EP2569362A1 - Insulation for rotating electrical machines - Google Patents
Insulation for rotating electrical machinesInfo
- Publication number
- EP2569362A1 EP2569362A1 EP11740857A EP11740857A EP2569362A1 EP 2569362 A1 EP2569362 A1 EP 2569362A1 EP 11740857 A EP11740857 A EP 11740857A EP 11740857 A EP11740857 A EP 11740857A EP 2569362 A1 EP2569362 A1 EP 2569362A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- impregnating resin
- insulation
- mica
- resin according
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009413 insulation Methods 0.000 title abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000010445 mica Substances 0.000 claims abstract description 19
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 6
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003153 chemical reaction reagent Substances 0.000 claims description 7
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- XWHJQTQOUDOZGR-UHFFFAOYSA-N hex-1-enyl(trimethoxy)silane Chemical compound CCCCC=C[Si](OC)(OC)OC XWHJQTQOUDOZGR-UHFFFAOYSA-N 0.000 claims description 4
- 238000002444 silanisation Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 claims description 3
- MZWXWSVCNSPBLH-UHFFFAOYSA-N 3-(3-aminopropyl-methoxy-methylsilyl)oxypropan-1-amine Chemical compound NCCC[Si](C)(OC)OCCCN MZWXWSVCNSPBLH-UHFFFAOYSA-N 0.000 claims description 2
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 claims description 2
- YMTRNELCZAZKRB-UHFFFAOYSA-N 3-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=CC(N)=C1 YMTRNELCZAZKRB-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 2
- KXJLGCBCRCSXQF-UHFFFAOYSA-N [diacetyloxy(ethyl)silyl] acetate Chemical compound CC(=O)O[Si](CC)(OC(C)=O)OC(C)=O KXJLGCBCRCSXQF-UHFFFAOYSA-N 0.000 claims description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- ZPECUSGQPIKHLT-UHFFFAOYSA-N bis(ethenyl)-dimethoxysilane Chemical compound CO[Si](OC)(C=C)C=C ZPECUSGQPIKHLT-UHFFFAOYSA-N 0.000 claims description 2
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 claims description 2
- OOSZILWKTQCRSZ-UHFFFAOYSA-N butyl-dimethoxy-methylsilane Chemical compound CCCC[Si](C)(OC)OC OOSZILWKTQCRSZ-UHFFFAOYSA-N 0.000 claims description 2
- ZMZCDKKVGLGCSJ-UHFFFAOYSA-N chloromethoxy-methoxy-methyl-(2-methylpropyl)silane Chemical compound CC(C)C[Si](C)(OC)OCCl ZMZCDKKVGLGCSJ-UHFFFAOYSA-N 0.000 claims description 2
- SJJCABYOVIHNPZ-UHFFFAOYSA-N cyclohexyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C1CCCCC1 SJJCABYOVIHNPZ-UHFFFAOYSA-N 0.000 claims description 2
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 claims description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 claims description 2
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 claims description 2
- WQTNGCZMPUCIEX-UHFFFAOYSA-N dimethoxy-methyl-prop-2-enylsilane Chemical compound CO[Si](C)(OC)CC=C WQTNGCZMPUCIEX-UHFFFAOYSA-N 0.000 claims description 2
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 2
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 claims description 2
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims description 2
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 claims description 2
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 claims description 2
- UWSYCPWEBZRZNJ-UHFFFAOYSA-N trimethoxy(2,4,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)CC(C)(C)C UWSYCPWEBZRZNJ-UHFFFAOYSA-N 0.000 claims description 2
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 claims description 2
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 claims description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 claims 1
- KIXRCYSYUXZLHM-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol;3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](C)(OC)CCCS.CO[Si](OC)(OC)CCCS KIXRCYSYUXZLHM-UHFFFAOYSA-N 0.000 claims 1
- SKKLFHLHRUFLBC-UHFFFAOYSA-N butyl-dimethoxy-propylsilane dicyclohexyl(dimethoxy)silane Chemical compound CCCC[Si](OC)(OC)CCC.C1CCCCC1[Si](OC)(OC)C1CCCCC1 SKKLFHLHRUFLBC-UHFFFAOYSA-N 0.000 claims 1
- -1 cyclohexylethyldimethoxysilane Octylcyclopentyldimethoxysilane Chemical compound 0.000 claims 1
- DIJRHOZMLZRNLM-UHFFFAOYSA-N dimethoxy-methyl-(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](C)(OC)CCC(F)(F)F DIJRHOZMLZRNLM-UHFFFAOYSA-N 0.000 claims 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 abstract description 15
- 238000003860 storage Methods 0.000 abstract description 11
- 238000005470 impregnation Methods 0.000 abstract description 9
- 230000009257 reactivity Effects 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 230000036961 partial effect Effects 0.000 description 6
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000005051 trimethylchlorosilane Substances 0.000 description 2
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- MLOKHANBEXWBKS-UHFFFAOYSA-N 3-triacetyloxysilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O MLOKHANBEXWBKS-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001251094 Formica Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- IYYIVELXUANFED-UHFFFAOYSA-N bromo(trimethyl)silane Chemical compound C[Si](C)(C)Br IYYIVELXUANFED-UHFFFAOYSA-N 0.000 description 1
- IIWMOGUWKRQOAD-UHFFFAOYSA-N butyl-ethyl-dimethoxysilane Chemical compound CCCC[Si](CC)(OC)OC IIWMOGUWKRQOAD-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QEPVYYOIYSITJK-UHFFFAOYSA-N cyclohexyl-ethyl-dimethoxysilane Chemical compound CC[Si](OC)(OC)C1CCCCC1 QEPVYYOIYSITJK-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- ZVMRWPHIZSSUKP-UHFFFAOYSA-N dicyclohexyl(dimethoxy)silane Chemical compound C1CCCCC1[Si](OC)(OC)C1CCCCC1 ZVMRWPHIZSSUKP-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Definitions
- Insulation for rotating electrical machines The invention relates to an insulation for rotating elekt ⁇ generic machines on the basis of impregnating with nano- particulate filler.
- the insulating system has the task of electrical conductors (wires, Spu ⁇ len, rods) permanently against each other and against the stator core or to isolate the environment.
- electrical conductors wires, Spu ⁇ len, rods
- partial conductor insulation partial conductor insulation
- conductors or windings conductor or winding insulation
- main insulation conductor and earth potential in the slot and winding head area
- the composite of impregnating resin and the base material of the mica provides the mechanical Fes ⁇ ACTION the insulation.
- the electrical strength results from the large number of solid-solid interfaces of the mica used.
- the resulting layering of organic and inorganic materials forms microscopic interfaces whose resistance to partial discharges and thermal stresses is determined by the properties of the mica platelets. Due to the complex VPI process, even the smallest cavities in the insulation have to be filled with resin in order to minimize the number of internal gas-solid interfaces.
