TW201417951A - Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine - Google Patents
Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine Download PDFInfo
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- TW201417951A TW201417951A TW102130043A TW102130043A TW201417951A TW 201417951 A TW201417951 A TW 201417951A TW 102130043 A TW102130043 A TW 102130043A TW 102130043 A TW102130043 A TW 102130043A TW 201417951 A TW201417951 A TW 201417951A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
本發明係有關於薄盤形工作件之載體裝置及其製造方法與雙邊研磨機，且更特別的是，有關於工作件旋轉支撐技術用於徑向定位工作件的圓形外周，以及在機械加工薄盤形工作件(例如，半導體晶圓)之正面及/或反面時旋轉及驅動該工作件。 The present invention relates to a carrier device for a thin disk-shaped work piece and a method of manufacturing the same, and a double-sided grinder, and more particularly to a circular outer periphery of a work piece rotating support technology for radially positioning a work piece, and a machine The workpiece is rotated and driven while the front and/or back of the thin disk-shaped workpiece (eg, a semiconductor wafer) is being processed.
例如，半導體晶圓用由單晶矽製成之柱狀半導體錠料(ingot)製造以及切成薄片，以及用研磨機或拋光機機械加工其表面及相反側，以及修整成平滑的表面。 For example, a semiconductor wafer is fabricated and cut into sheets by a columnar semiconductor ingot made of single crystal germanium, and its surface and the opposite side are machined by a grinder or a polisher, and trimmed to a smooth surface.
在薄盤形工作件(例如，半導體晶圓，以下稱作工作件)的研磨或拋光工作中，在旋轉及支承工作件時，機械加工正面及/或反面，以及例如，日本早期公開專利第2003-71704號揭示一種研磨半導體晶圓之表面及相反側的雙邊研磨機。 In the grinding or polishing work of a thin disk-shaped work piece (for example, a semiconductor wafer, hereinafter referred to as a work piece), the front side and/or the back side are machined while rotating and supporting the work piece, and, for example, Japanese Early Patent Publication No. No. 2003-71704 discloses a bilateral grinder for grinding the surface of a semiconductor wafer and the opposite side.
在揭示於日本早期公開專利第2003-71704號的雙邊研磨機中，載體裝置a的環形載環(annular carrier ring)b 可旋轉地配置於未圖示的框架上。在載環b的一內周側處，配置一對固定載體c，以及在另一內周側，配置在水平平面可繞著支撐軸e旋轉的一對活動載體d，以及用這幾對固定、活動載體c、d、...，使工作件(晶圓)W位於徑向，以及構成用於旋轉及支撐的載體主體。工作件W可拆卸地保持在載體c、d、...的內周區中。工作件W以被來自未圖示空氣軸承設備之空氣上舉的狀態容納及支援於載環b中。 In the bilateral grinder disclosed in Japanese Laid-Open Patent Publication No. 2003-71704, the annular carrier ring b of the carrier device a It is rotatably arranged on a frame (not shown). At a inner peripheral side of the carrier ring b, a pair of fixed carriers c are disposed, and on the other inner peripheral side, a pair of movable carriers d which are rotatable about a support axis e in a horizontal plane are disposed, and are fixed by the pairs The movable carriers c, d, ... place the workpiece (wafer) W in the radial direction and constitute a carrier body for rotation and support. The work piece W is detachably held in the inner peripheral area of the carriers c, d, . The work piece W is housed and supported in the carrier ring b in a state of being lifted by air from an air bearing device not shown.
彈簧f鉤在活動載體d、d之間，以及用此彈簧f可旋轉地強迫活動載體d、d至工作件W側，以及工作件W鬆弛地保持接近工作件W的狀態。在載環b上，配置未圖示的致動器，以及在帶進或帶出工作件W時，此致動器工作以在載環b的外周向以反抗彈簧f之推力的方式旋轉活動載體d、d，以及工作件W由保持狀態鬆開。 The spring f is hooked between the movable carriers d, d, and the spring f is used to rotatably force the movable carriers d, d to the side of the work piece W, and the work piece W is loosely held close to the work piece W. On the carrier ring b, an actuator (not shown) is disposed, and when the workpiece W is brought in or taken out, the actuator operates to rotate the movable carrier in the outer circumferential direction of the carrier ring b against the thrust of the spring f. d, d, and the work piece W are released from the hold state.
順便一提，工作件W是以載體c、d的內周位置之間有些許間隙的方式保持，亦即，在固定載體c、c與活動載體d、d的內周緣之間。 Incidentally, the work piece W is held in such a manner that there is a slight gap between the inner circumferential positions of the carriers c, d, that is, between the fixed carriers c, c and the inner periphery of the movable carriers d, d.
為了定位於這對固定載體c、c之間，在載環b的一內周側安裝及固定一缺口觸發器g，在前端部，形成構成平面三角點邊(plane triangular pointed edge)的尖端接合部h。當工作件W保持在固定載體c、活動載體d之間，缺口觸發器g的尖端接合部h與缺口Wn接合作為工作件W外周上的切口部份(cut portion)。在此狀態下，用未圖示之馬達旋轉載環b，以及工作件W通過該缺口觸發器g一體地旋轉。 In order to be positioned between the pair of fixed carriers c, c, a notch trigger g is mounted and fixed on an inner peripheral side of the carrier ring b, and a tip joint constituting a plane triangular pointed edge is formed at the front end portion. Department h. When the work piece W is held between the fixed carrier c and the movable carrier d, the tip joint portion h of the notch trigger g is engaged with the notch Wn as a cut portion on the outer circumference of the work piece W. In this state, the carrier ring b is rotated by a motor (not shown), and the workpiece W is integrally rotated by the notch trigger g.
在載體裝置a的上、下表面，配置一對杯形研磨 輪i、i和使它們旋轉的馬達j、j以便可在饋送方向抵頂載體裝置a地移動。 On the upper and lower surfaces of the carrier device a, a pair of cup-shaped grinding is arranged The wheels i, i and the motors j, j which rotate them so as to be movable in the feeding direction against the top carrier means a.
在工作件W保持於載體裝置a中的狀態下，藉由載環b的旋轉，工作件W通過缺口觸發器g而旋轉，以及研磨輪i、i旋轉，以及深切割(cut deep)且移向工作件W的表面及相反側。藉此此一饋送運動，研磨輪i、i同時研磨工作件W的表面及相反側。 In a state where the workpiece W is held in the carrier device a, the workpiece W is rotated by the notch trigger g by the rotation of the carrier ring b, and the grinding wheels i, i are rotated, and the cut deep and moved To the surface of the workpiece W and the opposite side. With this feeding motion, the grinding wheels i, i simultaneously grind the surface and the opposite side of the workpiece W.
此外，如日本早期公開專利第H11-333707號所揭示的，在平滑地拋光或磨光半導體晶圓之表面的加工技術中，載體c、d、...與缺口觸發器g可以形成為一整件。 Further, as disclosed in Japanese Laid-Open Patent Publication No. H11-333707, in the processing technique of smoothly polishing or polishing the surface of a semiconductor wafer, the carriers c, d, ... and the notch trigger g may be formed as one. Whole.
不過，在載體裝置的此類習知組態中，已知有下列問題，而且已有人想要做進一步的改善。 However, in such conventional configurations of carrier devices, the following problems are known and others have been desired to make further improvements.
(1)與工作件W接觸的載體c、d、...及缺口觸發器g會隨著時間而磨損，而且應作為耗材部件而定期更換，但是部件數大而且結構複雜，以及難以降低成本。 (1) The carriers c, d, ... and the notch trigger g which are in contact with the work piece W are worn out over time, and should be periodically replaced as a consumable part, but the number of parts is large and the structure is complicated, and it is difficult to reduce the cost. .
特別是，由於構成載體主體的多個固定、活動載體c、d、...有徑向定位工作件W的功能，以及原則上，是整批地更換該等部件，但是很花錢。 In particular, since the plurality of fixed and movable carriers c, d, ... constituting the carrier body have the function of radially positioning the workpiece W, and in principle, the components are replaced in batches, but it is expensive.
(2)用作工作件W之旋轉驅動用板的缺口觸發器g比載體c、d、...更嚴重地磨損，而且更換更頻繁，以及大體形成為與載體主體獨立的部件，以及它的底端部份安裝及固定於載環b上，以及在固定載體c、c之間徑向向內突出，以及與工作件W的缺口Wn接合。不過，在這種組態中，缺口觸發器g由載環b徑向向內突出作為安裝部，以及被支 撐成跟懸臂一樣，以及在缺口觸發器g有負載時可能顯著地偏折，結果，工作件W可能與缺口觸發器g一起偏折，或工作件W與缺口觸發器g的接合狀態可能鬆開，以及工作件W可能破裂，以及可能形成不良部件，或研磨輪i、i可能破裂，以及已知的其他問題。 (2) The notch trigger g used as the rotary drive plate of the work piece W is more severely worn than the carriers c, d, ..., and is replaced more frequently, and is formed substantially as a separate member from the carrier body, and it The bottom end portion is mounted and fixed to the carrier ring b, and projects radially inwardly between the fixed carriers c, c and engages the notch Wn of the workpiece W. However, in this configuration, the notch trigger g protrudes radially inward from the carrier ring b as a mounting portion, and is supported The support is the same as the cantilever, and may be significantly deflected when the notch trigger g is loaded. As a result, the work piece W may be deflected together with the notch trigger g, or the engagement state of the work piece W and the notch trigger g may be loose. Opening, and the work piece W may be broken, and may form a defective part, or the grinding wheel i, i may be broken, and other problems known.
