EP2247780B1 - Procédé de fabrication d'une sous-couche de revêtement de sol et sol dans lequelle est intégré au moins un composant électronique - Google Patents

Procédé de fabrication d'une sous-couche de revêtement de sol et sol dans lequelle est intégré au moins un composant électronique Download PDF

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Publication number
EP2247780B1
EP2247780B1 EP09713359.9A EP09713359A EP2247780B1 EP 2247780 B1 EP2247780 B1 EP 2247780B1 EP 09713359 A EP09713359 A EP 09713359A EP 2247780 B1 EP2247780 B1 EP 2247780B1
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EP
European Patent Office
Prior art keywords
layer
floor covering
sublayer
curable material
flooring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP09713359.9A
Other languages
German (de)
English (en)
Other versions
EP2247780A2 (fr
Inventor
Christl Lauterbach
Axel Steinhage
André BARTEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Future-Shape GmbH
Future Shape GmbH
Original Assignee
Future-Shape GmbH
Future Shape GmbH
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Filing date
Publication date
Application filed by Future-Shape GmbH, Future Shape GmbH filed Critical Future-Shape GmbH
Publication of EP2247780A2 publication Critical patent/EP2247780A2/fr
Application granted granted Critical
Publication of EP2247780B1 publication Critical patent/EP2247780B1/fr
Active legal-status Critical Current
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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/12—Flooring or floor layers made of masses in situ, e.g. seamless magnesite floors, terrazzo gypsum floors
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06N—WALL, FLOOR, OR LIKE COVERING MATERIALS, e.g. LINOLEUM, OILCLOTH, ARTIFICIAL LEATHER, ROOFING FELT, CONSISTING OF A FIBROUS WEB COATED WITH A LAYER OF MACROMOLECULAR MATERIAL; FLEXIBLE SHEET MATERIAL NOT OTHERWISE PROVIDED FOR
    • D06N7/00—Flexible sheet materials not otherwise provided for, e.g. textile threads, filaments, yarns or tow, glued on macromolecular material
    • D06N7/0063—Floor covering on textile basis comprising a fibrous top layer being coated at the back with at least one polymer layer, e.g. carpets, rugs, synthetic turf
    • D06N7/0089—Underlays
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/185—Underlayers in the form of studded or ribbed plates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]

Definitions

  • the invention relates to a method for producing a floor covering, a method for integrating at least one integrated radio tag in a floor and a floor with at least one integrated electronic component.
  • the robots or other moving objects to be located are equipped with a RFID tag reader.
  • the mapping information is made available to its local or central control unit.
  • the readers whenever they come with their reader antenna in the reception area of the antenna of a radio tag, read out its ID number and determine its exact location using the mapping information.
  • Examples of the localization and / or navigation by means of identification data carriers integrated in a floor are described for example in [1], [2] and [3], as well as in [4], which describes a wet wiping robot, and in [5], which describes a autonomously driving forklift describes.
  • radio tags into a floor has hitherto usually been carried out in such a way that the radio tags are introduced individually into the ground.
  • [6] describes the encapsulation of encapsulated RFID tags with holes in the ground. This process requires considerable effort in drilling the holes in the ground, placing the tags and sealing the holes, and then measuring and creating a mapping.
  • Floor elements which are placed on a screed via a putty may have on the bottom a recess in which RFID tags, e.g. at least one temperature sensor, as described in [7].
  • the recess can be milled, for example, in a wooden element.
  • radio tags with a cold adhesive layer are applied directly to the substrate (screed) below the floor covering for demonstration purposes.
  • the substrate must be as level as possible, which can be achieved for example by a leveling of the screed. Since a grid that is as exact as possible must be adhered to, a batter board must also be produced before the radio tags are applied.
  • elastic floor coverings eg carpet, PVC, rubber, linoleum
  • the mechanical stresses during use can lead to the failure of the radio tags in a short time.
  • the tile adhesive destroys the radio tags in many cases when laying.
  • a textile backing is described, e.g. a polyester fabric having a network of radio tags.
  • the textile fabric structure described in [10] has a coarse-meshed fabric which has microelectronic components and is composed of non-conductive and electrically conductive threads.
  • an electronic circuit e.g. a radio tag, in a first self-adhesive layer, which is deposited on a first carrier layer, e.g. Cardboard paper, is to be fixed and pressed.
  • the electronic circuit may be provided with a second self-adhesive layer on a second carrier layer, e.g. Cardboard paper to be covered.
  • An underlying problem of the invention is to integrate radio tags or general electronic components in a simple and cost-effective manner in a floor while reliably protecting the radio tags or the electronic components from possible stresses to which they are exposed in the ground.
  • the problem is solved by a method for producing a floor covering pad, a method for integrating at least one integrated radio tag into a floor and a floor with at least one integrated electronic component.
  • At least one integrated radio tag is embedded in a layer comprising at least one curable material.
  • a floor covering according to another embodiment comprises a layer comprising at least one curable material. Furthermore, the floor covering underlay has at least one electronic component, in particular an integrated radio label, which is embedded in the layer.