- nanoparticulate fillers To further improve the durability, the use of nanoparticulate fillers is described. It is known from the literature (and from experience with the use of mica) that inorganic particles, in contrast to the polymeric insulating material, are not damaged or destroyed to a very limited extent under partial discharge action. The resulting erosion-inhibiting effect is dependent, inter alia, on the particle diameter and the particle surface resulting therefrom. It turns out that the larger the specific surface area of the particles, the greater the erosion- inhibiting effect on the particles. Inorganic nanoparticles have very large specific surface areas of 50 g / m 2 or more.
- the viscosity of the impregnating resin is increased by the use of nanoparticulate fillers, which makes it difficult to impregnate the mica.
- the starting viscosity in Standardsys ⁇ system (BADGE / anhydride) about 15 - 20 mPas (at 60 ° C).
- modified nanoparticulate silica in epoxy resin / anhydride blends for the preparation of impregnating resins for mica-based insulation, the viscosity, in particular the start ⁇ viscosity at high filler holding comparatively low when, as a modification of nanoparticulate silica and / or alumina one or more silanization reagents are used.
- these reagents have at least one functional group which reacts Abspal ⁇ tung with the particle surface.
- an epoxy resin ⁇ / anhydride mixture with an amount of 3 to 60 wt ⁇ 6, in particular 5-40% by weight of filler nanopartiulärem before.
- silanization reagents are compounds selected from the following group:
- reagents can be used alone or as any mixtures.
- the modification of the nanoparticles based on silicon dioxide or aluminum oxide takes place, for example, in an aqueous or organic medium.
- the silanization reagents are reacted with the particles in an organic or aqueous medium.
- the reaction is designed so that as quan ⁇ titative saturation of the surface takes place and thereby the reactivity of the nanoparticles is significantly reduced.
- the surfaces of the nanoparticles are modified so that the thus-filled Imoniagnierhar ⁇ ze have a monodisperse distribution of the nanoparticles.
- the nanoparticles have a primary particle size of less than 50 nm.
- the low starting viscosity of the filled impregnating resin is achieved by using the coated particles in a low-viscosity aromatic epoxy resin, preferably an epoxy resin having a viscosity of less than 120 mPas, preferably less than 90 mPas and particularly preferably 60 mPas. at 60 ° C., based on BFDGE and / or BADGE (bisphenol A diglycidyl ether and / or bisphenol F diglycidyl ether).
- a reactive diluent is added to the low-viscosity aromatic epoxy resin.
- the reactive diluent is preferably added in an amount of from 1 to 20% by volume, more preferably in the range from 2 to 15% by volume and very particularly in the range from 2 to 10% by volume.
- a method for incorporating the coated particles is selected, which only slightly incriminates the entire matrix.
- the epoxy resin is, for example, in the mixture of the nanoparticulate filler, for example, an organic, there is ⁇ , stirred in a solvent. Subsequently, the organic solution ⁇ medium at reduced pressure by distillation, is separated at a low temperature, spray drying and / or Dünn fürdestil- lation either.
- the primary particle size of the SiO 2 particles is preferably below 50 nm.
- the good storage stability for example, the storage of the mixture nanoparticles / epoxy resin / anhydride at 70 ° C to a maximum value of the viscosity of 300 mPas after 10 days, accompanied by a low reactivity of the system in the absence of catalysts.
- Hexanediol-1,6-diglycidyl ether hexahydrophthalic acid diglycidyl ester, 2-ethylhexyl glycidyl ether, 1,4-butanediglycidyl ether, trimethylolpropane triglycidyl ether, polypropylene glycol diglycidyl ether.
- the potential of nanotechnology can be seen in the use of nanoparticulate fillers in combination with the currently used insulating materials based on mica.
- the lifetime of test specimens which correspond to the state of the art with regard to isolated copper conductors in stators of hydroelectric or turbo-generators in reduced size, is measured under electrical field loading up to the electrical breakdown. Since the electrical strength of the insulation system is several decades under operating stress, the electrical endurance tests are carried out at multiply excessive electrical field strengths.
- the graph below shows the mean values of the electrical life of each of seven specimens at three different field loads for each of a standard insulation system (mica) and a nanoparticle-filled insulation system (Nanolso).
- FIG. 1 shows the service life curves of unfilled and nanoparticle-filled high-voltage insulation systems.
- Nanopox from the company Nanoresins E500 (37.5% by weight Si0 2 , 25 nm, in BFDGE)
- FIG. 2 shows the comparison of the storage stability of selected systems based on BFDGE with and without additive use of BYK 985
- the produced nanocomposites (S1O 2 , 10 nm) based on BFDGE or BADGE are characterized by a low initial viscosity and low reactivity in the
- FIGS. 3 and 4 show, on the one hand, the starting viscosity of produced composites and, on the other hand, the storage stability of various composites based on BFDGE in FIGS. 3 and 4
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Abstract
The invention relates to mica-based insulation with increased electrical lifetime for rotating electrical machines based on impregnating resin with nanoparticulate filler. According to the invention, the reactivity, viscosity and grain size of the impregnating resin and nanoparticulate filler are matched to the requirements for the impregnation of the mica in such a way that the reaction mechanism that proceeds during the conduct of the process (impregnation, polymerization, storage) is at least not significantly affected by the nanoparticles.
Description
Beschreibung description
Isolierung für rotierende elektrische Maschinen Die Erfindung betrifft eine Isolierung für rotierende elekt¬ rische Maschinen auf der Basis von Imprägnierharzen mit nano- partikulärem Füllstoff. Insulation for rotating electrical machines The invention relates to an insulation for rotating elekt ¬ generic machines on the basis of impregnating with nano- particulate filler.
In rotierenden elektrischen Maschinen, wie Motoren oder Gene- ratoren, ist die Zuverlässigkeit des Isoliersystems maßgeb¬ lich für deren Betriebssicherheit verantwortlich. Das Isoliersystem hat die Aufgabe, elektrische Leiter (Drähte, Spu¬ len, Stäbe) dauerhaft gegeneinander und gegen das Ständerblechpaket oder die Umgebung zu isolieren. Innerhalb einer Hochspannungsisolierung unterscheidet man die Isolierung zwischen Teilleitern (Teilleiterisolierung) , zwischen den Leitern bzw. Windungen (Leiter- bzw. Windungsisolierung) und zwischen Leiter und Massepotenzial im Nut- und Wickelkopfbe- reich (Hauptisolierung) . Die Dicke der Hauptisolierung ist sowohl der Nennspannung der Maschine, als auch den Betriebsund Fertigungsbedingungen angepasst. Die Wettbewerbsfähigkeit von Anlagen zur Energieerzeugung, deren Verteilung und Nutzung hängt in entscheidendem Maße von den eingesetzten Materialien und angewandten Technologien zur Isolation ab. In rotating electrical machines, such as motors or generators generation, the reliability of the insulation system is be prevailing ¬ Lich responsible for their reliability. The insulating system has the task of electrical conductors (wires, Spu ¬ len, rods) permanently against each other and against the stator core or to isolate the environment. Within a high-voltage insulation, a distinction is made between the insulation between partial conductors (partial conductor insulation), between the conductors or windings (conductor or winding insulation) and between conductor and earth potential in the slot and winding head area (main insulation). The thickness of the main insulation is adapted to both the rated voltage of the machine and the operating and manufacturing conditions. The competitiveness of power plants, their distribution and use depends crucially on the materials and technologies used for isolation.