特別是，當使用直徑較大的研磨輪i、i以便增強研磨效率及研磨精度時，為了防止研磨輪i、i相互干擾，也增加載環b的直徑，以及極力延長缺口觸發器g的長度，以及該等問題變得更突出。 In particular, when the grinding wheels i, i having a large diameter are used in order to enhance the grinding efficiency and the grinding precision, in order to prevent the grinding wheels i and i from interfering with each other, the diameter of the carrier ring b is also increased, and the length of the notch trigger g is extended as much as possible. And these issues have become more prominent.
(3)缺口觸發器g比工作件W薄，而且需要剛性材料，但是目前，是形成如專利文獻1所揭示的特殊積層結構，或藉由切割工程塑膠(例如，PEEK(聚醚醚酮)樹脂)以建立必要的厚度，以及材料成本及製造成本很高，以及作為耗材部件是昂貴的部件。 (3) The notch trigger g is thinner than the work piece W, and requires a rigid material, but at present, it is formed into a special laminated structure as disclosed in Patent Document 1, or by cutting engineering plastics (for example, PEEK (polyether ether ketone)) Resin) is necessary to establish the necessary thickness, as well as material cost and manufacturing cost, and is an expensive component as a consumable component.
(4)包圍工作件W外周的載體主體為由多個固定、活動載體c、d、...組成的分體式結構，以及每個板體有可能扭曲、偏折或變形，這對研磨製程中的工作件W有不利影響，而且難以增強研磨精度。 (4) The carrier body surrounding the outer periphery of the workpiece W is a split structure composed of a plurality of fixed and movable carriers c, d, ..., and each plate body may be twisted, deflected or deformed, which is a grinding process The work piece W has an adverse effect and it is difficult to enhance the grinding precision.
(5)或者，如日本早期公開專利第H11-333707號所揭示的，在形成載體c、d、...及缺口觸發器g成為整體件的結構中，如果缺口觸發器部份首先因磨耗嚴重而磨損，整體成形載體主體與缺口觸發器必須整批全部更換，或為了延長整體件的使用壽命，構成材料必須換成適於缺口觸發器的材料，而增加材料成本。 (5) Or, as disclosed in Japanese Laid-Open Patent Publication No. H11-333707, in the structure in which the carriers c, d, ... and the notch trigger g are formed as a single piece, if the notch trigger portion is first worn Severe and worn, the integrally formed carrier body and the notch trigger must be completely replaced in batches, or in order to extend the service life of the integral piece, the constituent material must be replaced with a material suitable for the notch trigger, thereby increasing the material cost.
因此，本發明的主要目標是要提供一種薄盤形工作件的新穎載體裝置，其係能夠成功解決該等習知問題。 Accordingly, it is a primary object of the present invention to provide a novel carrier device for a thin disk shaped workpiece that is capable of successfully solving such conventional problems.
本發明的另一目標是要提供一種結構簡單便宜的載體裝置，其係在機械加工薄盤形工作件(例如，半導體晶圓)之正面及/或反面時能夠高效率及高精度地加工。 Another object of the present invention is to provide a carrier device that is simple and inexpensive in construction that can be processed with high efficiency and precision when machining the front and/or back of a thin disk-shaped workpiece (e.g., a semiconductor wafer).
本發明的另一目標是要提供一種載體裝置之製造方法，其係能夠以低成本製造載體裝置。 Another object of the present invention is to provide a method of manufacturing a carrier device which is capable of manufacturing a carrier device at low cost.
本發明的另一目標是要提供一種雙邊研磨機，其係具有該載體裝置作為構成設備，以及能夠高效率及高精度地研磨薄盤形工作件(例如，半導體晶圓)的表面及相反側。 Another object of the present invention is to provide a bilateral grinding machine having the carrier device as a constituent device and capable of grinding the surface and the opposite side of a thin disk-shaped workpiece (for example, a semiconductor wafer) with high efficiency and high precision. .
本發明薄盤形工作件之載體裝置的組態係有關於一種研磨或拋光工作件之至少一面同時支撐及旋轉薄盤形工作件的裝置，更特別的是，一種構成旋轉支撐設備的載體裝置用於旋轉及驅動工作件同時支撐工作件的圓形外周，其係包含：圓形內周緣緊緊地包圍該工作件之整個圓周的一環形載體主體，以及有一尖端接合部將會與設於該工作件之圓形外周緣之一切口部份接合的一缺口觸發器，兩者形成為一個整體件，其中該缺口觸發器為與載體主體獨立的部件，以便可置換和連結及固定成一體，以及該尖端接合部有徑向向內由該載體主體之圓形內周緣之一部份突出的一安裝結構。 The configuration of the carrier device of the thin disk-shaped work piece of the present invention relates to a device for simultaneously supporting and rotating a thin disk-shaped work piece on at least one side of a grinding or polishing work piece, and more particularly, a carrier device constituting a rotary support device a circular outer periphery for rotating and driving the workpiece while supporting the workpiece, the method comprising: a circular inner periphery tightly surrounding an entire circumference of the workpiece, an annular carrier body, and a tip joint portion to be provided with A notch trigger engaged by one of the circular outer peripheral edges of the working piece is formed as a single piece, wherein the notch trigger is a separate component from the carrier body so as to be replaceable, coupled and fixed. And the tip joint has a mounting structure projecting radially inwardly from a portion of the circular inner periphery of the carrier body.
數個較佳具體實施例包含下列組態。 Several preferred embodiments include the following configurations.
(1)該載體主體及該缺口觸發器的厚度經設定成比工作件的修整厚度(finishing thickness)薄，以及該缺口觸發器與該載體主體的連結及固定用可固定及分離的一黏著劑實現。 (1) The carrier body and the thickness of the notch trigger are set to be thinner than the finishing thickness of the workpiece, and an adhesive capable of fixing and separating the gap trigger and the carrier body for attachment and fixation achieve.
(2)在該載體主體上之該缺口觸發器安裝部經切割及形塑成其形狀對應至該缺口觸發器之該結合部的外輪廓形狀，以及塗佈該黏著劑於該缺口觸發器安裝部之該結合面上。 (2) the notch trigger mounting portion on the carrier body is cut and shaped into an outer contour shape whose shape corresponds to the joint portion of the notch trigger, and the adhesive is applied to the notch trigger mount The joint surface of the part.
(3)該缺口觸發器係由薄板構件構成而有三角形輪廓其中有一頂點形成為該尖端接合部以與該工作件之該切口部份接合，以及在該載體主體之該缺口觸發器安裝部中，在對應至該缺口觸發器之三角形輪廓之其餘兩個頂點的位置處形成用以避免應力集中的圓形凹槽。 (3) the notch trigger is formed of a thin plate member having a triangular profile in which a vertex is formed to engage the tip engagement portion with the slit portion of the work piece, and in the notch trigger mounting portion of the carrier body A circular groove for avoiding stress concentration is formed at a position corresponding to the remaining two vertices of the triangular profile of the notch trigger.
(4)該缺口觸發器之該尖端接合部有圓弧輪廓形狀，以及它的截面經設定成與該工作件之該切口部份的截面形狀對應。 (4) The tip joint portion of the notch trigger has a circular arc contour shape, and a cross section thereof is set to correspond to a sectional shape of the slit portion of the workpiece.
本發明薄盤形工作件之載體裝置的製造方法為適於製造該載體裝置的方法，以及包含步驟(a)至(c)如下。 The method of manufacturing the carrier device of the thin disk-shaped workpiece of the present invention is a method suitable for the production of the carrier device, and comprises the steps (a) to (c) as follows.
(a)清洗步驟，其係清洗及去脂該載體主體之缺口觸發器安裝部的結合面(junction surface)以及該缺口觸發器之結合部的結合面；(b)連結步驟，其係定位及保持該載體主體與該缺口觸發器的平行度，以及在塗佈該黏著劑時，黏著及連 結該載體主體之缺口觸發器安裝部的結合面與該缺口觸發器之結合部的結合面；以及(c)修整步驟，其係移除該載體主體與該缺口觸發器在該連結步驟連結成一體時由該等結合部露出的多餘黏著劑。 (a) a cleaning step of cleaning and debinding the bonding surface of the notch trigger mounting portion of the carrier body and the bonding surface of the joint of the notch trigger; (b) the joining step, which is positioned and Maintaining the parallelism of the carrier body with the gap trigger, and bonding and bonding when applying the adhesive a bonding surface of the joint surface of the notch trigger mounting portion of the carrier body and the joint of the notch trigger; and (c) a trimming step of removing the carrier body and the notch trigger at the joining step An excess adhesive that is exposed by the joints when integrated.
