Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
  • C09D5/03—Powdery paints
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
  • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C24/00—Coating starting from inorganic powder
  • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C24/00—Coating starting from inorganic powder
  • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
  • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
  • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0242—Shape of an individual particle
  • H05K2201/0257—Nanoparticles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0242—Shape of an individual particle
  • H05K2201/026—Nanotubes or nanowires
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/032—Materials
  • H05K2201/0323—Carbon
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/04—Soldering or other types of metallurgic bonding
  • H05K2203/0425—Solder powder or solder coated metal powder
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
  • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
  • Y10T428/24909—Free metal or mineral containing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31678—Of metal

Definitions

• the invention relates to a method for applying a coating composition containing carbon in the form of carbon nanotubes, graphenes, fullerenes or mixtures thereof and metal particles, to a substrate.
• the invention further relates to the coated substrate produced by the method according to the invention and to the use of the coated substrate as an electromechanical component or as conductor tracks in electrical and electronic applications.
• Carbon nanotubes were discovered by Sumio lijama in 1991 (see S. lijama, Nature, 1991, 354, 56). lijama found one in the soot Fullerengenerators under certain reaction conditions tube-like structures of only a few 10 nm in diameter, but up to a few micrometers in length. The compounds he found consisted of several concentric graphite tubes, which got the name multi-walled carbon nanotubes (MWCNTs). Shortly afterwards, lijama and Ichihashi found single-walled CNTs of about 1 nm in diameter, which were referred to as single-wall carbon nanotubes (SWCNTs) (see S. lijama, T. Ichihashi, Nature, 1993, 363, 6430).
• MWCNTs multi-walled carbon nanotubes
• CNTs are e.g. their mechanical tensile strength and stiffness of about 40 GPa and 1 TPa, respectively (20 and 5 times higher than steel).
• the carbon nanotubes belong to the family of fullerenes and have a diameter of 1 nm to several 100 nm.
• Carbon nanotubes are microscopic tubular structures (molecular nanotubes) made of carbon. Their walls, like the fullerenes or, like the planes of the graphite, consist only of carbon, with the carbon atoms having a honeycomb-like structure with six corners and three bonding partners each (dictated by the sp 2 hybridization).
• the diameter of the tubes is usually in the range of 1 to 50 nm, but also tubes were made with only 0.4 nm diameters. Lengths of several millimeters for single tubes and up to 20 cm for tube bundles have already been achieved.
• nanotubes are mixed with conventional plastic. This greatly improves the mechanical properties of the plastics.
• electrically conductive plastics for example, nanotubes have already been used for Leitschreibmachung antistatic films.
• the carbon nanotubes belong to the group of fullerenes.
• Fullerenes become spherical molecules Denoting high-symmetry carbon atoms representing the third elemental modification of the carbon (besides diamond and graphite).
• Graphenes are monatomic layers of sp 2 -hybridized carbon atoms. Graphenes show very good electrical and thermal conductivity along their plane.
• Tin or tin alloys are commonly used to solder electrical contacts, for example to bond together copper wires.
• tin or tin alloys are often applied to connectors to improve the coefficient of friction, to protect against corrosion and also to contribute to improving the conductivity.
• a problem with tin or tin alloys is the tendency to fretting corrosion, the coefficient of friction and in particular the softness of the metal or alloy, so that in particular with frequent loosening and joining of connectors and vibrations, the tin-containing coating is worn and thus lost the benefits of the tin-containing coating walk. Similar problems also occur when using other metals or alloys, for example Ag, Au, Ni or Zn.
• a coating which does not have the wear problem or only to a lesser extent and has no disadvantages in terms of electrical conductivity and the insertion and removal forces. This could be achieved, for example, by adding carbon to the coating metal.
• the addition of carbon could significantly increase the hardness of the coating on a substrate. However, this is at the expense of conductivity when using conventional carbon particles.
• the object of the present invention was therefore to provide a method for coating a substrate with a coating composition containing carbon and metal.