Das grundlegende Problem bei derartig elektrisch belasteten Isolatoren liegt in der sog. teilentladungsinduzierten Erosion, mit sich ausbildenden sog. „Treeing"-Kanälen, die letztendlich zum elektrischen Durchschlag des Isolators führen. Vor diesem Hintergrund ist es Stand der Technik, dass zur dauerhaften Isolierung der spannungsführenden Leiter der Statoren in rotierenden Maschinen (Motoren, Generatoren, Turbogeneratoren, Wasserkraftgeneratoren, Windkraftgeneratoren) glimmerbasierte Isolierungen zum Einsatz kommen. Bei Hoch- und Mittelspannungsmotoren und -generatoren werden heute geschichtete Glimmerisolierungen eingesetzt. Dabei werden die aus den isolierten Teilleitern hergestellten Formspulen mit Glimmerbändern umwickelt und vorrangig in einem Vakuum-Druck-
Prozess (VPI = vacuum pressure impregnation) mit Kunstharz imprägniert. Dabei wird Glimmer in Form von Glimmerpapier eingesetzt, wobei im Rahmen der Imprägnierung die im Glimmerpapier zwischen den einzelnen Partikeln befindlichen Hohlräu- me mit Harz gefüllt werden. Der Verbund von Imprägnierharz und Trägermaterial des Glimmers liefert die mechanische Fes¬ tigkeit der Isolierung. Die elektrische Festigkeit ergibt sich aus der Vielzahl der Feststoff-Feststoff-Grenzflächen des verwendeten Glimmers. Die so entstandene Schichtung aus organischen und anorganischen Materialien bildet mikroskopische Grenzflächen, deren Beständigkeit gegen Teilentladungen und thermische Beanspruchungen von den Eigenschaften der Glimmerplättchen bestimmt wird. Durch den aufwendigen VPI- Prozess müssen auch kleinste Hohlräume in der Isolierung mit Harz ausgefüllt werden, um die Anzahl innerer Gas-Feststoff- Grenzflächen zu minimieren. The fundamental problem with such electrically loaded insulators lies in the so-called "partial discharge induced erosion, with forming" treeing "channels, which ultimately lead to the electrical breakdown of the insulator.For this background, it is state of the art that for permanent insulation of the In the case of high-voltage and medium-voltage motors and generators, stratified mica insulations are now used, with mica tapes wrapped around the preformed coils made of insulated conductors and primarily in a vacuum pressure Process (VPI = vacuum pressure impregnation) impregnated with synthetic resin. In the process, mica is used in the form of mica paper, during which impregnation the voids in the mica paper between the individual particles are filled with resin. The composite of impregnating resin and the base material of the mica provides the mechanical Fes ¬ ACTION the insulation. The electrical strength results from the large number of solid-solid interfaces of the mica used. The resulting layering of organic and inorganic materials forms microscopic interfaces whose resistance to partial discharges and thermal stresses is determined by the properties of the mica platelets. Due to the complex VPI process, even the smallest cavities in the insulation have to be filled with resin in order to minimize the number of internal gas-solid interfaces.
Zur zusätzlichen Verbesserung der Beständigkeit wird der Einsatz von nanopartikulären Füllstoffen beschrieben. Es ist aus der Literatur (und durch die Erfahrung beim Einsatz von Glimmer) bekannt, dass anorganische Partikel, im Gegensatz zum polymeren Isolierstoff, nicht oder in nur sehr eingeschränktem Umfang unter Teilentladungseinwirkung geschädigt oder zerstört werden. Dabei ist die resultierende erosionsinhibie- rende Wirkung unter anderem vom Partikeldurchmesser und der daraus resultierenden Partikeloberfläche abhängig. Dabei zeigt sich, dass je größer die spezifische Oberfläche der Partikel ist, desto größer ist die erosionsinhibierende Wir¬ kung auf die Partikel. Anorganische Nanopartikel weisen sehr große spezifische Oberflächen mit 50 g/m2 oder mehr auf. To further improve the durability, the use of nanoparticulate fillers is described. It is known from the literature (and from experience with the use of mica) that inorganic particles, in contrast to the polymeric insulating material, are not damaged or destroyed to a very limited extent under partial discharge action. The resulting erosion-inhibiting effect is dependent, inter alia, on the particle diameter and the particle surface resulting therefrom. It turns out that the larger the specific surface area of the particles, the greater the erosion- inhibiting effect on the particles. Inorganic nanoparticles have very large specific surface areas of 50 g / m 2 or more.
Nachteilig an den bekannten Systemen ist, dassA disadvantage of the known systems is that
* die Viskosität des Imprägnierharzes durch den Einsatz von nanopartikulären Füllstoffen erhöht wird, wodurch die Durchimprägnierung des Glimmers erschwert wird. * Die große spezifische Oberfläche der Nanopartikel eine (teilweise) Polymerisation des Imprägnierharzes wäh¬ rend der Lagerung und der Prozessdurchführung initi-
iert, wodurch dessen Viskosität stark ansteigt, so dass die Imprägnierung des Glimmers zusätzlich erschwert ist. Beispielsweise beträgt die Startviskosität im Standardsys¬ tem (BADGE/Anhydrid) ca. 15 - 20 mPas (bei 60°C) . Bei einem Füllgrad an Nanopartikel von ca. 23 Gew.-%, wie er notwen¬ dig ist für eine signifikante Verbesserung der elektrischen Festigkeit, erhöht sich die Viskosität auf Werte > 80 mPas und erschwert damit die Imprägnierung des Glimmers, vor al¬ lem wenn dieser Wert durch die Lagerung des Systems mit der Zeit ansteigt. * The viscosity of the impregnating resin is increased by the use of nanoparticulate fillers, which makes it difficult to impregnate the mica. * The large specific surface of the nanoparticles initi- a (partial) polymerization of the impregnating resin currency ¬ rend storage and process performance iert, whereby its viscosity increases sharply, so that the impregnation of the mica is additionally difficult. For example, the starting viscosity in Standardsys ¬ system (BADGE / anhydride) about 15 - 20 mPas (at 60 ° C). At a degree of filling with nanoparticles of approximately 23 wt .-%, as it is notwen ¬ dig for a significant improvement in the electrical resistance, the viscosity increases to values> 80 mPas, and thus complicates the impregnation of the mica, before al ¬ lem when this value increases with the storage of the system over time.
Aufgabe der vorliegenden Erfindung ist es daher, einen Ver- bundwerkstoff für die Imprägnierung von glimmerbasierten Isolierungen zu schaffen, der trotz Einsatz von nanopartikulärem Füllstoff eine vergleichsweise niedrige, vorzugsweise eine Viskosität kleiner 50mPas, insbesondere als Startviskosität, hat . It is therefore an object of the present invention to provide a composite material for the impregnation of mica-based insulations which, despite the use of nanoparticulate filler, has a comparatively low, preferably a viscosity of less than 50 mPas, in particular as initial viscosity.