本發明薄盤形工作件的雙邊研磨機為一種機器用於旋轉及支撐一薄盤形工作件，饋送在研磨輪軸向高速旋轉的一對研磨輪，以及同時用這兩個研磨輪的研磨面研磨該工作件的表面及相反側，其係包含：一對研磨輪，彼等經配置成該等研磨面可彼此相對，以及一工作件旋轉支撐構件，其係用於在該工作件之表面及相反側在該對研磨輪的研磨面之間對著該等兩個研磨面的狀態下支撐及旋轉該工作件，其中該工作件旋轉支撐構件有用於軸向定位及支撐該工作件的一軸向支撐構件，以及用於徑向定位、旋轉及支撐該工作件的一徑向支撐構件，以及此徑向支撐構件具有該載體裝置。 The double side grinder of the thin disc-shaped working piece of the present invention is a machine for rotating and supporting a thin disc-shaped working piece, feeding a pair of grinding wheels rotating at a high speed in the axial direction of the grinding wheel, and simultaneously grinding the grinding surface of the two grinding wheels Grinding the surface of the workpiece and the opposite side, comprising: a pair of grinding wheels, which are configured such that the grinding surfaces are opposite to each other, and a workpiece rotating support member for use on the surface of the workpiece And the opposite side supports and rotates the workpiece between the grinding surfaces of the pair of grinding wheels against the two grinding surfaces, wherein the workpiece rotating support member has a shaft for axially positioning and supporting the workpiece An axial support member, and a radial support member for radially positioning, rotating, and supporting the work piece, and the radial support member has the carrier device.
本發明的載體裝置為用於支撐及旋轉薄盤形工作件以及研磨或拋光該工作件之至少一面的裝置，且更特別的是，一種構成工作件旋轉支撐裝置的載體裝置，該工作件旋轉支撐裝置用以旋轉及驅動同時定位及支撐該工作件之圓形外周，其係包含：圓形內周緣緊緊地包圍該工作件之整個圓周的一環形載體主體，以及有一尖端接合部將會與設於該工作件之圓形外周緣之一切口部份接合的一缺口觸發器，兩者形成為一個整體件，其中該缺口觸發器連 結及固定至該載體主體成一體成為獨立部件以便可置換，以及該尖端接合部有從該載體主體之圓形內周緣之一部份徑向向內突出的安裝結構，因而得到下列效益，以及保證以高效率及高精度機械加工的載體裝置有簡單便宜的結構。 The carrier device of the present invention is a device for supporting and rotating a thin disk-shaped workpiece and grinding or polishing at least one side of the workpiece, and more particularly, a carrier device constituting a workpiece rotation support device, the workpiece rotating The support device is configured to rotate and drive a circular outer periphery for simultaneously positioning and supporting the work piece, the method comprising: a circular inner peripheral edge tightly surrounding an entire circumference of the working member; and a tip joint portion a notch trigger engaged with one of the slit portions of the circular outer periphery of the workpiece, the two being formed as a single piece, wherein the notch trigger is connected And the carrier body is integrally formed as a separate component for replacement, and the tip joint has a mounting structure projecting radially inward from a portion of the circular inner periphery of the carrier body, thereby obtaining the following benefits, and A carrier device that ensures high-efficiency and high-precision machining has a simple and inexpensive structure.
(i)該環形載體主體緊緊地包圍該工作件的整個圓周，以及與該工作件之切口部份接合的該缺口觸發器形成為一個整體件，因而部件數少而結構簡單，以及在結構上可減少成本。 (i) the annular carrier body tightly surrounds the entire circumference of the workpiece, and the notch trigger engaged with the slit portion of the workpiece is formed as a single piece, thereby having a small number of parts and a simple structure, and in the structure Can reduce costs.
(ii)用於徑向定位該工作件之外周的載體主體形成為有圓形內周緣緊緊地包圍該工作件之整個圓周的連續環形形狀，因而相較於分體式結構的習知載體主體(參考圖8)，剛性較高，以及實現高精度的表面加工而對於工作件的加工精度沒有不利影響。 (ii) a carrier body for radially positioning the outer periphery of the workpiece is formed as a continuous annular shape having a circular inner circumference tightly surrounding the entire circumference of the workpiece, thus being compared to a conventional carrier body of a split structure (Refer to Fig. 8), the rigidity is high, and high-precision surface processing is achieved without adversely affecting the machining accuracy of the workpiece.
(iii)同樣，由於該載體主體呈環形及連續，相較於分體式結構的習知載體主體(參考圖8)，載體主體的製造有較小的加工扭曲，以及可有效地防止裝上載環時發生扭曲，以及在加工工作件時難以發生進一步的扭曲、偏折或變形，以及由此方面看，對於工作件的加工精度也沒有不利影響，以及實現高精度的表面加工。 (iii) Similarly, since the carrier body is annular and continuous, compared to the conventional carrier body of the split structure (refer to Fig. 8), the carrier body is manufactured with less processing distortion and can effectively prevent the loading ring from being mounted. Distortion occurs, and further distortion, deflection, or deformation is less likely to occur during processing of the workpiece, and thus, there is no adverse effect on the machining accuracy of the workpiece, and high-precision surface machining is achieved.
(iv)該缺口觸發器為與載體主體獨立的部件而且可置換以及連結及固定成一體，因而為可用於缺口觸發器及載體主體的最佳組成材料，以及可整體減少結構的材料成本。 (iv) The notch trigger is a separate component from the carrier body and is replaceable and coupled and fixed integrally, thereby being an optimum constituent material for the notch trigger and the carrier body, and overall reducing the material cost of the structure.
特別是，強度高及耐磨損性優異的材料可以只用於當作工作件之旋轉及驅動構件而嚴重磨損和經常更換的缺口觸發器，因而使用昂貴的材料可抑制至最小極限，以及整體可減少材料成本。 In particular, materials with high strength and excellent wear resistance can be used only as notched triggers which are severely worn and frequently replaced as rotating and driving members of the workpiece, so that the use of expensive materials can be suppressed to the minimum limit, and the whole Can reduce material costs.
(v)此外，該缺口觸發器為與載體主體獨立的部件而且可置換以及連結及固定成一體，因此當缺口觸發器提早磨損時，可以只換缺口觸發器，同時可繼續使用載體主體直到它的使用壽命結束，以及在此方面，整體可抑制材料成本。 (v) In addition, the notch trigger is a separate component from the carrier body and is replaceable and coupled and fixed in one body, so that when the notch trigger is worn out early, only the notch trigger can be replaced, and the carrier body can continue to be used until it At the end of its useful life, and in this respect, the overall material cost can be suppressed.
(vi)由於缺口觸發器一體地連結及固定至載體主體，由缺口觸發器之安裝部的徑向向內突出尺寸很小，而與習知懸臂型支撐結構不同，如果缺口觸發器有負載，它不會大幅偏折。結果，工作件與缺口觸發器不會扭曲，以及工作件與缺口觸發器的接合狀態不會鬆開，以及大部份可避免工作件破裂、出現不良部件或研磨輪或其他工具破損的習知問題。 (vi) since the notch trigger is integrally coupled and fixed to the carrier body, the radially inwardly protruding dimension of the mounting portion of the notch trigger is small, and unlike the conventional cantilever type support structure, if the notch trigger is loaded, It won't be heavily biased. As a result, the work piece and the notch trigger are not twisted, and the engagement state of the work piece and the notch trigger is not loosened, and most of the conventional methods of avoiding breakage of the work piece, occurrence of defective parts or grinding wheels or other tools are known. problem.
例如，在研磨製程中，在使用大直徑的研磨輪以便增強研磨效率或研磨精度時，由於缺口觸發器的安裝部與研磨輪禬沒有干擾，因此不需要延長觸發器缺口的長度。 For example, in the grinding process, when a large-diameter grinding wheel is used in order to enhance the grinding efficiency or the grinding precision, since the mounting portion of the notch trigger does not interfere with the grinding rim, it is not necessary to lengthen the length of the trigger notch.
(vii)同樣，如上述缺口觸發器的這種安裝結構，不需要使用昂貴材料(例如，PEEK)作為習知懸臂型結構之剛性降低的對抗手段，以及使用便宜材料可降低成本。 (vii) Also, such a mounting structure of the above-described notch trigger does not require the use of an expensive material (for example, PEEK) as a countermeasure against the rigidity reduction of the conventional cantilever type structure, and the use of an inexpensive material can reduce the cost.
(viii)此外，由於缺口觸發器連結及固定至載體主體，可簡化它的形狀，藉此可節省缺口觸發器的加工成 本，以及與習知缺口觸發器比較，更可節省材料消耗量，以及也降低此一方面的成本。 (viii) In addition, since the notch trigger is coupled and fixed to the carrier body, its shape can be simplified, thereby saving the processing of the notch trigger This, as well as comparison with conventional gap triggers, saves material consumption and also reduces the cost of this aspect.
根據本發明載體裝置的製造方法，可輕易及低成本地製造出有效實現該等效益的載體裝置。 According to the method of manufacturing a carrier device of the present invention, a carrier device that effectively achieves such benefits can be manufactured easily and at low cost.
根據本發明的雙邊研磨機，由於提供這種載體裝置，可有效地顯示上述效益，以及可同時以高效率及高精度研磨薄盤形工作件的表面及相反側。 According to the bilateral grinder of the present invention, since such a carrier device is provided, the above-described benefits can be effectively exhibited, and the surface and the opposite side of the thin disk-shaped work member can be simultaneously polished with high efficiency and high precision.
閱讀以下基於附圖及揭示於申請專利範圍之新穎事實的詳細說明可更加明白本發明及了解以上及其他的目標及特徵。 The above and other objects and features will become more apparent from the detailed description of the appended claims.
