CN105097613B - The chuck table of cutting apparatus - Google Patents
The chuck table of cutting apparatus Download PDFInfo
- Publication number
- CN105097613B CN105097613B CN201510240561.3A CN201510240561A CN105097613B CN 105097613 B CN105097613 B CN 105097613B CN 201510240561 A CN201510240561 A CN 201510240561A CN 105097613 B CN105097613 B CN 105097613B
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- frame
- supporting part
- ring
- frame supporting
- main body
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- 238000005520 cutting process Methods 0.000 title claims abstract description 52
- 239000007787 solid Substances 0.000 claims 2
- 230000037237 body shape Effects 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of chuck table of cutting apparatus, and the frame supporting part for supporting ring-shaped frame can be micro-adjusted relative to the height for keeping the retaining surface of chip.Frame support member (13A) includes base portion (132), is fixed on table base (11)；Frame supporting part (131A), it is fixed on base portion (132) by means of adjustment member (15), the adjustment member (15) adjusts position in the short transverse of the retaining surface perpendicular to workbench main body (12), and the height for being supported on the ring-shaped frame (6A) on frame supporting part (131A) is located on desired position relative to the retaining surface of workbench main body (12).
Description
Technical field
The present invention relates to the chuck tables of cutting apparatus.
Background technique
In semiconductor device manufacturing process or various electronic component manufacturing processes, make the very thin blade referred to as cast-cutting saw
High speed rotation is indispensable to which machined object is divided into the cutting apparatus of product one by one or chip.It is filled in the cutting
In setting, for ease of operation, machined object is fixed in the opening of cricoid frame by means of cutting belt.
In general, in order to avoid the contact with cutting tip, more leaned on frame is pulled down to the retaining surface than chuck table
It is cut on the position of lower section and in the state of fixing.This is because what cutting belt was just able to achieve with scalability, still,
According to processing conditions, using the band (PET base material) without scalability in the case where, when frame is pulled down and is fixed, it is possible to
Band is removed from frame and generates vacuum mistake or the band peeled off and blade contact and lead to blade breakage.Therefore, do not have in use
In the case where the cutting belt for having scalability, replace frame supporting part component, or replacement chuck table itself, thus with
The height of the roughly the same degree of retaining surface comes scaffold (patent document 1).
On the other hand, existing makes to support the device that the supporting member of cricoid frame moves along the vertical direction.For example, open
Following content: cricoid to change bearing by importing compressed air in the cylinder or the compressed air is discharged from cylinder
The position (patent document 2) of the clamping unit of frame.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-21464 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2009-141231 bulletin
Summary of the invention
Problem to be solved by the invention
However, there are problems that as follows: when the size according to machined object is to replace chuck table, by
It is different due to the type of chuck table in the thickness of chuck table, so occasionally resulting in the height relationships with frame supporting part
It changes, in this case, needs to be adjusted by the part replacement etc. of frame supporting part.In addition, when using cylinder come
In the case where the position for having adjusted clamping unit, it is difficult to which the position of clamping unit is micro-adjusted.
Therefore, the present invention is exactly completed in view of above content, and its purpose is to provide a kind of chucks of cutting apparatus
Workbench, can be to the frame supporting part for supporting ring-shaped frame relative to the height for keeping the retaining surface of machined object
Degree is micro-adjusted.
The means used to solve the problem
In order to solve the problem above-mentioned and achieve the goal, the chuck table of cutting apparatus of the invention, attracting holding
Machined object, the machined object are supported in the opening of ring-shaped frame by splicing tape, which is characterized in that the chuck table
Have: workbench main body is detachably fixed on the table base of the cutting apparatus, and is had for protecting
Hold the retaining surface of machined object；And frame support member, it is fixed on the table base, with the workbench master
The periphery of body supports the ring-shaped frame；The frame support member includes base portion, is fixed in the workbench bottom
On seat；And frame supporting part, it is fixed in the base portion by means of adjustment member, the adjustment member is perpendicular to institute
State and adjust position in the short transverse of retaining surface, be supported on the height of the ring-shaped frame on the frame supporting part relative to
The retaining surface of the workbench main body is located on desired position.