  • a curable material or curable material may, for example, be understood as meaning a material which essentially differs from a first state having a low viscosity (a state in which the material is moldable, eg, liquid, pourable, spreadable or spatulable) irreversibly can transition to a second state with a higher viscosity (For example, by means of heating or tempering), wherein the material in the second state is dimensionally stable or hard (hard). The transition may be referred to as curing the material.
  • the curable material of the layer may be processed in the first state and then converted to the second state (i.e., the layer may be cured).
  • the at least one electronic component can be introduced into the (not yet cured) layer and then embedded in it by hardening the layer firmly or without play.
  • the layer comprising the at least one curable material is also referred to below as a curable layer.
  • the at least one curable material comprises at least one of the following materials: a synthetic resin material (e.g., an epoxy resin or mixtures of epoxy resins), a dispersion adhesive material, a mineral primer material (e.g., concrete or cement). Alternatively, other suitable curable materials may be used.
  • a synthetic resin material e.g., an epoxy resin or mixtures of epoxy resins
  • a dispersion adhesive material e.g., a dispersion adhesive material
  • a mineral primer material e.g., concrete or cement
  • other suitable curable materials may be used.
  • an epoxy resin can be understood to mean a synthetic resin which consists of polymers which, depending on the reaction conditions, with the addition of suitable hardeners give a thermosetting plastic of high strength and chemical resistance. If epoxy resin and hardener are mixed, the curing of the originally liquid mixture usually takes place within a few minutes to a few hours, depending on the composition and temperature. In some cases, a longer period of time may pass until complete curing.
  • the thickness of the curable layer (for example the thickness of a synthetic resin layer) in which the electronic component, in particular the integrated radio tag, is embedded, is 0.2 mm to several centimeters, for example 0.2 mm to 2 cm, for example 2 mm.
  • the layer may have a different thickness.
  • the at least one integrated radio tag is applied on a first part-layer comprising a first curable material and / or at least partially introduced into the first part-layer, and a second part-layer comprising a second curable material is applied to the first part-layer applied first layer and the integrated radio tag, so that the layer is formed with the embedded therein at least one integrated radio tag.
  • the first curable material and the second curable material may be the same material.
  • the second curable material may be a different material than the first curable material.
  • the first sub-layer is also referred to below as the first curable sub-layer
  • the second sub-layer is also referred to below as the second curable sub-layer.
  • a first curable sub-layer can be provided, and the integrated radio tag is applied to the (not yet cured) first sub-layer and / or at least partially introduced therein.
  • a second curable sub-layer is applied to the first sub-layer and the integrated radio tag applied and / or incorporated therein, so that the component, in particular the integrated radio tag, is arranged or embedded between the two sub-layers.
  • the first sub-layer and the second sub-layer can subsequently be cured so that the integrated radio tag is firmly embedded (in other words, free of play) in the hardened sublayers.
  • the first curable material and / or the second curable material comprise at least one of the following materials: a synthetic resin material (eg, an epoxy resin or mixtures of epoxy resins), a dispersion adhesive material, a mineral primer material (eg, concrete or cement).
  • a synthetic resin material eg, an epoxy resin or mixtures of epoxy resins
  • a dispersion adhesive material e.g, a dispersion adhesive material
  • a mineral primer material eg, concrete or cement
  • other suitable curable materials may be used.
  • the at least one integrated radio tag is introduced into a backing layer and / or applied to the backing layer, and the integrated radio tag backing layer is embedded in the layer comprising the at least one curable material.
  • the introduction and / or application of the integrated radio tag in the base layer and / or on the backing layer can be carried out before embedding the backing layer in the layer.
  • a plurality of integrated radio tags are introduced into the backing layer and / or applied to the backing layer, for example in a regular grid.
  • the integrated radio tag can be arranged in a regular grid (eg a rectangular grid or a square grid) in and / or on the substrate layer.
  • the individual components, in particular the integrated radio tag may for example have a distance from one another of 10 cm to 1 m in the grid, for example 30 cm to 70 cm, for example 50 cm, according to one exemplary embodiment.
  • the components, in particular, the integrated radio tag have a different distance from one another.
  • the spacing of the components is variable.
  • the distance of the RFID tags in the pad layer may vary and be adapted, for example, to a spatial resolution desired in a localization / navigation, for example such that in a first subregion of the pad layer the RFID tags have a first distance from each other and in a second subregion of the substrate layer have a second distance from each other, wherein the second distance may be, for example, smaller than the first distance, so that in the second subarea localization / navigation with higher spatial resolution is enabled.
  • the base layer with the electronic components introduced therein or applied thereto, in particular integrated radio tags is applied to the first curable partial layer, and the second curable partial layer is applied to the base layer.
  • the backing layer has a permeable (in other words, a penetrable) structure.
  • the backing layer may comprise or consist of a permeable (penetrable) material.
  • a permeable or penetrable material may generally be understood as meaning a material which is at least partially permeable to another material or at least partially penetrated by the other material.
  • a permeable material can be understood as meaning a material which, for example, is suitable for the at least one curable material Material is at least partially permeable or at least partially can be penetrated by this.