Diese Aufgabe wird durch den Gegenstand der Ansprüche, im Zu¬ sammenhang mit der Beschreibung und den Figuren offenbart. This object is disclosed by the subject matter of the claims, in connexion to ¬ with the description and the figures.
Allgemeine Erkenntnis der Erfindung ist es, dass die Reakti- vität der Nanopartikel gegenüber der gesamten Matrix deren Viskosität entscheidend beeinflusst. General knowledge of the invention is that the reactivity of the nanoparticles over the entire matrix decisively influences their viscosity.
So konnte gefunden werden, dass der Einsatz von modifiziertem nanopartikulärem Siliciumdioxid in Epoxidharz/Anhydrid- mischungen zur Herstellung von Imprägnierharzen für glimmerbasierte Isolierungen die Viskosität, insbesondere die Start¬ viskosität bei hohen Füllgraden vergleichsweise niedrig hält, wenn als Modifikation von nanopartikulärem Siliciumdioxid und/oder Aluminiumoxid ein oder mehrere Silanisierungsreagen- zien eingesetzt werden. Bevorzugt weisen diese Reagenzien mindestens eine funktionelle Gruppe auf, welche unter Abspal¬ tung mit der Partikeloberfläche reagiert.
Bevorzugt liegt im Imprägnierharz eine Epoxid¬ harz/Anhydridmischung mit einer Menge von 3 bis 60 Gew~6 , ins besondere von 5 - 40 Gew % nanopartiulärem Füllstoff vor. Thus, it was found that the use of modified nanoparticulate silica in epoxy resin / anhydride blends for the preparation of impregnating resins for mica-based insulation, the viscosity, in particular the start ¬ viscosity at high filler holding comparatively low when, as a modification of nanoparticulate silica and / or alumina one or more silanization reagents are used. Preferably, these reagents have at least one functional group which reacts Abspal ¬ tung with the particle surface. Preferably in the impregnating an epoxy resin ¬ / anhydride mixture with an amount of 3 to 60 wt ~ 6, in particular 5-40% by weight of filler nanopartiulärem before.
Beispielsweise dienen als Silanisierungsreagenzien Verbindungen ausgewählt aus der folgenden Gruppe: For example, silanization reagents are compounds selected from the following group:
Trimethylmethoxysilan, Methylhydrogendimethoxysilan, Di- methyldimethoxysilan, Ethyltrimethoxysilan, Ethyltriacetoxysi- lan, Propyltrimethoxysilan, Diisopropyldimethoxysi- lan, Chlorisobutylmethyldimethoxysilan, Trifluorpropyltri- methoxysilan, rifluorpropylmethyldimethoxysilan, iso- Butyltrimethoxysilan, n-Butyltrimethoxysilan, n- Butylmethyldimethoxysilan, Phenyltrimethoxysilan, Phenyltri- methoxysilan, Phenylmethyldimethoxysilan, Triphenylsilanol , n- Hexyltrimethoxysilan, n-Octyltrimethoxysilan, iso- Octyltrimethoxysilan, Decyltrimethoxysi- lan, Hexadecyltrimethoxysilan, Cyclohexylmethyldimethoxysilan, Cyclohexylethyldimethoxysilan, Trimethylmethoxysilane, Methylhydrogendimethoxysilan, di- methyldimethoxysilane, ethyltrimethoxysilane, Ethyltriacetoxysi- lan, propyltrimethoxysilane, Diisopropyldimethoxysi- lan, Chlorisobutylmethyldimethoxysilan, methoxysilane Trifluorpropyltri-, rifluorpropylmethyldimethoxysilan, iso- butyl trimethoxysilane, n-butyltrimethoxysilane, n-butylmethyldimethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane, phenylmethyldimethoxysilane, triphenylsilanol, n-hexyltrimethoxysilane, n-octyltrimethoxysilane, isooctyltrimethoxysilane, decyltrimethoxysilane, hexadecyltrimethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylethyldimethoxysilane,
Octylcyclopentyldimethoxysilan, tert.- Octylcyclopentyldimethoxysilane, tert.
Butylethyldimethoxysilan, tert . -Butylpropyldimethoxysilan,Butylethyldimethoxysilane, tert. -Butylpropyldimethoxysilan,
Dicyclohexyldimethoxysilan, Mercaptopropyltrimethoxysilan,Dicyclohexyldimethoxysilane, mercaptopropyltrimethoxysilane,
Mercaptopropylmethyldimethoxysilan, mercaptopropylmethyldimethoxysilane,
Bis (triethoxysilylpropyl) disulfid, Bis (triethoxysilylpropyl) disulfide,
Bis (triethoxysilylpropyl) tetrasulfid, Aminopropyltrimeth- oxysilan, m-Aminophenyltrimethoxysilan, Aminopropyl- methyldiethoxysilan, Phenylaminopropyltrimethoxysilan, Bis (triethoxysilylpropyl) tetrasulfide, aminopropyltrimethoxysilane, m-aminophenyltrimethoxysilane, aminopropylmethyldiethoxysilane, phenylaminopropyltrimethoxysilane,
Aminoethylaminopropyltrimethoxysilan, Aminoethylaminopro- pylmethyldimethoxysilan, Aminoethylaminopropyltrimethoxysilane, aminoethylaminopropylmethyldimethoxysilane,
Glycidoxypropyltrimethoxysilan, Glycidoxypropylmethyldi- methoxysilan, Epoxycyclohexylethyltrimethoxysilan, y- Glycidoxypropyltrimethoxysilane, glycidoxypropylmethyldimethoxysilane, epoxycyclohexylethyltrimethoxysilane, y-
Methacryloxypropyltriacetoxysilan, Methacryloxypropyltriacetoxysilan,
Vinyltriacetoxysilan, Vinyltrimethoxysilan, Methylvinyldi- methoxysilan, Vinyldimethylmethoxysilan, Divinyldimethox- ysilan, Vinyltris (2- methoxyethoxy) silan, Hexenyltrimethoxysilan, y- Methacroyloxypropyltrimethoxysilan,
Acryloxypropyltrimethoxysilan, Vinylbenzylethylendiamin- propyltrimethoxysilan, Vinyltriacetoxysilane, vinyltrimethoxysilane, methylvinyldimethoxysilane, vinyldimethylmethoxysilane, divinyldimethoxysilane, vinyltris (2-methoxyethoxy) silane, hexenyltrimethoxysilane, y-methacroyloxypropyltrimethoxysilane, Acryloxypropyltrimethoxysilane, vinylbenzylethylenediaminepropyltrimethoxysilane,
Vinylbenzylethylendiaminpropyltrimethoxysilan-Hydrochlorid, Allylethylendiaminpropyltrimethoxysilan, Allyltrimethoxysi- lan, Allylmethyldimethoxysilan, Allyldimethylmethoxysilan und Hexenyltrimethoxysilan, Methyltrimethoxysilan, Trimethylmeth- oxysilan, Dimethyldimethoxysilan, Trimethylchlorosilan, Eth- oxytrimethylsilan, Vinyltrimethoxysilan, Trimethylchlorosilan, Trichlorsilan, Bromtrimethylsilan, Octamethyltrisiloxan, Tetramethyldisiloxan, Hexamethyldisiloxan . Vinylbenzylethylendiaminpropyltrimethoxysilan hydrochloride, Allylethylendiaminpropyltrimethoxysilan, Allyltrimethoxysi- lan, allylmethyldimethoxysilane, allyldimethylmethoxysilane and hexenyltrimethoxysilane, methyltrimethoxysilane, Trimethylmeth- oxysilane, dimethyldimethoxysilane, trimethylchlorosilane, Eth oxytrimethylsilan, vinyltrimethoxysilane, trimethylchlorosilane, trichlorosilane, bromotrimethylsilane, octamethyltrisiloxane, tetramethyldisiloxane, hexamethyldisiloxane.