Invention effect
The chuck table of cutting apparatus according to the present invention generates effect as follows: due to being configured to frame
The height of supporting part is adjusted, so ring-shaped frame can be micro-adjusted relative to the position of the height of retaining surface, no
Need replacing frame supporting part.
Detailed description of the invention
Fig. 1 is the perspective view for showing the structural example of cutting apparatus of the 1st embodiment.
Fig. 2 is the perspective view for showing the structural example of chuck table.
Fig. 3 is the perspective view for showing the example that ring-shaped frame is mounted on chuck table.
Fig. 4 is the cross-sectional view observed at A-A arrow shown in Fig. 3.
Fig. 5 is the enlarged drawing for showing the structural example of adjustment member shown in Fig. 4.
Fig. 6 is the cross-sectional view for showing the action example of chuck table.
Fig. 7 is the enlarged drawing for showing the action example of adjustment member shown in fig. 6.
Fig. 8 is the perspective view for showing the structural example of chuck table of the 2nd embodiment.
Fig. 9 is the perspective view for showing the example that ring-shaped frame is mounted on chuck table.
Label declaration:
1: cutting apparatus；
10A, 10B: chuck table；
11: table base；
12: workbench main body；
121: retaining surface；
13A: frame support member；
131A, 131B: frame supporting part；
131a: through hole；
131b: internal screw thread；
131c: opening portion；
132: base portion；
132a: support column；
133: permanent magnet；
134A, 134B: positioning member；
15: adjustment member；
151: adjustment bolt；
151a: external screw thread；
151b: head；
151c: through hole；
152: fixing bolt；
152a: front end；
152b: head；
21,31: cutting tip.
Specific embodiment
Referring to attached drawing, mode for carrying out the present invention (embodiment) is described in detail.The present invention is not limited to
The content recorded in following embodiment.In addition, in the structural element recorded below, including those skilled in the art are easy
The structural element and structural element of the same nature expected.In addition, can suitably carry out group to the structure recorded below
It closes.In addition, without departing from the spirit and scope of the invention, various omissions, displacement or the change of structure can be carried out.
(embodiment 1)
Fig. 1 is the perspective view for showing the structural example of cutting apparatus of the 1st embodiment.Fig. 2 shows chuck table
The perspective view of structural example.Fig. 3 is the perspective view for showing the example that ring-shaped frame is mounted on chuck table.Fig. 4 is in Fig. 3
Shown in the cross-sectional view observed at A-A arrow.Fig. 5 is the enlarged drawing for showing the structural example of adjustment member shown in Fig. 4.Fig. 6 is
The cross-sectional view of the action example of chuck table is shown.Fig. 7 is the enlarged drawing for showing the action example of adjustment member shown in fig. 6.
As shown in Figure 1, cutting apparatus 1 is configured to include chuck table 10A, the 1st cutting member 20, the 2nd cutting member
30, the 1st mobile member 40, the 2nd mobile member 50 and movable workbench component 60.
Chuck table 10A is configured to, can be around parallel relative to vertical direction by rotating member (not shown)
Axis rotated, that is to say, that can be rotated in the horizontal plane.Chuck table 10A attracting holding is as processed
The wafer W of object.
1st cutting member 20 cuts the wafer W being held on chuck table 10A.1st cutting member 20 tool
Standby cutting tip 21, main shaft 22 and shell 23.Cutting tip 21 cuts off wafer W from a side to which wafer W to be divided into one by one
Chip.Main shaft 22 installs cutting tip 21 in a manner of assemble and unassemble.Shell 23 has the driving sources such as motor, around Y direction
Rotary shaft rotatably freely supporting spindle 22.
2nd cutting member 30 is configured to identical as the 1st cutting member 20, to the crystalline substance being held on chuck table 10A
Piece W is cut.2nd cutting member 30 has cutting tip 31, main shaft 32 and shell 33.Cutting tip 31 is cut off from another party
Wafer W is to be divided into chip one by one for wafer W.Main shaft 32 installs cutting tip 31 in a manner of assemble and unassemble.Shell 33
With driving sources such as motors, around rotary shaft rotatably freely supporting spindle 32 of Y direction.