1、2‧‧‧研磨輪 1, 2‧‧‧ grinding wheel
1a、2a‧‧‧周緣前端 1a, 2a‧‧‧ peripheral front end
3、4‧‧‧研磨輪軸線 3, 4‧‧‧ grinding wheel axis
5‧‧‧工作件旋轉支撐設備 5‧‧‧Workpiece Rotary Support Equipment
6‧‧‧載體裝置 6‧‧‧ Carrier device
7、8‧‧‧驅動馬達 7, 8‧‧‧ drive motor
10‧‧‧軸向支撐構件 10‧‧‧Axial support members
11‧‧‧徑向支撐構件 11‧‧‧ Radial support members
15、16‧‧‧左、右靜態壓力墊 15, 16‧‧‧ Left and right static pressure pads
17‧‧‧旋轉設備 17‧‧‧Rotating equipment
20‧‧‧支撐滾輪 20‧‧‧Support roller
21‧‧‧環狀驅動齒輪 21‧‧‧Circular drive gear
30‧‧‧載環 30‧‧‧Chasing ring
30a‧‧‧外周 30a‧‧‧out week
30c‧‧‧環形安裝凹槽 30c‧‧‧Ring mounting groove
31‧‧‧載體主體 31‧‧‧ Carrier body
31a‧‧‧圓形內周緣 31a‧‧‧Circular inner circumference
32‧‧‧缺口觸發器 32‧‧‧ gap trigger
32a‧‧‧尖端接合部 32a‧‧‧Digital joints
32b‧‧‧底端側結合部 32b‧‧‧Bottom side joint
33‧‧‧載體加壓器 33‧‧‧Carrier pressurizer
33a‧‧‧內齒 33a‧‧‧ internal teeth
35‧‧‧缺口觸發器安裝部 35‧‧‧ Notch Trigger Installation Department
35a‧‧‧圓形凹槽 35a‧‧‧Circular groove
a‧‧‧載體裝置 A‧‧‧carrier device
b‧‧‧環形載環 B‧‧‧ring carrier ring
c‧‧‧固定載體 c‧‧‧Fixed carrier
d‧‧‧活動載體 D‧‧‧ Activity carrier
e‧‧‧支撐軸 e‧‧‧Support shaft
f‧‧‧彈簧 F‧‧‧spring
g‧‧‧缺口觸發器 G‧‧‧ gap trigger
h‧‧‧尖端接合部 h‧‧‧Front joint
i‧‧‧杯形研磨輪 I‧‧‧ Cup-shaped grinding wheel
j‧‧‧馬達 j‧‧‧Motor
W‧‧‧工作件 W‧‧‧Workpieces
Wa、Wb‧‧‧正面、反面 Wa, Wb‧‧‧ positive and negative
Wn‧‧‧缺口 Wn‧‧‧ gap
圖1的截面圖根據本發明之一示範具體實施例圖示水平雙邊研磨機之主要部件的組態。 1 is a cross-sectional view showing the configuration of the main components of a horizontal bilateral grinder in accordance with an exemplary embodiment of the present invention.
圖2的前視圖圖示同一雙邊研磨機的組態，其中的部份截面圖沿著圖1的直線II-II繪出。 The front view of Figure 2 illustrates the configuration of the same bilateral grinder, with a partial cross-sectional view taken along line II-II of Figure 1.
圖3的放大前視圖圖示作為雙邊研磨機之載體裝置之必要部件的載體主體及觸發器缺口之組態。 The enlarged front view of Figure 3 illustrates the configuration of the carrier body and the trigger notch as a necessary component of the carrier device of the bilateral grinder.
圖4為載體裝置之載體主體及觸發器缺口之組態沿著圖1之直線IV-IV繪出的放大截面圖。 4 is an enlarged cross-sectional view of the carrier body of the carrier device and the configuration of the trigger notch along the line IV-IV of FIG. 1.
圖5的放大展開透視圖圖示載體裝置的載體主體及觸發器缺口。 The enlarged expanded perspective view of Figure 5 illustrates the carrier body and the trigger notch of the carrier device.
圖6A為缺口觸發器的放大前視圖。 Figure 6A is an enlarged front elevational view of the notched trigger.
圖6B為缺口觸發器的放大平面圖。 Fig. 6B is an enlarged plan view of the notch trigger.
圖7的前視圖圖示作為要用雙邊研磨機研磨之工作件 的半導體晶圓。 The front view of Figure 7 is shown as a work piece to be ground with a bilateral grinder Semiconductor wafers.
圖8A的前視圖圖示用以研磨半導體晶圓之習知雙邊研磨機的主要部件之部份截面。 The front view of Figure 8A illustrates a partial cross-section of the main components of a conventional bilateral grinder for grinding semiconductor wafers.
圖8B的側視圖圖示雙邊研磨機之主要部件的部份截面。 The side view of Fig. 8B illustrates a partial cross section of the main components of the bilateral grinder.
以下用附圖具體描述本發明的較佳具體實施例。附圖中，類似的組件或元件用相同的元件符號表示。 Preferred embodiments of the present invention are specifically described below with reference to the accompanying drawings. In the figures, like components or elements are denoted by the same reference numerals.
本發明的雙邊研磨機圖示於圖1及圖2，以及此研磨機是專門用來同時研磨薄盤形工作件W(例如，圖示於圖7的半導體晶圓)的表面及相反側，且更特別的是，有一對研磨輪1、2之研磨輪軸線3、4在水平方向相對地旋轉及支撐的水平雙邊研磨機。 The bilateral grinder of the present invention is illustrated in Figures 1 and 2, and the grinder is specifically designed to simultaneously grind the surface of the thin disc-shaped workpiece W (e.g., the semiconductor wafer shown in Figure 7) and the opposite side. More particularly, there is a horizontal bilateral grinder having a pair of grinding wheel axes 3, 4 that are relatively rotated and supported in the horizontal direction.
在本較佳具體實施例作為研磨物件的半導體晶圓W為厚1毫米或更小的薄盤形片體，以及在製程中為了對齊晶圓的晶向，在圓形外周緣中提供缺口Wn作為切口部份。在本較佳具體實施例中，為了實現研磨而有效地利用缺口Wn。 The semiconductor wafer W as the abrasive article in the preferred embodiment is a thin disc-shaped sheet having a thickness of 1 mm or less, and a notch Wn is provided in the circular outer periphery in order to align the crystal orientation of the wafer during the manufacturing process. As a part of the cut. In the preferred embodiment, the notch Wn is effectively utilized for achieving the grinding.
如圖1及圖2所示，此研磨機基本上包含一對左、右研磨輪1、2與工作件旋轉支撐設備5作為研磨部的主要組件，以及工作件旋轉支撐設備5主要包含為本發明之另一特徵的載體裝置6。 As shown in FIG. 1 and FIG. 2, the grinder basically comprises a pair of left and right grinding wheels 1, 2 and a workpiece rotating support device 5 as main components of the grinding portion, and the workpiece rotating support device 5 mainly comprises A carrier device 6 of another feature of the invention.
研磨輪1、2具體為杯形研磨輪，以及其周緣前端 1a、2a為環形研磨面。研磨輪1、2經配置成研磨面1a、2a在近乎水平狀態下可彼此相對，以及在兩個研磨面1a、2a之間的研磨位置處，如下述，工作件W是用工作件旋轉支撐設備5旋轉及支撐。 The grinding wheel 1, 2 is specifically a cup-shaped grinding wheel, and its peripheral front end 1a and 2a are ring-shaped abrasive faces. The grinding wheels 1, 2 are configured such that the grinding faces 1a, 2a can be opposed to each other in a nearly horizontal state, and at the grinding position between the two grinding faces 1a, 2a, as described below, the workpiece W is rotatably supported by the workpiece The device 5 is rotated and supported.
更特別的是，研磨輪1、2可拆卸地安裝及固定於研磨輪軸線3、4的前端。研磨輪軸線3、4用裝在未圖示之研磨輪座內部的驅動馬達7、8驅動及耦合，以及用同樣裝在研磨輪座內部之研磨輪饋送設備(未圖示)在軸向操作，亦即，沿著饋送方向X、Y移動。 More specifically, the grinding wheels 1, 2 are detachably mounted and fixed to the front ends of the grinding wheel axes 3, 4. The grinding wheel axes 3, 4 are driven and coupled by drive motors 7, 8 mounted inside a grinding wheel housing (not shown), and are axially operated by a grinding wheel feed device (not shown) also mounted inside the grinding wheel housing. That is, moving along the feeding directions X, Y.
工作件旋轉支撐設備5當作用以支撐及旋轉工作件W的工作件旋轉支撐構件，以及經設計成在研磨輪1、2的研磨面1a、2a之間可支撐及旋轉工作件W使得它的表面及相反側Wa、Wb可與研磨面1a、2a相對地保持垂直狀態。 The workpiece rotating support device 5 serves as a workpiece rotating support member for supporting and rotating the workpiece W, and is designed to support and rotate the workpiece W between the grinding faces 1a, 2a of the grinding wheels 1, 2 such that it The surface and the opposite sides Wa and Wb can be kept perpendicular to the polishing surfaces 1a and 2a.
此外，工作件旋轉支撐設備5包含用以軸向定位及支撐工作件W的軸向支撐構件10，以及用以徑向定位工作件W以及旋轉及支撐的徑向支撐構件11，以及此徑向支撐構件11有作為主要組件的載體裝置6。 Further, the workpiece rotating support device 5 includes an axial support member 10 for axially positioning and supporting the work piece W, and a radial support member 11 for radially positioning the work piece W and rotating and supporting, and the radial direction The support member 11 has a carrier device 6 as a main component.
