EP2382660A1 - Élément composite électrique ou électronique et procédé de fabrication d'un élément composite électrique ou électronique - Google Patents

Élément composite électrique ou électronique et procédé de fabrication d'un élément composite électrique ou électronique

Info

Publication number
EP2382660A1
EP2382660A1 EP09799096A EP09799096A EP2382660A1 EP 2382660 A1 EP2382660 A1 EP 2382660A1 EP 09799096 A EP09799096 A EP 09799096A EP 09799096 A EP09799096 A EP 09799096A EP 2382660 A1 EP2382660 A1 EP 2382660A1
Authority
EP
European Patent Office
Prior art keywords
sintered
joining
joining partner
sintering
composite component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09799096A
Other languages
German (de)
English (en)
Inventor
Daniel Wolde-Giorgis
Erik Sueske
Martin Rittner
Erik Peter
Herbert Schwarzbauer
Michael Guenther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP2382660A1 publication Critical patent/EP2382660A1/fr
Withdrawn legal-status Critical Current

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Classifications

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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions

  • the invention relates to an electrical or electronic composite component according to the preamble of claim 1 and to a method for producing an electrical or electronic composite component according to claim 7.
  • NTV Low Temperature Connection Technology
  • the sintering of silver metal nanoparticles offers the option to carry out the sintering process with significantly less pressure from a pressure range between approximately 100 kPa and 5 MPa.
  • oxygen and a process temperature of about 280 ° C. are also required for sintering nanoparticles.
  • the known silver metal nanoparticle paste formulation contains an even higher organic content, such as solvents and / or binders, than silver metal flake-based paste formulations.
  • sintering paste is applied directly to the first and / or the second joining partner, whereupon the joining partners are pressed against each other under the influence of temperature.
  • process management with sintering paste there is the difficulty of having to exchange large volumes of gas through the sintering layer; so oxygen must reach the joints and solvents and burned / oxidized organics must be able to escape. This leads, in particular under the desired low process pressures to increased cracking, especially in large-scale joints.
  • the invention is based on the idea of proposing an electronic or electrical composite component and a production method for such a composite component, in which, on the one hand, lead-containing soft solders can be dispensed with and, on the other hand, crack formation during sintering (joining) can be avoided.
  • the invention is based on the idea not to sinter at least two joining partners directly by means of sintering paste, ie directly to each other, but the joining partners firmly by sintering by means of sintering paste, with a previously prepared sintered compact, having a continuous open porosity to connect.
  • the thickness extension of the sintered shaped part (sintered foil) used in the stacking direction of the joining partners is preferably between about 10 ⁇ m and about 300 ⁇ m, or more.
  • Such a sintered molded part has the advantage of already integrated and in the subsequent sintering process with the joining partners stable gas ducts for the ventilation of the forming joint.
  • a further advantage of the provision of a porous sintered molded part between the joining partners is that the sintered molded part, in particular when the joining partners are connected with the identical material to the sintered shaped part from which the sintered shaped part is made, already has identical properties as the forming joint, such as a high electrical and thermal conductivity, a large porosity and thus a comparatively low modulus of elasticity.
  • a porous sintered molded part as an insert or insert part has a positive effect on the sintering process for joining the joining partners with the sintered molded part, especially when large-area joining partners, such as silicon power semiconductors and circuit carriers or circuit substrate and heat sinks are connected by sintering with the sintered molded part.
  • Another advantage of the use of a sintered molded part is that the freedom in the design of the joint can be extended, since the sintered molded part have a larger area than at least one of the joining partners, preferably as both joining partners can and / or the joining partners can be significantly further spaced from each other, as in the process control according to the prior art, ie in an immediate sintering of the joining partners by means of sintering paste.
  • the advantage is in particular in an increased thermal shock resistance.
  • the invention can be used in a variety of electrical and / or electronic applications. Particularly preferred is the implementation in power electronic modules, which are required for example for many forms of energy conversion, in particular mechanical / electrical (generator, rectifier), electric / electrical (inverter, AC / AC, DC / DC) and electrical / mechanical (electric drives , Change direction).
