EP2457412B1 - Chauffage, notamment chauffage à haute température, ainsi que son procédé de fabrication - Google Patents

Chauffage, notamment chauffage à haute température, ainsi que son procédé de fabrication Download PDF

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Publication number
EP2457412B1
EP2457412B1 EP10736624.7A EP10736624A EP2457412B1 EP 2457412 B1 EP2457412 B1 EP 2457412B1 EP 10736624 A EP10736624 A EP 10736624A EP 2457412 B1 EP2457412 B1 EP 2457412B1
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EP
European Patent Office
Prior art keywords
layer
electrically conductive
substrate
protective layer
heating
Prior art date
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Active
Application number
EP10736624.7A
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German (de)
English (en)
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EP2457412A1 (fr
Inventor
Harun Erismis
Michael Geiss
Dominik Nemec
Frank JÖRDENS
Gerhard Schmidmayer
Philipp Schaller
Jürgen Salomon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
BSH Hausgeraete GmbH
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
BSH Bosch und Siemens Hausgeraete GmbH
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Priority to SI201030272T priority Critical patent/SI2457412T1/sl
Priority to PL10736624T priority patent/PL2457412T3/pl
Publication of EP2457412A1 publication Critical patent/EP2457412A1/fr
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Publication of EP2457412B1 publication Critical patent/EP2457412B1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0014—Devices wherein the heating current flows through particular resistances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/028—Heaters specially adapted for trays or plates to keep food or liquids hot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
    • H05B2214/04—Heating means manufactured by using nanotechnology
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Definitions

  • the invention relates to a method for producing a heater, in particular high-temperature heating, as well as such a heater, in particular a high-temperature heating, in which on a carrier material at a current flow heat generating layer is provided.
  • Such heaters are used for products of white goods, for example as a heater for an oven, toaster or hobs or glass ceramic hobs.
  • a heater for an oven toaster or hobs or glass ceramic hobs.
  • the use of such heating elements leads to an inhomogeneous warm-up process. A targeted focus on the food or to be heated Good is not given.
  • there is an air cushion between the heating wires and the carrier material which has a negative effect on the heat transfer.
  • induction hobs are known in which the heat is generated directly in the cooking pot by eddy currents.
  • the initial cost is complex, and it requires special pots for heating the food.
  • this high-temperature heating can not be easily transferred to any white goods.
  • a plate-shaped heating element has become known, which is used for the air conditioning of homes and buildings.
  • a heating layer of a carbon-fiber mixture with non-conductive materials has become known, which is applied to a gypsum board or composite panel provided on the backside with a composite building material.
  • strip-shaped contact elements are provided, so that a surface heating of the layer is made possible on carbon-fiber mixture.
  • Such sheet-like heaters allow due to their design of the heating layer only temperatures in a range of ⁇ 50 ° C and are not suitable for the use of white goods.
  • the application of such fiber blends or fiber fabrics is very costly.
  • an electric hotplate with at least one cooking zone has become known which uses glass ceramic, glass or ceramic as the carrier material.
  • an electrical insulation layer is provided for heating the cooking zones and a thermally insulating cover layer, wherein a Schuwiderstandsmaterial is provided therebetween lying.
  • the heating resistor material consists of electrically conductive carbon, graphite particles or carbon fibers which are contacted with electrodes.
  • the heating resistor element may be mixed with a binder of heat-resistant organic or inorganic substances.
  • the second thermally insulating covering layer applied thereon terminates airtight with respect to the atmosphere of the heating resistance element, wherein the covering layer consists of heat-resistant glass or an enamel layer.
  • the assembly of the hot plate body is carried out by electrochemical bonding of the superimposed layers, wherein it is provided that the heating resistance element is brought by heating to a temperature above 400 ° C and in addition an electrical voltage of more than 400 V to the hotplate body and the Schuwiderstandselement is applied.
  • This layer structure of the cooking zone has the disadvantage that a complex representation of the adhesion properties is given by high voltages and no free choice of the contacting method is possible because the contact must be directly on the conductive layer.