Diese Reagenzien können allein oder als beliebige Mischungen eingesetzt werden. These reagents can be used alone or as any mixtures.
Die Modifizierung der Nanopartikel auf Basis von Siliciumdio- xid oder Aluminiumoxid erfolgt beispielsweise in wässrigem oder organischem Medium. The modification of the nanoparticles based on silicon dioxide or aluminum oxide takes place, for example, in an aqueous or organic medium.
Dabei werden die Silanisierungsreagenzien in einem organischen oder wässrigen Medium mit den Partikeln zur Reaktion gebracht. The silanization reagents are reacted with the particles in an organic or aqueous medium.
Nach einer vorteilhaften Ausführungsform der Erfindung wird die Reaktionsführung so gestaltet, dass eine möglichst quan¬ titative Absättigung der Oberfläche stattfindet und dadurch die Reaktivität der Nanopartikel entscheidend reduziert wird. According to an advantageous embodiment of the invention, the reaction is designed so that as quan ¬ titative saturation of the surface takes place and thereby the reactivity of the nanoparticles is significantly reduced.
Nach einer Ausführungsform sind die Oberflächen der Nanopartikel so modifiziert, dass die damit gefüllten Imprägnierhar¬ ze eine monodisperse Verteilung der Nanopartikel aufweisen. ( In one embodiment, the surfaces of the nanoparticles are modified so that the thus-filled Imprägnierhar ¬ ze have a monodisperse distribution of the nanoparticles. (
Nach einer weiteren Ausführungsform haben die Nanopartikel eine Primärkorngröße von unter 50nm. According to another embodiment, the nanoparticles have a primary particle size of less than 50 nm.
Die niedrige Startviskosität des gefüllten Imprägnierharzes wird durch den Einsatz der beschichteten Partikel in einem niederviskosen aromatischen Epoxidharz, bevorzugt ein Epoxidharz mit einer Viskosität von kleiner 120mPas, bevorzugt von kleiner 90mPas und insbesondere bevorzugt von 60 mPas, bei-
spielsweise bei 60°C, auf Basis BFDGE und/oder BADGE (Bisphe- nol-A-Diglycidylether und/oder Bisphenol-F-Diglycidylether) erreicht . Nach einer bevorzugten Ausführungsform wird dem niederviskosen aromatischen Epoxidharz noch ein Reaktivverdünner zugesetzt. Bevorzugt wird der Reaktivverdünner in einer Menge von 1 bis 20 Vol%, insbesondere bevorzugt im Bereich von 2 bis 15 Vol% und ganz besonders im Bereich von 2 bis 10 Vol% zuge setzt. The low starting viscosity of the filled impregnating resin is achieved by using the coated particles in a low-viscosity aromatic epoxy resin, preferably an epoxy resin having a viscosity of less than 120 mPas, preferably less than 90 mPas and particularly preferably 60 mPas. at 60 ° C., based on BFDGE and / or BADGE (bisphenol A diglycidyl ether and / or bisphenol F diglycidyl ether). According to a preferred embodiment, a reactive diluent is added to the low-viscosity aromatic epoxy resin. The reactive diluent is preferably added in an amount of from 1 to 20% by volume, more preferably in the range from 2 to 15% by volume and very particularly in the range from 2 to 10% by volume.
Vorteilhafterweise wird auch eine Methode zur Einarbeitung der beschichteten Partikel gewählt, welche die gesamte Matrix nur geringfügig belastet. So wird beispielsweise das Epoxid- harz in die Mischung des nanopartikulären Füllstoffs, der in einem Lösungsmittel, beispielsweise einem organischen, vor¬ liegt, eingerührt. Anschließend wird das organische Lösungs¬ mittel bei Unterdruck mittels Destillation entweder bei niedriger Temperatur, Sprühtrocknung und/oder Dünnschichtdestil- lation abgetrennt. Advantageously, a method for incorporating the coated particles is selected, which only slightly incriminates the entire matrix. Thus, the epoxy resin is, for example, in the mixture of the nanoparticulate filler, for example, an organic, there is ¬, stirred in a solvent. Subsequently, the organic solution ¬ medium at reduced pressure by distillation, is separated at a low temperature, spray drying and / or Dünnschichtdestil- lation either.
Durch den erfindungsgemäßen Einsatz von beschichteten Nano- partikeln in Imprägnierharzen zur Herstellung glimmerbasierten Hochspannungsisolationen, ist es möglich, Hochspannungs- Isolationen mit bislang noch nicht erreichten Eigenschaften zu realisieren: By the use according to the invention of coated nanoparticles in impregnating resins for the production of mica-based high-voltage insulation, it is possible to realize high-voltage insulation with hitherto unattainable properties:
Zum ersten die Erhöhung der elektrischen Festigkeit von Isolationen im Vergleich zum Stand der Technik (z.B. Micalastic) um den Faktor > 5. Die Charakterisierung erfolgt an gewickelten Röbelstäben oder Spulen mittels elektrischer Lebensdauerversuche bei Testspannungen von 2 UN bis 4 UN. Dies ermög¬ licht den Nachweis der erhöhten Labensdauer bei Nennspannung im Betrieb des Generators/Motors. First, the increase in the electrical strength of insulation compared to the prior art (eg Micalastic) by a factor> 5. The characterization is carried out on wound Röbelstäben or coils by means of electrical life tests at test voltages from 2 UN to 4 UN. This allows the detection of the light ¬ Laben® increased duration at the nominal voltage during operation of the generator / motor.
