EP2614559B1 - Method for producing pin-shaped contact elements and contact element - Google Patents

Method for producing pin-shaped contact elements and contact element Download PDF

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Publication number
EP2614559B1
EP2614559B1 EP11754393.4A EP11754393A EP2614559B1 EP 2614559 B1 EP2614559 B1 EP 2614559B1 EP 11754393 A EP11754393 A EP 11754393A EP 2614559 B1 EP2614559 B1 EP 2614559B1
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EP
European Patent Office
Prior art keywords
section
region
wire
stamping
press
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EP11754393.4A
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German (de)
French (fr)
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EP2614559A1 (en
Inventor
Ronny Ludwig
Gustav Klett
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of EP2614559A1 publication Critical patent/EP2614559A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F5/00—Upsetting wire or pressing operations affecting the wire cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board

Definitions

  • the invention relates to a method for producing pin-shaped contact elements according to the preamble of claim 1.
  • a method according to the preamble of claim 1 is known from DE 1 615 681 A1 known.
  • the known method is characterized by the formation of a press-in section, which is formed by an embossing step, wherein the press-in section has an asymmetrically formed cross-section.
  • a limitation of the axial insertion movement of the pin-shaped contact element into a corresponding counter element by the contact element is not provided.
  • EP 0 313 300 A1 known to be spaced from a press-in portion forming a holding portion which projects transversely to the longitudinal extent of the wire over the cross section of the wire, wherein the holding portion is formed by a punching step in a embossed region of the wire.
  • a pin-shaped contact element which is made of a wire with a round cross-section.
  • a press-fit portion in particular for connection to a printed circuit board, is formed by an embossing process at the one end portion of the contact element.
  • a holding section follows, in which is ensured by two harpoon-like embossments that the contact element only up to the over the circumference of the central region protruding embossments in a through hole of the circuit board can be inserted.
  • the press-fit portion is formed as a symmetrical press-in portion having symmetrically formed and arranged contact legs. As a result, a relatively elaborately designed embossing tool is required, which forms the press-in section from two sides.
  • the invention has the object, a method for producing pin-shaped contact elements according to the preamble of claim 1 such that a manufacturing technology particularly simple and economically trained method for producing a round base cross-section having contact elements with a holding area is shown.
  • This object is achieved in a method for producing pin-shaped contact elements with the features of claim 1.
  • the holding region is formed by a stamping step in an embossed region of the wire, wherein the embossed region simultaneously forms an asymmetrically formed press-in section.
  • the holding region is formed by a stamping step in the region of the embossing region, that subsequently in a third production step the press-in section is produced in the embossing region by a further, one-sided embossing step and in a fourth production step individual contact elements pass through Punching are cut out of the endless wire.
  • a secure guidance of the wire in the individual tools is achieved during manufacture or during the individual manufacturing steps of the wire, since the wire during the various manufacturing steps can be simply cyclically pulled through the individual production facilities.
  • this eliminates a complex handling of individual contact elements, which otherwise would be required if the contact elements would first be formed by separating respective sections of the wire.
  • embossing of the contact sections in the press-in section is furthermore particularly preferred for the embossing of the contact sections in the press-in section to take place from one side of the rectangular embossing area. This makes it possible to use a relatively simple embossing tool that requires only a counter-holder.
  • the surface of the wire is treated by a coating process, in particular by a galvanic process.