  • an electric roasting oven plate for heating which is based on a structure of the electric hotplate according to of the DE 100 01 330 A1 Reference, this structure for electric baking, cooking or electric roasting ovens should be used.
  • An infrared CNT heating device which comprises a thermally loadable molded body with an electrically conductive structural layer, which generates infrared heat rays when current flows through.
  • the electrically conductive structural layer consists of CNT materials, which are obtained by extraction or manual application of CNT suspensions and applied to the molding with suitable support materials such as gel or pasty emulsions.
  • a functional coating of thermally treated ceramic, metal, enamel, blocking, adhesive or insulating layer may be present between the shaped body and the conductive structural layer.
  • the invention has the object of providing a method for producing a heater, in particular a high-temperature heating and a heater, in particular a high-temperature heating to propose, in which a heating element in a simple manner can be applied over the entire surface as a thin layer and allows homogeneous heat transfer.
  • a method for producing a heater in particular for thermal household appliances, in which on the carrier material, a first electrically conductive layer is applied, which is formed from a flowable base material and carbon nanotubes dispersed therein that on the first Layer, a protective layer is applied, which penetrates by applying to the first layer in this, by compressing the layers by a temperature treatment and to prepare the protective layer, a silicate is used to form an inorganic layer.
  • This method makes it possible to produce a very thin heating element which can be heated up very quickly and allows a uniform heat transfer to the carrier material.
  • the heat treatment process after applying the first layer and the protective layer has surprisingly revealed that the carbon nanotube selected as the conductive material is temperature resistant in the first layer and the protective layer can be introduced and burning is avoided.
  • a silicate as a protective layer, the carbon nanotubes dispersed in the base material can be completely incorporated or protected from the environment, so that especially at elevated temperatures oxidation protection of the carbon nanotubes is given, since they begin to degrade at these high temperatures , By penetrating the protective layer and the subsequent compression of this degradation is counteracted.
  • a heating element which enables a corresponding thermal shock stability and a mechanical adhesion to the carrier material.
  • the at least one layer is contacted with contact elements and the layers applied to the carrier material are heated.
  • an increased mechanical adhesion between the contact element and the carrier material can be achieved.
  • a further preferred embodiment of the method provides that the contact elements are strip-shaped. As a result, a sheet-like heating can be achieved.
  • the applied first layer and protective layer is heated in particular to a temperature between 300 ° C to 700 ° C.
  • a sintering process of the layers takes place. This can be done in particular a compression of the layers.
  • This has the advantage that such high-temperature heaters are compressed by the sintering oxygen-tight and thus suitable for operation at temperatures of> 400 ° C and are resistant.
  • a preferred embodiment of the method provides that the first layer is dried after application and then the protective layer is applied.
  • This drying process has the advantage that the first layer is at least slightly compressed, in particular water-soluble constituents can evaporate before the further protective layer is applied. As a result, a thin structure of the heating element can be favored.
  • the first layer and separately the protective layer or the functional layer are applied by a spray method by knife coating or a printing process.
  • a screen printing method can be provided, by which the in particular pasty first layer is applied in a simple manner to the carrier material.
  • the likewise preferred pasty trained second protective layer can be applied in the same way.
  • known technologies can be used for the production of high-temperature heating elements.
  • a spraying method or a spraying method may be provided in order to apply the first and second layer to the carrier material.
  • a so-called spray coating, a dip coating, so a dip coating or a spin coating can be realized.
  • a further preferred embodiment of the method provides that the first layer is applied over the entire surface or in adjacent strips, the protective layer is applied over the entire surface of the first layer and this completely envelopes the substrate, in particular before or after the application of the first layer strip-shaped contact elements be applied.
  • the first layer is connected as an electrically conductive layer with the strip-shaped contact elements and then allows electrical insulation through the protective layer with the exception of connection points on the strip-shaped contact elements.
  • the complete encapsulation of the first electrically conductive layer by the protective layer further makes it possible to use water-soluble materials as the basis for a dispersion for the production of the first electrically conductive layer. These in turn have the advantage that processing without the use of solvents is possible and thus harmless to health.