  • power electronic modules which are required for example for many forms of energy conversion, in particular mechanical / electrical (generator, rectifier), electric / electrical (inverter, AC / AC, DC / DC) and electrical / mechanical (electric drives , Change direction).
  • suitably designed power electronic modules can be used for the rectification in a motor vehicle generator, for controlling electric drives, for DC / DC converters, for a pulse change direction, for hybrid / FC / E drives and for photovoltaic inverters
  • individual components with higher power losses, in particular on the punched grids of discrete packages according to the invention can be added, which can then be used for example as completely lead-free solutions in printed circuit board technology.
  • the realization of the invention is particularly preferred in structures with semiconductor laser diodes or in MEMS and sensors, in particular for high-temperature applications. Further fields of application are semiconductor light-emitting diodes and high-frequency semiconductors for radar applications.
  • an embodiment of the composite component in which the sintered shaped part is made of silver metal, in particular silver metal flakes, and / or silver metal, in particular silver metal flakes, is very particularly preferred.
  • Sintered molded parts made of silver metal or silver metal are advantageous in view of the high electrical and thermal conductivity.
  • silver is suitable for realizing a continuous, gas channel forming, porosity. It is further preferred if such a sintered shaped part constructed with silver sintering paste is joined with at least one of the joining partners, preferably with both joining partners.
  • the sintered molded part is produced in a silver sintering process, which Preferably, it is carried out in such a way that the sintered shaped part or a sintered part which is subsequently to be divided into a plurality of sintered moldings does not join with the punch used for the purpose nor with the die used for the associated pressing operation.
  • stamp and die have oxide-coated steel surfaces, as described, for example, in the dissertation by Mertens, pages 78 and 79, ISBN 3-18-336521-9.
  • the first and / or the second joining partner are / are sintered with the sintered shaped part, in particular by means of sintering paste, preferably by means of silver sintering paste. Due to the uniform expression of the porosity in the resulting combined sintered joint made of sintered molded part and sintered paste, essential material characteristics, such as mechanical moduli, as well as electrical and / or thermal conductivity, should be represented more uniformly than was possible in the prior art.
  • the sintering paste in particular the silver sintering paste, is preferably applied either to the joining partners as well as to the sintered molding then serving as a depot, or alternatively only on both sides to the sintered molding or even alternatively only to one side of the sintered molding and to only one joining partner.
  • the organic components are removed from the sintering paste by temperature and, if appropriate, pressure introduction. Removal of the evaporated or oxidized organic components is ensured by the open porosity of the presintered sintered part.
  • the sintering paste sinters, in particular the silver sintering paste with the respective joining partner and the porous silver sintered part (silver preform).
  • further organic constituents are oxidized. The oxidation products and the oxygen required are transported through the presintered silver molding.
  • the first joining partner is very particularly preferably an electronic component, preferably a semiconductor component, very particularly preferably a power semiconductor, which can be connected via a sintered molded part to the second joining part, in particular a circuit carrier (printed circuit board) is.
  • a first joining partner designed as a circuit carrier via a sintered shaped part to a second joining partner, preferably a second base plate, preferably a copper base plate.
  • the copper base plate serves as a heat sink or is connected to a heat sink serving as a heat sink.
  • the heat sink first joining partner
  • the base plate second joining partner
  • a sintered shaped part it is possible to connect via a sintered molded part at least one bonding wire or at least one bonding tape with a further joining partner, in particular an electronic component, preferably a semiconductor device, in particular a power semiconductor device or a circuit carrier (electrical component), ie (to contact).
  • the sintered molded part increases reliability.
  • the first joining partner to be, for example, an electrical component, in particular a stamped grid (line grid), which can be connected via a sintered shaped part to a second joining partner, in particular a circuit carrier, more precisely a metal of the circuit carrier.