  • the permeable material for the first curable material of the first curable sub-layer and / or the second curable material of the second curable sub-layer may be at least partially permeable or at least partially penetrated by the first and / or second curable material.
  • the permeable structure may be arranged such that when the substrate layer is applied to the first curable sublayer and / or when the second curable sublayer is applied to the substrate layer, the material of the first curable sublayer and / or the material of the second curable sublayer is at least partially can pass through the permeable structure of the backing layer so that the materials of the first and second curable sub-layers can come into contact with each other through the backing layer and thus a firm bond between the sub-layers can be achieved after curing of the two sub-layers.
  • the transmissive structure for another material may have permeable openings (also referred to as holes), the openings having a size (eg, diameter) of 1 mm to 50 mm , For example, 3 mm to 10 mm, for example, 5 mm.
  • the sizes of the openings may have a different value.
  • According to one embodiment may be as a permeable material, for example, mesh fabric made of glass fiber, carbon fiber, metal wire, polyester, polyethylene or stamped or perforated films, sheets or with openings provided paper. Alternatively, other materials may be used.
  • the backing layer has a mesh structure.
  • the backing layer may comprise or consist of a material having a mesh structure (for example, a mesh).
  • the mesh size of the mesh structure may be formed such that the mesh structure for the first curable material of the first curable sub-layer and / or the second curable material of the second curable sub-layer is at least partially permeable.
  • the mesh size can be designed so that when applying the backing layer on the first curable sub-layer and / or when applying the second curable sub-layer on the backing layer, the material of the first curable sub-layer and / or the material of the second curable sub-layer at least partially can pass through the mesh structure of the backing layer so that the materials of the first and second curable sub-layers can come into contact with each other through the backing layer and thus a firm bond between the layers can be achieved after the sub-layers have cured.
  • the mesh size is for example 1 mm to 50 mm, for example 3 mm to 10 mm, for example 5 mm.
  • the mesh size may have a different value.
  • the backing layer is a reinforcing fabric.
  • a reinforcement fabric can be understood as meaning a fabric or a fabric structure that is used for reinforcement (also referred to as reinforcement or reinforcement).
  • a reinforcing fabric for example, a higher tensile strength and / or compressive strength than the object to be reinforced or to be reinforced, and / or greater durability against other influences (eg environmental influences such as water, frost, chemicals, etc.).
  • the reinforcing fabric comprises at least one of the following materials: a glass fiber material, polyethylene, polypropylene, polyester, a carbon fiber material, a natural fiber material.
  • the reinforcing fabric may comprise or consist of one or more of the aforementioned materials.
  • the hardenable layer is applied to the substrate layer (e.g., the reinforcing mesh) with the electronic components applied thereto, in particular integrated radio tags.
  • the backing layer has a mesh structure or a permeable structure
  • the material of the curable layer eg, a synthetic resin layer
  • a layer eg, a substrate such as a screed
  • the pad layer can be firmly embedded (or play) in the curable layer.
  • At least one recess is formed in the base layer, and the at least one integrated radio tag is inserted into the at least one recess introduced.
  • the shape and size of the recess may be adapted to the electronic component to be incorporated therein, in particular the integrated radio tag.
  • the at least one recess is formed by one of the following methods: laser cutting, punching, cutting, milling. Alternatively, other suitable methods of forming the recess may be used.
  • the at least one integrated radio tag is encapsulated in an encapsulation layer (for example a plastic layer) prior to embedding in the curable layer.
  • the integrated radio tag is laminated with the encapsulation layer.
  • encapsulation also referred to as encapsulation
  • laminating for example, a height compensation between individual components of the integrated radio tag can be achieved.
  • the integrated radio tag can be protected by means of the encapsulation layer against mechanical and / or chemical influences and / or moisture.
  • the at least one integrated radio tag is encapsulated in the encapsulation layer prior to introduction into the substrate layer and / or application to the substrate layer.
  • the at least one integrated radio tag is bonded to the pad layer using the encapsulation layer.
  • the at least one electronic component is a radio identification data carrier (also referred to as radio tag), for example an RFID tag, for example a passive RFID tag.
  • the radio identification data carrier can have unique identification information (ID number), which can be read out, for example, by means of a suitable reading device which is brought to the radio identification data carrier or past it.
  • a floor covering pad is provided. Furthermore, a floor covering is applied to the floor covering.
  • a floor with at least one integrated electronic component has a floor covering and a floor covering, which is applied to the floor covering, on.
  • a backing layer for a floor covering according to another embodiment, is provided, wherein the backing layer has a permeable structure or a mesh structure. Furthermore, at least one electronic component in the Base layer introduced and / or applied to the backing layer.
  • a backing layer for a floor covering comprises at least one electronic component, which is introduced into the base layer and / or applied to the base layer, wherein the base layer has a permeable structure or a mesh structure.
  • the backing layer may be formed according to any of the embodiments described herein.
  • a pad layer 20 is provided.
  • Fig. 1A and Fig. 1B show a section of the base layer 20 in plan view ( Fig. 1A ) and in cross section ( Fig. 1B ).
  • the backing layer 20 comprises a reinforcing fabric 9 having a mesh structure.
