • At least one arithmetic unit may be provided for the necessary calculations for determining the temperature and for the evaluation of the detected variables.
  • the arithmetic unit can be at least partially provided on the circuit board 50.
  • the control device 106 it is also possible, for example, for the control device 106 to be designed accordingly, or at least one separate arithmetic unit is provided.
  • the FIG. 4 shows a development in which below the glass ceramic plate 15, a security sensor 73 is attached.
  • the safety sensor 73 is designed here as a temperature-sensitive resistor, such as a thermistor, in particular an NTC sensor, and thermally conductively connected to the glass ceramic plate 15.
  • the safety sensor 73 is provided here to be able to detect a temperature of the cooking area 31 and in particular of the glass ceramic plate 15. If the temperature exceeds a certain value, there is a risk of overheating and the heaters 2 are switched off.
  • the safety sensor 73 is operatively connected to a safety device, not shown here, which can trigger a safety state depending on the detected temperature.
  • a security condition has z. B. the shutdown of the heaters 2 and the cooking device 1 result.
  • the safety sensor 73 is assigned here as a further sensor unit 33 of the sensor device 3.
  • the values detected by the safety sensor 73 are also taken into account for the determination of the temperature by the sensor device 3.
  • the values of the safety sensor 73 are used. So z. B. the temperature, which was determined by means of the other sensor unit 23 on the detected thermal radiation, are compared with the temperature detected by the safety sensor 73. This adjustment can on the one hand serve to control the function of the sensor device 3, but on the other hand can also be used for a tuning or adjustment of the sensor device 3.
  • a sensor device 3 is likewise shown, in which a safety sensor 73 is assigned as a further sensor unit 33 to the sensor device 3. Unlike the one in the FIG. 4 described embodiment, but no other sensor unit 23 is provided here. The task of the other sensor unit 23 is taken over here by the safety sensor 73.
  • the safety sensor 73 is used to determine the temperature of the glass ceramic plate 15. For example, with knowledge of this temperature from the thermal radiation, which detects the first sensor unit 13, the proportion of a pot bottom can be determined.
  • the other sensor unit 23 may be referred to as a second sensor unit.
  • the further sensor unit 33 may be referred to as a third sensor unit. In the embodiment according to Fig. 5 only the first sensor unit and the third sensor unit are provided.
  • FIG. 6 Another embodiment of a cooking device 1 is in the FIG. 6 shown.
  • a common sealing device 6 for the induction device 12 and the ferrite body 14 of the sensor device 3 is provided.
  • the sealing device 6 is designed as a micanite layer 16 which has a recess in the detection area 83 of the sensor device 3.
  • the FIG. 7 shows a schematic, magnetic shielding 4, which is formed as a hollow, cylindrical ferrite body 14.
  • a schematic, magnetic shielding 4 which is formed as a hollow, cylindrical ferrite body 14.
  • the wall of the ferrite body 14 has a thickness of about 1 mm to 10 mm and in particular from 2 mm to 5 mm, and particularly preferably from 2.5 mm to 4 mm and in particular of 3 mm or more.
  • FIG. 8 is an optical shield device 7 shown schematically, which is designed here as a cylinder 17.
  • the cylinder has here three locking devices 80, which are suitable for connection to a holding device 10.
  • a thermal compensation device 9 is in the FIG. 9 shown.
  • the thermal compensation device 9 is designed as a copper plate 19.
  • the copper plate has a thickness of 0.5 mm to 4 mm or even 10 mm or more, and more preferably from 0.8 mm to 2 mm, and more preferably 1 mm or more.
  • the copper plate 19 here has two coupling devices 29.
  • the coupling device 29 is suitable and provided to receive a sensor unit 13, 23 thermally conductive.
  • the copper plate 19 has a reflector device 39, which can reflect the radiation of a radiation source 63 and, in particular, can focus.
  • FIG. 10 shows a holding device 10, which is designed as a plastic holder.
  • the holding device 10 preferably has a thickness between 0.3 mm and 3 mm or even 6 mm, and particularly preferably a thickness of 1 mm or more.
  • the holding device 10 includes, for example, three connecting devices, of which only two connecting devices 20 are visible in the figure, by means of which the holding device 10 z. B. is connectable to a support device 30.
