EP2235491A1 - Mikromechanischer drucksensor - Google Patents
Mikromechanischer drucksensorInfo
- Publication number
- EP2235491A1 EP2235491A1 EP08869465A EP08869465A EP2235491A1 EP 2235491 A1 EP2235491 A1 EP 2235491A1 EP 08869465 A EP08869465 A EP 08869465A EP 08869465 A EP08869465 A EP 08869465A EP 2235491 A1 EP2235491 A1 EP 2235491A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- membrane
- pressure sensor
- reinforcements
- frame
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
- G01L9/0025—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element with acoustic surface waves
Definitions
- the invention relates to a micromechanical pressure sensor with a substrate and a membrane, on which piezoelectric sensor elements are located.
- the invention can preferably be used for pressure measurements with frequently changing loads.
- JP 61-82130 for example, a pressure sensor device is described, which detects pressure fluctuations of a gas or a liquid and converts it into electrical signals.
- a device is used which detects fluctuations in the applied pressure as changes in the oscillation frequency of a sensor part.
- DE 11 2004 002 281 T5 specifies an arrangement for pressure measurement, in which a sensor substrate contains on its lower surface a surface acoustic wave element for detecting pressure, which is fastened on a carrier substrate.
- the surface acoustic wave element is hermetically sealed in the sealed space for pressure detection.
- the invention has for its object to provide a pressure sensor of the type mentioned, which has small dimensions and are largely avoided in the Torsionsbe screw.
- the invention also relates to combinations of features in which the individual features specified in the description and / or in the claims are combined with one another as desired.
- the pressure sensor has a substrate with a frame on which the membrane is arranged. At the bottom of the membrane is a centrally located mass element. This allows small dimensions of the arrangement.
- the strip-shaped sections of the membrane, which are located between frame and mass element, are each provided with two partial reinforcements. This achieves both a high level of safety against torsional stresses and also reduces nonlinearities of the pressure-deflection dependence.
- the piezoelectric sensors are located in the reinforcements.
- An advantageous embodiment provides that the reinforcements are mounted symmetrically in each case to the right and left of the middle of the strip-shaped sections.
- the strip-shaped reinforcements are arranged at the corners of the mass element.
- a further advantageous embodiment results from the fact that the piezoelectric zones in the membrane are connected to a Wheatstone measuring bridge, with which the pressure-dependent deflection of the membrane is detected.
- the double arrangement of the stiffeners allows the piezoelectric zones in the membrane to be connected to two Wheatstone bridges. This can also be compensated for temperature differences in the measurement.
- FIG. 1 shows a perspective view of a detail of an arrangement with eccentric reinforcement of the membrane
- FIG. 2 shows a perspective view of a detail of an arrangement with reinforcement of the membrane at the corners
- Figure 3 is a schematic representation of a measuring bridge circuit.
- the arrangement shown in Figure 1 consists of a substrate which includes a rectangular frame 1, on the upper side of a membrane 2 is arranged. At the bottom of the membrane 2 is a centrally disposed mass element 3 with a rectangular cross-section.
- the membrane 2 is provided with piezoelectric sensor elements. These are diffused in the edge region of the membrane 2 in this.
- the strip-shaped sections of the membrane 2, which are located between the frame and mass element 3, are provided with two partial reinforcements 2.1 and 2.2. These reinforcements 2.1, 2.5 or 2.2 and 2.6 or 2.3 and 2.7 or 2.4 and 2.8 are mounted symmetrically to the right and left of the middle of the strip-shaped sections.
- a measuring bridge circuit is shown schematically.
- Each of the eight reinforcements 2.1 ... 2.8 contains piezoelectric sensor elements.
- a piezoelectric sensor element of a reinforcement 2.1, 2.2, 2.3 and 2.4 located in a strip forms a resistance element of a measuring bridge.
- a second measuring bridge can be formed from the piezoelectric sensor elements located in the gains 2.5, 2.6, 2.7 and 2.8.
- Both Measuring bridges each contain a resistance element which is assigned to one of the four strip-shaped membrane sections.
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008003716A DE102008003716A1 (de) | 2008-01-09 | 2008-01-09 | Mikromechanischer Drucksensor |
PCT/EP2008/068146 WO2009087055A1 (de) | 2008-01-09 | 2008-12-22 | Mikromechanischer drucksensor |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2235491A1 true EP2235491A1 (de) | 2010-10-06 |
Family
ID=40490591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08869465A Withdrawn EP2235491A1 (de) | 2008-01-09 | 2008-12-22 | Mikromechanischer drucksensor |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2235491A1 (de) |
DE (1) | DE102008003716A1 (de) |
WO (1) | WO2009087055A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2552824B1 (de) * | 2010-03-26 | 2014-05-21 | ELMOS Semiconductor AG | Mikroelektromechanische vorrichtung und ihre verwendung |
DE102011077499A1 (de) * | 2011-06-14 | 2012-12-20 | CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH | Interferometrische Druckmesszelle |
AT520304B1 (de) * | 2018-03-21 | 2019-03-15 | Piezocryst Advanced Sensorics | Drucksensor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4021424A1 (de) * | 1989-07-11 | 1991-01-24 | Teltov Geraete Regler | Drucksensor fuer kleine druecke |
US5068203A (en) * | 1990-09-04 | 1991-11-26 | Delco Electronics Corporation | Method for forming thin silicon membrane or beam |
US6255728B1 (en) * | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
WO2007073994A1 (de) * | 2005-12-22 | 2007-07-05 | Robert Bosch Gmbh | Mikromechanisches sensorelement |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5780532A (en) * | 1980-11-07 | 1982-05-20 | Hitachi Ltd | Semiconductor load converter |
JPS6182130A (ja) | 1984-09-28 | 1986-04-25 | Shimadzu Corp | 表面弾性波圧力センサ |
DD267107A1 (de) * | 1987-12-23 | 1989-04-19 | Teltov Geraete Regler | Drucksensor fuer kleine nenndruecke |
JP4099504B2 (ja) | 2003-11-27 | 2008-06-11 | 京セラ株式会社 | 圧力センサ装置 |
-
2008
- 2008-01-09 DE DE102008003716A patent/DE102008003716A1/de not_active Ceased
- 2008-12-22 WO PCT/EP2008/068146 patent/WO2009087055A1/de active Application Filing
- 2008-12-22 EP EP08869465A patent/EP2235491A1/de not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4021424A1 (de) * | 1989-07-11 | 1991-01-24 | Teltov Geraete Regler | Drucksensor fuer kleine druecke |
US5068203A (en) * | 1990-09-04 | 1991-11-26 | Delco Electronics Corporation | Method for forming thin silicon membrane or beam |
US6255728B1 (en) * | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
WO2007073994A1 (de) * | 2005-12-22 | 2007-07-05 | Robert Bosch Gmbh | Mikromechanisches sensorelement |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009087055A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009087055A1 (de) | 2009-07-16 |
DE102008003716A1 (de) | 2009-07-30 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20100702 |
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AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
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DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20110907 |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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INTG | Intention to grant announced |
Effective date: 20150728 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20151208 |