軸向支撐構件10形成為靜態壓力支撐設備用以定位及支撐工作件W之表面及相反側Wa、Wb而不通過靜態壓力流體來接觸，以及它的主要組件為彼此相對地配置的一對左、右靜態壓力墊15、16。靜態壓力墊15、16皆連接至未圖示之流體供給源，以及供給自流體供給源的壓力流體(例如，水)由靜態壓力凹槽(未圖示)噴出，以及工作件W的表面及相反側Wa、Wb在研磨輪1、2的研磨面1a、2a之間 的軸向中央位置中靜態地保持未接觸狀態。 The axial support member 10 is formed as a static pressure support device for positioning and supporting the surface of the work piece W and the opposite sides Wa, Wb without being contacted by static pressure fluid, and its main components are a pair of left sides arranged opposite each other , right static pressure pads 15, 16. The static pressure pads 15, 16 are all connected to a fluid supply source (not shown), and the pressure fluid (for example, water) supplied from the fluid supply source is ejected by a static pressure groove (not shown), and the surface of the workpiece W and The opposite sides Wa, Wb are between the grinding faces 1a, 2a of the grinding wheels 1, 2. The axially central position remains statically untouched.
徑向支撐構件11形成為用以徑向定位工作件W和旋轉及驅動之旋轉驅動設備，以及它的主要組件包含用以配合及支撐工作件W的載體裝置6，以及旋轉設備17作為用以支撐及旋轉此載體裝置6的旋轉驅動單元 The radial support member 11 is formed as a rotary drive device for radially positioning the work piece W and rotating and driving, and its main assembly includes a carrier device 6 for engaging and supporting the work piece W, and the rotary device 17 is used as Rotary drive unit for supporting and rotating the carrier device 6
旋轉設備17構造成如圖1所示，其中多個(在該較佳具體實施例為4個)支撐滾輪20、20、...可旋轉地支撐載體裝置6之載環30的外周30a，以及環狀驅動齒輪21與一體地配合及固定至載環30之載體加壓器33的內齒33a接合，以及環狀驅動齒輪21被驅動及耦合至未圖示的旋轉驅動源。 The rotating device 17 is configured as shown in FIG. 1, wherein a plurality of (four in the preferred embodiment) support rollers 20, 20, ... rotatably support the outer periphery 30a of the carrier ring 30 of the carrier device 6, The ring-shaped drive gear 21 is engaged with the internal teeth 33a of the carrier presser 33 that is integrally fitted and fixed to the carrier ring 30, and the ring-shaped drive gear 21 is driven and coupled to a rotational drive source (not shown).
在此，藉由用此一旋轉驅動源來驅動及旋轉環狀驅動齒輪21，用以配合及支撐工作件W的載體裝置6會繞著由支撐滾輪20、20、...定義的旋轉中心旋轉及操作，以及工作件W被支撐及旋轉而處於位在徑向中的狀態。 Here, by driving and rotating the ring-shaped drive gear 21 with the rotary drive source, the carrier device 6 for engaging and supporting the workpiece W is wound around the center of rotation defined by the support rollers 20, 20, . Rotation and operation, and the workpiece W is supported and rotated to be in a radial position.
載體裝置6是要配合及支撐工作件W，以及如圖1及圖2所示，它主要是由載環30、載體主體31、缺口觸發器32及載體加壓器33構成。 The carrier device 6 is to be fitted and supported by the workpiece W, and as shown in Figs. 1 and 2, it is mainly composed of a carrier ring 30, a carrier body 31, a notch trigger 32 and a carrier presser 33.
載環30是當作載體裝置6之主體環的位置，以及由如圖1所示之環形環構件形成，以及如圖2及圖4所示，在圓柱表面上形成外環面30a。載環30有用旋轉設備17中作為旋轉驅動部件的4個支撐滾輪20、20、...可旋轉地定位及支撐的外環面30a。 The carrier ring 30 is formed as a position of the main body ring of the carrier device 6, and is formed of an annular ring member as shown in Fig. 1, and as shown in Figs. 2 and 4, an outer annular surface 30a is formed on the cylindrical surface. The carrier ring 30 has an outer ring surface 30a that is rotatably positioned and supported by four support rollers 20, 20, ... as rotary drive members in the rotary device 17.
在載環30的內徑側，裝設連續繞著整個圓周的環形安裝凹槽30c，以及載體主體31的外周緣位置套入安裝凹 槽30c，以及用環形載體加壓器33由兩側安裝及固定成可置換。用任何習知固定構件可正確地實現固定載體加壓器33於載環30上，以及圖示較佳具體實施例是使用安裝螺栓(未圖示)。 On the inner diameter side of the carrier ring 30, an annular mounting groove 30c continuous around the entire circumference is provided, and the outer peripheral edge of the carrier body 31 is fitted into the mounting recess. The groove 30c, and the annular carrier presser 33 are mounted and fixed from both sides to be replaceable. The fixed carrier presser 33 can be properly implemented on the carrier ring 30 by any conventional securing member, and the preferred embodiment is illustrated using mounting bolts (not shown).
載體加壓器33經形成類似由圖1之環形環構件製成的內齒輪，以及在內周中形成內齒33a。因此，當載體加壓器33一體地配合及固定於載環30的安裝凹槽30c中時，如上述，載環30的外周30a用旋轉設備17中作為旋轉驅動單元的4個支撐滾輪20、20、...可旋轉地支撐，以及旋轉設備17的環狀驅動齒輪21與載體加壓器33的內齒33a接合。 The carrier presser 33 is formed into an internal gear similar to that of the annular ring member of Fig. 1, and an internal tooth 33a is formed in the inner circumference. Therefore, when the carrier presser 33 is integrally fitted and fixed in the mounting recess 30c of the carrier ring 30, as described above, the outer circumference 30a of the carrier ring 30 is used as the four supporting rollers 20 as the rotary driving unit in the rotating device 17, 20, ... rotatably supported, and the annular drive gear 21 of the rotary device 17 is engaged with the internal teeth 33a of the carrier presser 33.
載體主體31為用於與缺口觸發器32合作地配合及支撐工作件W的位置，以及更特別的是，如圖1所示，它是由環形薄片材料形成，以及它的圓形內周緣31a經形成可緊緊地包圍工作件W的圓形外周(整個圓周)。亦即，圓形內周緣31a有稍微小於待研磨工作件W之外直徑的內直徑，以及與工作件W的外周形成規定的間隙，從而工作件W鬆動地配合及支撐於載體主體31上。 The carrier body 31 is a position for cooperatively supporting and supporting the work piece W with the notch trigger 32, and more particularly, as shown in Fig. 1, it is formed of an annular sheet material, and its circular inner periphery 31a It is formed to surround the circular outer circumference (entire circumference) of the work piece W tightly. That is, the circular inner peripheral edge 31a has an inner diameter slightly smaller than the outer diameter of the workpiece W to be polished, and a predetermined gap is formed with the outer circumference of the workpiece W, so that the workpiece W is loosely fitted and supported on the carrier main body 31.
缺口觸發器32有尖端接合部32a以與缺口Wn接合成為設於工作件W之圓形外周緣的切口部份，以及與載體主體31構成為整體件。 The notch trigger 32 has a tip end portion 32a joined to the notch Wn to form a slit portion provided on the circular outer periphery of the workpiece W, and is formed integrally with the carrier body 31.
更特別的是，缺口觸發器32一體地連結及固定至載體主體31成為可置換獨立部件，以及尖端接合部32a有由載體主體31之圓形內周緣31a之一部份周向徑向向內突出的安裝結構。在載體主體31之圓形內周緣31a鬆動地接合及 支撐工作件W的狀態下，缺口觸發器32的尖端接合部32a與工作件W的缺口Wn在載體裝置6的旋轉方向接合。 More specifically, the notch trigger 32 is integrally coupled and fixed to the carrier body 31 as a replaceable independent member, and the tip engaging portion 32a has a circumferentially radially inward portion from a portion of the circular inner periphery 31a of the carrier body 31. Outstanding mounting structure. Loosely engaging at the circular inner periphery 31a of the carrier body 31 and In a state in which the work piece W is supported, the tip end portion 32a of the notch trigger 32 and the notch Wn of the work piece W are engaged in the rotation direction of the carrier device 6.
載體主體31與缺口觸發器32經設計成在旋轉方向一體地旋轉同時在鬆動地接合及支撐時徑向定位工作件W，以及在研磨製程中，它們與工作件W用力接觸，以及與工作件W的間隙可能因磨耗而過大，或不均勻的磨耗對於研磨精度可能造成不利影響。 The carrier body 31 and the notch trigger 32 are designed to rotate integrally in the rotational direction while radially positioning the workpiece W during loose engagement and support, and in the grinding process, they are in force contact with the workpiece W, and the workpiece The gap of W may be excessive due to wear, or uneven wear may adversely affect the grinding accuracy.
因此，載體主體31與缺口觸發器32形成為可定期或不定期更換的耗材部件，以及有以下特徵結構。 Therefore, the carrier body 31 and the notch trigger 32 are formed as consumable parts that can be replaced periodically or irregularly, and have the following features.
載體主體31及缺口觸發器32的厚度經設定成小於工作件W的修整厚度，以及缺口觸發器32連結及固定於載體主體31上用可固定及分離的黏著劑實現。 The thickness of the carrier body 31 and the notch trigger 32 is set to be smaller than the trim thickness of the workpiece W, and the notch trigger 32 is coupled and fixed to the carrier body 31 by an adhesive that can be fixed and separated.