  • a preferred field of use of the contact element is the use as a connecting element between a printed circuit board and a sensor element. With such an arrangement can be dispensed with additional solder joints between the contact element and the circuit board, so possibly caused by a soldering process manufacturing errors, e.g. in the form of soldering or the like, can be excluded.
  • the holding portion has a width which is approximately twice as wide as the wire diameter.
  • the holding region has two holding edges which extend at right angles to the longitudinal axis of the contact element. As a result, a secure blocking of the contact element in the opening of the circuit board is effected.
  • a pin-shaped contact element 10 is shown, as it can be used in particular for contacting circuit substrates such as printed circuit boards or the like in the automotive supply industry.
  • the contact element 10 is made of a wire 1 with a round cross-section.
  • the contact element 10 has at its one end an asymmetrically formed press-fit section 11, which cooperates with the through-opening in the circuit carrier or can be inserted therein.
  • At the Einpressabêt 11 closes a holding portion 12 which limits the axial insertion movement of the contact element 10 in the passage opening of the circuit carrier.
  • Both the press-in section 11 and the holding area 12 have, in contrast to the remaining area of the contact element 10, no round cross-section.
  • a cylindrically formed connecting section 13 adjoins, which is designed as an electrode 15 in the exemplary embodiment shown.
  • the electrode 15 is for example part of a liquid sensor 20, which in the Fig. 8 is shown.
  • the press-in sections 11 of the contact elements 10 penetrate the printed circuit board 21 in the region of passage openings 22. Additional connections, in particular solder joints, are not required in order to electrically connect or contact the electrodes 15 or the contact elements 10 with the printed circuit board 21.
  • the Fig. 1 shows a portion of the wire 1 after a first manufacturing step.
  • a stamping area 24 is formed by the first manufacturing step in the wire 1 by a first stamping step.
  • the embossing area 24 has the corresponding Fig. 2 a substantially rectangular cross-sectional area, wherein the width b of the embossing region 24 corresponds approximately to twice the diameter d of the wire 1.
  • a transitional portion 25 is formed on both sides of the embossing region 24.
  • the state of the wire 1 is shown after two further, consecutive manufacturing steps.
  • the embossing region 24 is processed by a punching step such that the holding region 12 is punched on the side facing the one transitional section 25.
  • the holding portion 12 has two perpendicular to the longitudinal axis 26 of the wire 1 arranged holding edges 27, 28.
  • the stamping step reduced the stamping area 24 from the width b to the width a.
  • the press-in section 11 is formed in the embossing area 24 by a second embossing step. How to make a synopsis of the Fig. 3 to 5 recognizes, while the embossing region 24 in the region of the press-in section 11 is increased from the original width a to the width A. At the same time, two contact sections 29, 30 are embossed and a recess 31 is formed in the region of the press-in section 11.
  • the press-in portion 11 is formed asymmetrically. This is done by the embossing tool (not shown) used for embossing the press-in section 11 acting on the embossing area 24 from one side only, thereby embossing the recess 31.
  • the reduced in height contact portions 29, 30 act upon insertion into the through holes 22 of the circuit board 21 together with these, wherein a connection between the contact portions 29, 30 and the passage openings 22 sets.
  • a fourth manufacturing step is shown in which individual contact elements 10 are punched out of the endless wire 1 or separated by a second punching step. This is a piece of waste 2. At the same time, the press-in portion 11 opposite end 3 of the contact element 10 is formed.
  • the contact element 10 described so far can be modified or modified in many ways. In particular, other geometric relationships between the individual regions or sections of the contact element 10 are conceivable. Furthermore, it is preferably provided that the surface of the wire 1 is treated by a coating process, in particular by a galvanic process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Description