• the object is achieved by a method for applying a coating composition to a substrate, comprising the steps of: a) producing a coating composition by physically and / or chemically mixing carbon in the form of carbon nanotubes, graphenes, fullerenes or their mixtures with metal particles,
• the previously applied coating or the previously applied substrate may be intermediate layers, for example layers containing Cu, Ni, Ag, Co, Fe and / or their alloys.
• the metal particles used for the coating composition are preferably metal particles containing Cu, Sn, Ag, Au, Pd, Ni and / or Zn and their alloys.
• the metal particles have an average particle size (d 50 ) in the range from 10 to 200 ⁇ m, preferably from 25 to 150 ⁇ m, more preferably from 40 to 100 ⁇ m.
• the average particle size can be determined, for example, by XRD.
• the metal particles have an average particle size in the range of 8 nm to 500 nm, preferably 10 nm - 250 nm. These particle sizes are particularly advantageous when applying the coating composition via an inkjet process. In a further embodiment of the invention, it is preferred that the metal particles have an average particle size in the range from 50 to 1000 nm, preferably 100 nm to 500 nm. These particle sizes are particularly advantageous if the coating composition is applied by means of an Aerosoljet process.
• Multi-wall carbon nanotubes MWCNTs
• SWCNTs single-walled carbon nanotubes
• the carbon nanotubes preferably have a diameter of 1 nm to 1000 nm.
• the mixing of the carbon with the metal particles preferably takes place in a dry or moist state. Accordingly, the application of the coating composition in dry form or in moist form takes place.
• the mixing of the components of the coating composition preferably takes place with the aid of mixing devices, for example with a ball mill, a speed mixer, mechanical stirrers, kneading machines, extruders etc.
• the mixing of the carbon with the metal particles takes place in a moist state, with so much solvent (liquid dispersion medium) being added that a paste or dispersion (in particular a suspension) is formed.
• additives / wetting agents When wet mixing, one or more additives / wetting agents may be added.
• the additives / wetting agents are preferably selected from surfactants, antioxidants, fluxes and / or acidic agents. - -
• the surfactants which may be nonionic, anionic, cationic and / or amphoteric in nature, contribute in particular to obtaining a stable dispersion or suspension.
• Suitable surfactants for the purposes of the invention are, for example, octylphenol ethoxylate (Triton), sodium lauryl sulfate, CTAB (cetyltrimethylammonium bromide), poly (sodium 4-styrenesulfonate) or gum arabic.
• antioxidants are believed to provide better adhesion of the coating composition to the substrate and thus activation of the substrate surface.
• metal oxides are to be reduced again to the metallic and thus conductive form.
• Suitable antioxidants are, for example, selected from inorganic salts such as stannous chloride dissolved in hydrochloric acid, sodium sulfite or calcium sulfite and the like.
• Fluxes are additives intended to facilitate the melting and handling of molten substances. Fluxes are added in metal processing as well as in molten salts to reduce the melting temperature and viscosity (viscosity). In addition, they also have a function as oxidation protection in some processes. Suitable fluxes in the context of this invention are, for example, boron compounds such as hydroboric acids, fluorine compounds such as hydrofluoric acids, phosphates, silicates or metal chlorides, in particular zinc chloride, and also ammonium chloride and also rosin.
• Suitable acidic agents within the meaning of this invention are, in particular, dilute inorganic acids, e.g. Hydrochloric acid with a concentration ⁇ 5 mol%, preferably 1 to 4.5 mol%, particularly preferably 2 to 4 mol%.
• dilute inorganic acids e.g. Hydrochloric acid with a concentration ⁇ 5 mol%, preferably 1 to 4.5 mol%, particularly preferably 2 to 4 mol%.
• the coating composition may be applied to the substrate in a wet state as a paste or as a dispersion. This can be done, for example, by spraying, spraying, knife coating, dipping, rolling and the like or a combination of said methods. These techniques are known to those skilled in the art.
• the coating composition may further be applied wholly or partially to the substrate. For selective application while the usual techniques in printing such as gravure, screen printing or stamp printing can be applied. Further, for partial application of the spray during spraying, for example, via the inkjet technique can be controlled accordingly.