1st mobile member 40 is the mobile member for moving the 1st cutting member 20 along Y-axis and Z-direction, has Y-axis
Movable plate 41 and Z axis movable plate 42.Y-axis moving plate 41 engages with the ball-screw extended parallel to relative to Y direction, passes through
The driving source being made of pulse motor etc. is moved along the direction close and separate relative to the 2nd cutting member 30.Z axis is mobile
Plate 42 engages with the ball-screw extended parallel to relative to Z-direction, by the driving source being made of pulse motor etc., along
The direction close and separate relative to chuck table 10A is mobile.
2nd mobile member 50 is the mobile member for moving the 2nd cutting member 30 along Y-axis and Z-direction, has Y-axis
Movable plate 51 and Z axis movable plate 52.Y-axis moving plate 51 engages with the ball-screw extended parallel to relative to Y direction, passes through
The driving source being made of pulse motor etc. is moved along the direction close and separate relative to the 1st cutting member 20.Z axis is mobile
Plate 52 engages with the ball-screw extended parallel to relative to Z-direction, by the driving source being made of pulse motor etc., along
The direction close and separate relative to chuck table 10A is mobile.
Movable workbench component 60 has the movable workbench pedestal 61 for supporting chuck table 10A.Workbench moves
Moving base 61 engages with the ball-screw extended parallel to relative to X-direction, by the driving source being made of pulse motor etc.,
It is moved along X-direction to be configured on the machining area of the 1st cutting member 20 and the 2nd cutting member 30.
Then, the structural example of chuck table 10A is described in detail.As shown in Fig. 2, chuck table 10A has
Table base 11, workbench main body 12, frame support member 13A and adjustment member 15 (referring to Fig. 4 etc.).Table base 11
Be formed as cylindric, and be fixed on the movable workbench pedestal 61 of apparatus main body 2.
Workbench main body 12 is detachably fixed on the upper end of table base 11, is had brilliant for attracting holding
The retaining surface 121 of piece W.Wafer W shown in Fig. 3 is supported in the opening of ring-shaped frame 6A by means of splicing tape 7A.For example, bonding
It is so-called be referred to as with the guard block that 7A is on the face with the face opposite side for being formed with device being attached in wafer W
The component of cutting belt.One side in the two sides of splicing tape 7A is equipped with bonding agent, attaches wafer W on the bonding plane equipped with bonding agent
With ring-shaped frame 6A.There is the splicing tape with scalability and (such as the PET of the splicing tape without scalability in splicing tape 7A
Substrate).The retaining surface 121 of workbench main body 12 is connected to vacuum attraction source (not shown), using vacuum attraction source negative pressure from
The non-stick junction attracting holding wafer W of the splicing tape 7A of ring-shaped frame 6A.
Frame support member 13A is fixed in table base 11, with the periphery support ring shape frame of workbench main body 12
6A.Frame support member 13A has frame supporting part 131A and base portion 132.Frame supporting part 131A is formed as cricoid plate
Shape has permanent magnet 133 on the region being located at for ring-shaped frame 6A, and has positioning member 134A, the positioning structure
Part 134A loads ring-shaped frame 6A with the center of the center Alignment stage main body 12 of ring-shaped frame 6A.With 90 °
Phase is provided with permanent magnet 133 on 4 positions of the upper surface of frame supporting part 131A, the permanent magnet 133 using magnetic force come
Attract the ring-shaped frame 6A of magnet, thus frame supporting part 131A supports ring-shaped frame 6A.Positioning member 134A is in overshooting shape
Be formed on 2 positions with defined interval of the upper surface edge of frame supporting part 131A, and with ring-shaped frame 6A
Periphery abut and make the center of wafer W Alignment stage main body 12.
