EP2257822A1 - Mikroelektromechanischer inertialsensor mit atmosphaerischer bedaempfung - Google Patents
Mikroelektromechanischer inertialsensor mit atmosphaerischer bedaempfungInfo
- Publication number
- EP2257822A1 EP2257822A1 EP09723766A EP09723766A EP2257822A1 EP 2257822 A1 EP2257822 A1 EP 2257822A1 EP 09723766 A EP09723766 A EP 09723766A EP 09723766 A EP09723766 A EP 09723766A EP 2257822 A1 EP2257822 A1 EP 2257822A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cavity
- inertial sensor
- housing
- detection unit
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/003—Details of instruments used for damping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/52—Plural diverse manufacturing apparatus
Definitions
- the present invention relates to an inertial sensor, preferably an acceleration sensor or multi-axis acceleration sensor as a microelectromechanical component.
- miniaturized and cost-effective components can be produced that are used, for example, as sensors or actuators in numerous fields of technology with different functions.
- miniaturized and cost-effective components can be produced that are used, for example, as sensors or actuators in numerous fields of technology with different functions.
- WLP wafer-level packaging
- Multi-sensor module is a sensor unit in which several individual sensor modules or units are accommodated in a common housing and which combines them in accordance with the various functions of the individual modules.
- the structures of a plurality of sensor or multisensor modules are formed by appropriate coating and etching processes on a substrate wafer.
- the functional units of a plurality of sensor or multi-sensor modules are then next to and / or above each other in a matrix-like manner with the interposition of corresponding separation sections.
- the substrate wafers are joined together with correspondingly manufactured cap wafers so that each (multi) sensor chip is firmly connected to a corresponding housing chip. Only after this wafer-level join does the unit consisting of substrate wafer and cap wafer then become single chips, i. isolated into the individual sensor or multi-sensor modules.
- the wafer-level package Due to the massively parallel operation, the wafer-level package has tremendous advantages in terms of cost, component integration density, and yield compared to a chip-level package.
- a major problem in the production of multi-sensor modules using the WLP is that different sensor systems to fulfill their respective function require individual working pressures and / or individual gas compositions, the partly differ considerably.
- Resonant systems for example, usually have a high quality, which is why they are operated at correspondingly low working pressures.
- Resonant yaw rate sensors are usually operated at a working pressure of a few ⁇ bar to a few mbar in order to avoid an undesirably high damping by the gas surrounding the sensor or its detection unit.
- Acceleration sensors which are based on the principle of action of the inertial mass, however, usually have to be strongly damped, so that here operating pressures are generally of some 100 mbar.
- the following table shows typical operating pressures for different microsystems, for example:
- the applicant of the present invention has developed a method for integrating a plurality of sensor units, which require different operating pressures and / or gas compositions, on a multi-sensor module, in which cavities with defined and optionally different gas pressures and / or gas compositions are formed in one operation within the WLP can.
- the assembly of substrate wafer and cap wafer takes place in a process chamber, which can be acted upon by a gas or gas mixture of appropriate composition and under appropriate pressure.
- the WLP initially sets the same gas composition at the same pressure in all cavities of the wafer unit. By using getter materials in selected cavities, the gas pressure and / or the gas composition of different cavities is formed differently.
- Wafer unit with the process technology described above about 200 mbar.
- this pressure is too low for a precise and reliable operation of acceleration sensors, damping of vibrations can only be ensured insufficiently.
- the object of the invention is to enable an inertial sensor, in particular a multi-sensor module, in which sensor units of lower quality, such as, for example, heavily damped acceleration sensors, with gas pressure and / or compositions which can be set in a wide range, especially low pressures, can be operated, preferably together with sensor units of high and highest quality, for example resonant yaw rate sensors, bolometers and / or RF switches, on a component.
- sensor units of lower quality such as, for example, heavily damped acceleration sensors
- gas pressure and / or compositions which can be set in a wide range, especially low pressures
- an inertial sensor preferably an acceleration sensor or multi-axis acceleration sensor as a microelectromechanical component, comprising a housing with at least a first gas-filled cavity, in which a first detection unit is movably arranged relative to the housing for detecting an acceleration to be detected, wherein the acceleration sensor a damping structure which damps a movement of the first detection unit in the housing at least in the measuring direction.