  • the reinforcing fabric may comprise other materials such as polyethylene, polypropylene, polyester, carbon fibers, natural fibers or metal wires.
  • the glass fiber fabric 9 has first glass fibers 6 which are arranged in a first direction (for example in the weft direction) and second glass fibers 7 which are arranged in a second direction (according to the embodiment shown perpendicular to the first direction, for example in the warp direction). Furthermore, the glass fiber fabric 9 has a plurality of meshes 9a, which are formed between the glass fibers 6, 7.
  • the glass fiber fabric 9 of the base layer 20 may have, for example, a thickness of 0.1 mm to 5 mm, for example 0.2 mm to 1 mm, for example 0.45 mm according to one embodiment.
  • the mesh size of the glass fiber fabric 9 may be, for example, 1 mm to 50 mm, for example 3 mm to 10 mm, for example 5 mm according to an embodiment.
  • the glass fiber fabric 9 can be rolled goods.
  • recesses 8 are formed in the size of RFID tags 1 to be integrated in a regular grid.
  • Fig. 2A and Fig. 2B show the base layer 20 with a recess 8 formed therein as a plan view ( Fig. 2A ) and in cross section ( Fig. 2B ).
  • a plurality or a plurality of recesses 8 may be formed in the base layer 20.
  • the recesses 8 may be punched or lasered into the backing layer 20.
  • the recesses 8 may have a different cross-sectional shape (e.g., rectangular, round, oval, or any other shape) and / or size, for example, adapted to the shape and / or size of the tags to be integrated (generally, electronic components to be integrated).
  • radio tags 1 are introduced into the base layer 20.
  • FIGS. 3A and 3B show the base layer 20 with a (in other words integrated) radio tag 1 inserted therein as a plan view (FIG. Fig. 3A ) and in cross section ( Fig. 3B ).
  • a radio tag 1 inserted therein as a plan view (FIG. Fig. 3A ) and in cross section ( Fig. 3B ).
  • more RFID tags 1 may be incorporated in the pad layer 20 (not shown).
  • the radio tags 1 are encapsulated in an encapsulation layer 5 (in other words, laminated with the encapsulation layer 5) prior to introduction into the substrate layer 20.
  • the encapsulant layer 5 is a thermoplastic layer and the RFID tags 1 are laminated on both sides (i.e., top and bottom) with the thermoplastic resin layer 5.
  • FIGS. 5A and 5B show a laminated radio tag 1, in other words a radio tag 1 after the encapsulation, as a plan view ( Fig. 5A ) and in cross section ( Fig. 5B ), according to an embodiment.
  • the RFID tags 1 can be, for example, radio tags (eg passive RFID tags) for the 13.56 MHz standard, with the reading distance with a handheld antenna being, for example, 10 cm. In other words, the tags in this case can be up to a distance of 10 cm be read out. Alternatively, radio tags which are set up for a different frequency range or standard can be used.
  • the RFID tags 1 can have a unique identification information for the respective RFID tag 1 (eg ID number), which can be read out with a suitable reading device.
  • Each radio tag 1 can be, for example, an antenna 2 (for example an induction coil) formed on the upper side of the radio tag 1, a chip 3 (eg silicon chip) formed on the upper side of the radio tag 1 and coupled to the antenna 2 and one formed on the underside of the radio tag 1 have conductive bridge 4 (eg metal bridge) of the antenna 2, as in FIGS. 5A and 5B is shown.
  • antenna 2 for example an induction coil
  • chip 3 eg silicon chip
  • the radio tag 1 can be protected, for example, from pressure, moisture and chemical influences. Furthermore, by means of the lamination 5, a height compensation of the radio tag 1 can be achieved. In other words, the laminated RFID tag 1 has a flat top and a flat bottom.
  • the lamination 5 can for example be designed so that it is wider on one or more sides, for example on at least two opposite sides, than the RFID tag 1, for example 0.5 cm to 1 cm wider according to an embodiment.
  • the lamination 5 is designed such that it projects beyond all four edges of the radio tag 1.
  • the radio tags 1 can be adjusted to the respective recess 8 of the base layer 20 and under pressure and heat are pressed into the base layer 20.
  • the protruding edges of the plastic layer 5 connect firmly to the reinforcing fabric 9 and fix the radio tags 1, at the same time the height differences can be compensated.
  • the RFID tags 1 can be bonded to the backing layer 20 (for example, to the glass fiber fabric) using the plastic layer 5 (generally, the encapsulant layer 5).
  • Fig. 3A shows a radio tag 1 integrated into the reinforcing fabric 9 in plan view, Fig. 3B in cross section.
  • the formation of the recesses 8 in the base layer 20 may be dispensed with, for example if the material (for example the glass fiber fabric 9) of the base layer 20 has a very coarse mesh structure.
  • the recess (s) 8 can be dispensed with the recess (s) 8, if the mesh size of the fabric 9 is large enough that sensitive parts of the radio tags 1 and the wireless modules 1 (eg, the silicon chip 3 or the metal bridge 4 of the antenna coil 2) within a mesh 9a to come to rest.