載體主體31的缺口觸發器安裝部35經切割及形塑成其形狀對應至缺口觸發器32之底端側結合部32b的外周輪廓形狀，以及塗佈黏著劑至缺口觸發器安裝部35的結合面。 The notch trigger mounting portion 35 of the carrier body 31 is cut and shaped into a peripheral contour shape whose shape corresponds to the bottom end side joint portion 32b of the notch trigger 32, and a combination of applying the adhesive to the notch trigger mounting portion 35. surface.
在圖示較佳具體實施例中，缺口觸發器32具體形成如圖5及圖6所示，以及由有三角形輪廓的薄片材料製成，有一頂點形成為尖端接合部32a以與工作件W之缺口Wn接合，以及在載體主體31的缺口觸發器安裝部35中，用以避免應力集中的圓形凹槽35a、35a形成於對應至缺口觸發器32之三角形輪廓的其餘兩個頂點的位置(轉角位置)。圓形凹槽35a、35a降低輔助缺口觸發器安裝部35之製造的副作用。 In the preferred embodiment illustrated, the notch trigger 32 is specifically formed as shown in FIGS. 5 and 6, and is formed of a sheet material having a triangular profile with a apex formed as a tip engagement portion 32a for engagement with the workpiece W. The notch Wn is engaged, and in the notch trigger mounting portion 35 of the carrier main body 31, circular grooves 35a, 35a for avoiding stress concentration are formed at positions corresponding to the remaining two vertices of the triangular outline of the notch trigger 32 ( Corner position). The circular grooves 35a, 35a reduce the side effects of the manufacture of the auxiliary notch trigger mounting portion 35.
在圖示較佳具體實施例中，缺口觸發器32的尖端接合部32a修整成如圖5及圖6A所示的R形，其係具有弧形輪廓，以及在軸向的轉角修整成正角形，以及截面形成為如圖6B所示的矩形截面。決定尖端接合部32a的特定形狀或結構可適當地關連於與其有接合配搭關係的工作件W缺口Wn形狀及結構。 In the preferred embodiment illustrated, the tip end portion 32a of the notch trigger 32 is trimmed into an R-shape as shown in FIGS. 5 and 6A, which has an arcuate profile and is trimmed to a positive angle at an axial corner. And the cross section is formed into a rectangular cross section as shown in Fig. 6B. It is determined that the specific shape or structure of the tip joint portion 32a can be appropriately associated with the shape and structure of the workpiece W notched in the mating relationship.
亦即，尖端接合部32a修整成如圖6A所示的R形，以便不會咬入工作件W的缺口Wn。 That is, the tip joint portion 32a is trimmed into an R shape as shown in FIG. 6A so as not to bite into the notch Wn of the work piece W.
尖端接合部32a的截面修整成如圖6B所示的矩形截面，由於工作件W的外周(包括缺口Wn的部份)可倒角加工成可避免破損，以及在此情況下，當缺口觸發器32倒角加工成跟工作件W類似時，工作件W的缺口Wn可能不鉤(接合)在缺口觸發器32上，這是為了避免這種不便。 The cross section of the tip joint portion 32a is trimmed into a rectangular cross section as shown in FIG. 6B, since the outer circumference of the workpiece W (the portion including the notch Wn) can be chamfered to avoid breakage, and in this case, when the gap trigger When the chamfering is processed to be similar to the workpiece W, the notch Wn of the workpiece W may not be hooked (engaged) on the notch trigger 32 in order to avoid such inconvenience.
因此，與上述情形相反地，當包含工作件W之缺口Wn部份的外周修整成無倒角的矩形截面時，相應地，當缺口觸發器32之尖端接合部32a的截面組態與圖示較佳具體實施例顛倒時，雖然未特別圖示於附圖，而不是圖示於圖6B的矩形截面，完成倒角或類似修整。 Therefore, contrary to the above, when the outer circumference including the notch Wn portion of the work piece W is trimmed into a chamfer-free rectangular cross section, correspondingly, the cross-sectional configuration and illustration of the tip end portion 32a of the notch trigger 32 When the preferred embodiment is reversed, although not specifically illustrated in the drawings, rather than the rectangular cross-section illustrated in Figure 6B, chamfering or similar trimming is accomplished.
載體主體31與缺口觸發器32由考慮到待研磨工作件W之材料的合適材料製成，以及沒有特別規定。它們可適當地由相同材料或不同材料製成，但是希望選擇有考慮到磨耗程度或其他。 The carrier body 31 and the notch trigger 32 are made of a suitable material in consideration of the material of the workpiece W to be polished, and are not particularly specified. They may suitably be made of the same material or different materials, but it is desirable to have a degree of wear or other considerations.
例如，如果工作件W為矽晶圓，如同本較佳具體實施例，考慮到金屬污染或其他問題，缺口觸發器32的材 料不希望為金屬材料。 For example, if the workpiece W is a tantalum wafer, as in the preferred embodiment, the material of the notch trigger 32 is considered in consideration of metal contamination or other problems. It is not desirable to be a metallic material.
在圖示較佳具體實施例中，載體主體31由便宜的GFRP(玻璃纖維增強塑料)製成，以及由強度高於使用於載體主體31之GFRP之工程塑膠製成的缺口觸發器32，例如，基於PEEK(聚醚醚酮)樹脂的FRP或其類似物，藉此可抑制材料成本。 In the preferred embodiment illustrated, the carrier body 31 is made of inexpensive GFRP (glass fiber reinforced plastic) and a notched trigger 32 made of engineering plastic having a higher strength than the GFRP used for the carrier body 31, for example A FRP based on PEEK (polyetheretherketone) resin or the like, whereby the material cost can be suppressed.
如上述，載體主體31與缺口觸發器32均為耗材部件，但是缺口觸發器32磨損更快而更換更頻繁，以及只有缺口觸發器32可由強度較高及耐磨性較高的材料製成。 As described above, the carrier body 31 and the notch trigger 32 are both consumable parts, but the notch trigger 32 wears more quickly and is replaced more frequently, and only the notch trigger 32 can be made of a material having higher strength and higher wear resistance.
缺口觸發器32可置換而且為與載體主體31獨立的部件，如上述，而與其連結及固定成一體，以及使缺口觸發器32連結及固定至載體主體31以形成為整體件的方法(製程)可用步驟(a)至(c)實現如下。 The notch trigger 32 is replaceable and is a separate component from the carrier body 31, as described above, and is integrally coupled thereto and fixed, and a method (process) in which the notch trigger 32 is coupled and fixed to the carrier body 31 to be formed into a unitary member. Steps (a) to (c) can be used to achieve the following.
(a)結合面的清洗步驟 (a) Cleaning step of the joint surface
清洗及去脂載體主體31之缺口觸發器安裝部35的結合面與缺口觸發器32之結合部的結合面的步驟 Step of cleaning and bonding the bonding surface of the notch trigger mounting portion 35 of the degreased carrier main body 31 to the joint portion of the notch trigger 32
這個步驟是要移除污染、濕氣、油狀物或其類似物，因為作為使用於隨後連結步驟之連結構件的黏著劑應該沒有這些東西，藉此黏著劑的固定能力可充分展現。 This step is to remove contamination, moisture, oil or the like because the adhesive as the joining member used in the subsequent joining step should be free of these, whereby the fixing ability of the adhesive can be sufficiently exhibited.
(b)連結步驟 (b) Linking steps
在塗佈黏著劑時定位及保持載體主體31與缺口觸發器32的平行度，以及黏著及連結載體主體31之缺口觸發器安裝部35的結合面與缺口觸發器32之結合部的結合面的步驟。 Positioning and maintaining the parallelism of the carrier body 31 and the notch trigger 32 when applying the adhesive, and the bonding surface of the bonding surface of the gap trigger mounting portion 35 of the carrier body 31 and the joint of the notch trigger 32 step.
圖5中黏著劑的塗佈位置是整個表面缺口觸發器安裝部35的平面部份，以及黏著劑大體為市售瞬間黏著劑。，瞬間黏著劑的選擇條件包括作為本較佳具體實施例的連結及固定構件有充分強度、單一成分型、高黏度、以及高工作效率。 The application position of the adhesive in Fig. 5 is the planar portion of the entire surface notch trigger mounting portion 35, and the adhesive is generally a commercially available instant adhesive. The selection conditions of the instant adhesive include the joint and fixing members as the preferred embodiment having sufficient strength, single component type, high viscosity, and high work efficiency.
在連結載體主體31與缺口觸發器32時，需要充分小心使得缺口觸發器32與載體主體31可相互平行，以及利用有保證平行度的平板或其類似物，可相對容易地實現這兩個部件31、32的平行度。 When joining the carrier body 31 and the notch trigger 32, it is necessary to take sufficient care so that the notch trigger 32 and the carrier body 31 can be parallel to each other, and the plate can be relatively easily realized by using a plate having a parallelism or the like. 31, 32 parallelism.
(c)修整步驟 (c) finishing steps
徹底移除載體主體31與缺口觸發器32在連結步驟連結成一體時由結合部露出的多餘黏著劑以乾淨地結束的步驟。 The step of completely ending the excess adhesive exposed by the joint portion when the carrier main body 31 and the notch trigger 32 are integrally joined in the joining step is completely removed.