Daneben gibt es eine ausreichende Lagerstabilität, die es er¬ laubt nanopartikuläre Imprägnierharze zur Imprägnierung glim¬ merbasierter Isolierungen mehrfach durchzuführen. Dies wird
erreicht durch eine niedrige und über die Anzahl der Impräg¬ nierungen konstante Viskosität die lediglich die Zugabe von neuem Imprägnierharz in der Menge erfordert, die pro Impräg- nierprozess verbraucht wird. Dieses Volumen entspricht pro Imprägnierprozess ca. 1 - 5 % des gesamten Imprägnierharzvo¬ lumens. Die Primärkorngröße der Si02-Partikel liegt bevorzugt unter 50 nm. Die gute Lagerstabilität, beispielsweise führt die Lagerung der Mischung Nanopartikel/Epoxidharz/Anhydrid bei 70°C zu einem maximalen Wert der Viskosität von 300 mPas nach 10 Tagen, geht einher mit einer geringen Reaktivität des Systems in Abwesenheit von Katalysatoren. Besides there is an adequate shelf life, which he carried out ¬ laubt nanoparticulate impregnating resins for impregnating glim ¬ merbasierter insulation several times. this will achieved by a low and the number of the impregnating ¬ sation constant viscosity which only the addition of new impregnating resin in the amount required, which is per impregnation nierprozess consumed. This volume corresponds to each impregnation approximately 1-5% of the total Imprägnierharzvo ¬ lumens. The primary particle size of the SiO 2 particles is preferably below 50 nm. The good storage stability, for example, the storage of the mixture nanoparticles / epoxy resin / anhydride at 70 ° C to a maximum value of the viscosity of 300 mPas after 10 days, accompanied by a low reactivity of the system in the absence of catalysts.
Schließlich wird eben die geringe Startviskosität von bei¬ spielsweise < 60 mPas bei 60°C durch die Beschichtung der Na- nopartikel und deren Einsatz von BFDGE und/oder BADGE in eventueller Verbindung mit Reaktivverdünnern wie Glycidy- lether, erreicht. Beispiele für Reaktivverdünner sind außerdem: Finally, the low start viscosity of the pitch at ¬ <60 mPas at 60 ° C by coating the sodium nopartikel and their use of BFDGE and / or BADGE in any combination with reactive diluents such as glycidyl ether is precisely achieved. Examples of reactive diluents are also:
Hexandiol-1, 6-diglycidylether, Hexahydrophthalsäurediglycidy- lester, 2-Ethylhexylglycidylether, 1 , 4-Butandiglycidylether, Trimethylolpropantriglycidylether, Polypropyleneglycoldigly- cidylether .
Hexanediol-1,6-diglycidyl ether, hexahydrophthalic acid diglycidyl ester, 2-ethylhexyl glycidyl ether, 1,4-butanediglycidyl ether, trimethylolpropane triglycidyl ether, polypropylene glycol diglycidyl ether.
Ausführungsbeispiele embodiments
Das Potential der Nanotechnologie zeigt sich beim Einsatz na- nopartikulärer Füllstoffe in Kombination mit den aktuell ein- gesetzten Isolationsmaterialien auf Basis von Glimmer. Hierzu wird die Lebensdauer von Versuchsprobekörpern, die in verkleinerter Form dem Stand der Technik bzgl. isolierter Cu- Leitern in Statoren von Wasserkraft- oder Turbogeneratoren entsprechen, unter elektrischer Feldbelastung bis zum elekt- rischen Durchschlag gemessen. Da die elektrische Festigkeit des Isoliersystems bei Betriebsbeanspruchung mehrere Jahr¬ zehnte beträgt, erfolgen die elektrischen Dauertests bei mehrfach überhöhten elektrischen Feldstärken. Folgende Grafik stellt die Mittelwerte der elektrischen Lebensdauer von je- weils sieben Probekörpern bei drei verschiedenen Feldbelastungen für jeweils ein Standardisolationssystem (Glimmer) und ein nanopartikulär gefülltes Isolationssystem (Nanolso) dar. The potential of nanotechnology can be seen in the use of nanoparticulate fillers in combination with the currently used insulating materials based on mica. For this purpose, the lifetime of test specimens, which correspond to the state of the art with regard to isolated copper conductors in stators of hydroelectric or turbo-generators in reduced size, is measured under electrical field loading up to the electrical breakdown. Since the electrical strength of the insulation system is several decades under operating stress, the electrical endurance tests are carried out at multiply excessive electrical field strengths. The graph below shows the mean values of the electrical life of each of seven specimens at three different field loads for each of a standard insulation system (mica) and a nanoparticle-filled insulation system (Nanolso).
Figur 1 zeigt die Lebensdauerkurven ungefüllter und nanopar- tikulär gefüllter Hochspannungs-Isolationssysteme . FIG. 1 shows the service life curves of unfilled and nanoparticle-filled high-voltage insulation systems.
Vergleicht man die Lebensdauer der jeweiligen Kollektive, zeigt sich, dass man Verbesserungen in der Lebensdauer um einen Faktor 5 bis 10 erreicht. Beide Lebensdauerverläufe wei- sen die gleiche Steigung auf, so dass eine direkte Übertra¬ gung der Lebensdauerverlängerung auf Betriebsverhältnisse zulässig erscheint. Comparing the lifespan of the respective collectives, it can be seen that improvements in the service life are achieved by a factor of 5 to 10. Both life histories WEI sen on the same pitch, so that a direct Übertra ¬ account the lifetime extension appears allowed on operating conditions.
Dies ist nur durch Imprägnierharze mit niedriger Startvis¬ kosität und guter Lagerstabilität (Auslagerung bei 70°C) möglich .
Die Lagerstabilität kann neben der Verringerung der Reaktivität auch durch eine Reduktion der Startviskosität po¬ sitiv beeinflusst werden. Hierzu stehen verschiedene Be- schichtungsmaßnahmen zur Verfügung. Die Auswirkungen einer verringerten Startviskosität auf den Viskositätsverlauf durch den Einsatz von Bisphenol-F-diglycidylether (BFDGE) als Ersatz des bisher standardmäßig eingesetzten BADGE ist in Abbildung 5 dargestellt. Die Einarbeitung erfolgte in der Form: This is possible only by impregnating low viscosity by Startvis ¬ and good storage stability (storage at 70 ° C). The storage stability can be po sitive ¬ influenced not only by reducing the reactivity and by reduction of the starting viscosity. Various coating measures are available for this purpose. The effect of reduced initial viscosity on the viscosity profile through the use of bisphenol F diglycidyl ether (BFDGE) as a replacement for the standard BADGE used to date is shown in Figure 5. The incorporation took place in the form:
Nanopox der Fa. Nanoresins E500 (37,5 Gew.-% Si02,25 nm, in BFDGE) Nanopox from the company Nanoresins E500 (37.5% by weight Si0 2 , 25 nm, in BFDGE)
•* Trocknung im Vakuum und Temperatur • * Drying in vacuum and temperature
Absättigung mit monofunktionellen Silanen (z.B. ETMS) < 1 % Byk W985 Saturation with monofunctional silanes (e.g., ETMS) <1% Byk W985
Figur 2 zeigt den Vergleich der Lagerstabilität ausgewählter Systeme auf Basis von BFDGE mit und ohne additiven Einsatz von BYK 985 FIG. 2 shows the comparison of the storage stability of selected systems based on BFDGE with and without additive use of BYK 985
Der Vergleich der Graphen zeigt, dass die Verwendung von nanopartikulär BFDGE (Nanopox E 500) zur erwartungsgemäßen Reduktion der Startviskosität führt und durch Trocknung, Absättigung mit ETMS und anschließender Zugabe von BYK W 985 eine Lagerstabilität von 28 Tagen (Referenz 3500 mPas) erreicht wird. The comparison of the graphs shows that the use of nanoparticulate BFDGE (Nanopox E 500) leads to the expected reduction of the starting viscosity and a storage stability of 28 days (reference 3500 mPas) is achieved by drying, saturation with ETMS and subsequent addition of BYK W 985.