Base portion 132 is made of 3 support column 132a being fixed on table base 11.3 support column 132a from
The top of columned table base 11 is with the upper surface of 120 ° of phase and workbench main body 12 in parallel with defined length
Degree extends radially setting.Defined interval is equipped between 3 support column 132a and workbench main body 12.
Frame supporting part 131A is fixed in base portion 132 by means of adjustment member 15, and the adjustment member 15 is vertical
In adjusting position in the short transverse of the retaining surface 121 of workbench main body 12.Be formed as the frame supporting part of cricoid plate shape
131A surrounds workbench main body 12, and is fixed on the support column 132a of base portion 132 by adjustment member 15 with 3 points.?
3 through hole 131a are equipped with 120 ° of phases identical with the extended phase of support column 132a on frame supporting part 131A.
Through hole 131a engages with adjustment member 15.As shown in figure 5, being formed with internal screw thread 131b and aperture efficiency in through hole 131a
The big opening portion 131c of the inner circumferential of internal screw thread 131b.
Adjustment member 15 has adjustment bolt 151 and fixing bolt 152.Adjustment bolt 151 has external screw thread 151a, head
Through hole 151c at 151b and inner circumferential.The internal screw thread of the external screw thread 151a and frame supporting part 131A of adjustment bolt 151
131b is screwed togather, and the head 151b of adjustment bolt 151 is abutted with the upper surface of the support column 132a of base portion 132, adjusts spiral shell
Bolt 151 is in the state being sandwiched between frame supporting part 131A and base portion 132.Adjustment bolt 151 is respectively and set on frame
Through hole 131a on 3 positions of supporting part 131A is screwed togather, bearing of the frame supporting part 131A three-point support in base portion 132
On column 132a.Adjustment member 15 by adjusting the external screw thread 151a and frame supporting part 131A of bolt 151 internal screw thread 131b spiral shell
The length of conjunction, to adjust height of the frame supporting part 131A relative to the retaining surface 121 of workbench main body 12.That is, by exchanging
The depth of whole bolt 151 being threaded into is adjusted, and is supported on the height phase of the ring-shaped frame 6A on frame supporting part 131A
The retaining surface 121 of workbench main body 12 is located on desired position.For example, as shown in Figures 4 and 5, being adjusted if increased
The length that the internal screw thread 131b of the external screw thread 151a and frame supporting part 131A of whole bolt 151 are screwed togather, then frame supporting part 131A
Decline, the difference of height between the height of ring-shaped frame 6A and the retaining surface 121 of workbench main body 12 become larger, and being adapted for use with has
The case where splicing tape 7A of scalability.In addition, as shown in FIG. 6 and 7, if shorten adjustment bolt 151 external screw thread 151a with
The length that the internal screw thread 131b of frame supporting part 131A is screwed togather, then frame supporting part 131A rises, can be by ring-shaped frame 6A's
Difference of height between height and the retaining surface 121 of workbench main body 12 is set as zero, is adapted for use with viscous without scalability
The case where tape splicing 7A.In this way, by the depth being threaded into when adjustment bolt 151 to be screwed into frame supporting part 131A into
Row adjustment, ring-shaped frame 6A can be micro-adjusted relative to the position of the height of the retaining surface 121 of workbench main body 12.When
So, in the case where needing to adjust the height of frame supporting part 131A according to the presence or absence of scalability, replacement frame branch is not needed
Bearing portion 131A.In addition, when adjusting the height of frame supporting part 131A, it, can by adjusting 3 positions using adjustment member 15
The height of complete cycle is adjusted, can be adjusted with the number of working processes of bottom line.Frame is adjusted using adjustment bolt 151
After height of the supporting part 131A relative to the retaining surface 121 of workbench main body 12, by fixing bolt 152 by frame supporting part
131A is fixed on the support column 132a of base portion 132.