  • the radio tags 1 can be applied to the base layer 20 (for example, the reinforcing mesh 9), for example glued to it according to an exemplary embodiment.
  • FIGS. 4A and 4B show a base layer 20 with a radio tag 1 integrated therein, wherein the formation of the base layer (s) in the fabric 9 has been dispensed with as described above and the radio tag 1 is applied to the fabric 9 so that the Chip 3 of the radio tag 1 within a mesh 9a of the fabric 9 is located.
  • FIGS. 4A and 4B show FIGS. 4A and 4B as a plan view or cross section, the integration of radio tags in a coarse-mesh fabric without cutout.
  • the radio tags 1 are shown on the Applied underside of the fabric 9. Alternatively, the radio tags 1 can also be applied to the top of the fabric 9.
  • a material having a permeable structure may be used for the backing layer, and the radio tag (s) (in general, the electronic components) may be incorporated into the permeable material / or applied to (not shown).
  • the production of the base layer 20 with the RFID tags 1 integrated therein according to one of the embodiments described above can be carried out, for example, on a machine which is suitable for roll-to-roll processing.
  • the RFID tags 1 after the insertion of the RFID tags 1 into the backing layer 20, these can be read out with readers integrated in the process flow and their function can be tested.
  • a mapping of the ID numbers of the radio tags 1 on the roll can be created.
  • the mapping can be delivered together with the roll and thus made available to a customer or installer.
  • manufacturer information in the radio tags 1 with.
  • a life-time monitoring of the pavement is possible, i. monitoring throughout the life of the pavement.
  • Fig. 6 1 schematically shows a functional test of radio tags 1 integrated in a base layer 20 with a simultaneous mapping of the radio tags 1 on the reel according to an exemplary embodiment.
  • the backing layer 20 has a glass fiber fabric 9 with incorporated therein and / or on it applied radio tags 1.
  • the glass fiber fabric 9 with the radio tags 1 is formed as a roll material which can be unrolled from a first roller 18 and rolled up on a second roller 19, wherein between the two rollers 18, 19 by means of a plurality of readers (in Fig.
  • a first reading device 21 and a second reading device 22 are shown; alternatively, a different number of reading devices can be used) and a control unit 23 coupled to the reading devices 21, 22 read out the radio tags 1, a mapping of the radio tags 1 is established, and a functional test of the radio tags 1 can be performed.
  • the mapping can for example be stored on a commercially available data carrier 24 or storage medium (eg CD-ROM, DVD-ROM, floppy disk, USB memory stick, etc.) and, for example, delivered together with the backing layer 20 to a customer.
  • each individual radio tag may also contain the mapping information of the entire reel.
  • the radio tags can be set up such that the memory of each radio tag is sufficiently large to store the mapping information.
  • the mapping can be created if all radio tags are already integrated in the reel.
  • Fig. 7A a method for producing a floor covering according to an embodiment described.
  • a base layer 20 having radio tags 1 incorporated therein is embedded in a layer 11 of a thermosetting resin material (for example, epoxy resin), so that a floor covering pad 25 is formed, as in FIG Fig. 7A is shown.
  • a thermosetting resin material for example, epoxy resin
  • a layer of one or more other curable materials e.g. a dispersion adhesive material or a mineral primer material.
  • the production of the base layer 20 with the RFID tags 1 introduced therein can be carried out in accordance with the method described in connection with FIG Fig. 1A to Fig. 3B described embodiment.
  • the base layer 20 may be formed with the RFID tags 1 (generally, electronic components) integrated therein according to another of the embodiments described herein.
  • the base layer 20 with the radio tags 1 is designed as a roll material or as a roll, for example in a similar manner as in FIG Fig. 6 shown schematically.
  • the embedding of the base layer 20 with the RFID tags 1 integrated therein into the synthetic resin layer 11 and thus the formation of the floor covering underlay 25 can take place, for example, in that the roll on site (ie where a floor covering is to be installed or laid) on a subfloor ( Screed) 10 is applied, glued to the bottom 10 with synthetic resin and simultaneously covered with it.
  • Fig. 7A shows the formed on the underbody 10 flooring pad 25.
  • the flooring pad 25 can be arranged on a different surface.
  • the embedding of the base layer 20 can be effected in that on the subfloor 10, a first part layer 11a made of synthetic resin (in general, from a first curable material) is applied (see Fig. 8A ) and the backing layer 20 on the first sub-layer 11a applied and / or at least partially introduced into the first sub-layer 11a (see Fig. 8B ). Thereafter, a second sub-layer 11b of synthetic resin (generally, of a second curable material which may or may not be the same as the first curable material) may be applied to the first sub-layer 11a and the sub-layer 20 (see FIG Fig. 8C ).
  • the first sub-layer 11a and the second sub-layer 11b are applied in a not yet cured state. If the base layer 20 has a mesh structure or a permeable structure, the material of the first partial layer 11a can at least partially come into contact with the material of the second partial layer 11b, and a subsequent hardening of the two partial layers 11a, 11b results in a strong and robust one Connecting the first sub-layer 11a to the second sub-layer 11b, wherein the sub-layer 20 is embedded with the RFID tags 1 in the layer 11 formed from the two sub-layers 11a, 11b. Furthermore, a firm connection of the first part-layer 11a to the underbody 10 results.