- the invention relates generally to an inertial sensor. It therefore includes acceleration sensors in the broadest sense and, for example, yaw rate sensors.
- a detection unit in the sense of the invention is a unit or structure that can be used to detect a variable to be measured.
- driven or non-driven mass units are active or passive structures that react to an acceleration to be detected, including gravitational acceleration, according to the principle of inertial mass or through the action of corrionic accelerations, which reaction is metrologically evaluated by evaluating a resulting change in position
- Mass unit can be detected to the housing or substrate.
- the detection unit is thus part of a sensor or a sensor itself.
- a multisensor module in the sense of the invention is to be understood as meaning a unit in which a plurality of individual sensors of any kind are arranged on a substrate and possibly accommodated in a common housing.
- the individual sensors can have different functions (eg acceleration sensor with active principle “inertial mass”, acceleration sensor with operating principle “Corriolis acceleration”, yaw rate sensors, actuators, resonators, displays, digital micromirrors, bolometers, RF switches, pressure or temperature sensor, resonant magnetic field sensors, Inclination sensors, etc.) and be arranged in a common cavity or in several different cavities.
- functions eg acceleration sensor with active principle “inertial mass”, acceleration sensor with operating principle “Corriolis acceleration”, yaw rate sensors, actuators, resonators, displays, digital micromirrors, bolometers, RF switches, pressure or temperature sensor, resonant magnetic field sensors, Inclination sensors, etc.
- the quality factor of the sensor having the first detection unit can be lowered to below 1, even at low cavity pressures of approximately 100 mbar to 200 mbar, which results in a
- Refill pressure of about 600 mbar to 1000 mbar corresponds.
- the residual filling pressure is the internal pressure in the closed cavity, for. B. set by argon filling before the closure of the cavity. Therefore, using the WLP, inertial sensors and, in particular, multi-sensor modules with a plurality of individual sensors can be realized, which can be set at a correspondingly low level
- Cavity pressure can be operated with a sufficiently strong damping, so that the sensor module comprising the first detection unit, even at low Kavticians committee. is insensitive to vibration, but does not lose its measurement sensitivity to the measured values (e.g., accelerations) to be detected.
- the damping structure can in principle be designed as desired. Their effectiveness can be limited to a movement axis (measuring axis). A damping in two or three spatial directions is also conceivable with a suitable design. It is essential that the damping unit eliminates or at least minimizes unwanted or undesirably strong relative movements between the first detection unit and the housing due to its damping effect. For this purpose, basically all known functional principles of damping are applicable.
- Detection unit surrounding medium usually a gas or gas mixture, forcibly passes through one or more bottlenecks in the presence of a damping movement of the first detection unit (squeeze film damping).
- the bottlenecks can be in be formed in any way.
- Conceivable are penetrations or projections or similar corresponding dimensions, which are provided in or on the first detection unit.
- the penetrations or protrusions may be provided on or in the housing or other units which are arranged in the vicinity of the first detection unit, so that a damping effect can be achieved.
- the damping structure is realized by at least portions of the first detection unit and the housing are arranged and formed such that an intermediate space between them is designed as constriction or narrowing and at least in the measuring direction during movement of the first detection unit is traversed by the present in the cavity gas / gas mixture.
- the amount of attenuation can be varied widely by the individual geometric configuration (s) of the constriction (s). As has been found particularly advantageous if the aforementioned sections of the first
- Detection unit and the housing are each comb-like with comb fingers and between these arranged spaces are formed.
- the comb fingers of the first detection unit engage in the intermediate spaces of the comb-like structure of the housing and vice versa.
- the damping effect can be defined directionally.
- a particular high damping results when the comb fingers transverse to the direction to be damped, e.g. the measuring direction, are arranged.
- the preferred dimensions of the bottlenecks depend on the particular design available. Preferably, the width of the bottlenecks is in a range of 0.4 to 5 microns.
- the inertial sensor has, in addition to the first gas-filled cavity, a second, preferably likewise gas-filled, cavity in which a second detection unit-and optionally further detection units-and a getter material are arranged. Due to the effect of the getter material, the pressure and / or the gas composition in the second cavity can be adjusted differently from the pressure and / or the gas composition in the first cavity. In this way it is possible to produce multi-sensor modules which have cavities with different gas compositions and / or different pressures. The pressures and gas compositions present in a gettered material cavity can be adjusted individually, for example to within the range of less than 0.1 ⁇ bar.