Fixing bolt 152 is inserted from above into the adjustment bolt 151 screwed togather with the internal screw thread 131b of frame supporting part 131A
Through hole 151c in, the support column 132a of front end 152a and base portion 132 is screwed togather and head 152b and frame supporting part
The edge of the opening portion 131c of 131A abuts, thus the support column 132a of fixed frame supports portion 131A and base portion 132.It is set to
The diameter of the through hole 151c of the inner circumferential of adjustment bolt 151 is designed to bigger than the diameter of the front end 152a of fixing bolt 152,
In the state that the front end 152a of fixing bolt 152 is inserted into the through hole 151c of adjustment bolt 151, in through hole 151c
There are gaps between the 152a of front end.Fixing bolt 152, which is inserted respectively into, to be screwed togather with 3 positions of frame supporting part 131A
In the through hole 151c of adjustment bolt 151, frame supporting part 131A three-point mount is on the support column 132a of base portion 132.According to
This, is set so as to using adjustment member 15 by the ring-shaped frame 6A that frame supporting part 131A is supported relative to workbench main body
12 retaining surface 121 carries out height adjustment.
Then, the movement of adjustment member 15 is illustrated.Specifically, about to being attached at the bonding with scalability
After carrying out machining with the wafer W on 7A, using identical chuck table 10A to being attached at the bonding without scalability
The case where carrying out machining with the wafer W on 7A is illustrated.Firstly, unloading from frame supporting part 131A with scalability
The ring-shaped frame 6A of splicing tape 7A.Then, screwing togather for the fixing bolt 152 at 3 positions is released.The fixing bolt 152 at 3 positions
Frame supporting part 131A is fixed on the support column 132a of base portion 132 by means of the adjustment bolt 151 of adjustment member 15.Solution
Except after the screwing togather of fixing bolt 152, for the adjustment bolt 151 at 3 positions screwed togather with frame supporting part 131A, to reduce spiral shell
The mode of line the amount of screwing is adjusted.For example, releasing screwing togather for the adjustment bolt 151 at a certain amount of 3 positions, frame is supported
Portion 131A is positioned on the support column 132a of base portion 132, and so that frame supporting part 131A height and workbench main body
The consistent mode of 12 height, is adjusted the amount of being threaded into of adjustment bolt 151.To being threaded into for adjustment bolt 151
After amount is adjusted, fixing bolt 152 is inserted into the through hole 151c with the frame supporting part 131A adjustment bolt 151 screwed togather
In, frame supporting part 131A is fixed on support column 132a.After fixed frame supports portion 131A, it will be provided with not having scalability
Splicing tape 7A ring-shaped frame 6A configure on frame supporting part 131A.Accordingly, as shown in fig. 6, frame branch will be supported in
It is zero that ring-shaped frame 6A on bearing portion 131A, which is configured to the difference of height between the retaining surface 121 of workbench main body 12, so as to
It is enough to use the splicing tape 7A without scalability.In addition, passing through when the height to frame supporting part 131A is adjusted
The depth of the adjustment bolt 151 for being set to 3 positions being threaded into is adjusted, the whole of frame supporting part 131A can be adjusted
The height in week, therefore the number of working processes of bottom line is only needed, it can be improved operating efficiency.
In this way, generating effect as follows: due to being configured to frame according to the chuck table 10A of the 1st embodiment
The height of frame supporting part 131A is adjusted, therefore being capable of retaining surface 121 to ring-shaped frame 6A relative to workbench main body 12
The position of height be micro-adjusted, and when being adjusted to ring-shaped frame 6A relative to the position of retaining surface 121,
Replacement frame supporting part 131A is not needed.
In addition, as shown in fig. 6, the size of wafer W is limited in the case where ring-shaped frame 6A not being pulled down fixed
The control of cutting tip 21,31 so that cutting tip 21,31 will not be contacted with ring-shaped frame 6A, and is rising by small size
To ring-shaped frame 6A.
(embodiment 2)
Then, the chuck table of the 2nd embodiment is illustrated.Fig. 8 is the chucking work for showing the 2nd embodiment
The perspective view of the structural example of platform.Fig. 9 is the perspective view for showing the example that ring-shaped frame is mounted on chuck table.For with
The identical structure of the chuck table 10A of the 1st above-mentioned embodiment marks identical label, and omits specifically to it
It is bright.