• the substrate may be heated prior to or during the application of the coating composition, preferably to a temperature of 50 to 320 ° C, more preferably 80 to 300 ° C.
• a thermal treatment is preferably carried out at a temperature of> 150 ° C to 1000 ° C, preferably 200 to 950 ° C, particularly preferably 250 to 900 ° C.
• the coating composition is applied to the substrate in the dry state, ie without solvent, as a powder mixture.
• the dry coating composition is preferably heated to the molten state and applied to the substrate.
• the coating composition may be by spraying, spraying, knife coating, dipping, rolling and the like. These techniques are known to those skilled in the art.
• the coating composition may further be applied wholly or partially to the substrate. In the partial application, for example, masks can be used, or it can be controlled according to the spray during spraying. - -
• the substrate is treated and / or heated with an antioxidant, flux and / or acidic agent prior to application of the coating composition.
• the substrate is precoated in a further preferred embodiment with metal particles.
• the metal particles preferably contain the metal or are preferably made of the metal used in the corresponding coating composition.
• the substrate may also be provided with further intermediate layers such as Cu, Ni, Ag, Co, Fe and their alloys.
• a thermal treatment is preferably carried out at a temperature of> 150 ° C to 1, 000 ° C, preferably 200 to 950 ° C, particularly preferably 250 to 900 ° C.
• the coating is homogenized after application by pressure and / or temperature.
• a stamp or a roller exert pressure on the coating and can be heated at the same time in order to achieve melting of the coating. This leads to an improved homogenization of the coating on the substrate.
• a metal-containing substrate is preferably used as a substrate to be coated with the coating composition.
• a non-metallic plastic is preferably used as a substrate.
• the metal-containing substrate is preferably selected from copper, copper alloys, nickel and nickel alloys, aluminum and aluminum alloys, steels, tin alloys, silver alloys, metallized plastics or metallized ceramics.
• Another object of the invention is a coated substrate, obtainable by the method according to the invention.
• the coated substrate is characterized in that it has a homogeneous coating containing carbon in the form of carbon nanotubes, graphenes, fullerenes or their Having mixtures with metal particles.
• the substrate may further include intermediate layers.
• the metal particles used for the coating composition are preferably metal particles containing Cu, Sn, Ag, Au, Pd, Ni and / or Zn.
• the metal particles can also be present as a mixture or alloy of the elements. It has proven to be advantageous if the metal particles have an average particle size (d 50 ) in the range of 10 to 200 ⁇ , preferably 25 to 150 ⁇ , more preferably 40 to 100 pm.
• the particle size is in the range 8 nm-300 nm or 50-1000 nm, preferably 10 nm-250 nm or 100 nm-500 nm ,
• the average particle size can be determined, for example, by XRD.
• the carbon nanotubes are preferably multi-walled carbon nanotubes (MWCNTs) or single-walled carbon nanotubes (SWCNTs).
• MWCNTs multi-walled carbon nanotubes
• SWCNTs single-walled carbon nanotubes
• the carbon nanotubes preferably have a diameter of 1 nm to 1000 nm and a length ⁇ 50 ⁇ m, preferably 1 ⁇ m and in particular 200 nm.
• the synthesis of the carbon nanotubes is preferably carried out by deposition of carbon from the gas phase or a plasma. These techniques are known to those skilled in the art.
• the fullerenes used according to the invention are spherical molecules of carbon atoms with high symmetry.
• the preparation of the fullerenes is preferably carried out by evaporating graphite under reduced pressure and under a protective gas atmosphere (eg argon) with a resistance heater or in the arc.
• a protective gas atmosphere eg argon
• the fullerenes have semiconducting to superconducting properties.
• the graphenes used according to the invention are monoatomic layers of sp 2 -hybridized carbon atoms.
• the graphenes show a very good electrical and thermal conductivity along their plane.