  • the backing layer 20 may be introduced (eg, embedded) into the first sub-layer 11a applied to the subfloor 10 and not yet cured, and the sub-layer 11a with the (eg embedded) sublayer 20 incorporated therein may subsequently be cured to provide the sublayer 11a Stick sublayer 11 a to the subfloor 10.
  • the second partial layer 11b can be applied to the first partial layer 11a.
  • the embedding of the substrate layer 20 in the resin layer 11 can be effected by the pad layer 20 is applied to the subfloor 10 (see Fig. 9A ) and then the resin layer 11 the backing layer 20 is applied (see Fig. 9B ).
  • the material of the resin layer 11 may at least partially pass through the mesh / openings of the mesh / permeable structure and contact the subfloor 10, such that upon subsequent curing of the resin layer 11 results in a firm and robust connection of the synthetic resin layer 11 with the subfloor 10, at the same time the base layer 20 with the RFID tags 1 is firmly (or backlash-free) embedded in the cured resin layer 11.
  • a substrate preparation by means of grinding and / or milling and / or shot peening and / or suction may be carried out prior to the application of the first sub-layer 11a or the layer 11 (eg a synthetic resin layer) in order to improve the composite of the first sub-layer 11a or Layer 11 to the substrate 10 produce.
  • the first sub-layer 11a or the layer 11 eg a synthetic resin layer
  • any gross unevenness, cracks and voids in the substrate 10 can be remedied.
  • the substrate 10 may be provided with a primer, for example a synthetic resin (eg epoxy resin) or other suitable primer to remove the absorbency and the pores in the substrate 10 close. Subsequently, the backing layer 20 as described above firmly bonded to the substrate 10.
  • a primer for example a synthetic resin (eg epoxy resin) or other suitable primer to remove the absorbency and the pores in the substrate 10 close.
  • a substrate is provided for all common floor coverings, such as stone, tiles, carpet, parquet, laminate and elastic coverings with the exception of metal.
  • the floor 50 illustratively comprises a subfloor 10 (screed) and a floor covering 12, as well as a floor covering 25 disposed between the subfloor 10 and the floor covering 12 which has a base layer 20 embedded in a curable layer 11 with radio tags 1 integrated therein, for example a fiberglass fabric embedded in synthetic resin with integrated radio tags.
  • Fig. 10A a method for producing a floor covering according to another embodiment described.
  • the procedure is different from that associated with Fig. 7A Essentially, the method described is essentially that, when the radio tags 1 are embedded in the synthetic resin layer 11 (generally in a curable layer), a backing layer is dispensed with.
  • the previously laminated radio tags 1 (generally the electronic components) according to this embodiment are embedded directly in synthetic resin 11, so that the in Fig. 10A shown flooring pad 25 is obtained.
  • This configuration can be used for example in small areas or strip-like introduction of the radio tags 1 in the floor covering or in the floor covering pad 25.
  • the radio tags 1 can be laid by hand and coated with the synthetic resin layer 11.
  • a mapping and / or a functional test of the radio tags 1 can take place, for example, by reading each radio tag 1 after installation by hand and measuring it in its surroundings.
  • the floor covering pad 25 can For example, be formed on a subfloor 10 (screed), as in Fig. 10A is shown.
  • any flooring 12 may be applied to the flooring pad 25 so that once again a floor 50 having radio tags 1 integrated therein is obtained, as in FIG Fig. 10B is shown.
  • a method which enables the introduction of electronic components (eg RFID tags) in a ground in a simple and cost-effective manner, at the same time the electronic components (eg the radio tags) reliably against high loads to which they be exposed to soil (eg pressure, moisture, chemicals).
  • electronic components eg RFID tags
  • high loads eg pressure, moisture, chemicals
  • a method is provided by which a high quality flooring for a floor can be made, or a floor covering (underlayer) that allows the most free choice of the overlying visible floor covering.
  • RFID tags radio tags
  • electronic components in particular radio tags (RFID tags)
  • RFID tags can be integrated in or under any floor covering, whereby, for example, on any surface a location determination is made possible to movable objects with and without human To locate companions and / or robots of all types and / or vehicles and / or persons and to open the possibility of navigation via a central or local control.
  • radio tags can be rationally integrated in a regular grid in a backing layer, placed under all common floor coverings - with the exception of metal - and (for example with synthetic resin) can be encapsulated so that they are protected from pressure, Moisture and chemicals are protected.
  • a mapping can be created when integrating the RFID tags into the backing layer, which eliminates the need for time-consuming individual mapping during on-site installation.
  • the laminated RFID tags can be embedded directly in the resin, for example, if only small quantities or individual tracks of radio tags to be laid. In this case, a manual reading and calibration of the radio tags can be carried out to produce the mapping information on site.
  • a method in which one or more radio tags (generally, one or more electronic components) are placed in a backing layer (eg, in a regular grid) which is used as a backing layer in a carpeting, linoleum, PVC flooring pad other conceivable sheet goods, tiles, stone floors, concrete floors, terrazzo or a synthetic resin coating is suitable.