Chuck table 10B has frame supporting part 131B, and the frame supporting part 131B is by the finishing of cutting tip 21,31
(dressing) finishing member 8 used when supports together with the ring-shaped frame 6B of rectangle.The ring-shaped frame 6B of rectangle is by parallel
2 line segments and connect the line segment end arc sections constitute.The ring-shaped frame 6B of rectangle and circular ring-shaped frame 6A phase
Than becoming the shape for the arc sections being cut off at two, therefore the quilt can be equivalent in circular frame supporting part 131B
Region for supporting finishing member 8 is set on the part for the arc sections cut away.
Frame supporting part 131B is inhaled with the finishing member distributing area 8a for installing finishing member 8 and with finishing member
Draw the attraction piping 8b of region 8a connection.Piping 8b is attracted to apply negative pressure by vacuum attraction source (not shown), using the negative pressure,
Attracting holding finishing member 8 on finishing member distributing area 8a.In addition, it is formed with slot on finishing member distributing area 8a, benefit
Finishing member 8 will not be made in finishing hour offset with the slot.
Frame supporting part 131B has positioning member 134B.Positioning member 134B is to provide above-mentioned finishing member suction zone
The mode of domain 8a is in overshooting shape ground at 2 positions with defined interval in the upper surface edge of frame supporting part 131B
On.Positioning member 134B is abutted with the straight line portion of the ring-shaped frame 6B of rectangle, is made in wafer W Alignment stage main body 12
Centre.In addition, the direction of setting chuck table 10B, so that the direction of the straight line portion of the ring-shaped frame 6B of rectangle and cutting
The X-direction of device is parallel.Accordingly, although it is right using finishing member 8 in the state that wafer W is positioned in chuck table main body
Cutting tip is modified, and ring-shaped frame 6B will not interfere cutting tip.
In this way, according to the chuck table 10B of the 2nd embodiment there is finishing member 8 used in modifying to prop up together
The frame supporting part 131B held, therefore when carrying out the machining of wafer W, it is able to use frame branch identical with machining
Bearing portion 131B carries out the dressing operation of cutting tip 21,31, can be improved operating efficiency.
In addition, about ring-shaped frame 6B shown in Fig. 9, although in the direction that its straight line portion is abutted with positioning member 134B
It is upper to be easy to carry out position alignment, still, for the direction that the straight line portion of abutting slides, due to position be not prescribed without
Easily carry out position alignment.Therefore, two are supplied respectively although it is not shown, being still equipped on the straight line portion of the ring-shaped frame 6B of rectangle
Position pair when the recess portion that the positioning member 134B at place is fitted into, on the direction of the straight line portion sliding of the ring-shaped frame 6B of abutting
Standard becomes easy.
Claims (3)
1. a kind of chuck table of cutting apparatus, attracting holding machined object, the machined object are propped up by means of splicing tape
Hold the opening in ring-shaped frame, which is characterized in that
The chuck table has:
Workbench main body is detachably fixed on the table base of the cutting apparatus, and is had for protecting
Hold the retaining surface of machined object；And
Frame support member is fixed on the table base, supports the ring in the periphery of the workbench main body
Shape frame；
The frame support member includes
Base portion is fixed on the table base；And
Frame supporting part is fixed in the base portion by means of adjustment member, and the adjustment member is perpendicular to the guarantor
It holds and adjusts position in the short transverse in face,
It is supported on the holding of the height of the ring-shaped frame on the frame supporting part relative to the workbench main body
Face is located on desired position,
The frame supporting part is formed as cyclic annular, and surrounds the workbench main body, and by three solid point of adjustment member
Due in the base portion,
The adjustment member is made of adjustment bolt and fixing bolt,
The adjustment bolt and the internal screw-thread screw for penetrating through the frame supporting part, and there is through hole in inner circumferential,
The fixing bolt be inserted into in the through hole of the adjustment bolt of the internal screw-thread screw, and it is described solid
The front end and the base portion for determining bolt screw togather,
The adjustment member adjusts the frame supporting part by the adjustment bolt and the length of the internal screw-thread screw
Highly.