- the detection unit arranged in the second or further cavity may, for example, be part of an RF switch, a bolometer or a resonant sensor, such as a rotation rate sensor, or may form such structures.
- the invention makes it possible for the first time to produce sensors with such different quality factors using the WLP in the form of a multi-sensor module.
- the number of cavities of the sensor according to the invention can be arbitrarily increased, wherein the pressure and / or the gas composition in each cavity or in selected cavities is adjustable according to the individual sensors or detection units arranged there.
- the cavities are preferably hermetically sealed against each other and / or the environment.
- one or more cavities can be connected to the environment via a gas passage or the like, for example, when recording absolute pressure sensors.
- the first detection unit arranged in the first cavity may be both an active and a passive structure.
- An example of a passive structure is a mass unit acting as an inert mass which, due to its inertial mass, is subject to an acceleration to be detected relative to the mass
- An example of an active structure is a mass unit that is excited relative to the housing to move, for example in the form of a rotational vibration and can be detected by means of the detected position changes or accelerations on the effect of Coriolis accelerations.
- the housing of the inertial sensor according to the invention can in principle be of any desired design. In the framework of the WLP, it is done by joining a Substrate wafer with one or more lid or cap wafers, possibly with the interposition of bonding frame produced.
- the detection and functional units of the inertial sensor are usually arranged on the substrate wafer, although an arrangement on the cap wafer is likewise possible.
- the Gettermatehal used in connection with the inertial sensor according to the invention can basically be of any type.
- getters include metals or alloys such as Ba, Al, Ti, Zr, V, Fe, and the like, e.g. at
- NEGs NonEvaporable Getters
- the superficial oxide layer formed on the metal during the sintering step is removed.
- the activation is then completed by continuous heating of the entire surrounding structure or by resistance heating (with an ohmic heater).
- the getter material can be selected such that it can absorb the gas present in the cavity or, in the case of a gas mixture, one or more of its constituents so that the activation of the pressure present in the cavity and / or the gas composition can be adjusted. It may be particularly advantageous if the inertial sensor in different cavities different Gettermaterialien each having specific absorption properties or a getter with identical absorption properties, but in different amounts, has. In this way, the internal pressure and / or the gas composition in cavities of almost any number can be adjusted individually according to the respective requirements.
- the pressure in the second cavity can be adjusted to values between 0.1 ⁇ bar and 1 mbar, preferably between 0.1 ⁇ bar, by appropriate use of getter matehal and ⁇ , 1 mbar.
- detection units with correspondingly high quality can be operated in the second cavity, wherein detection units which require a correspondingly low quality, ie high pressure, can simultaneously be operated there by the inventive use of the damping structure within the first cavity.
- the invention further relates to a multiple component for producing an inertial sensor of the type described above.
- Under a multiple component according to the invention is to provide a unit, an element or a semi-finished, which is preferably prepared using the wafer-level packaging.
- the functional units of a plurality of sensors are arranged on a substrate wafer, which is then joined together with a correspondingly configured cap wafer, possibly with the interposition of a bonding frame.
- a large number of sensors are present in a matrix-like arrangement next to and / or above one another.
- the multiple component of this type is isolated by means of appropriate separation methods to the final sensor modules.
- Fig. 1 is a schematic sectional view parallel to the wafer plane through a part of a multi-sensor module
- Fig. 2 is a schematic sectional view of the multi-sensor module of Fig. 1 transverse to the wafer plane.
- a multi-sensor module 20 is shown. It has two individual sensor modules, namely a resonant yaw rate sensor 3 and an acceleration sensor 4, which require very different grades during operation.
- the resonant rotation rate sensor 3 is arranged in a first cavity 5, while the acceleration sensor 4 is arranged in a second cavity 6.
- the first cavity 5 and the second cavity 6 are formed in a housing 19, which consists essentially of a substrate 1 and a cap 2, which are hermetically sealed together with the interposition of a bonding frame 7.
- the resonant rotation rate sensor 3 is shown greatly simplified in FIG. It has a mass unit 25 which is connected to the substrate 1 by means of a suspension 26 in such a way that it is excited relative to the housing formed by substrate 1 and cap element 2 by means of unrepresented excitation electrodes for torsional vibrations about the excitation axis 27 indicated in FIG can be.
