EP2614559B1 - Procédé de fabrication d'éléments de contact en forme de tige et élément de contact - Google Patents
Procédé de fabrication d'éléments de contact en forme de tige et élément de contact Download PDFInfo
- Publication number
- EP2614559B1 EP2614559B1 EP11754393.4A EP11754393A EP2614559B1 EP 2614559 B1 EP2614559 B1 EP 2614559B1 EP 11754393 A EP11754393 A EP 11754393A EP 2614559 B1 EP2614559 B1 EP 2614559B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- section
- region
- wire
- stamping
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims 1
- 238000004049 embossing Methods 0.000 description 21
- 239000007788 liquid Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F5/00—Upsetting wire or pressing operations affecting the wire cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
Definitions
- the invention relates to a method for producing pin-shaped contact elements according to the preamble of claim 1.
- a method according to the preamble of claim 1 is known from DE 1 615 681 A1 known.
- the known method is characterized by the formation of a press-in section, which is formed by an embossing step, wherein the press-in section has an asymmetrically formed cross-section.
- a limitation of the axial insertion movement of the pin-shaped contact element into a corresponding counter element by the contact element is not provided.
- EP 0 313 300 A1 known to be spaced from a press-in portion forming a holding portion which projects transversely to the longitudinal extent of the wire over the cross section of the wire, wherein the holding portion is formed by a punching step in a embossed region of the wire.
- a pin-shaped contact element which is made of a wire with a round cross-section.
- a press-fit portion in particular for connection to a printed circuit board, is formed by an embossing process at the one end portion of the contact element.
- a holding section follows, in which is ensured by two harpoon-like embossments that the contact element only up to the over the circumference of the central region protruding embossments in a through hole of the circuit board can be inserted.
- the press-fit portion is formed as a symmetrical press-in portion having symmetrically formed and arranged contact legs. As a result, a relatively elaborately designed embossing tool is required, which forms the press-in section from two sides.
- the invention has the object, a method for producing pin-shaped contact elements according to the preamble of claim 1 such that a manufacturing technology particularly simple and economically trained method for producing a round base cross-section having contact elements with a holding area is shown.
- This object is achieved in a method for producing pin-shaped contact elements with the features of claim 1.
- the holding region is formed by a stamping step in an embossed region of the wire, wherein the embossed region simultaneously forms an asymmetrically formed press-in section.
- the holding region is formed by a stamping step in the region of the embossing region, that subsequently in a third production step the press-in section is produced in the embossing region by a further, one-sided embossing step and in a fourth production step individual contact elements pass through Punching are cut out of the endless wire.
- a secure guidance of the wire in the individual tools is achieved during manufacture or during the individual manufacturing steps of the wire, since the wire during the various manufacturing steps can be simply cyclically pulled through the individual production facilities.
- this eliminates a complex handling of individual contact elements, which otherwise would be required if the contact elements would first be formed by separating respective sections of the wire.
- embossing of the contact sections in the press-in section is furthermore particularly preferred for the embossing of the contact sections in the press-in section to take place from one side of the rectangular embossing area. This makes it possible to use a relatively simple embossing tool that requires only a counter-holder.
- the surface of the wire is treated by a coating process, in particular by a galvanic process.
- a preferred field of use of the contact element is the use as a connecting element between a printed circuit board and a sensor element. With such an arrangement can be dispensed with additional solder joints between the contact element and the circuit board, so possibly caused by a soldering process manufacturing errors, e.g. in the form of soldering or the like, can be excluded.
- the holding portion has a width which is approximately twice as wide as the wire diameter.
- the holding region has two holding edges which extend at right angles to the longitudinal axis of the contact element. As a result, a secure blocking of the contact element in the opening of the circuit board is effected.
- a pin-shaped contact element 10 is shown, as it can be used in particular for contacting circuit substrates such as printed circuit boards or the like in the automotive supply industry.
- the contact element 10 is made of a wire 1 with a round cross-section.
- the contact element 10 has at its one end an asymmetrically formed press-fit section 11, which cooperates with the through-opening in the circuit carrier or can be inserted therein.