2. the chuck table of cutting apparatus according to claim 1, which is characterized in that
The frame supporting part has permanent magnet on the region that the ring-shaped frame is located at, and has positioning member, should
Positioning member makes the center of the ring-shaped frame be directed at the center of the workbench main body and be loaded.
3. the chuck table of cutting apparatus according to claim 1, which is characterized in that
The finishing member used when the frame supporting part is by the finishing of cutting tip supports together with the ring-shaped frame.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014099762A JP6325335B2 (en) | 2014-05-13 | 2014-05-13 | Chuck table of cutting equipment |
| JP2014-099762 | 2014-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105097613A CN105097613A (en) | 2015-11-25 |
| CN105097613B true CN105097613B (en) | 2019-04-26 |
Family
ID=54577752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510240561.3A Active CN105097613B (en) | 2014-05-13 | 2015-05-13 | The chuck table of cutting apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6325335B2 (en) |
| KR (1) | KR102234975B1 (en) |
| CN (1) | CN105097613B (en) |
| TW (1) | TWI644769B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6579930B2 (en) * | 2015-11-27 | 2019-09-25 | 株式会社ディスコ | Processing equipment |
| JP2017157748A (en) * | 2016-03-03 | 2017-09-07 | 株式会社ディスコ | Cutting device |
| JP6817725B2 (en) * | 2016-06-07 | 2021-01-20 | 株式会社ディスコ | Chuck table |
| JP2018125492A (en) * | 2017-02-03 | 2018-08-09 | 株式会社ディスコ | Chuck table of processing device |
| JP6797043B2 (en) * | 2017-02-08 | 2020-12-09 | 株式会社ディスコ | Chuck table of processing equipment |
| JP7394712B2 (en) * | 2020-06-24 | 2023-12-08 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut products |
| JP2022077172A (en) * | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | Grinding device |
| KR102273359B1 (en) | 2020-12-04 | 2021-07-06 | (주)네온테크 | Dicing Device Capable, Manufacturing Method Thereof And Inspecting Method of Step Cut Electronic Chips |
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| JP2008300556A (en) * | 2007-05-30 | 2008-12-11 | Disco Abrasive Syst Ltd | Frame clamp |
| JP2009141231A (en) * | 2007-12-10 | 2009-06-25 | Disco Abrasive Syst Ltd | Frame clamping apparatus |
| JP2010021464A (en) * | 2008-07-14 | 2010-01-28 | Disco Abrasive Syst Ltd | Chuck table of working device |
| CN103531516A (en) * | 2012-07-03 | 2014-01-22 | 株式会社迪思科 | Chuck table mechanism of cutting apparatus |
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| JP4632313B2 (en) * | 2006-05-18 | 2011-02-16 | リンテック株式会社 | Pasting device and pasting method |
| JP5269522B2 (en) * | 2008-08-27 | 2013-08-21 | キヤノンマシナリー株式会社 | Expanding device |
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2014
- 2014-05-13 JP JP2014099762A patent/JP6325335B2/en active Active
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2015
- 2015-04-09 TW TW104111424A patent/TWI644769B/en active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300556A (en) * | 2007-05-30 | 2008-12-11 | Disco Abrasive Syst Ltd | Frame clamp |
| JP2009141231A (en) * | 2007-12-10 | 2009-06-25 | Disco Abrasive Syst Ltd | Frame clamping apparatus |
| JP2010021464A (en) * | 2008-07-14 | 2010-01-28 | Disco Abrasive Syst Ltd | Chuck table of working device |
| CN103531516A (en) * | 2012-07-03 | 2014-01-22 | 株式会社迪思科 | Chuck table mechanism of cutting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015216324A (en) | 2015-12-03 |
| TW201600283A (en) | 2016-01-01 |
| KR20150130234A (en) | 2015-11-23 |
| KR102234975B1 (en) | 2021-03-31 |
| CN105097613A (en) | 2015-11-25 |
| TWI644769B (en) | 2018-12-21 |
| JP6325335B2 (en) | 2018-05-16 |
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