EP2270242A4 - Copper alloy material for electric and electronic apparatuses, and electric and electronic components - Google Patents

Copper alloy material for electric and electronic apparatuses, and electric and electronic components

Info

Publication number
EP2270242A4
EP2270242A4 EP09728058A EP09728058A EP2270242A4 EP 2270242 A4 EP2270242 A4 EP 2270242A4 EP 09728058 A EP09728058 A EP 09728058A EP 09728058 A EP09728058 A EP 09728058A EP 2270242 A4 EP2270242 A4 EP 2270242A4
Authority
EP
European Patent Office
Prior art keywords
electric
copper alloy
alloy material
electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09728058A
Other languages
German (de)
French (fr)
Other versions
EP2270242A1 (en
EP2270242B1 (en
Inventor
Koji Sato
Kiyoshige Hirose
Hiroshi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2270242A1 publication Critical patent/EP2270242A1/en
Publication of EP2270242A4 publication Critical patent/EP2270242A4/en
Application granted granted Critical
Publication of EP2270242B1 publication Critical patent/EP2270242B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09728058.0A 2008-03-31 2009-03-30 Copper alloy material for electric or electronic apparatuses, method for producing it and component Not-in-force EP2270242B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008092315 2008-03-31
PCT/JP2009/056576 WO2009123159A1 (en) 2008-03-31 2009-03-30 Copper alloy material for electric and electronic apparatuses, and electric and electronic components

Publications (3)

Publication Number Publication Date
EP2270242A1 EP2270242A1 (en) 2011-01-05
EP2270242A4 true EP2270242A4 (en) 2012-06-27
EP2270242B1 EP2270242B1 (en) 2014-06-04

Family

ID=41135533

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09728058.0A Not-in-force EP2270242B1 (en) 2008-03-31 2009-03-30 Copper alloy material for electric or electronic apparatuses, method for producing it and component

Country Status (6)

Country Link
US (1) US20110017357A1 (en)
EP (1) EP2270242B1 (en)
JP (1) JP4653240B2 (en)
KR (1) KR101114116B1 (en)
CN (1) CN101981213B (en)
WO (1) WO2009123159A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102639732B (en) * 2009-12-02 2017-08-04 古河电气工业株式会社 copper alloy plate
US8821655B1 (en) 2010-12-02 2014-09-02 Fisk Alloy Inc. High strength, high conductivity copper alloys and electrical conductors made therefrom
JP5773929B2 (en) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance
CN103631050B (en) * 2012-08-20 2018-08-07 东莞市鸿显实业投资有限公司 LCD MODULE and LCD MODULE manufacturing method
US9560154B2 (en) * 2014-12-11 2017-01-31 Facebook, Inc. Systems and methods for providing information regarding future content
JP6385383B2 (en) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 Copper alloy sheet and method for producing copper alloy sheet
CN106011522A (en) * 2016-08-03 2016-10-12 苏州市虎丘区浒墅关弹簧厂 High elasticity copper alloy material for springs
KR102119552B1 (en) * 2016-12-02 2020-06-05 후루카와 덴키 고교 가부시키가이샤 Copper alloy wire and method for manufacturing copper alloy wire
JP7193941B2 (en) * 2018-07-26 2022-12-21 Koa株式会社 SHUNT RESISTOR AND CURRENT DETECTION DEVICE USING THE SAME

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP2143810A1 (en) * 2007-03-26 2010-01-13 The Furukawa Electric Co., Ltd. Copper alloy for electrical/electronic device and method for producing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4154100B2 (en) 1999-12-17 2008-09-24 日鉱金属株式会社 Copper alloy for electronic materials having excellent surface characteristics and method for producing the same
JP2004180161A (en) 2002-11-28 2004-06-24 Nippon Telegraph & Telephone East Corp Communication mode adjustment device, communication mode adjusting method, communication mode adjustment program, and recording medium with the program stored
JP4100629B2 (en) * 2004-04-16 2008-06-11 日鉱金属株式会社 High strength and high conductivity copper alloy
JP4959141B2 (en) 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 High strength copper alloy
JP4566048B2 (en) 2005-03-31 2010-10-20 株式会社神戸製鋼所 High-strength copper alloy sheet excellent in bending workability and manufacturing method thereof
JP5247021B2 (en) * 2005-11-28 2013-07-24 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-based alloy plate / strip with reduced wrinkles in the bent portion and method for producing the same
JP4986499B2 (en) * 2006-04-26 2012-07-25 Ｊｘ日鉱日石金属株式会社 Method for producing Cu-Ni-Si alloy tin plating strip
JP2008092315A (en) 2006-10-03 2008-04-17 Ricoh Co Ltd Remote management system of image forming apparatus
JP4357536B2 (en) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent strength and formability
CN101646792B (en) * 2007-03-30 2012-02-22 Jx日矿日石金属株式会社 Cu-Ni-Si-based alloy for electronic material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP2143810A1 (en) * 2007-03-26 2010-01-13 The Furukawa Electric Co., Ltd. Copper alloy for electrical/electronic device and method for producing the same

Also Published As

Publication number Publication date
WO2009123159A1 (en) 2009-10-08
EP2270242A1 (en) 2011-01-05
CN101981213B (en) 2012-11-14
EP2270242B1 (en) 2014-06-04
JPWO2009123159A1 (en) 2011-07-28
US20110017357A1 (en) 2011-01-27
CN101981213A (en) 2011-02-23
JP4653240B2 (en) 2011-03-16
KR20100132044A (en) 2010-12-16
KR101114116B1 (en) 2012-03-13

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