Stand der TechnikState of the art

Die Erfindung betrifft ein Verfahren zum Herstellen von stiftförmigen Kontaktelementen nach dem Oberbegriff des Anspruchs 1.The invention relates to a method for producing pin-shaped contact elements according to the preamble of claim 1.

Ein Verfahren nach dem Oberbegriff des Anspruchs 1 ist aus der DE 1 615 681 A1 bekannt. Das bekannte Verfahren zeichnet sich durch die Ausbildung eines Einpressabschnittes aus, der durch einen Prägeschritt gebildet ist, wobei der Einpressabschnitt einen asymmetrisch ausgebildeten Querschnitt aufweist. Eine Begrenzung der axialen Einschubbewegung des stiftförmigen Kontaktelements in ein entsprechendes Gegenelement durch das Kontaktelement ist nicht vorgesehen.A method according to the preamble of claim 1 is known from DE 1 615 681 A1 known. The known method is characterized by the formation of a press-in section, which is formed by an embossing step, wherein the press-in section has an asymmetrically formed cross-section. A limitation of the axial insertion movement of the pin-shaped contact element into a corresponding counter element by the contact element is not provided.

Aus dem US 5,893,779 ist weiterhin ein Verfahren zum Herstellen von Kontaktelementen bekannt, bei dem ein Einpressabschnitt ebenfalls mit einem asymmetrisch ausgebildeten Querschnitt ausgebildet wird.From the US 5,893,779 Furthermore, a method for producing contact elements is known, in which a press-in section is likewise formed with an asymmetrically formed cross-section.

Darüber hinaus ist aus der EP 0 313 300 A1 bekannt, beabstandet zu einem Einpressabschnitt einen Haltebereich auszubilden, der quer zur Längserstreckung des Drahtes über den Querschnitt des Drahtes herausragt, wobei der Haltebereich durch einen Stanzschritt in einem Prägebereich des Drahtes ausgebildet wird.In addition, from the EP 0 313 300 A1 known to be spaced from a press-in portion forming a holding portion which projects transversely to the longitudinal extent of the wire over the cross section of the wire, wherein the holding portion is formed by a punching step in a embossed region of the wire.

Zuletzt ist aus der DE 20 2006 000 183 U1 ein stiftförmiges Kontaktelement bekannt, das aus einem Draht mit rundem Querschnitt hergestellt ist. Dabei wird an dem einen Endabschnitt des Kontaktelements ein Einpressabschnitt, insbesondere zur Verbindung mit einer Leiterplatte, durch einen Prägeprozess ausgebildet. Im mittleren Bereich des Kontaktabschnitts schließt sich ein Halteabschnitt an, bei dem durch zwei harpunenartige Prägungen gewährleistet ist, dass das Kontaktelement nur bis zu den über den Umfang des mittleren Bereichs überstehenden Prägungen in eine Durchgangsöffnung der Leiterplatte eingesteckt werden kann. Ferner ist wesentlich, dass der Einpressabschnitt als symmetrischer Einpressabschnitt ausgebildet ist, der symmetrisch ausgebildete und angeordnete Kontaktschenkel aufweist. Dadurch wird ein relativ aufwändig gestaltetes Prägewerkzeug benötigt, das den Einpressabschnitt von zwei Seiten her ausbildet.Last is from the DE 20 2006 000 183 U1 a pin-shaped contact element is known, which is made of a wire with a round cross-section. In this case, a press-fit portion, in particular for connection to a printed circuit board, is formed by an embossing process at the one end portion of the contact element. In the middle region of the contact section, a holding section follows, in which is ensured by two harpoon-like embossments that the contact element only up to the over the circumference of the central region protruding embossments in a through hole of the circuit board can be inserted. Furthermore, it is essential that the press-fit portion is formed as a symmetrical press-in portion having symmetrically formed and arranged contact legs. As a result, a relatively elaborately designed embossing tool is required, which forms the press-in section from two sides.