如果直接使用連結成一體的缺口觸發器32與載體主體31而不移除由結合部滲出的黏著劑，則在研磨製程可能接觸研磨輪1、2，從而造成研磨輪1、2的研磨面1a、2a堵塞，或工作件W破損。 If the notched trigger 32 and the carrier main body 31 are integrally used without removing the adhesive oozing out from the joint, the grinding process may contact the grinding wheels 1, 2, thereby causing the grinding surface 1a of the grinding wheels 1, 2. 2a is blocked, or the work piece W is broken.
以此方式，一體連結於載體主體31上的缺口觸發器32，如圖1所示，會與工作件W的缺口Wn接合，以及一體地旋轉，以及在旋轉方向施力，但是在圖示較佳具體實施例中，缺口觸發器32係設計成如圖3所示的結合固定結構(包括缺口觸發器32的三角形輪廓)，使得它在旋轉方向難以與載體主體31分離。另一方面，由於部件31、32的黏著面積小，在旋轉軸方向的黏結力微弱，因而缺口觸發器32可 輕易地由載體主體31卸下而可更換。 In this manner, the notch trigger 32 integrally coupled to the carrier body 31, as shown in FIG. 1, will engage with the notch Wn of the workpiece W, and rotate integrally, and apply force in the direction of rotation, but In a preferred embodiment, the notch trigger 32 is designed as a bonded fixed structure (including the triangular profile of the notched trigger 32) as shown in FIG. 3 such that it is difficult to separate from the carrier body 31 in the direction of rotation. On the other hand, since the adhesive areas of the members 31 and 32 are small, the bonding force in the direction of the rotation axis is weak, and thus the notch trigger 32 can be It can be easily removed by the carrier body 31 and can be replaced.
因此，在有此組態的雙邊研磨機中，工作件旋轉支撐設備5旋轉及支撐工作件W於研磨位置，以及高速旋轉的研磨輪1、2沿著研磨輪軸線3、4的方向以指定的饋送方式饋入，以及用研磨輪1、2的研磨面1a、2a同時研磨工作件W的表面及相反側Wa、Wb。 Therefore, in the bilateral grinding machine having this configuration, the workpiece rotating support device 5 rotates and supports the workpiece W at the grinding position, and the grinding wheels 1, 2 rotating at high speed are specified along the direction of the grinding wheel axes 3, 4. The feed mode is fed, and the surfaces of the workpiece W and the opposite sides Wa, Wb are simultaneously polished by the polishing surfaces 1a, 2a of the grinding wheels 1, 2.
在此工作件旋轉支撐設備5中，用徑向支撐構件11之載體裝置6配合及支撐的工作件W之表面及相反側Wa、Wb用靜態壓力保持在與軸向支撐構件10之靜態壓力墊15、16不接觸的狀態，以及研磨輪1、2的研磨面1a、2a被定位及支撐幾乎在軸向的中央位置，以及載體裝置6繞著由支撐滾輪20、20...定義的旋轉中心旋轉及操作，藉此以位於徑向中的狀態支撐及旋轉工作件W。 In the workpiece rotating support device 5, the surface and the opposite sides Wa, Wb of the workpiece W that are fitted and supported by the carrier device 6 of the radial support member 11 are held at a static pressure pad with the axial support member 10 by static pressure. 15, 16 non-contact state, and the grinding faces 1a, 2a of the grinding wheels 1, 2 are positioned and supported at a central position almost in the axial direction, and the carrier device 6 is rotated about the support rollers 20, 20... The center rotates and operates, thereby supporting and rotating the work piece W in a state of being located in the radial direction.
如以上所具體描述的，本較佳具體實施例的載體裝置6實現下列效果。 As described in detail above, the carrier device 6 of the preferred embodiment achieves the following effects.
(1)由於環形載體主體31緊緊地包圍工作件W的整個圓周，以及待與工作件W之缺口Wn接合的缺口觸發器32形成為整體件，節省部件數而結構簡單，以及可結構上可降低成本。 (1) Since the annular carrier main body 31 tightly surrounds the entire circumference of the work piece W, and the notch trigger 32 to be engaged with the notch Wn of the work piece W is formed as a single piece, the number of parts is saved and the structure is simple, and the structure is structurally Can reduce costs.
(2)由於用以徑向定位工作件W之外周的載體主體31形成為有緊緊包圍工作件W整個圓周之圓形內周緣31a的連續環形形狀，相較於如圖8所示之分體式結構的習知載體c、d、...，可實現較高的剛性，高精度的表面機械加工，而在研磨製程中對於工作件W的機械加工精度沒有不利影 響。 (2) Since the carrier main body 31 for radially positioning the outer periphery of the work piece W is formed to have a continuous annular shape closely surrounding the circular inner circumference 31a of the entire circumference of the work piece W, as compared with that shown in Fig. 8 The conventional carriers c, d, ... of the body structure can realize high rigidity and high-precision surface machining without adversely affecting the machining accuracy of the workpiece W in the grinding process. ring.
(3)同樣，由於載體主體31為環形及連續，相較於如圖8所示之分體式結構的習知載體c、d、...，在製造載體主體31期間幾乎沒有機械加工扭曲，以及可有效地防止在裝上載環30時發生扭曲，以及在工作件W的研磨製程中也幾乎沒有扭曲、偏折或變形，以及從此方面看，也實現高精度的表面機械加工而在研磨製程中對於工作件W的機械加工精度沒有不利影響。 (3) Similarly, since the carrier main body 31 is annular and continuous, there is almost no machining distortion during the manufacture of the carrier main body 31 compared to the conventional carriers c, d, ... of the split structure shown in Fig. 8. And it can effectively prevent the distortion occurring when the upload ring 30 is mounted, and there is almost no distortion, deflection or deformation in the grinding process of the workpiece W, and in this respect, high-precision surface machining is also realized in the grinding process. There is no adverse effect on the machining accuracy of the workpiece W.
(4)由於缺口觸發器32可置換而且為與載體主體31獨立的部件以及連結及固定成一體，最佳材料可個別用於缺口觸發器32與載體主體31兩者，以及整體可降低載體裝置6的材料成本。 (4) Since the notch trigger 32 is replaceable and is a separate component from the carrier body 31 and is integrally coupled and fixed, the optimum material can be used individually for both the notch trigger 32 and the carrier body 31, and the carrier device can be lowered as a whole. 6 material costs.
特別是，有高強度及高耐磨性的優異材料可以只用於用作工作件W之旋轉驅動構件而嚴重磨耗及高置換頻率的缺口觸發器32，以及可抑制昂貴材料的消耗量，以及整體可抑制載體裝置6的材料成本。 In particular, an excellent material having high strength and high wear resistance can be used only for the notched trigger 32 which is used as a rotational driving member of the workpiece W and which is severely worn and has a high replacement frequency, and can suppress the consumption of expensive materials, and The material cost of the carrier device 6 can be suppressed as a whole.
(5)此外，由於缺口觸發器32可置換而且為與載體主體31獨立的部件以及連結及固定成一體，如果缺口觸發器32因為比較容易磨損而首先耗盡，可以只更換缺口觸發器32，以及可繼續使用載體主體31直到使用壽命結束，以及在此方面，也可抑制載體裝置6的整體材料成本。 (5) In addition, since the notch trigger 32 is replaceable and is a separate component from the carrier body 31 and is coupled and fixed integrally, if the notch trigger 32 is first exhausted because it is relatively easy to wear, only the notch trigger 32 can be replaced. And the carrier body 31 can continue to be used until the end of its useful life, and in this respect, the overall material cost of the carrier device 6 can also be suppressed.
(6)由於缺口觸發器32一體地連結及固定至載體主體31，由缺口觸發器32之安裝部徑向向內突出的尺寸很小，而與習知懸臂類支撐結構不同，如果有外加重負載， 缺口觸發器32大體不會偏折。結果，工作件W不會跟隨缺口觸發器32而切斷工作件W與缺口觸發器32的接合狀態，以及與先前技術不同，它幾乎沒有因工作件W破損、研磨輪破損及其他問題所引起的不良部件。 (6) Since the notch trigger 32 is integrally coupled and fixed to the carrier main body 31, the size of the mounting portion of the notch trigger 32 protruding radially inward is small, and unlike the conventional cantilever type supporting structure, if there is an external weighting load, The notch trigger 32 is generally not deflected. As a result, the work piece W does not follow the notch trigger 32 and cuts off the engagement state of the work piece W and the notch trigger 32, and unlike the prior art, it is hardly caused by the breakage of the work piece W, the damage of the grinding wheel, and other problems. Bad parts.
例如，當使用大直徑的研磨輪1、2以便增強研磨效率或研磨精度時，由於在缺口觸發器32的安裝部與研磨輪1、2之間沒有干擾，因此不需要延長缺口觸發器32的長度。 For example, when the large diameter grinding wheels 1, 2 are used in order to enhance the grinding efficiency or the grinding precision, since there is no interference between the mounting portion of the notch trigger 32 and the grinding wheels 1, 2, it is not necessary to extend the notch trigger 32. length.
(7)同樣，由於缺口觸發器32有此安裝結構，因此不需要使用昂貴的材料(例如，PEEK)作為對抗習知懸臂類結構之剛性降低的手段，以及使用便宜的材料可降低成本。 (7) Also, since the notch trigger 32 has this mounting structure, it is not necessary to use an expensive material (for example, PEEK) as a means for suppressing the rigidity of the conventional cantilever type structure, and the use of an inexpensive material can reduce the cost.