  • first and second joint partners can be realized, wherein the joining partner is connected to the sintered compact by sintering by means of sintering paste.
  • sintered components is not limited to composite components with only two joining partners. So it is conceivable, for example, to produce a composite component with two or more sintered moldings, wherein in each case via a sintered molded part at least two joining partners are fixed together. In this way, a sandwich-like structure comprising three or more joining partners can be produced, wherein the joining partners and the sintered shaped parts are preferably stacked in a stacking direction.
  • a second joining partner formed by a power semiconductor can be connected on both sides via a respective sintered shaped part to a circuit carrier forming a first or a second joining partner, so that the power semiconductor can be connected is sandwiched between the circuit carriers and wherein in each case between a circuit carrier and the power semiconductor is a sintered molded part.
  • the sandwich construction does not necessarily have to be realized in one process step, but can also be produced, for example, in two or more stages.
  • the invention also leads to a method for producing an electrical or electronic composite component, preferably a composite component designed as described above.
  • the core of the method is to sinter at least two joining partners with an open-porous sintered compact (sintered foil) by means of sintering paste, it being possible to use the same sintering paste or alternatively different sintering pastes for both joining partners.
  • the joining partners are sintered especially on two opposite sides of the sintered molding.
  • the advantage of the method according to the invention is that gases escape through the continuous open-porous structure of the sintered molded part during the bonding process (sintering process) with the joining partners and, if required, gases such as oxygen can be led to the joints.
  • the gas removal and the gas supply from the lateral direction, ie transverse to the stacking direction of the joining partners.
  • the sintered shaped part sintered foil
  • the sintered shaped part sintered foil
  • 1 is a power electronic composite component (here power electronic module / module)
  • 2 is a fragmentary view of a sintered molded part for interconnecting two joining partners
  • FIG. 3 schematically shows a manufacturing process for producing an electrical or electronic composite component, comprising two joining partners
  • FIG. 4 shows a schematic representation of a production process for producing an electrical or electronic composite component with three joining partners and two sintered shaped parts.
  • the 1 shows an electronic composite component 1. This comprises a first joining partner 2, a second joining partner 3 and a third joining partner 4.
  • the first joining partner 2 is a power semiconductor component, here an IGB transistor
  • the second joining partner 3 is a circuit carrier
  • the third joining partner 4 is a base plate made of copper.
  • the base plate made of copper is in turn fixed to a heat sink 5 (heat sink).
  • a sintered shaped part 6 is arranged with a thickness extension of about 50 microns in a stacking direction S.
  • the first joining partner 2 and the second joining partner 3 are fixed on two opposite sides of the sintered shaped part 6 by sintering by means of silver sintering paste.
  • the sintered molded part 6 is formed of silver sintered material.
  • the second joining partner 3 is in turn connected via a further sintered shaped part 7 with the third joining partner 4, wherein the third joining partner 4 and the second joining partner 3 are each firmly connected to the sintered shaped part 7 with silver sintering paste.
  • the third joining partner 4 is soldered directly to the heat sink 5.
  • Alternatively may be between the Third joining partner 4 and the heat sink 5, a sintered molded part are provided, with which the third joining partner 4 and the heat sink 5, are determined by sintering by means of sintering paste.
  • a plastic housing 8 is fixed to the third joining partner 4 formed by the base plate, which encloses the stack arrangement comprising the first and the second joining partners 2, 3 as well as the sintered shaped part 6.
  • the so-called stacked arrangement is surrounded by an elastic protective compound 9. Through these, connecting wires 10, 11 are guided up to the outside of the housing 8, which are fixed via the sintered shaped part 6 to the second joining partner 3 (circuit carrier), contacting them.
  • Fig. 2 shows the structure of a sintered compact 6, which is made of silver metal flakes. Evident is the continuous open porosity. This forms gas passageways through which gases can flow outward from the joints to the joints or in a sintering process. The gases preferably exit the pores laterally, ie transversely to the stacking direction S (see FIG. 1), whereby cracking by the sintering process using sintering paste is avoided.