Offenbarung der ErfindungDisclosure of the invention

Ausgehend von dem dargestellten Stand der Technik liegt der Erfindung die Aufgabe zugrunde, ein Verfahren zum Herstellen von stiftförmigen Kontaktelementen nach dem Oberbegriff des Anspruchs 1 derart weiterzubilden, dass ein herstellungstechnisch besonders einfach und wirtschaftlich ausgebildetes Verfahren zur Herstellung von einen runden Grundquerschnitt aufweisenden Kontaktelementen mit einem Haltebereich aufgezeigt wird. Diese Aufgabe wird bei einem Verfahren zum Herstellen von stiftförmigen Kontaktelementen mit den Merkmalen des Anspruchs 1 gelöst. Hierbei ist es vorgesehen, dass der Haltebereich durch einen Stanzschritt in einem geprägten Bereich des Drahtes ausgebildet wird, wobei der geprägte Bereich gleichzeitig einen asymmetrisch ausgebildeten Einpressabschnitt ausbildet. Weiterhin ist es vorgesehen, dass in einem zweiten Fertigungsschritt durch einen Stanzschritt im Bereich des Prägebereichs der Haltebereich ausgebildet wird, dass anschließend in einem dritten Fertigungsschritt durch einen weiteren, einseitigen Prägeschritt der Einpressabschnitt in dem Prägebereich gefertigt wird und dass in einem vierten Fertigungsschritt einzelne Kontaktelemente durch Stanzen aus dem endlosen Draht herausgetrennt werden. Mit anderen Worten gesagt bedeutet dies, dass die einzelnen Kontaktelemente erst am Schluss des Fertigungsverfahrens herausgetrennt werden, bei dem die Kontaktelemente noch miteinander stirnseitig verbunden sind. Dadurch wird während der Fertigung bzw. während der einzelnen Fertigungsschritte des Drahtes eine sichere Führung des Drahtes in den einzelnen Werkzeugen erreicht, da der Draht während der verschiedenen Fertigungsschritte einfach taktweise durch die einzelnen Fertigungseinrichtungen gezogen werden kann. Insbesondere entfällt dadurch ein aufwändiges Handling einzelner Kontaktelemente, welches ansonsten erforderlich wäre, wenn die Kontaktelemente zunächst durch Abtrennen entsprechender Abschnitte von dem Draht gebildet werden würden.Based on the illustrated prior art, the invention has the object, a method for producing pin-shaped contact elements according to the preamble of claim 1 such that a manufacturing technology particularly simple and economically trained method for producing a round base cross-section having contact elements with a holding area is shown. This object is achieved in a method for producing pin-shaped contact elements with the features of claim 1. In this case, it is provided that the holding region is formed by a stamping step in an embossed region of the wire, wherein the embossed region simultaneously forms an asymmetrically formed press-in section. Furthermore, it is provided that in a second production step the holding region is formed by a stamping step in the region of the embossing region, that subsequently in a third production step the press-in section is produced in the embossing region by a further, one-sided embossing step and in a fourth production step individual contact elements pass through Punching are cut out of the endless wire. In other words, this means that the individual contact elements are cut out only at the end of the manufacturing process, in which the contact elements are still connected to each other frontally. As a result, a secure guidance of the wire in the individual tools is achieved during manufacture or during the individual manufacturing steps of the wire, since the wire during the various manufacturing steps can be simply cyclically pulled through the individual production facilities. In particular, this eliminates a complex handling of individual contact elements, which otherwise would be required if the contact elements would first be formed by separating respective sections of the wire.

Vorteilhafte Weiterbildungen des erfindungsgemäßen Verfahrens zum Herstellen von stiftförmigen Kontaktelementen sind in den Unteransprüchen angegeben.Advantageous developments of the method according to the invention for producing pin-shaped contact elements are specified in the subclaims.

Besonders bevorzugt ist es weiterhin, dass das Prägen der Kontaktabschnitte im Einpressabschnitt von einer Seite des rechteckigen Prägebereichs her erfolgt. Dadurch wird es ermöglicht, ein relativ einfach gestaltetes Prägewerkzeug zu verwenden, das lediglich einen Gegenhalter benötigt.It is furthermore particularly preferred for the embossing of the contact sections in the press-in section to take place from one side of the rectangular embossing area. This makes it possible to use a relatively simple embossing tool that requires only a counter-holder.

Zur Vermeidung von Korrosion oder sonstiger, die elektrische Verbindung beeinträchtigender, Faktoren wird weiterhin vorgeschlagen, dass die Oberfläche des Drahtes durch einen Beschichtungsprozess, insbesondere durch einen Galvanikprozess, behandelt wird.To avoid corrosion or other, the electrical connection impairing factors, it is further proposed that the surface of the wire is treated by a coating process, in particular by a galvanic process.

Ein bevorzugtes Einsatzgebiet des Kontaktelements besteht in der Verwendung als Verbindungselement zwischen einer Leiterplatte und einem Sensorelement. Bei einer derartigen Anordnung kann auf zusätzliche Lötverbindungen zwischen dem Kontaktelement und der Leiterplatte verzichtet werden, sodass durch einen Lötprozess ggf. bedingte Fertigungsfehler, z.B. in Form von Lötspritzern oder ähnlichem, ausgeschlossen werden können. Um eine sichere Verankerung des Einpressabschnittes in der Öffnung einer Leiterplatte zu ermöglichen, die ein weiteres Durchrutschen des Kontaktelements sicher vermeidet, wird darüber hinaus vorgeschlagen, dass der Haltebereich eine Breite aufweist, die in etwa doppelt so breit ist wie der Drahtdurchmesser. Insbesondere kann es dabei vorgesehen sein, dass der Haltebereich zwei Haltekanten aufweist, die sich rechtwinklig zur Längsachse des Kontaktelements erstrecken. Dadurch wird eine sichere Blockierung des Kontaktelements in der Öffnung der Leiterplatte bewirkt.A preferred field of use of the contact element is the use as a connecting element between a printed circuit board and a sensor element. With such an arrangement can be dispensed with additional solder joints between the contact element and the circuit board, so possibly caused by a soldering process manufacturing errors, e.g. in the form of soldering or the like, can be excluded. In order to enable a secure anchoring of the press-in portion in the opening of a printed circuit board, which avoids further slippage of the contact element safely, it is also proposed that the holding portion has a width which is approximately twice as wide as the wire diameter. In particular, it may be provided that the holding region has two holding edges which extend at right angles to the longitudinal axis of the contact element. As a result, a secure blocking of the contact element in the opening of the circuit board is effected.

Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele sowie anhand der Zeichnung.Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawing.

Diese zeigt in:

Fig. 1
eine Seitenansicht auf einen Abschnitt eines endlosen Drahtes nach einem ersten Fertigungsschritt eines Kontaktelements, bei dem ein Prägebereich ausgebildet wurde,
Fig. 2
eine Ansicht in Richtung des Schnittes II-II der Fig. 1,
Fig. 3
den Teilbereich des Drahtes gemäß Fig. 1, nachdem ein Einpressabschnitt und ein Haltebereich ausgebildet wurden,
Fig. 4
einen Schnitt in der Ebene IV-IV der Fig. 3,
Fig. 5
einen Längsschnitt durch den Draht gemäß Fig. 3,
Fig. 6
den Abschnitt des Drahtes gemäß den Fig. 1 und 3 nach dem Abtrennen eines Kontaktelements von dem Draht,
Fig. 7
ein Kontaktelement in Seitenansicht und
Fig. 8
eine perspektivische Ansicht eines Flüssigkeitssensors in teilweise geschnittener Darstellung unter Verwendung erfindungsgemäßer Kontaktelemente.
This shows in:
Fig. 1
a side view of a portion of an endless wire after a first manufacturing step of a contact element in which a stamping area has been formed,
Fig. 2
a view in the direction of the section II-II of Fig. 1 .
Fig. 3
the partial area of the wire according to Fig. 1 after a press-fit portion and a holding portion have been formed,
Fig. 4
a section in the level IV-IV of the Fig. 3 .
Fig. 5
a longitudinal section through the wire according to Fig. 3 .
Fig. 6
the section of the wire according to the Fig. 1 and 3 after severing a contact element from the wire,
Fig. 7
a contact element in side view and
Fig. 8
a perspective view of a liquid sensor in a partially sectioned view using inventive contact elements.

Gleiche Bauteile bzw. Bauteile mit gleicher Funktion sind in den Figuren mit den gleichen Bezugsziffern versehen.The same components or components with the same function are provided in the figures with the same reference numerals.

In der Fig. 7 ist ein stiftförmiges Kontaktelement 10 dargestellt, wie es insbesondere zur Kontaktierung von Schaltungsträgern wie Leiterplatten oder ähnlichem in der Kraftfahrzeugzulieferindustrie eingesetzt werden kann. Das Kontaktelement 10 ist aus einem Draht 1 mit rundem Querschnitt hergestellt. Das Kontaktelement 10 weist an seinem einen Ende einen asymmetrisch ausgebildeten Einpressabschnitt 11 auf, der mit der Durchgangsöffnung in dem Schaltungsträger zusammenwirkt bzw. in diese einsteckbar ist. An den Einpressabschnitt 11 schließt sich ein Haltebereich 12 an, der die axiale Einschubbewegung des Kontaktelements 10 in der Durchgangsöffnung des Schaltungsträgers begrenzt. Sowohl der Einpressabschnitt 11 als auch der Haltebereich 12 weisen, im Gegensatz zu dem restlichen Bereich des Kontaktelements 10, keinen runden Querschnitt auf.In the Fig. 7 a pin-shaped contact element 10 is shown, as it can be used in particular for contacting circuit substrates such as printed circuit boards or the like in the automotive supply industry. The contact element 10 is made of a wire 1 with a round cross-section. The contact element 10 has at its one end an asymmetrically formed press-fit section 11, which cooperates with the through-opening in the circuit carrier or can be inserted therein. At the Einpressabschnitt 11 closes a holding portion 12 which limits the axial insertion movement of the contact element 10 in the passage opening of the circuit carrier. Both the press-in section 11 and the holding area 12 have, in contrast to the remaining area of the contact element 10, no round cross-section.