Die hergestellten Nanocomposite (S1O2, 10 nm) auf Basis von BFDGE oder BADGE sind gekennzeichnet durch eine nied- rige Startviskosität und eine geringe Reaktivität in derThe produced nanocomposites (S1O 2 , 10 nm) based on BFDGE or BADGE are characterized by a low initial viscosity and low reactivity in the
Abmischung mit dem Härter. Mixing with the hardener.
Die Figuren 3 und 4 zeigen zum einen die Startviskosität hergestellter Composites und zum anderen die Lagerstabili- tät verschiedener Composites auf der Basis von BFDGE inFIGS. 3 and 4 show, on the one hand, the starting viscosity of produced composites and, on the other hand, the storage stability of various composites based on BFDGE in FIG
Abmischung mit MHHPA.
Die Erfindung betrifft eine Isolierung für rotierende elekt¬ rische Maschinen auf der Basis von niederviskosen aromati- sehen Epoxidharzen auf der Basis BFDGE oder BADGE als Imprägnierharzmatrix mit nanopartikulärem Füllstoff. Gemäß der Erfindung wird der nanopartikuläre Füllstoff in Reaktivität, Viskosität und Korngröße auf die Harzmatrix abgestimmt, so dass der bei der Polymerisation ablaufende Reaktionsmechanis- mus durch die Nanopartikel zumindest nicht gefördert wird.
Blend with MHHPA. The invention relates to an insulation for rotating elekt ¬ generic machines on the basis of low-aromatic epoxy resins based see BFDGE or BADGE as Imprägnierharzmatrix with nanoparticulate filler. According to the invention, the nanoparticulate filler is matched to the resin matrix in terms of reactivity, viscosity and grain size, so that the reaction mechanism that occurs during the polymerization is at least not promoted by the nanoparticles.
Claims
Glimmerbasiertes Imprägnierharz eine Epoxid¬ harz/Anhydridmischung und einen nanopartikulären Füllstoff umfassend, wobei der nanopartikuläre Füllstoff ein mit einem Silanisierungsreagenz modifiziertes nano partikuläres Siliciumdioxid und/oder Aluminiumoxid ist Mica-based impregnating resin wherein the nanoparticulate filler is comprising a modified with a silanizing reagent nano particulate silica and / or alumina an epoxy resin ¬ / anhydride mixture, and a nanoparticulate filler
Imprägnierharz nach Anspruch 1, wobei eine Epoxid harz/Anhydridmischung mit einer Menge von 3 - 60 nanopartiulärem Füllstoff vorliegt. The impregnating resin of claim 1, wherein an epoxy resin / anhydride mixture is present in an amount of 3-60 nanoparticulate filler.
Imprägnierharz nach einem der vorstehenden Ansprüche, unter Verwendung von BFDGE oder BADGE, wobei ein Reak tivverdünner zugesetzt ist. Impregnating resin according to one of the preceding claims, using BFDGE or BADGE, wherein a reactive diluent is added.
Imprägnierharz nach einem der vorstehenden Ansprüche, wobei ein Reaktivverdünner im Bereich von 1 - 20 Vol.- zugesetzt ist. Impregnating resin according to one of the preceding claims, wherein a reactive diluent in the range of 1 - 20 vol .- added.
5. Imprägnierharz nach einem der vorstehenden Ansprüche, wobei das Silanisierungsreagenz eine Verbindung, ausge wählt aus der Gruppe folgender Verbindungen: 5. Impregnating resin according to one of the preceding claims, wherein the silanization reagent is a compound selected from the group of the following compounds:
Trimethylmethoxysilan, Methylhydrogendimethoxysilan, Dimethyldimethoxysilan, Ethyltrimethoxysilan, Ethyltria cetoxysilan, Propyltrimethoxysilan, Diisopropyldimetho xysilan, Chlorisobutylmethyldimethoxysilan, Trifluorpro pyltrimethoxysilan, Trifluorpropylmethyldimethoxysilan, iso-Butyltrimethoxysilan, n-Butyltrimethoxysilan, n- Butylmethyldimethoxysilan, Phenyltrimethoxysilan, Phe- nyltrimethoxysilan, Phenylmethyldimethoxysilan, Triphe- nylsilanol, n-Hexyltrimethoxysilan, n- Octyltrimethoxysilan, iso-Octyltrimethoxysilan, De- cyltrimethoxysilan, Hexadecyltrimethoxysilan, Cyclohe- xylmethyldimethoxysilan, Cyclohexylethyldimethoxysilan Trimethylmethoxysilane, Methylhydrogendimethoxysilan, dimethyldimethoxysilane, ethyltrimethoxysilane, Ethyltria cetoxysilan, propyltrimethoxysilane, Diisopropyldimetho xysilan, Chlorisobutylmethyldimethoxysilan, Trifluorpro pyltrimethoxysilan, trifluoropropylmethyldimethoxysilane, iso-butyltrimethoxysilane, n-butyltrimethoxysilane, n-butylmethyldimethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane, phenylmethyldimethoxysilane, triphenyl nylsilanol, n-hexyltrimethoxysilane , n-octyltrimethoxysilane, iso-octyltrimethoxysilane, decyltrimethoxysilane, hexadecyltrimethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylethyldimethoxysilane
Octylcyclopentyldimethoxysilan, tert . -Octylcyclopentyldimethoxysilane, tert. -
Butylethyldimethoxysilan, tert . -Butylpropyldimethoxysilan Dicyclohexyldimethoxysilan, Mercaptopropyltrimethoxysilan Mercaptopropylmethyldimethoxysilan, Butylethyldimethoxysilane, tert. Butylpropyldimethoxysilane Dicyclohexyldimethoxysilane, Mercaptopropyltrimethoxysilane mercaptopropylmethyldimethoxysilane,
Bis (triethoxysilylpropyl) disulfid, Bis (triethoxysilylpropyl) disulfide,
Bis (triethoxysilylpropyl) tetrasulfid, Aminopropyltrimeth- oxysilan, m-Aminophenyltrimethoxysilan, Aminopropyl- methyldiethoxysilan, Phenylaminopropyltrimethoxysilan, Bis (triethoxysilylpropyl) tetrasulfide, aminopropyltrimethoxysilane, m-aminophenyltrimethoxysilane, aminopropylmethyldiethoxysilane, phenylaminopropyltrimethoxysilane,
Aminoethylaminopropyltrimethoxysilan, Aminoethylaminopro- pylmethyldimethoxysilan, Aminoethylaminopropyltrimethoxysilane, aminoethylaminopropylmethyldimethoxysilane,
Glycidoxypropyltrimethoxysilan, Glycidoxypropylmethyldi- methoxysilan, Epoxycyclohexylethyltrimethoxysilan, y- Methacryloxypropyltriacetoxysilan, Glycidoxypropyltrimethoxysilane, glycidoxypropylmethyldimethoxysilane, epoxycyclohexylethyltrimethoxysilane, y-methacryloxypropyltriacetoxysilane,
Vinyltriacetoxysilan, Vinyltrimethoxysilan, Methylvinyldi- methoxysilan, Vinyldimethylmethoxysilan, Divinyldimethox- ysilan, Vinyltris (2- methoxyethoxy) silan, Hexenyltrimethoxysilan, y- Methacroyloxypropyltrimethoxysilan, Vinyltriacetoxysilane, vinyltrimethoxysilane, methylvinyldimethoxysilane, vinyldimethylmethoxysilane, divinyldimethoxysilane, vinyltris (2-methoxyethoxy) silane, hexenyltrimethoxysilane, y-methacroyloxypropyltrimethoxysilane,
Acryloxypropyltrimethoxysilan, Vinylbenzylethylendiamin- propyltrimethoxysilan, Acryloxypropyltrimethoxysilane, vinylbenzylethylenediaminepropyltrimethoxysilane,
Vinylbenzylethylendiaminpropyltrimethoxysilan- Hydrochlorid, Allylethylendiaminpropyltrimethoxysilan, Al- lyltrimethoxysilan, Allylmethyldimethoxysilan, Allyldi- methylmethoxysilan und Hexenyltrimethoxysilan, allein oder in beliebigen Mischungen, ist. Vinylbenzylethylenediaminepropyltrimethoxysilane hydrochloride, allylethylenediaminepropyltrimethoxysilane, allyltrimethoxysilane, allylmethyldimethoxysilane, allyldimethylmethoxysilane and hexenyltrimethoxysilane, alone or in any mixtures.