  • a further preferred embodiment of the method provides that before applying the first layer to the carrier material in the heating region, an electrically insulating layer is applied to the carrier material. This is done in particular when the carrier material is not made of a dielectric material, but of an electrically conductive or weakly electrically conductive material.
  • a preferred embodiment of the method provides that an aqueous solution, in particular water or distilled water, is used for producing the first layer as electrically non-conductive base material, which preferably comprises a dispersant, such as gum arabic.
  • a dispersant such as gum arabic.
  • a further preferred embodiment of the method provides that incorporated into the electrically non-conductive base material fillers of carbon nanotubes and / or graphite and this paste can then be printed.
  • the last step describes the application of the protective layer (TopCoat), which preferably consists of ethyl silicate with graphite.
  • single, double or multiwalled nanotubes can preferably be used.
  • the combination of graphite and carbon nanotubes has the advantage that a flowable dispersion for the first layer for full-surface application to a carrier material is achieved.
  • an adhesive in particular gum arabic
  • an adhesive is dispersed into the first layer.
  • an adhesion mediation between the first layer and a carrier material can be improved.
  • the gum arabic is used before the application of the protective layer (TopCoat) as a primer. This guarantees that when printing the protective layer (TopCoat) this does not destroy the first layer (PreCoat).
  • gum arabic During the penetration of the layers, the gum arabic is burned out. Before the protective layer forms gas-tight, the volatile constituents of gum arabic diffuse out.
  • other surfactants such as SDS or Triton are also conceivable.
  • a heating element in particular a high-temperature heating element, for example for thermal household appliances, in which a first electrically conductive layer consisting of a base material and a carbon nanotube dispersed therein and a protective layer are provided on the carrier material the first layer is penetrated and that the protective layer consists of silicate.
  • a heating element allows high temperature resistance and thermal shock stability to be achieved.
  • any desired geometries for the heating elements on a carrier material, in particular for forming a high-temperature heating can thereby be selected.
  • a preferred embodiment of the heating element provides that the layers are contacted with contact elements. As a result, a simple connection can be created.
  • the contact elements are strip-shaped.
  • Eint further preferred embodiment of the heating provides that the layers are compressed by a temperature treatment. As a result, the temperature resistance and / or thermal shock stability can be further increased.
  • the first layer and the protective layer form a heating element with a layer thickness of less than 500 ⁇ m, in particular less than 100 ⁇ m. Due to the choice of materials, an ultra-thin application may be possible. At the same time, a homogeneous heat generation within the first electrically conductive layer and thus of the carrier material can take place.
  • the heater preferably has a first layer, which has a concentration of 0.1 to 100 wt% CNT in the flowable base material, in particular in water or distilled water. This can be given a high electrical conductivity, so that you can work with low voltages.
  • a concentration of 1 to 3 wt% CNT and 5 to 50 wt% graphite is provided as a filler in the base material. By adding graphite, the flowability of the first layer or the mixture can be increased.
  • the heating element preferably has a heating element with a first layer and a protective layer which has an electrical resistance of less than 100 ohms / sq. having. This allows a temperature generation of> 400 ° C on large substrates by means of a conventional power supply in the home. In addition, the layers could be made even thinner to ensure even better mechanical stabilities.
  • a carrier material is preferably provided which consists of ceramic, glass ceramic, ceran ceramic, aluminum oxide ceramic, MgO, KER 520.
  • FIG. 1 is a schematic side view of a heater 11, in particular a high-temperature heating shown.
  • FIG. 2 shows a schematic view from below.
  • the high-temperature heating 11 comprises a carrier material 12, which may be formed, for example, when used in the field of white goods as ceramics, glass ceramic, Cerankeramik, alumina ceramics or the like.
  • On the underside of a heating element 14 is provided within a heating area.
  • This heating element 14 comprises a first electrically conductive layer 16, on which a protective layer 17 is applied.
  • the protective layer 17 completely surrounds the first electrical layer 16, so that it is electrically insulated and mechanically protected against the environment on the substrate 12 is provided.