An den Haltebereich 12 schließt sich auf der dem Einpressabschnitt 11 gegenüberliegenden Seite ein zylindrisch ausgebildeter Verbindungsabschnitt 13 an, der in dem dargestellten Ausführungsbeispiel als Elektrode 15 ausgebildet ist. Die Elektrode 15 ist beispielsweise Bestandteil eines Flüssigkeitssensors 20, der in der Fig. 8 dargestellt ist. Man erkennt, dass der in der Fig. 8 dargestellte Flüssigkeitssensor 20 zwei Elektroden 15 mit zwei Kontaktelementen 10 aufweist, die in Wirkverbindung mit einer Leiterplatte 21 des Flüssigkeitssensors 20 angeordnet sind. Hierbei durchdringen die Einpressabschnitte 11 der Kontaktelemente 10 die Leiterplatte 21 im Bereich von Durchgangsöffnungen 22. Zusätzliche Verbindungen, insbesondere Lötverbindungen, sind nicht erforderlich, um die Elektroden 15 bzw. die Kontaktelemente 10 elektrisch mit der Leiterplatte 21 zu verbinden bzw. zu kontaktieren.On the holding region 12, on the side opposite the press-in section 11, a cylindrically formed connecting section 13 adjoins, which is designed as an electrode 15 in the exemplary embodiment shown. The electrode 15 is for example part of a liquid sensor 20, which in the Fig. 8 is shown. One recognizes that in the Fig. 8 illustrated liquid sensor 20 has two electrodes 15 with two contact elements 10, which are arranged in operative connection with a circuit board 21 of the liquid sensor 20. In this case, the press-in sections 11 of the contact elements 10 penetrate the printed circuit board 21 in the region of passage openings 22. Additional connections, in particular solder joints, are not required in order to electrically connect or contact the electrodes 15 or the contact elements 10 with the printed circuit board 21.

In den Fig. 1 bis 6 wird nunmehr der Fertigungsprozess von erfindungsgemäßen Kontaktelementen 10 näher erläutert: Die Fig. 1 zeigt einen Abschnitt des Drahtes 1 nach einem ersten Fertigungsschritt. Hierbei wird durch den ersten Fertigungsschritt in dem Draht 1 durch einen ersten Prägeschritt ein Prägebereich 24 ausgebildet. Der Prägebereich 24 weist entsprechend der Fig. 2 eine im Wesentlichen rechteckförmige Querschnittsfläche auf, wobei die Breite b des Prägebereichs 24 in etwa dem doppelten Durchmesser d des Drahtes 1 entspricht. Zwischen dem rechteckförmigen Prägebereich 24 und dem im Querschnitt restlichen Bereich des (runden) Drahts 1 ist auf beiden Seiten des Prägebereichs 24 noch jeweils ein Übergangsabschnitt 25 ausgebildet.In the Fig. 1 to 6 Now, the manufacturing process of contact elements 10 according to the invention will be explained in more detail: The Fig. 1 shows a portion of the wire 1 after a first manufacturing step. Here, a stamping area 24 is formed by the first manufacturing step in the wire 1 by a first stamping step. The embossing area 24 has the corresponding Fig. 2 a substantially rectangular cross-sectional area, wherein the width b of the embossing region 24 corresponds approximately to twice the diameter d of the wire 1. Between the rectangular embossing region 24 and the region of the (round) wire 1 remaining in cross section, a transitional portion 25 is formed on both sides of the embossing region 24.