• the preparation of the graphene is preferably carried out by splitting graphite into its basal planes. Initially, oxygen is intercalated. The oxygen reacts partially with the carbon and leads to a mutual repulsion of the layers. Subsequently, the graphenes are suspended and processed in the coating composition.
• Another way of displaying individual graphene layers is to heat hexagonal silicon carbide surfaces to temperatures above 1,400 ° C. Due to the higher vapor pressure of the silicon, the silicon atoms evaporate faster than the carbon atoms. Thin layers of monocrystalline graphite, consisting of a few graphene monolayers, then form on the surface.
• the coated substrate can be used as an electromechanical component, which has a low mechanical wear and low insertion and removal forces due to a reduced coefficient of friction and also has a very good electrical conductivity.
• the invention can be used, for example, for the following applications:
• MID Molded Inteconnect Devices
• FIG. 1 shows a micrograph of an Sn powder (of Ecka granules) having a particle size ⁇ 45 ⁇ m with 2.1% by weight of CNTs mixed in a ball mill under protective gas; the length of the measuring beam is 20 pm; the recording was taken with a voltage of 10 kV;
• Figure 2 is a micrograph of a mixture of Sn and CNT powder, which has been melted in a crucible under pressure.
• FIG. 3 shows a mixture of Sn and CNT powder which has been sprinkled on a Cu tape sample which was hot-dip-tinned. The powder was then melted at 260 ° C and pressed in at the same time; the length of the measuring bar of the enlarged receptacle is 1 pm; this recording was taken with a voltage of 10 kV and
• FIG. 4 shows a FIB (focussed ion beam) image of a cross-section through a substrate 1 after the application of a coating 2 according to the invention; the size of the area imaged in the FIB recording is 8.53 pm; the recording was made with a voltage of 30kV.
• FIB focused ion beam
• Example 1 Sn powder (particle size ⁇ 45 ⁇ m, see FIG. 1) was mixed with 2.1% by weight of CNTs in a ball mill under an Ar atmosphere, and these powders were scattered onto a Cu strip sample which had been hot-dip-tinned. The powder was then melted at 260 ° C and simultaneously rolled (pressed) (see Figure 3).
• the powder on the Sn surface was melted and pressed and then aged out to get the CNTs in the Sn matrix by the growth of the intermetallic phase to the surface, where the effect in terms of plugging and pulling forces then advantage comes.
• the coating in FIG. 4 consists of graphenes 3 mixed with Sn powder.
• the substrate used is a CuSn 6 sheet.
• Substrate 1 and coating 2 are melted under pressure and temperature and the melt solidifies again.
• the graphenes 3 have been placed around the Sn grains 4 in the solidified melt of the coating 2 and envelop them.
• a two-layer intermetallic Cu-Sn intermediate layer 5, which is formed by the melting between the substrate 1 and the coating 2 is also to be recognized.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Metallurgy (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Mechanical Engineering (AREA)
• Dispersion Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Life Sciences & Earth Sciences (AREA)
• Wood Science & Technology (AREA)
• Other Surface Treatments For Metallic Materials (AREA)
• Carbon And Carbon Compounds (AREA)
• Powder Metallurgy (AREA)
• Laminated Bodies (AREA)
• Manufacture Of Metal Powder And Suspensions Thereof (AREA)
• Non-Insulated Conductors (AREA)
• Paints Or Removers (AREA)
• Conductive Materials (AREA)
• Materials For Medical Uses (AREA)
• Manufacturing Of Electric Cables (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

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• 2009
  • 2009-11-25 DE DE200910054427 patent/DE102009054427B4/de active Active
• 2010
  • 2010-10-01 EP EP10784952A patent/EP2504398A1/de not_active Withdrawn
  • 2010-10-01 WO PCT/DE2010/001165 patent/WO2011063778A1/de active Application Filing
  • 2010-10-01 CN CN201080053385.8A patent/CN102648246B/zh active Active
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  • 2010-10-01 US US13/511,646 patent/US20130004752A1/en not_active Abandoned
  • 2010-10-01 BR BR112012012488A patent/BR112012012488A2/pt not_active Application Discontinuation
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