  • the first electrically conductive layer 16 extends between two strip-shaped contact elements 18, which are guided for contacting the electrical layer 16, for example, to an edge region of the carrier material 12. Between the two preferably parallel to each other extending contact elements 18, the first layer 16 extends and forms the heating area.
  • the protective layer 17 covers the first layer 16 and preferably the strip-shaped contact elements 18, so that only for example in the edge region a free contact point can be recessed. Alternatively, it can also be provided that initially the first layer 16 and the protective layer 17 are applied and then the strip-shaped contact elements 18 are brought to the heating zone formed by the first layer 16 and protective layer 17.
  • the first electrically conductive layer 16 consists of a flowable, electrically non-conductive base material.
  • an aqueous-based dispersion is provided. Carbon nanotubes are dispersed in this dispersion as an electrically conductive material.
  • the dispersion comprises a filler, in particular graphite, in order to support the electrical conductivity and to adjust the flowability.
  • an adhesive is preferably provided in the dispersion. This may be, for example, gum arabic. Other surfactants such as SDS or Triton can be used. As a result, a flowable or pasty mass can be produced, which can be applied to the carrier material 12 by a printing process or spraying process.
  • the protective layer 17 is preferably made of a silicate, which may preferably be enriched with adhesive, filler or other particles in order to increase the adhesion properties. As a result, the thermal shock stability and the mechanical adhesion to the substrate can be improved. By penetrating the protective layer 17 into the first layer 16, these CNTs are also suitable for use at temperatures above 350 ° C., since the protective layer 17 encloses the CNTs airtight.
  • the electrically conductive material preferably consists of a composite of CNTs and graphite or further electrically conductive particles or constituents which make it possible to form a pasty mass or a sprayable mass.
  • heating element 14 is prepared by first mixing the components of an electrically non-conductive base material and carbon nanotubes dispersed therein or a composite of carbon nanotubes with other electrically conductive materials to form a flowable or pasty mass, which by means of a Screen printing process is applied over the entire surface of the substrate 12. Subsequently, the strip-shaped contact elements 18 can preferably be printed by applying a conductive paste, in particular silver conductive paste, by screen printing. These contact elements 18 can also be provided on the carrier material 12 before the application of the first layer 16. Following this For example, according to a variant of the first embodiment of the production method, this first layer 16 can be subjected to temperature treatment.
  • the protective layer 17 is preferably applied by a screen printing method. Alternatively, this can also be applied without an intervening drying process of the first layer 16.
  • the carrier material 12 is treated with the layers 17 applied thereto as well as the contact elements 18, so that at least the protective layer 17 is preferably sintered.
  • the compression takes place and requires a further "compression" of the conductive particles, which due to the increased number of contacts and the compactness to a lower spec. Resistance leads. This in turn can be used to create a conductivity improvement in the first layer 16.
  • Such high-temperature heaters 11 have heating elements 14, the thickness of which may be formed, for example, ⁇ 100 ⁇ m.
  • heating elements 14 the thickness of which may be formed, for example, ⁇ 100 ⁇ m.
  • the full-surface arrangement of the electrically conductive layer 16 on the carrier material 12 a homogeneous heating and thermal radiation of the carrier material 12 is made possible.
  • the protective layer 17 may be associated with a reflector to reflect the heat radiation from the heating element 14 in the opposite direction to the carrier material 12 and to accelerate the heating of the carrier material 12.
  • FIG. 3 is an alternative embodiment to FIG. 1 shown.
  • This embodiment differs from that in FIG. 1 from that prior to the application of the first electrically conductive layer 16, an electrical insulating layer 19 is applied over the entire surface of the carrier material 12 in order to arrange the electrically conductive layer 16 relative to the carrier material 12 in isolation.
  • This arrangement of the insulating layer 19 may also be provided when applying a mixture consisting of the first electrically conductive layer 16 and the protective layer 17.
  • an electrically insulating layer 19 are applied over the entire surface.
  • FIG. 4 is an alternative embodiment to FIG. 1 shown.
  • This embodiment differs only in that instead of a full-surface first electrically conductive layer 16, a strip-shaped layer 16 is formed.
  • Such webs or ribs can be adapted in geometry and contour to the corresponding applications.