  • a backing layer eg, in a regular grid
  • PVC flooring pad other conceivable sheet goods, tiles, stone floors, concrete floors, terrazzo or a synthetic resin coating is suitable.
  • the backing layer is rolled or larger sheets.
  • a base layer are, for example, reinforcement fabric made of glass fiber, polyethylene, polypropylene, polyester, carbon fiber or natural fibers.
  • the radio tags (in general the electronic components or electronic modules) are introduced into this base layer (for example in a regular grid).
  • a recess in the base layer is produced for this purpose in the size of the radio tag in order to achieve height compensation between the module and the base layer.
  • the recess can be produced, for example, by lasering, stamping, cutting, milling or other suitable method.
  • the recess can be dispensed with according to another exemplary embodiment.
  • the insertion of the RFID tags can be done so that sensitive areas of the RFID tags such. a silicon chip comes to lie within the mesh of the fabric.
  • the radio tag can be encapsulated on both sides with an encapsulation layer (for example a thermoplastic layer) in order to achieve height compensation on the RFID tag (between individual components of the radio tag, eg silicon chip, inlay, tracks, etc.) and for protection to ensure against mechanical and chemical influences as well as moisture during installation.
  • an encapsulation layer for example a thermoplastic layer
  • the encapsulation layer is chosen to be somewhat larger than the radio tag and can thereby also be used according to another embodiment for gluing the radio tag into the pad layer.
  • the radio tag is glued into the backing layer under pressure and heat.
  • the ID number of each RFID tag is read and thus realizes a functional test.
  • the ID numbers are simultaneously stored with a corresponding software. In this way, a mapping of the roll material can be obtained.
  • a reel can be supplied with this information (e.g., to a customer) so that after installation it is sufficient to read only the beginning and end of a web, for example, to quickly determine the physical location of the individual tags in the room.
  • the installation of the backing layer is accomplished by embedding in a curable layer, e.g. a synthetic resin layer (for example, an epoxy resin layer) having, for example, a slightly larger thickness than the base layer.
  • a curable layer e.g. a synthetic resin layer (for example, an epoxy resin layer) having, for example, a slightly larger thickness than the base layer.
  • the respective substrate for example, concretes and screeds of all kinds, in exceptional cases also tiles, stones of all kinds, artificial stones of all kinds, coatings
  • Substrate preparation by means of grinding, milling, shot peening and suction can be carried out in order to produce an improved or optimum bond to the substrate. Any rough bumps, cracks and voids can be removed or rehabilitated beforehand.
  • the respective substrate can be provided, for example, first by means of synthetic resin / epoxy resin or another suitable primer in order to remove the absorbency and to close the pores in the substrate.
  • the tissue can then firmly bonded to the substrate by means of synthetic resin / epoxy resin or another suitable material.
  • the coverage of the fabric (e.g., a reinforcement fabric) and / or the radio tag with the curable layer (eg, the resin layer) may be 0.1 mm to 10 mm, for example 0.5 mm to 4 mm, for example, greater than or equal to 2 mm.
  • a floor covering (floor covering) of a floor may, according to one embodiment, be glued to the fabric with materials corresponding to the material in which the fabric is embedded.
  • the range of RFID tags is usually large enough to allow any other type of floor to be built on the floor, with the exception of metal floors, as these would shield the electromagnetic waves of a reader.
  • the thickness of this layer can be minimized.
  • the thickness of the synthetic resin layer in this case may be 0.1 mm to 2 mm, for example 1 mm.
  • the synthetic resin layer may have a different thickness.
  • the backing layer can be completely dispensed with (eg, if only very small areas or individual radio tags are to be laid), and the, for example, encapsulated with a plastic layer, radio tags can be embedded directly in the resin layer.
  • mapping can be done, for example, by reading each tag individually and measuring and mapping its position in space.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Floor Finish (AREA)

Claims (14)

  1. Procédé de fabrication d'un substrat de revêtement de sol, dans lequel :
    • au moins une étiquette d'identification par radiofréquence intégrée est incorporée dans une couche comprenant au moins un matériau durcissable ;
    • l'étiquette ou les étiquettes d'identification par radiofréquence intégrées sont noyées dans une sous-couche et/ou appliquées sur une sous-couche ;
    • la sous-couche avec l'étiquette d'identification par radiofréquence intégrée est incorporée dans la couche comprenant au moins un matériau durcissable ;
    • la sous-couche est une structure perméable pour le ou les matériaux durcissables, ou comprend une structure à mailles, ou est un treillis d'armature ;
    • le ou les matériaux durcissables sont durcis.
  2. Procédé selon la revendication 1,
    dans lequel le ou les matériaux durcissables comprennent au moins un des matériaux suivants :
    • une résine synthétique ;
    • une colle à dispersion ;
    • un matériau d'apprêt minéral ;
    • un mélange des matériaux susmentionnés.