In der Fig. 3 ist der Zustand des Drahtes 1 nach zwei weiteren, aufeinander folgenden Fertigungsschritten dargestellt. Hierbei wird in einem zweiten Fertigungsschritt der Prägebereich 24 durch einen Stanzschritt derart bearbeitet, dass auf der dem einen Übergangsabschnitt 25 zugewandten Seite der Haltebereich 12 gestanzt wird. Hierbei weist der Haltebereich 12 zwei rechtwinklig zur Längsachse 26 des Drahtes 1 angeordnete Haltekanten 27, 28 auf. Ferner wurde durch den Stanzschritt der Prägebereich 24 von der Breite b auf die Breite a reduziert.In the Fig. 3 the state of the wire 1 is shown after two further, consecutive manufacturing steps. Here, in a second production step, the embossing region 24 is processed by a punching step such that the holding region 12 is punched on the side facing the one transitional section 25. Here, the holding portion 12 has two perpendicular to the longitudinal axis 26 of the wire 1 arranged holding edges 27, 28. Furthermore, the stamping step reduced the stamping area 24 from the width b to the width a.

Anschließend wird in einem dritten Fertigungsschritt durch einen zweiten Prägeschritt der Einpressabschnitt 11 in den Prägebereich 24 eingeformt. Wie man aus einer Zusammenschau der Fig. 3 bis 5 erkennt, wird dabei der Prägebereich 24 im Bereich des Einpressabschnittes 11 von der ursprünglichen Breite a auf die Breite A vergrößert. Gleichzeitig werden zwei Kontaktabschnitte 29, 30 eingeprägt und eine Vertiefung 31 im Bereich des Einpressabschnittes 11 ausgebildet.Subsequently, in a third production step, the press-in section 11 is formed in the embossing area 24 by a second embossing step. How to make a synopsis of the Fig. 3 to 5 recognizes, while the embossing region 24 in the region of the press-in section 11 is increased from the original width a to the width A. At the same time, two contact sections 29, 30 are embossed and a recess 31 is formed in the region of the press-in section 11.

Wesentlich dabei ist, dass, wie insbesondere anhand der Fig. 4 und 5 erkennbar ist, der Einpressabschnitt 11 asymmetrisch ausgebildet ist. Dies erfolgt dadurch, dass das zum Prägen des Einpressabschnittes 11 verwendete, nicht dargestellte Prägewerkzeug lediglich von einer Seite auf den Prägebereich 24 einwirkt und dabei die Vertiefung 31 einprägt.It is essential that, as in particular on the basis of Fig. 4 and 5 can be seen, the press-in portion 11 is formed asymmetrically. This is done by the embossing tool (not shown) used for embossing the press-in section 11 acting on the embossing area 24 from one side only, thereby embossing the recess 31.

Die in ihrer Höhe reduzierten Kontaktabschnitte 29, 30 wirken beim Einführen in die Durchgangsöffnungen 22 der Leiterplatte 21 mit diesen zusammen, wobei sich eine Verbindung zwischen den Kontaktabschnitten 29, 30 und den Durchgangsöffnungen 22 einstellt.The reduced in height contact portions 29, 30 act upon insertion into the through holes 22 of the circuit board 21 together with these, wherein a connection between the contact portions 29, 30 and the passage openings 22 sets.

In der Fig. 6 ist ein vierter Fertigungsschritt dargestellt, bei dem durch einen zweiten Stanzschritt einzelne Kontaktelemente 10 aus dem endlosen Draht 1 ausgestanzt bzw. ausgetrennt werden. Hierbei fällt ein Abfallstück 2 an. Gleichzeitig wird das dem Einpressabschnitt 11 gegenüberliegende Ende 3 des Kontaktelements 10 ausgebildet.In the Fig. 6 a fourth manufacturing step is shown in which individual contact elements 10 are punched out of the endless wire 1 or separated by a second punching step. This is a piece of waste 2. At the same time, the press-in portion 11 opposite end 3 of the contact element 10 is formed.

Das soweit beschriebene Kontaktelement 10 kann in vielfältiger Art und Weise abgewandelt bzw. modifiziert werden. Insbesondere sind andere geometrische Verhältnisse zwischen den einzelnen Bereichen bzw. Abschnitten des Kontaktelements 10 denkbar. Weiterhin ist es bevorzugt vorgesehen, dass die Oberfläche des Drahtes 1 durch einen Beschichtungsprozess, insbesondere durch einen Galvanikprozess, behandelt wird.The contact element 10 described so far can be modified or modified in many ways. In particular, other geometric relationships between the individual regions or sections of the contact element 10 are conceivable. Furthermore, it is preferably provided that the surface of the wire 1 is treated by a coating process, in particular by a galvanic process.