- At the Einpressabêt 11 closes a holding portion 12 which limits the axial insertion movement of the contact element 10 in the passage opening of the circuit carrier.
- Both the press-in section 11 and the holding area 12 have, in contrast to the remaining area of the contact element 10, no round cross-section.
- a cylindrically formed connecting section 13 adjoins, which is designed as an electrode 15 in the exemplary embodiment shown.
- the electrode 15 is for example part of a liquid sensor 20, which in the Fig. 8 is shown.
- the press-in sections 11 of the contact elements 10 penetrate the printed circuit board 21 in the region of passage openings 22. Additional connections, in particular solder joints, are not required in order to electrically connect or contact the electrodes 15 or the contact elements 10 with the printed circuit board 21.
- the Fig. 1 shows a portion of the wire 1 after a first manufacturing step.
- a stamping area 24 is formed by the first manufacturing step in the wire 1 by a first stamping step.
- the embossing area 24 has the corresponding Fig. 2 a substantially rectangular cross-sectional area, wherein the width b of the embossing region 24 corresponds approximately to twice the diameter d of the wire 1.
- a transitional portion 25 is formed on both sides of the embossing region 24.
- the state of the wire 1 is shown after two further, consecutive manufacturing steps.
- the embossing region 24 is processed by a punching step such that the holding region 12 is punched on the side facing the one transitional section 25.
- the holding portion 12 has two perpendicular to the longitudinal axis 26 of the wire 1 arranged holding edges 27, 28.
- the stamping step reduced the stamping area 24 from the width b to the width a.
- the press-in section 11 is formed in the embossing area 24 by a second embossing step. How to make a synopsis of the Fig. 3 to 5 recognizes, while the embossing region 24 in the region of the press-in section 11 is increased from the original width a to the width A. At the same time, two contact sections 29, 30 are embossed and a recess 31 is formed in the region of the press-in section 11.
- the press-in portion 11 is formed asymmetrically. This is done by the embossing tool (not shown) used for embossing the press-in section 11 acting on the embossing area 24 from one side only, thereby embossing the recess 31.
- the reduced in height contact portions 29, 30 act upon insertion into the through holes 22 of the circuit board 21 together with these, wherein a connection between the contact portions 29, 30 and the passage openings 22 sets.
- a fourth manufacturing step is shown in which individual contact elements 10 are punched out of the endless wire 1 or separated by a second punching step. This is a piece of waste 2. At the same time, the press-in portion 11 opposite end 3 of the contact element 10 is formed.
- the contact element 10 described so far can be modified or modified in many ways. In particular, other geometric relationships between the individual regions or sections of the contact element 10 are conceivable. Furthermore, it is preferably provided that the surface of the wire 1 is treated by a coating process, in particular by a galvanic process.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Claims (5)
- Procédé de fabrication d'une pluralité d'éléments de contact (10) en forme de broche, avec lequel, dans un fil métallique (1) de section transversale ronde, une portion d'enfoncement (11) est formée par une étape de matriçage à l'une des extrémités de l'élément de contact (10), et une zone de maintien (12) étant formée à distance de la portion d'enfoncement (11), laquelle fait saillie transversalement à la projection longitudinale du fil métallique (1) au-dessus de la section transversale dans la zone du fil métallique (1) rond,
la zone de maintien (12) étant formée par une étape de poinçonnage dans une zone de matriçage (24) du fil métallique (1), la zone de matriçage (24) formant en même temps la portion d'enfoncement (11) de configuration asymétrique
et
en vue de la fabrication de la pluralité d'éléments de contact (10), le fil métallique (1) est pourvu, au cours d'une première étape de fabrication, de la zone de matriçage (24) qui possède une section transversale approximativement rectangulaire, le côté plus large (b) dans la section transversale faisant saillie des deux côtés au-dessus de la section transversale dans la zone du fil métallique (1) rond, la zone de maintien (12) étant formée au cours d'une deuxième étape de fabrication par une étape de poinçonnage dans la région de la zone de matriçage (24), la portion d'enfoncement (11) étant ensuite formée dans la zone de matriçage (24) au cours d'une troisième étape de fabrication par l'étape de matriçage unilatérale supplémentaire, puis les éléments de contact (10) individuels étant séparés par poinçonnage du fil métallique (1) continu au cours d'une quatrième étape de fabrication. - Procédé selon la revendication 1, caractérisé en ce que la portion d'enfoncement (11) est formée par matriçage de deux portions de contact (29, 30) qui font saillie au-dessus de la section transversale de la portion rectangulaire (a) restante de la zone de matriçage (24).