  • the holding device 10 on three receiving devices 40, which are formed here as webs.
  • the recording devices 40 are suitable for receiving the optical screen device 7 and arranging it at a defined distance from the magnetic shielding device 4. To carry out contacts receiving openings 70 are provided.
  • the holding device 10 may also have further, not shown receptacles 40 which z. B.
  • Such receiving devices 40 are provided in particular for the defined arrangement of a magnetic shielding device 4, an optical shield device 7, a thermal compensation device 9, an insulation device 8 and / or a support device 30.
  • a sensor unit 13 for non-contact detection of heat radiation is listed.
  • the sensor unit 13 is designed as a thermopile or thermopile.
  • the sensor unit 13 has contacts in order to connect them, for example, to a printed circuit board 50 or board.
  • a filter device 43 is arranged here.
  • FIG. 12a shows a formed as a thermopile sensor unit 13 with a filter device 43 in a sectioned, schematic side view.
  • the filter device 43 is arranged here on the region in which the thermal radiation impinges on the sensor unit 13 and is detected.
  • the filter device 43 is here attached to the sensor unit 13 with an adhesive connection means 430 in a thermally conductive manner.
  • the connecting means 430 here is an adhesive with a thermal conductivity of at least 1 W m -1 K -1 (W / (mK)) and preferably of 0.5 W m -1 K -1 (W / (mK)). Also possible and preferred is a thermal conductivity of more than 4 W m -1 K -1 (W / (mK)).
  • heat from the filter device 43 to the Sensor unit 43 are derived.
  • the dissipation of the heat prevents the sensor unit 13 from detecting the self-heat of the filter device 43, which would lead to a falsified measurement result.
  • the heat from the filter device 43 via the sensor unit 13 can also be forwarded to the thermal compensation device 9 or the copper plate 19.
  • Such indirect dissipation of the heat from the filter device 43 via the sensor unit 13 to the copper plate 19 is also particularly favorable since the copper plate 19 has a high heat capacity.
  • the adhesive may be, for example, a thermosetting, one-component, solvent-free silver-filled epoxy conductive adhesive. Due to the proportion of silver or silver-containing compounds a very favorable thermal conductivity is achieved. Also possible is a proportion of other metals or metal compounds with a corresponding thermal conductivity. Such an adhesive ensures a thermally conductive connection, which is durable and stable even at the temperatures to be expected in a cooking device 1.
  • the filter device 43 is designed as an interference filter 433 and here has four filter layers 432 with a different refractive index and with dielectric properties. In this case, filter layers 432 with higher and lower refractive indices are alternately stacked and connected.
  • the filter layers 432 are, in particular, very thin, preferably a few nanometers to 25 nm.
  • the carrier layer for the filter layers 432 here is a filter base 431 made of a silicon-containing material with a thickness of more than 0.2 mm.
  • the filter device 43 is designed and suitable for transmitting a wavelength range in the infrared spectrum and for substantially reflecting radiation outside this range.
  • FIG. 12b shows a further embodiment of a sensor unit 13 with a filter device 43, wherein the filter device 43 is glued here only partially on the sensor device 13.
  • the region in which the heat radiation strikes and is detected on the sensor unit 13 is surrounded here by a raised edge region.
  • the connecting means 430 was applied only in an edge region. This has the advantage that the heat radiation to be detected does not have to pass through the connection means 430 before it strikes the sensor unit 13.
  • a sensor device 3 is shown in a plan view. For clarity and distinctiveness, some parts or areas are shaded. It can be clearly seen that the sensor device 3 has a concentric structure according to the onion shell principle. Inside there is a thermal compensation device 9 or a copper plate 19, on which two sensor units 13, 23 and designed as a lamp 111 radiation source 63 are arranged. So that no unwanted heat radiation from the side of the sensor units 13, 23 is incident, the sensor units 13, 23 of an optical screen device 7 and a cylinder 17th surround. The cylinder 17 is spaced from the copper plate 19, so that as possible no heat transfer between the cylinder 17 and copper plate 19 can take place. The cylinder 17 is surrounded by a magnetic shielding device 4 and a ferrite body 14, respectively. The ferrite body 14 represents the outermost layer of the sensor device 3 and shields it against electromagnetic interactions.