  • the strip geometry can heat targeted areas. In addition, it further favors the adhesion properties of the respective substrate.
  • the strips can be arranged as desired, so that different heating zones can be implemented on a substrate in a targeted manner.

Claims (17)

  1. Procédé destiné à fabriquer un chauffage, notamment pour appareils thermiques domestiques, lors duquel une couche génératrice de chaleur en cas de passage de courant est prévue en tant qu'élément chauffant (14) sur un matériau support (12), et lors duquel sur le matériau support (12) est appliquée une première couche électroconductrice (16) qui est formée par un matériau de base coulant et, dispersés dans celui-ci, des nanotubes de carbone,
    caractérisé en ce que
    - sur cette première couche (16) est appliquée une couche protectrice (17) qui, lors de son application sur la première couche (16), pénètre dans celle-ci,
    - les couches (16, 17) sont comprimées par un traitement thermique, et
    - pour la fabrication de la couche protectrice (17) est utilisé un silicate destiné à former une couche inorganique.
  2. Procédé selon la revendication 1, caractérisé en ce que ladite au moins une couche (16, 17) est mise en contact avec de préférence des éléments de contact (18) en forme de bande et que les couches (16, 17) appliquées sur le matériau support sont chauffées, et ce de préférence uniquement par application d'une tension aux éléments de contact (18).
  3. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les couches (16, 17) appliquées sur le matériau support (12) sont chauffées jusqu'à atteindre une température comprise entre 300 °C et 700 °C.
  4. Procédé selon la revendication 1, caractérisé en ce que la première couche électroconductrice (16) est séchée après avoir été appliquée sur le matériau support (12) et qu'ensuite la couche protectrice (17) est appliquée.
  5. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que la première couche électroconductrice (16) et, séparément de celle-ci, la couche protectrice (17) sont appliquées par un procédé de pulvérisation, par raclage ou par un procédé d'impression.
  6. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que la première couche électroconductrice (16) est appliquée sur le matériau support (12), et ce en bandes ou sur toute la surface, en ce que la couche protectrice (17) est ensuite appliquée sur toute la surface de la première couche (16) de manière à entourer celle-ci jusqu'au matériau support (12), des éléments de contact (18) en forme de bande étant appliqués sur le matériau support (12) avant ou après l'application de la première couche électroconductrice (16) ou de la couche protectrice (17).
  7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'avant l'application de la première couche électroconductrice (16), une couche électriquement isolante (19) est appliquée, dans la zone d'échauffement, sur le matériau support (12).
  8. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que pour la fabrication de la première couche électroconductrice (16) une solution aqueuse, notamment de l'eau ou de l'eau distillée, qui comprend de préférence un agent de dispersion tel que de la gomme arabique, est utilisée en tant que matériau de base coulant non-électroconducteur.
  9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que dans le matériau de base coulant de la première couche électroconductrice (16) sont dispersés des nanotubes de carbone et/ou du graphite en tant que matériau électroconducteur.
  10. Procédé selon la revendication 1, caractérisé en ce que dans la couche protectrice (17) est dispersé un matériau de remplissage, notamment du graphite.
  11. Procédé selon la revendication 1, caractérisé en ce que dans la première couche (16) est dispersé un agent adhésif, notamment de la gomme arabique.
  12. Chauffage, notamment chauffage à haute température, en particulier pour des appareils thermiques domestiques, lequel présente sur un matériau support (12), en tant qu'élément chauffant (11), une couche génératrice de chaleur en cas de passage de courant, caractérisé en ce que sur le matériau support (12) sont prévues une première couche électroconductrice (16) composée d'un matériau de base et, dispersés dans celui-ci, de nanotubes de carbone ainsi qu'une couche protectrice (17) qui a pénétré dans la première couche (16), et en ce que la couche protectrice (17) se compose d'un silicate.
  13. Chauffage selon la revendication 12, caractérisé en ce que les couches (16, 17) sont mises en contact avec des éléments de contact (18) de préférence en forme de bande.