- Procédé selon la revendication 2, caractérisé en ce que le matriçage des portions de contact (29, 30) est effectué depuis un côté de la zone de matriçage (24).
- Procédé selon la revendication 2 ou 3, caractérisé en ce que l'étape de matriçage produit un creux (31) dans la portion d'enfoncement (11).
- Procédé selon l'une des revendications 1 à 4, caractérisé en ce que la surface du fil métallique (1) est traitée par un processus de revêtement, notamment par un processus galvanique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010040561A DE102010040561A1 (de) | 2010-09-10 | 2010-09-10 | Verfahren zum Herstellen von stiftförmigen Kontaktelementen und Kontaktelement |
PCT/EP2011/065441 WO2012032077A1 (fr) | 2010-09-10 | 2011-09-07 | Procédé de fabrication d'éléments de contact en forme de tige et élément de contact |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2614559A1 EP2614559A1 (fr) | 2013-07-17 |
EP2614559B1 true EP2614559B1 (fr) | 2017-11-15 |
Family
ID=44583048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11754393.4A Active EP2614559B1 (fr) | 2010-09-10 | 2011-09-07 | Procédé de fabrication d'éléments de contact en forme de tige et élément de contact |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2614559B1 (fr) |
CN (1) | CN103109422B (fr) |
DE (1) | DE102010040561A1 (fr) |
WO (1) | WO2012032077A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3958402B1 (fr) | 2017-05-17 | 2023-04-05 | Infineon Technologies AG | Procédé de connexion électrique d'un module électronique et ensemble électronique |
CN109692909B (zh) * | 2019-01-14 | 2023-12-15 | 上海徕木电子股份有限公司 | 一种连接器用鱼叉形端子的制备工艺 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1615681A1 (de) * | 1967-01-27 | 1970-06-18 | Amp Inc | Elektrischer Steckerstift und Verfahren zu seiner Herstellung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3634819A (en) * | 1970-03-18 | 1972-01-11 | William Robert Evans | Resilient pin and method of production thereof |
US4586778A (en) * | 1983-08-25 | 1986-05-06 | Bmc Industries, Inc. | Compliant pin |
US4606589A (en) * | 1984-01-12 | 1986-08-19 | H & V Services | Compliant pin |
US4831728A (en) * | 1987-06-05 | 1989-05-23 | Northern Telecom Limited | Method of making circuit board pin |
US5893779A (en) * | 1996-10-18 | 1999-04-13 | Autosplice Systems Inc. | Conforming press-fit contact pin for printed circuit board |
DE202006000183U1 (de) | 2006-01-07 | 2006-05-11 | Sorig, Ludger | Einpresskontaktstift |
-
2010
- 2010-09-10 DE DE102010040561A patent/DE102010040561A1/de not_active Withdrawn
-
2011
- 2011-09-07 WO PCT/EP2011/065441 patent/WO2012032077A1/fr active Application Filing
- 2011-09-07 EP EP11754393.4A patent/EP2614559B1/fr active Active
- 2011-09-07 CN CN201180043247.6A patent/CN103109422B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1615681A1 (de) * | 1967-01-27 | 1970-06-18 | Amp Inc | Elektrischer Steckerstift und Verfahren zu seiner Herstellung |
Also Published As
Publication number | Publication date |
---|---|
DE102010040561A1 (de) | 2012-03-15 |
WO2012032077A1 (fr) | 2012-03-15 |
CN103109422A (zh) | 2013-05-15 |
EP2614559A1 (fr) | 2013-07-17 |
CN103109422B (zh) | 2015-07-22 |
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