  • the sensor device 3 is preferably provided as close as possible below a carrier device 5, a sealing device 6 or a micanite layer 16 lies on the ferrite body 14, which considerably reduces a heat transfer from the carrier device 5 to the ferrite body 14.
  • an insulation device 8 is formed between the ferrite body 14 and the cylinder 17, an insulation device 8 is formed.
  • the insulation device 8 is here an air layer 18.
  • the air layer 18 counteracts a heat transfer from the ferrite body 14 to the cylinder 17.
  • the sensor units 13, 23 in the interior of the sensor device 3 are thus very effective against interference, such.
  • B. a magnetic field of an induction device 12, heat radiation from outside the detection range 83 and heating by heat conduction, protected.
  • Such a configured, shell-like arrangement of the listed components significantly increases the reliability of the measurements performed with the sensor device 3.
  • FIG. 14 shows a sensor device 3 in an exploded view.
  • the items are here shown spatially separated from each other, whereby the arrangement of the items within the sensor device 3 is clearly visible.
  • the concentric or onion-like structure is also clearly visible here. In addition to an improved measurement accuracy, such a structure also allows a particularly production-friendly and cost-effective installation of the sensor device 3.
  • a sensor unit 13, 23 may already be adhesively bonded to a filter device 43, 53 in a thermally conductive manner.
  • the circuit board 50 may already be partially equipped with electronic components prior to assembly. Preferably z. B. the radiation source 63 already contacted with the circuit board 50.
  • the holding device 10 designed as a plastic holder is first mounted on the supporting device 30 designed as a printed circuit board 50.
  • the holding device 10 at least one connecting device 20, not shown here, which is connected to the circuit board 50 and z. B. can be locked.
  • a holding device 10 with three connecting devices 20 is in the FIG. 10 shown.
  • the provided here as a copper plate 19 thermal compensation device 9 is inserted into the holding device 10.
  • the sensor units 13, 23 designed as thermopiles or thermopiles are carried out through receiving openings 70 in the copper plate 19, the holding device 10 and the printed circuit board 50.
  • the mounting of the holding device 10, the copper plate 19 and the sensor units 13, 23 can also be performed in any other order. So z. B. first inserted the copper plate 19 in the holding device 10, then the sensor units 13, 23 inserted and subsequently the holding device 10 is locked to the circuit board 50. The contacting of the sensor units 13, 23 with the printed circuit board 50 can be done at any time during assembly.
  • the contacting of the radiation source 63 designed as a lamp 111 with the printed circuit board 50 can likewise take place at any desired time of assembly. It is preferred to contact the lamp 111 first with the printed circuit board 50 and then to start with the mounting option described above.
  • the optical screen device 7 designed as a cylinder 17.
  • the cylinder 17 has three latching devices 80, which are latched to the three receiving devices 40 of the holding device 10.
  • the ferrite body 14 formed magnetic shield 4 is mounted on the holding device 10.
  • the holding device 10 preferably has a further, not shown here receiving device 40, which may be formed as a recess, survey, web and / or annular groove or the like.
  • the sealing device 6 designed as micanite layer 16 is fastened to the magnetic shielding device 4.
  • Other suitable mounting sequences for the cylinder 17, the ferrite body 14 and the sealing device 6 may be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Food Science & Technology (AREA)
  • Electric Stoves And Ranges (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Claims (7)

  1. Dispositif de cuisson (1), comprenant au moins une table de cuisson (11) avec au moins un emplacement de cuisson (21), et avec au moins un dispositif de chauffage (2) prévu pour le chauffage d'au moins une zone de cuisson (31), et avec au moins un dispositif de capteur (3) pour la détection d'au moins une grandeur physique dans une zone de détection (83),
    dans lequel la table de cuisson (11) présente au moins un dispositif de support (5) qui est approprié et constitué pour le positionnement d'au moins un récipient de produit à cuire et
    dans lequel, dans la position montée de la table de cuisson (11), le dispositif de capteur (3) est disposé au moins partiellement au-dessous du dispositif de support (5),
    dans lequel il est prévu au moins un dispositif d'étanchéité (6) pour l'isolation thermique, dans lequel au moins une partie du dispositif d'étanchéité (6) est disposée entre au moins une partie du dispositif de support (5) et au moins une partie du dispositif de capteur (3),
    caractérisé en ce que,
    pour le dispositif de chauffage (2), il est prévu au moins un dispositif d'induction (12), et le dispositif de capteur (3) comprend au moins un dispositif de blindage magnétique (4), dans lequel le dispositif de blindage magnétique (4) est constitué et approprié pour le blindage contre des interactions électromagnétiques et en particulier pour le blindage contre le champ électromagnétique du dispositif d'induction (12),
    et
    le dispositif d'étanchéité (6) est disposé au moins partiellement entre le dispositif de support (5) et le dispositif de blindage magnétique (4), et
    il est prévu au moins un dispositif d'amortissement (102) pour l'agencement élastique du dispositif de capteur (3), dans lequel au moins une partie du dispositif de capteur (3) est mise en place sur le dispositif d'amortissement (102), et le dispositif d'amortissement (102) est constitué et approprié pour pré-charger de façon élastique au moins le dispositif de blindage magnétique (4), en tant que partie du dispositif de capteur (3), contre le dispositif d'étanchéité (6, 26).