  14. Chauffage selon la revendication 12 ou 13, caractérisé en ce que la première et la deuxième couche (16, 17) présentent une épaisseur de couche inférieure à 500 µm, notamment inférieure à 100 µm.
  15. Chauffage selon l'une quelconque des revendications 12 à 14, caractérisé en ce que la première couche électroconductrice (16) présente une concentration en nanotubes de carbone comprise entre 0,1 et 100 pourcent en poids dans le matériau de base coulant, ou en ce qu'il est prévu une matrice présentant une concentration en nanotubes de carbone comprise entre 1 et 3 pourcent en poids et une concentration en graphite comprise entre 5 et 50 pourcent en poids dans le matériau de base.
  16. Chauffage selon l'une quelconque des revendications 12 à 15, caractérisé en ce que l'élément chauffant (14) constitué par la première et la deuxième couche (16, 17) présente une résistance électrique inférieure à 100 Ω/carré.
  17. Chauffage selon l'une quelconque des revendications 12 à 16, caractérisé en ce que le matériau support (12) se compose de céramique, vitrocéramique, céramique CERAN, céramique en oxyde d'aluminium, MgO, KER500.
EP10736624.7A 2009-07-21 2010-07-19 Chauffage, notamment chauffage à haute température, ainsi que son procédé de fabrication Active EP2457412B1 (fr)

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SI201030272T SI2457412T1 (sl) 2009-07-21 2010-07-19 Grelnik, zlasti visokotemperaturni grelnik, ter postopek za proizvodnjo le-tega
PL10736624T PL2457412T3 (pl) 2009-07-21 2010-07-19 Jednostka grzejna, w szczególności wysokotemperaturowa jednostka grzejna jak też sposób jej wytwarzania

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DE102009034307A DE102009034307A1 (de) 2009-07-21 2009-07-21 Hochtemperaturheizung sowie Verfahren zu dessen Herstellung
PCT/EP2010/004389 WO2011009577A1 (fr) 2009-07-21 2010-07-19 Chauffage, notamment chauffage à haute température, ainsi que son procédé de fabrication

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EP (1) EP2457412B1 (fr)
KR (1) KR20120038998A (fr)
DE (1) DE102009034307A1 (fr)
ES (1) ES2422704T3 (fr)
PL (1) PL2457412T3 (fr)
SI (1) SI2457412T1 (fr)
WO (1) WO2011009577A1 (fr)

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US10231287B2 (en) 2012-04-20 2019-03-12 Universitat Bremen (Bccms) Electrical heating device, component and method for the production thereof
JP5989901B2 (ja) * 2012-07-09 2016-09-14 ハノン システムズ 車両用ヒーター
ITMO20120243A1 (it) * 2012-10-04 2014-04-05 Giemme S N C Di Corradini Marco & C Pannello riscaldante ad elevata efficienza e relativo procedimento di realizzazione
FR3005388B1 (fr) * 2013-05-03 2017-10-06 Topinox Sarl Element de chauffage a sections ayant differentes puissances de chauffage, et appareil de cuisson.
DE102014110186B4 (de) * 2014-07-18 2018-10-31 Anneliese Backtechnik Gmbh Vorrichtung zur Wärmebehandlung von Lebensmitteln
KR101718076B1 (ko) * 2015-05-14 2017-03-20 주식회사 대화알로이테크 전기차량의 히터장치 및 그 제어방법
KR101698908B1 (ko) 2015-05-14 2017-02-01 주식회사 대화알로이테크 하이브리드 차량용 배터리 프리 히팅장치 및 그 제어 방법
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Publication number Publication date
WO2011009577A1 (fr) 2011-01-27
DE102009034307A1 (de) 2011-01-27
US20120118873A1 (en) 2012-05-17
PL2457412T3 (pl) 2013-09-30
ES2422704T3 (es) 2013-09-13
US10149350B2 (en) 2018-12-04
US9578691B2 (en) 2017-02-21
KR20120038998A (ko) 2012-04-24
US20170150552A1 (en) 2017-05-25
EP2457412A1 (fr) 2012-05-30
SI2457412T1 (sl) 2013-08-30

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