Verfahren zur Herstellung eines Imprägnierharzes nach einem der vorstehenden Ansprüche 1 bis 5, folgende Ver fahrensschritte umfassend: Process for producing an impregnating resin according to one of the preceding claims 1 to 5, comprising the following process steps:
Verwendung eines Imprägnierharzes nach einem der vorstehenden Ansprüche zur Isolierung rotierender elektri scher Maschinen wie Motoren und Generatoren. Use of an impregnating resin according to any one of the preceding claims for the isolation of rotating electrical shear machines such as motors and generators.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102010032555A DE102010032555A1 (en) | 2010-07-29 | 2010-07-29 | Insulation for rotating electrical machines |
PCT/EP2011/061036 WO2012013439A1 (en) | 2010-07-29 | 2011-06-30 | Insulation for rotating electrical machines |
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EP (1) | EP2569362A1 (en) |
CN (1) | CN103003345B (en) |
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WO (1) | WO2012013439A1 (en) |
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DE102011079489A1 (en) * | 2011-07-20 | 2013-01-24 | Siemens Aktiengesellschaft | Method for producing a strip for an electrical insulation system |
DE102011083228A1 (en) * | 2011-09-22 | 2013-03-28 | Siemens Aktiengesellschaft | Insulating systems with improved partial discharge resistance, process for the preparation thereof |
DE102012205046A1 (en) * | 2012-03-29 | 2013-10-02 | Siemens Aktiengesellschaft | An electrical insulation body for a high-voltage rotary machine and method for producing the electrical insulation body |
EP2763142A1 (en) * | 2013-02-04 | 2014-08-06 | Siemens Aktiengesellschaft | Impregnating resin for an electrical insulation body, electrical insulation body and method for producing the electrical insulation body |
JP2015083663A (en) * | 2013-09-11 | 2015-04-30 | 三菱日立パワーシステムズ株式会社 | Electric insulation resin composition and cured product thereof as well as coil, stator, rotating machine and high-voltage equipment using the same |
DE102014219765A1 (en) * | 2014-09-30 | 2016-03-31 | Siemens Aktiengesellschaft | Formulation for an insulation system and insulation system |
DE102015213537A1 (en) | 2015-07-17 | 2017-01-19 | Siemens Aktiengesellschaft | Solid, in particular band-shaped, insulating material, formulation for an impregnating agent for producing an insulation system in a Vakuumimprägnierverfahren with it and machines with such insulation system |
DE102015218096A1 (en) * | 2015-09-21 | 2017-03-23 | Siemens Aktiengesellschaft | Formulation for an impregnating resin for the VPI process |
DE102016001211A1 (en) | 2016-02-03 | 2017-08-03 | Audi Ag | Carrier for coils of an electric machine |
JP6575701B1 (en) * | 2019-02-25 | 2019-09-18 | 住友電気工業株式会社 | Resin composition, inorganic filler, DC power cable, and method for manufacturing DC power cable |
CN110601409B (en) * | 2019-09-19 | 2020-12-18 | 住井科技(深圳)有限公司 | Coil for motor and motor containing same |
KR20230041098A (en) | 2020-08-28 | 2023-03-23 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | Resin manufacturing method and insulation structure manufacturing method |
JP7308799B2 (en) | 2020-08-31 | 2023-07-14 | 東芝三菱電機産業システム株式会社 | Resin manufacturing method and insulating structure manufacturing method |
CN117916984A (en) | 2022-03-08 | 2024-04-19 | 东芝三菱电机产业***株式会社 | Rotating electrical machine and insulating tape |
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US7781063B2 (en) * | 2003-07-11 | 2010-08-24 | Siemens Energy, Inc. | High thermal conductivity materials with grafted surface functional groups |
EP1557880A1 (en) * | 2004-01-21 | 2005-07-27 | Nitto Denko Corporation | Resin composition for encapsulating semiconductor |
US7846853B2 (en) * | 2005-04-15 | 2010-12-07 | Siemens Energy, Inc. | Multi-layered platelet structure |
CN101189686B (en) * | 2005-05-04 | 2013-01-02 | Abb研究有限公司 | Electric insulation material, an electric device and a method for producing an electric insulation material |
DE102006039638B3 (en) * | 2006-08-24 | 2007-11-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Production of nano-composite for use e.g. in coating materials and adhesives, involves surface-modifying nano-filler with a silane, titanate or zirconate in presence of strong non-ionic base and then mixing with binder |
EP2137740A1 (en) * | 2007-04-20 | 2009-12-30 | ABB Research LTD | An impregnation medium |
DE102007024096A1 (en) * | 2007-05-22 | 2008-11-27 | Evonik Degussa Gmbh | adhesives |
DE102007062035A1 (en) * | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Reactive resin system useful for encapsulating electronic or electrical components comprises an epoxy resin based on a monomer with three epoxy groups and an epoxy resin based on a monomer with at least four epoxy groups |
CN102725802B (en) * | 2010-02-03 | 2016-04-06 | Abb研究有限公司 | Electrical insulation system |
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- 2011-06-30 US US13/812,954 patent/US20130131218A1/en not_active Abandoned
- 2011-06-30 EP EP11740857A patent/EP2569362A1/en not_active Withdrawn
- 2011-06-30 WO PCT/EP2011/061036 patent/WO2012013439A1/en active Application Filing
- 2011-06-30 CN CN201180036964.6A patent/CN103003345B/en not_active Expired - Fee Related
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