- the mass unit 25 forms the second detection unit of the acceleration sensor according to the invention in the terminology of the general description and the claims.
- the acceleration sensor 4 is shown in detail in FIG. 1 and has a mass unit 9. This forms the first in the terminology of the general description and the claims detection unit of the acceleration sensor described by way of example.
- the mass unit 9 acts as a sluggish mass and is used to detect accelerations in the direction transverse to the plane of the drawing of FIG. 2, indicated in FIG. 1 by a directional arrow 28 (measuring direction).
- the mass unit 9 becomes relative to through the action of acceleration components in the direction 28 the housing 19 formed from substrate 1 and cap member 2 moves, which can be detected by corresponding measuring electrodes 14,15.
- the bonding frame 7 encloses the sensor regions and cavities 5, 6 and seals them hermetically against each other and against the environment.
- the arrangement of the structures of the sensors 3, 4 and the recesses may of course also be different than shown in the figure.
- the sensors 3, 4 can be arranged in a depression of the substrate 1, while the cap element 2 is flat on the inside depending on the space required or has only slight depressions.
- the sensors 3, 4 may also be mounted in the cap member 2 as needed, so that the aforementioned variants would be realized in mirror image.
- the production of the illustrated multi-sensor module 20 takes place via a multiple component using the wafer-level packaging.
- the functional units of a plurality of multi-sensor modules 20, i. a corresponding number of resonant rotation rate sensors 3 and acceleration sensors 4 are arranged on a substrate wafer 1, which is then joined together with a correspondingly formed cap wafer 2 with the interposition of a bonding frame 7.
- a multiplicity of multi-sensor modules 20 according to FIG. 2 are present in a matrix-like arrangement next to and above one another.
- the resulting multiple component is then separated by means of appropriate separation process to the final multi-sensor modules 20.
- the multisensor modules 20 can also be produced individually from a substrate 1 (for example a base chip) carrying the resonant rotation rate sensor 3 and the acceleration sensor 4 and a corresponding cap wafer element 2 (eg cap chip) covering the two cavities 5, 6 and at the same time hermetically separating from each other ,
- a substrate 1 for example a base chip
- a cap wafer element 2 eg cap chip
- the WLP initially has the same gas pressure and the same gas composition in the two cavities 5, 6.
- An adjustment of the pressure and / or the gas composition in the first cavity 5 to a value suitable for the resonant yaw rate sensor 3 is achieved by the use of a getter material 8 arranged inside the cavity 5.
- the getter material 8 can be arranged in any shape, for example as a strip or surface, in the cavity 5, but it can also have a structured shape. Conveniently, it is on the cap side of the wafer or the like. Attached, for example, in the wells, provided that they are provided there. Alternatively, however, the getter material 8 can also be located on the substrate side, for example laterally of the sensors 3, 4 or even below, unless the corresponding surfaces are otherwise required.
- the gas atmosphere used in the manufacture of the multi-sensor module 20 is selected such that it has at least one type of gas, which differs from the
- Getter material 8 can be absorbed.
- the use of a clean gas is possible. Due to the absorption properties of getter matehal 8 in relation to this type of gas, after activation the first cavity 5 has a different internal pressure and / or different gas composition than the second cavity 6 in the first cavity 5 present internal pressure on a required to operate the resonant yaw rate sensor 3 value, for example, to 0.1 mbar lowered.
- the pressure present in the second cavity 6 and the gas composition present therein substantially correspond to the pressure and the gas composition during the assembly of the substrate 1 and the cap element 2.
- the acceleration sensor 4 is provided with a damping structure 16a, b, c, d.
- Their configuration is shown in greater detail in FIG. 1, which shows a schematic plan view of the acceleration sensor 4.
- the mass unit 9 is connected to the substrate 1 via suspension springs 10a, b and corresponding anchoring structures 11a, b.
- the Damping structure 16a, b, c, d the quality factor is lowered in the measuring direction 28 to values below 1, which corresponds to a pressure in the second cavity 6 of about 200 mbar a backfill pressure of about 600 mbar to 1000 mbar.
- the sensor 4 is thus insensitive to vibrations acting in the measuring direction 28, but does not lose its measuring sensitivity with respect to the accelerations to be detected in this measuring direction.
- the damping structure 16a, b, c, d consists essentially of a fixed damping comb 17a, b, c, d which is fixedly arranged on the substrate 1.