  2. Dispositif de cuisson (1) selon la revendication 1, caractérisé en ce que le dispositif d'étanchéité (6) est formé au moins partiellement d'un matériau ayant une faible conduction thermique ou bien comprend un tel matériau.
  3. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif d'étanchéité (6) est formé d'un matériau minéral et/ou d'un matériau en silicate et en particulier d'un matériau en mica ou bien comprend un tel matériau.
  4. Dispositif de cuisson (1) selon l'une des deux revendications précédentes, caractérisé en ce que le dispositif d'étanchéité (6) est également disposé au moins partiellement entre le dispositif de support (5) et le dispositif d'induction (12).
  5. Dispositif de cuisson (1) selon la revendication précédente, caractérisé en ce que le dispositif d'étanchéité (6, 26) présente un creux dans la zone de détection (83).
  6. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de capteur (3) comprend au moins une unité de capteur (13) et en ce qu'au moins une unité de capteur (13) est appropriée pour la détection sans contact d'au moins un paramètre caractéristique pour des températures.
  7. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de capteur (3) présente au moins une source de rayonnement (63) qui émet un signal, en particulier dans la plage de longueurs d'onde de la lumière infrarouge et/ou de la lumière visible.
EP14401011.3A 2013-03-04 2014-02-03 Appareil de cuisson Active EP2775787B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013102110.7A DE102013102110A1 (de) 2013-03-04 2013-03-04 Kocheinrichtung

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EP2775787A1 EP2775787A1 (fr) 2014-09-10
EP2775787B1 true EP2775787B1 (fr) 2017-06-21

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EP (1) EP2775787B1 (fr)
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ES (1) ES2636798T3 (fr)

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CN109373367B (zh) * 2018-10-12 2020-03-20 李敏 直热炉头
DE102019109409A1 (de) * 2019-04-10 2020-10-15 Miele & Cie. Kg Sicherheitsvorrichtung für ein Kochfeld und Verfahren für deren Betrieb

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DE19604436A1 (de) * 1996-02-07 1997-08-14 Bosch Siemens Hausgeraete Muldenplatteninduktor
JP2004063451A (ja) * 2002-06-07 2004-02-26 Ishizuka Electronics Corp 誘導加熱調理器の放射温度検知装置および該装置用演算装置
JP3975865B2 (ja) * 2002-08-30 2007-09-12 松下電器産業株式会社 誘導加熱調理器
JP2004227976A (ja) * 2003-01-24 2004-08-12 Matsushita Electric Ind Co Ltd 誘導加熱調理器
JP4123085B2 (ja) * 2003-07-17 2008-07-23 松下電器産業株式会社 誘導加熱調理器
DE102004002058B3 (de) 2004-01-15 2005-09-08 Miele & Cie. Kg Verfahren zur Steuerung eines Kochprozesses bei einem Kochfeld und Kochfeld zur Durchführung des Verfahrens
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DE102007013839A1 (de) 2007-03-22 2008-09-25 BSH Bosch und Siemens Hausgeräte GmbH Kochfeldsensorvorrichtung
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Publication number Publication date
DE102013102110A1 (de) 2014-09-18
ES2636798T3 (es) 2017-10-09
EP2775787A1 (fr) 2014-09-10

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