(8)結構上，由於缺口觸發器32連結及固定至載體主體31，因此可簡化形狀，以及可節省缺口觸發器32的加工成本，以及相較於習知缺口觸發器32，可節省材料消耗量，以及在此方面也可降低成本。 (8) Structurally, since the notch trigger 32 is coupled and fixed to the carrier body 31, the shape can be simplified, and the processing cost of the notch trigger 32 can be saved, and material consumption can be saved compared to the conventional notch trigger 32. Quantity, and in this respect, can also reduce costs.
此外，根據本發明載體裝置6製造方法，可容易及以低成本製造有效展現該等效果的載體裝置6。 Further, according to the manufacturing method of the carrier device 6 of the present invention, the carrier device 6 which effectively exhibits such effects can be easily and inexpensively manufactured.
此外，根據本發明的雙邊研磨機，由於提供有效地展現該等效果的載體裝置6，以及可以高效率及高精度同時研磨薄盤形工作件W的表面及相反側Wa、Wb。 Further, according to the bilateral grinding machine of the present invention, since the carrier device 6 which effectively exhibits such effects is provided, the surface and the opposite sides Wa, Wb of the thin disk-shaped workpiece W can be simultaneously polished with high efficiency and high precision.
順便一提，描述於本文的本發明較佳具體實施例有可能有不同的設計變更及修改，如下述。 Incidentally, the preferred embodiments of the invention described herein are susceptible to various design changes and modifications, such as those described below.
例如，圖示較佳具體實施例顯示本發明係應用於 水平雙邊研磨機的載體裝置6，然而它也可應用於如日本早期公開專利第2003-71704號所揭示之垂直雙邊研磨機的載體裝置，或可用作單面研磨用之研磨機的載體裝置。此外，本發明可用作用於機械加工薄盤形工作件之其他機械加工工具的載體裝置，例如，揭示於日本早期公開專利第H11-333707號之研磨機的載體裝置。 For example, the preferred embodiment illustrated shows that the invention is applied The carrier device 6 of the horizontal bilateral grinder, however, it can also be applied to a carrier device of a vertical bilateral grinder as disclosed in Japanese Laid-Open Patent Publication No. 2003-71704, or as a carrier device for a grinder for single-side grinding. . Further, the present invention can be used as a carrier device for machining other mechanical processing tools of a thin disk-shaped workpiece, for example, a carrier device of a grinding machine disclosed in Japanese Laid-Open Patent Publication No. H11-333707.
待研磨工作件W不受限於如圖7所示的半導體晶圓，而可包括其他的薄盤形工作件。 The workpiece to be polished W is not limited to the semiconductor wafer as shown in FIG. 7, but may include other thin disk-shaped workpieces.
就得到相同或類似的效果而言，載體裝置6的特定結構不限於附圖所示的結構，以及例如可根據待加工工作件W的材料來適當地選擇載體主體31與缺口觸發器32的構成材料，以及不限於圖示圖示較佳具體實施例的。例如，就由鐵材料製成的工作件W而言，在剛性及成本方面最好使用鐵材料。 The specific structure of the carrier device 6 is not limited to the structure shown in the drawings, and the composition of the carrier body 31 and the notch trigger 32 can be appropriately selected depending on the material of the workpiece W to be processed, for example, in order to obtain the same or similar effects. The materials, and are not limited to the preferred embodiments illustrated in the drawings. For example, in the case of the work piece W made of an iron material, it is preferable to use an iron material in terms of rigidity and cost.
揭示於以上詳細說明的特定示範具體實施例旨在揭示本發明的技術細節，然而應注意本發明不是解釋該具體實施例的有限狹窄範疇，反而應瞭解在較寬的範疇中，仍在本發明的精神及下述申請專利範圍內仍有各種改變及修改。 The specific exemplary embodiments disclosed above are intended to disclose the technical details of the present invention, but it should be noted that the present invention is not intended to explain the limited narrow scope of the specific embodiments. Instead, it should be understood that in the broader scope, the present invention is still There are various changes and modifications in the spirit of the following patents.
1、2‧‧‧研磨輪 1, 2‧‧‧ grinding wheel
1a、2a‧‧‧周緣前端 1a, 2a‧‧‧ peripheral front end
5‧‧‧工作件旋轉支撐設備 5‧‧‧Workpiece Rotary Support Equipment
6‧‧‧載體裝置 6‧‧‧ Carrier device
11‧‧‧徑向支撐構件 11‧‧‧ Radial support members
17‧‧‧旋轉設備 17‧‧‧Rotating equipment
20‧‧‧支撐滾輪 20‧‧‧Support roller
21‧‧‧環狀驅動齒輪 21‧‧‧Circular drive gear
30‧‧‧載環 30‧‧‧Chasing ring
30a‧‧‧外周 30a‧‧‧out week
30c‧‧‧環形安裝凹槽 30c‧‧‧Ring mounting groove
31‧‧‧載體主體 31‧‧‧ Carrier body
31a‧‧‧圓形內周緣 31a‧‧‧Circular inner circumference
32‧‧‧缺口觸發器 32‧‧‧ gap trigger
32a‧‧‧尖端接合部 32a‧‧‧Digital joints
32b‧‧‧底端側結合部 32b‧‧‧Bottom side joint
33‧‧‧載體加壓器 33‧‧‧Carrier pressurizer
33a‧‧‧內齒 33a‧‧‧ internal teeth
35‧‧‧缺口觸發器安裝部 35‧‧‧ Notch Trigger Installation Department
35a‧‧‧圓形凹槽 35a‧‧‧Circular groove
W‧‧‧工作件 W‧‧‧Workpieces
Wa、Wb‧‧‧正面、反面 Wa, Wb‧‧‧ positive and negative
Wn‧‧‧缺口 Wn‧‧‧ gap
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-195611 | 2012-09-05 | ||
| JP2012195611A JP6033614B2 (en) | 2012-09-05 | 2012-09-05 | Thin-walled disk-shaped workpiece carrier device, manufacturing method thereof, and double-side grinding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201417951A true TW201417951A (en) | 2014-05-16 |
| TWI632987B TWI632987B (en) | 2018-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102130043A TWI632987B (en) | 2012-09-05 | 2013-08-22 | Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine |
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| Country | Link |
|---|---|
| EP (1) | EP2705930B1 (en) |
| JP (1) | JP6033614B2 (en) |
| KR (1) | KR102093680B1 (en) |
| SG (1) | SG2013065842A (en) |
| TW (1) | TWI632987B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6197580B2 (en) * | 2013-10-29 | 2017-09-20 | 株式会社Sumco | Double-side polishing machine for carrier plate and workpiece |
| CN104493689B (en) | 2014-12-16 | 2017-01-11 | 天津大学 | Double-disc straight-groove grinding disc for surfaces of cylindrical parts |
| CN114406853A (en) * | 2022-02-17 | 2022-04-29 | 安徽申容压力容器有限公司 | Clamping mechanism for processing end cover of gas storage tank based on multidimensional rotation |
| CN115070604B (en) * | 2022-06-09 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | Double-sided polishing apparatus and double-sided polishing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS555222Y2 (en) * | 1976-05-19 | 1980-02-06 | ||
| JP3207787B2 (en) * | 1997-04-04 | 2001-09-10 | 株式会社日平トヤマ | Wafer processing method, surface grinder and work support member |
| US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
| JPH11221760A (en) * | 1998-02-06 | 1999-08-17 | Nippei Toyama Corp | Cracking occurrance predicting method of workpiece, wafer working method utilizing the same, and grinder |
| JPH11333707A (en) | 1998-05-26 | 1999-12-07 | Toshiba Ceramics Co Ltd | Carrier |
| JP2000288921A (en) * | 1999-03-31 | 2000-10-17 | Hoya Corp | Polishing carrier, polishing method and manufacture of information recording medium substrate |
| JP2003071704A (en) | 2001-08-29 | 2003-03-12 | Nippei Toyama Corp | Drive plate for rotating wafer |
| JP2003124167A (en) * | 2001-10-10 | 2003-04-25 | Sumitomo Heavy Ind Ltd | Wafer support member and double-ended grinding device using the same |
| US6899595B2 (en) * | 2002-03-29 | 2005-05-31 | Maurice J. Moriarty | Seal assembly manufacturing methods and seal assemblies manufactured thereby |
| JP4881798B2 (en) * | 2007-06-20 | 2012-02-22 | 清水建設株式会社 | Member joining method and panel structure |
| JP2009178780A (en) * | 2008-01-29 | 2009-08-13 | Seiko Instruments Inc | Carrier, device and method of grinding wafer, piezoelectric transducer and its manufacturing method, oscillator, electric instrument and atomic clock |
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2012
- 2012-09-05 JP JP2012195611A patent/JP6033614B2/en active Active
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2013
- 2013-08-20 EP EP13181047.5A patent/EP2705930B1/en active Active
- 2013-08-22 TW TW102130043A patent/TWI632987B/en active
- 2013-09-02 SG SG2013065842A patent/SG2013065842A/en unknown
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| Publication number | Publication date |
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| TWI632987B (en) | 2018-08-21 |
| KR20140031816A (en) | 2014-03-13 |
| JP2014050901A (en) | 2014-03-20 |
| EP2705930B1 (en) | 2022-02-16 |
| JP6033614B2 (en) | 2016-11-30 |
| SG2013065842A (en) | 2014-04-28 |
| EP2705930A3 (en) | 2014-08-13 |
| EP2705930A2 (en) | 2014-03-12 |
| KR102093680B1 (en) | 2020-03-26 |
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