  3. Procédé selon la revendication 1 ou 2, dans lequel :
    • l'étiquette ou les étiquettes d'identification par radiofréquence intégrées sont appliquées sur une première couche partielle comprenant un premier matériau durcissable et/ou au moins partiellement noyées dans la première couche partielle ;
    • une deuxième couche partielle comprenant un deuxième matériau durcissable est appliquée sur la première couche partielle et l'étiquette d'identification par radiofréquence intégrée, de manière à former la couche avec l'étiquette ou les étiquettes d'identification par radiofréquence intégrées qui y sont incorporées.
  4. Procédé selon l'une des revendications 1 à 3,
    dans lequel le treillis d'armature comprend au moins un des matériaux suivants :
    • des fibres de verre ;
    • un polyéthylène ;
    • un polypropylène ;
    • un polyester ;
    • des fibres de carbone ;
    • des fibres naturelles ;
    • des fils métalliques.
  5. Procédé selon l'une des revendications 1 à 4,
    dans lequel au moins un évidement est ménagé dans la sous-couche et dans lequel l'étiquette ou les étiquettes d'identification par radiofréquence intégrées sont mises en place dans l'évidement ou les évidements.
  6. Procédé selon la revendication 5,
    dans lequel l'évidement ou les évidements sont formés au moyen d'un des procédés suivants :
    • découpe par laser ;
    • poinçonnage ;
    • découpe par outil de coupe ;
    • fraisage.
  7. Procédé d'intégration d'au moins une étiquette d'identification par radiofréquence intégrée dans un plancher, dans lequel :
    • un substrat de revêtement de sol est réalisé au moyen d'un procédé selon l'une des revendications 1 à 6 ;
    • un revêtement de sol est appliqué sur le substrat de revêtement de sol.
  8. Plancher, comprenant :
    un substrat de revêtement de sol, lequel comporte :
    • une couche comprenant au moins un matériau durci ;
    • au moins un composant électronique incorporé dans la couche ;
    • une sous-couche ;
    • le ou les composants électroniques étant noyés dans la sous-couche et/ou appliqués sur la sous-couche ;
    • la sous-couche avec le composant électronique étant incorporée dans la couche ; et
    • la sous-couche comprenant une structure perméable pour le ou les matériaux durcis avant leur durcissement, ou une structure à mailles, ou la sous-couche étant un treillis d'armature ; et
    un revêtement de sol appliqué sur le substrat de revêtement de sol.
  9. Plancher selon la revendication 8,
    dans lequel le ou les matériaux durcissables comprennent un des matériaux suivants :
    • une résine synthétique ;
    • une colle à dispersion ;
    • un matériau d'apprêt minéral ;
    • un mélange des matériaux susmentionnés.
  10. Plancher selon la revendication 8 ou 9, dans lequel :
    • la couche comprend une première couche partielle et une deuxième couche partielle ;
    • la première couche partielle comprend un premier matériau durcissable ;
    • la deuxième couche partielle comprend un deuxième matériau durcissable ;
    • le ou les composants électroniques sont appliqués sur la première couche partielle et/ou au moins partiellement noyés dans la première couche partielle ;
    • la deuxième couche partielle est appliquée sur la première couche partielle et le composant électronique.
  11. Plancher selon la revendication 10,
    dans lequel le premier matériau durcissable et/ou le deuxième matériau durcissable comprennent au moins un des matériaux suivants :
    • une résine synthétique ;
    • une colle à dispersion ;
    • un matériau d'apprêt minéral ;
    • un mélange des matériaux susmentionnés.
  12. Plancher selon l'une des revendications 8 à 11,
    dans lequel au moins un évidement est ménagé dans la sous-couche et où le ou les composants électroniques sont mis en place dans l'évidement ou les évidements.
  13. Plancher selon l'une des revendications 8 à 12,
    dans lequel le ou les composants électroniques sont encapsulés dans une couche d'encapsulation.
  14. Plancher selon l'une des revendications 8 à 13,
    dans lequel le ou les composants électroniques sont des supports de données d'identification.
EP09713359.9A 2008-02-22 2009-02-20 Procédé de fabrication d'une sous-couche de revêtement de sol et sol dans lequelle est intégré au moins un composant électronique Active EP2247780B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810010530 DE102008010530A1 (de) 2008-02-22 2008-02-22 Verfahren zum Herstellen einer Bodenbelagunterlage und Verfahren zum Herstellen einer Unterlageschicht für eine Bodenbelagunterlage mit mindestens einem darin integrierten elektronischen Bauelement
PCT/EP2009/052072 WO2009103806A2 (fr) 2008-02-22 2009-02-20 Procédé de fabrication d'une sous-couche de revêtement de sol et procédé de fabrication d'une couche pour une sous-couche de revêtement de sol dans laquelle est intégré au moins un composant électronique

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EP2247780A2 EP2247780A2 (fr) 2010-11-10
EP2247780B1 true EP2247780B1 (fr) 2015-09-16

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EP (1) EP2247780B1 (fr)
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WO2009103806A3 (fr) 2010-02-18
US20110027520A1 (en) 2011-02-03
DE102008010530A1 (de) 2009-08-27
EP2247780A2 (fr) 2010-11-10

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