EP2333127A4 - Copper alloy material for electrical/electronic component - Google Patents

Copper alloy material for electrical/electronic component

Info

Publication number
EP2333127A4
EP2333127A4 EP09804912A EP09804912A EP2333127A4 EP 2333127 A4 EP2333127 A4 EP 2333127A4 EP 09804912 A EP09804912 A EP 09804912A EP 09804912 A EP09804912 A EP 09804912A EP 2333127 A4 EP2333127 A4 EP 2333127A4
Authority
EP
European Patent Office
Prior art keywords
electrical
electronic component
copper alloy
alloy material
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09804912A
Other languages
German (de)
French (fr)
Other versions
EP2333127A1 (en
Inventor
Ryosuke Matsuo
Kuniteru Mihara
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2333127A1 publication Critical patent/EP2333127A1/en
Publication of EP2333127A4 publication Critical patent/EP2333127A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09804912A 2008-08-05 2009-07-30 Copper alloy material for electrical/electronic component Withdrawn EP2333127A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008202469 2008-08-05
PCT/JP2009/063614 WO2010016428A1 (en) 2008-08-05 2009-07-30 Copper alloy material for electrical/electronic component

Publications (2)

Publication Number Publication Date
EP2333127A1 EP2333127A1 (en) 2011-06-15
EP2333127A4 true EP2333127A4 (en) 2012-07-04

Family

ID=41663648

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09804912A Withdrawn EP2333127A4 (en) 2008-08-05 2009-07-30 Copper alloy material for electrical/electronic component

Country Status (6)

Country Link
US (1) US20110200480A1 (en)
EP (1) EP2333127A4 (en)
JP (1) JPWO2010016428A1 (en)
KR (1) KR20110039372A (en)
CN (1) CN102112641B (en)
WO (1) WO2010016428A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4708497B1 (en) * 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy plate and method for producing the same
JP4834781B1 (en) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
JP5508326B2 (en) * 2011-03-24 2014-05-28 Ｊｘ日鉱日石金属株式会社 Co-Si copper alloy sheet
JP4831552B1 (en) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Co-Si copper alloy sheet
JP6205105B2 (en) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 Cu-Ni-Si based alloy for electronic material, Cu-Co-Si based alloy and method for producing the same
JP5802150B2 (en) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
US10002684B2 (en) * 2012-07-26 2018-06-19 Ngk Insulators, Ltd. Copper alloy and method for manufacturing the same
KR102005332B1 (en) * 2019-04-09 2019-10-01 주식회사 풍산 Method for manufacturing Cu-Co-Si-Fe-P alloy having Excellent Bending Formability
CN110205570B (en) * 2019-04-15 2021-01-01 丰山(连云港)新材料有限公司 Heat treatment method of copper alloy for electric and electronic parts
CN110415895A (en) * 2019-08-16 2019-11-05 仙桃科利科技发展有限公司 A kind of manufacture craft of the anti-aging data line of high transmission rates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307232A (en) * 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd Copper alloy
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
JP2007169764A (en) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The Copper alloy
WO2007139213A1 (en) * 2006-06-01 2007-12-06 The Furukawa Electric Co., Ltd. Process for manufacturing copper alloy wire rod and copper alloy wire rod
JP2008088512A (en) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk Method for producing copper alloy for electronic material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277735A (en) * 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JP3510469B2 (en) * 1998-01-30 2004-03-29 古河電気工業株式会社 Copper alloy for conductive spring and method for producing the same
JP3739214B2 (en) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 Copper alloy sheet for electronic parts
JP2000087158A (en) * 1998-09-11 2000-03-28 Furukawa Electric Co Ltd:The Copper alloy for semiconductor lead frame
JP3754011B2 (en) * 2002-09-04 2006-03-08 デプト株式会社 Metal material for electronic component, electronic component, electronic device, method for processing metal material, method for manufacturing electronic component, and electro-optical component
EP1873267B1 (en) * 2005-03-24 2014-07-02 JX Nippon Mining & Metals Corporation Copper alloy for electronic material
JP4068626B2 (en) * 2005-03-31 2008-03-26 日鉱金属株式会社 Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP4943095B2 (en) * 2006-08-30 2012-05-30 三菱電機株式会社 Copper alloy and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307232A (en) * 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd Copper alloy
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
JP2007169764A (en) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The Copper alloy
WO2007139213A1 (en) * 2006-06-01 2007-12-06 The Furukawa Electric Co., Ltd. Process for manufacturing copper alloy wire rod and copper alloy wire rod
JP2008088512A (en) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk Method for producing copper alloy for electronic material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010016428A1 *

Also Published As

Publication number Publication date
CN102112641A (en) 2011-06-29
EP2333127A1 (en) 2011-06-15
KR20110039372A (en) 2011-04-15
JPWO2010016428A1 (en) 2012-01-19
CN102112641B (en) 2013-03-27
WO2010016428A1 (en) 2010-02-11
US20110200480A1 (en) 2011-08-18

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DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 9/06 20060101AFI20120524BHEP

Ipc: C22F 1/08 20060101ALI20120524BHEP

Ipc: H01B 1/02 20060101ALI20120524BHEP

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