  • first joining partner 2 is, for example, a chip and the second joining partner 3 is a circuit carrier.
  • first joining partner 2 is a circuit carrier and the second joining partner 3 is a base plate, in particular of copper, and / or a heat sink. Further, resulting from the claims combinations of first and second joint partners 2, 3 are alternatively feasible.
  • sintered paste 12 here silver sintering paste
  • sintered paste 12 was applied as a depot on both surface sides of the sintered shaped part 6.
  • the joining partners 2, 3, the sintered compact 6 and the sintering paste 12 are fed to a sintering process 13.
  • This sintering process is the second sintering process of the sintered compact 6.
  • the gas exchange for the sintering of the sintering paste 12 can take place over the entire porous volume of the sintered compact 6.
  • Sintering between joining partners 2, 3 usually does not show the same porosity at the edge area (in particular at a chip edge) after the sintering process as in an interior area. This is due to the fact that no isostatic pressure conditions can be built up there and thus the sintering takes place locally with less compression. In the event that only sintering paste is used, it is conceivable that in addition results in a bead-shaped squeezing in the edge region of the joining zones.
  • the second joining partner 3 may be a circuit carrier, in particular the metal of a circuit carrier, typically copper or a copper alloy, and the first joining partner 2 may be a stamped grid, typically copper or a copper alloy.
  • the first joining partner 2 may be a stamped grid, typically copper or a copper alloy.
  • the sintering paste is applied in a downstream process, for example dispensing, as a sintered paste deposit.
  • the first joining partner 2 is applied to the sintering paste and fed to a sintering process (pressure + temperature).
  • the porous structure of the sintered molded part 6 now brings with it sufficient possibilities for degassing from the sintered paste system.
  • Fig. 4 shows in the drawing plane right a multi-part electrical or electronic composite component 1.
  • This comprises a total of three joining partners 2, 3, 4, wherein between two joining partners 2, 3; 3, 4 a sintered molded part 6, 7 is arranged.
  • the first and the third joint partners 2, 4 may each be a circuit carrier and the central, ie internal joining partner 3 may be a power semiconductor.
  • the sandwich structure does not necessarily have to be joined in a common sintering process, but two-stage process management can also be realized, for example next to the first joining partner 1, the sintered shaped part 6, the second joining partner 3 and then subsequently the third joining partner 4 or alternatively first the third joining partner 4, the further sintered shaped part 7, the second joining partner 3 and then downstream of the first joining partner.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention concerne un élément composite électrique ou électronique (1) comportant un premier partenaire d'assemblage (2) et au moins un deuxième partenaire d'assemblage (3). Selon l'invention, une pièce frittée (6, 7) à pores ouverts est logée entre le premier et le deuxième partenaire d'assemblage (2, 3), ladite pièce étant frittée avec le premier et le deuxième partenaire d'assemblage (2, 3) par frittage au moyen de pâte de frittage. L'invention concerne également un procédé de fabrication d'un élément composite électrique ou électronique.
EP09799096A 2008-12-23 2009-12-18 Élément composite électrique ou électronique et procédé de fabrication d'un élément composite électrique ou électronique Withdrawn EP2382660A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008055137A DE102008055137A1 (de) 2008-12-23 2008-12-23 Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils
PCT/EP2009/067498 WO2010072667A1 (fr) 2008-12-23 2009-12-18 Élément composite électrique ou électronique et procédé de fabrication d'un élément composite électrique ou électronique

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EP2382660A1 true EP2382660A1 (fr) 2011-11-02

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US (1) US20120028025A1 (fr)
EP (1) EP2382660A1 (fr)
JP (1) JP2012513683A (fr)
CN (1) CN102272921A (fr)
DE (1) DE102008055137A1 (fr)
WO (1) WO2010072667A1 (fr)

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JP6026900B2 (ja) * 2013-01-30 2016-11-16 京セラ株式会社 電子部品収納用パッケージおよびそれを用いた電子装置
SG11201601437UA (en) 2013-08-29 2016-03-30 Alpha Metals Composite and multilayered silver films for joining electrical and mechanical components
JP6354147B2 (ja) * 2013-12-13 2018-07-11 三菱マテリアル株式会社 半導体装置、及び半導体装置の製造方法
DE102016123917A1 (de) * 2016-12-09 2018-06-14 Endress+Hauser SE+Co. KG Elektronik-Baugruppe
CN108243137B (zh) * 2016-12-27 2021-08-13 普天信息技术有限公司 一种无线帧业务子带帧结构资源分配方法
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DE102008055137A1 (de) 2010-07-01
US20120028025A1 (en) 2012-02-02
CN102272921A (zh) 2011-12-07
JP2012513683A (ja) 2012-06-14

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