Claims (5)

  1. Method for producing a large number of pin-like contact elements (10), in which method, in a wire (1) of round cross section, a press-in section (11) is formed at one end of the contact element (10) by a stamping step, and wherein a holding region (12) is formed at a distance from the press-in section (11), the said holding region protruding transverse to the longitudinal extent of the wire (1) beyond the cross section in the region of the round wire (1), wherein the holding region (12) is formed by a punching step in a stamping region (24) of the wire (1), wherein the stamping region (24) at the same time forms the asymmetrical press-in section (11), and wherein, in order to produce the large number of contact elements (10), the wire (1) is provided with the stamping region (24) in a first manufacturing step, the said stamping region having an approximately rectangular cross section, wherein the side (b) which is wider in cross section protrudes beyond the cross section in the region of the round wire (1) on both sides, the holding region (12) is formed in a second manufacturing step by a punching step in the region of the stamping region (24), then the press-in section (11) is formed in the stamping region (24) in a third manufacturing step by the further, one-sided stamping step, and the individual contact elements (10) are separated off from the endless wire (1) by punching in a fourth manufacturing step.
  2. Method according to Claim 1, characterized in that the press-in section (11) is formed by stamping two contact sections (29, 30) which protrude beyond the cross section of the remainder of the rectangular section (a) of the stamping region (24).
  3. Method according to Claim 2, characterized in that the contact sections (29, 30) are stamped from one side of the stamping region (24).
  4. Method according to Claim 2 or 3, characterized in that the stamping step creates a recess (31) in the press-in section (11).
  5. Method according to one of Claims 1 to 4, characterized in that the surface of the wire (1) is treated by a coating process, in particular by an electrodeposition process.
EP11754393.4A 2010-09-10 2011-09-07 Method for producing pin-shaped contact elements and contact element Active EP2614559B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010040561A DE102010040561A1 (en) 2010-09-10 2010-09-10 Method for producing pin-shaped contact elements and contact element
PCT/EP2011/065441 WO2012032077A1 (en) 2010-09-10 2011-09-07 Method for producing pin-shaped contact elements and contact element

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EP2614559A1 EP2614559A1 (en) 2013-07-17
EP2614559B1 true EP2614559B1 (en) 2017-11-15

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EP (1) EP2614559B1 (en)
CN (1) CN103109422B (en)
DE (1) DE102010040561A1 (en)
WO (1) WO2012032077A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3958402B1 (en) 2017-05-17 2023-04-05 Infineon Technologies AG Method for electrically connecting an electronic module and electronic assembly
CN109692909B (en) * 2019-01-14 2023-12-15 上海徕木电子股份有限公司 Preparation process of fish fork terminal for connector

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1615681A1 (en) * 1967-01-27 1970-06-18 Amp Inc Electrical connector pin and method for its manufacture

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
US3634819A (en) * 1970-03-18 1972-01-11 William Robert Evans Resilient pin and method of production thereof
US4586778A (en) * 1983-08-25 1986-05-06 Bmc Industries, Inc. Compliant pin
US4606589A (en) * 1984-01-12 1986-08-19 H & V Services Compliant pin
US4831728A (en) * 1987-06-05 1989-05-23 Northern Telecom Limited Method of making circuit board pin
US5893779A (en) * 1996-10-18 1999-04-13 Autosplice Systems Inc. Conforming press-fit contact pin for printed circuit board
DE202006000183U1 (en) 2006-01-07 2006-05-11 Sorig, Ludger Press-in contact pin for pressing into a through-hole-plated hole in a printed circuit board has a press-in contact to form two outwardly curved contact limbs each separated by an oblong slot

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1615681A1 (en) * 1967-01-27 1970-06-18 Amp Inc Electrical connector pin and method for its manufacture

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CN103109422A (en) 2013-05-15
DE102010040561A1 (en) 2012-03-15
WO2012032077A1 (en) 2012-03-15
EP2614559A1 (en) 2013-07-17
CN103109422B (en) 2015-07-22

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