- the solid damping comb 17a, b, c, d cooperates with a counter-damping comb 18a, bc, d, which is realized by a corresponding shaping of the mass unit 9.
- the fixed damping comb 17a, b, c, d has comb-like outgoing from a central region 21 comb fingers 22, between which correspondingly dimensioned gaps 23 are formed. In this comb fingers 24 of the counter-damping comb 18a, b, c, d engage.
- the comb fingers 22,24 are oriented transversely to the measuring direction 28.
- the damping structure 16a, b, c, d functions in the manner of a piston-cylinder system.
- a movement of the mass unit 9 in the measuring direction 28 relative to the substrate 1 due to an external acceleration there is a shift of the fixed damping comb 17a, b, c, d against the counter-damping comb 18a, b, c, d in the measuring direction 28.
- This displacement comes it results in a displacement of the gas present in the intermediate spaces 23 between the damping chambers 17a, b, c, d, 18a, b, c, d.
- a movement of the mass unit 9 relative to the housing formed from substrate 1 and cap member 2 is detected by fixed measuring electrodes 14 and counter-measuring electrodes 15.
- the measuring electrodes 14 are firmly connected to the substrate 1, the counter-measuring electrodes to the mass unit 9.
- the acceleration sensor 4 shown in FIG. 2 has a fixed one
- Excitation electrode 12 and a corresponding counter electrode 13 By excitation via this arrangement, the mass unit 9 of the acceleration sensor 4 can be excited in the measuring direction 28.
- the purpose of this suggestion is to carry it out an electrical function test without mechanical excitation from the outside, which can be very helpful in wafer level inspection prior to capping and sawing.
- the solid damping comb 17a, b, c, d is connected via the substrate 1 to a definable or defined electrical potential. This serves the purpose of substantially avoiding charging effects that may occur due to the narrow spaces 23 and therefore to prevent uncontrolled sticking of the comb finger structures 22, 24 to each other.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102008016004A DE102008016004A1 (de) | 2008-03-27 | 2008-03-27 | Mikroelektromechanischer Inertialsensor mit atmosphärischer Bedämpfung |
PCT/EP2009/053541 WO2009118355A1 (de) | 2008-03-27 | 2009-03-25 | Mikroelektromechanischer inertialsensor mit atmosphaerischer bedaempfung |
Publications (1)
Publication Number | Publication Date |
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EP2257822A1 true EP2257822A1 (de) | 2010-12-08 |
Family
ID=40759725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP09723766A Ceased EP2257822A1 (de) | 2008-03-27 | 2009-03-25 | Mikroelektromechanischer inertialsensor mit atmosphaerischer bedaempfung |
Country Status (5)
Country | Link |
---|---|
US (1) | US8590376B2 (de) |
EP (1) | EP2257822A1 (de) |
DE (1) | DE102008016004A1 (de) |
TW (1) | TW200946915A (de) |
WO (1) | WO2009118355A1 (de) |
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FR3021645B1 (fr) | 2014-06-03 | 2019-06-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure d'encapsulation a plusieurs cavites munies de canaux d'acces de hauteurs differentes |
US9891244B2 (en) * | 2014-08-15 | 2018-02-13 | Nxp Usa, Inc. | Microelectronic packages having split gyroscope structures and methods for the fabrication thereof |
CA3004760A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
GB201514319D0 (en) | 2015-08-12 | 2015-09-23 | Atlantic Inertial Systems Ltd | Accelerometers |
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2008
- 2008-03-27 DE DE102008016004A patent/DE102008016004A1/de active Granted
-
2009
- 2009-03-25 TW TW098109698A patent/TW200946915A/zh unknown
- 2009-03-25 EP EP09723766A patent/EP2257822A1/de not_active Ceased
- 2009-03-25 US US12/934,783 patent/US8590376B2/en active Active
- 2009-03-25 WO PCT/EP2009/053541 patent/WO2009118355A1/de active Application Filing
Non-Patent Citations (1)
Title |
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See references of WO2009118355A1 * |
Also Published As
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TW200946915A (en) | 2009-11-16 |
US20110016972A1 (en) | 2011-01-27 |
US8590376B2 (en) | 2013-11-26 |
DE102008016004A1 (de) | 2009-10-08 |
WO2009118355A1 (de) | 2009-10-01 |
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