EP1950834B1 - Module sans fil comprenant une antenne à fentes intégrée - Google Patents

Module sans fil comprenant une antenne à fentes intégrée Download PDF

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Publication number
EP1950834B1
EP1950834B1 EP20070001518 EP07001518A EP1950834B1 EP 1950834 B1 EP1950834 B1 EP 1950834B1 EP 20070001518 EP20070001518 EP 20070001518 EP 07001518 A EP07001518 A EP 07001518A EP 1950834 B1 EP1950834 B1 EP 1950834B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
wireless radio
frequency module
slot antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP20070001518
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German (de)
English (en)
Other versions
EP1950834A1 (fr
Inventor
Peter Schoss
Axel Schaab
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to EP20070001518 priority Critical patent/EP1950834B1/fr
Publication of EP1950834A1 publication Critical patent/EP1950834A1/fr
Application granted granted Critical
Publication of EP1950834B1 publication Critical patent/EP1950834B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Definitions

  • the present invention relates in general to the field of wireless radio-frequency (RF) modules, and in particular to wireless RF modules used in communication devices. More particular, the present invention relates to a wireless RF module having a grounded or non-grounded metal case, such as a RF circuit module provided with a metal shielding or metal casing on top, in combination with a slot antenna formed at said metal casing.
  • a wireless RF module in combination with said slot antenna can be adapted for use in wireless communication apparatuses such as mobile phones or Bluetooth devices.
  • the size of such apparatuses can be reduced, and the antenna characteristics thereof can be improved.
  • a wireless RF module which is provided with a metal shielding or metal casing.
  • the wireless radio-frequency circuit (RF circuit) of the wireless RF module provided on a printed circuit board (PCB) of the RF module and the antenna are separate components which are usually miniaturized separately from each other.
  • PCB printed circuit board
  • a notch portion is formed in a shield case formed of conductive material that covers a radio-frequency wireless communication circuit provided on a printed wiring board so as to house the radio-frequency wireless communication circuit within the shield case.
  • the slot is formed as a trench that is soldered on its walls to the printed circuit board (PCB) of the component.
  • PCB printed circuit board
  • WO 02/095869 A1 and US 2005/0237251 A1 both relate to radio-frequency communication devices provided with different slot antenna arrangements.
  • these documents have their focus on varying resonant frequencies and bandwidth but do not disclose any teachings with respect to the miniaturization of RF modules and the coupling between a slot antenna and the related RF circuit.
  • a slot antenna apparatus comprises a circuit substrate having a high-frequency circuit arranged therein and a shield case for accommodating the circuit substrate.
  • a cross-shaped slot and a feeding pin are formed in an upper plate of the shield case.
  • the cross-shaped slot is composed of a first slot and a second slot. The length of the first slot is different from that of the second slot by a predetermined size and the first and second slot are perpendicular to each other.
  • the shortest distance from the feeding pin to the first slot is approximately equal to the shortest distance from the feeding pin 15 to the second slot 14b.
  • US 6424309 B1 relates to a broadband compact antenna comprises an electric dipole or monopole coupled or connected in parallel to a slot antenna.
  • the slot antenna is composed of a flat, square or rectangular conducting sheet with a slot having a variety of possible shapes including a bow-tie or rectangle.
  • the slot is then fed at the center by a coaxial transmission line with its outer conductor bonded to the sheet.
  • a dipole or monopole formed using either wire, flat strips or shapes formed in sheets of metal, is located in close proximity to the center of the slot.
  • EP 1418642 A2 provides a wireless communication apparatus that allows miniaturization of the wireless communication apparatus as a whole and improvement of characteristics of an antenna device.
  • a notch portion is formed in a shield case formed of a conductive material that covers a radio-frequency wireless communication circuit provided on a printed wiring board so as to house the radio-frequency wireless communication circuit within the shield case.
  • the shield case is operated as a slot antenna.
  • the shield case blocks undesired electromagnetic wavers emitted from the radio-frequency wireless communication circuit.
  • the present invention comprises two main ideas:
  • Figure 1 shows an exploded and perspective view from above of a wireless RF module 100 according to a first embodiment of the present invention
  • Figure 2 shows a perspective view from above of the wireless RF module 100 of Figure 1 after assembly thereof.
  • the wireless RF module 100 includes a conductive or metal casing 101 and a RF circuit module formed by a printed circuit board 102 comprising several electronic components 103a - 103c (see Figure 1 ) of an electronic RF circuit (for example a transceiver circuit), and other electronic means as required for a wireless communication device.
  • the metal casing 101 is adapted to be attached to the printed circuit board 102. Details of different attachment configurations and attachment methods are explained below with reference to the present and alternative embodiments of the present invention.
  • Figure 3 shows a top view of a metal sheet 150 prior to forming the metal casing 101 for the wireless RF module 100 of Figures 1 and 2 .
  • the metal sheet 150 formed by punching of a metal plate for example, comprises a rectangular main surface 151, left and right side walls 154, 155, and upper and lower side walls 156, 157 which can be bent downwards along the connection lines C, preferably with an angle of 90°, to form the metal casing 101.
  • the metal casing has a cubic configuration with an open bottom side wherein the side walls 154, 155, 156, 157 extend substantially perpendicular to the main surface 151.
  • the metal casing 101 serves as an electromagnetic wave shielding member for blocking undesired electromagnetic waves emitted from the printed circuit board 102 of the wireless RF module 100, and in particular from the RF circuit, the electronic components 103a - 103c, and the conducting structure thereof.
  • the inventive concept preferably relates to forming a meander-shaped slot 158 in the metal sheet 150 for the slot antenna wherein the production process for forming the slot antenna is no additional production step.
  • the meander-shaped slot 158 is made by punching, etching or laser cutting, for example, the metal sheet 150 prior to forming the metal sheet 150 into the metal casing 101 by means of an appropriate forming tool.
  • the punching or etching technique is well known and best suited for high production volumes.
  • the manufacturing of the slot 158 is part of the production process for the metal casing sheet 150 such that no additional production steps for forming the slot are needed.
  • the meander-shaped slot 158 is provided in the main surface 151 and in the lower side wall 157, and the meander-shaped slot 158 ends at the lower edge of the lower side wall 157 as shown in Figures 1 to 3 , thus forming a terminal portion 159 at the lower side wall 157, the function thereof is described below in detail. However, it is obvious for a person skilled in the art after studying the present specification that alternative configurations are possible.
  • the metal sheet 150 is made of conductive metal or any other suitable conductive material or material composition. It is also possible that the metal sheet 150 includes a resin or ceramic layer which is plated with copper or silver or any other conductive materials.
  • the term "metal casing" is used to describe a conductive casing. However, other conductive materials or material compositions can be used instead of metal.
  • the total length of the meander-shaped slot 158 is about 1/2 of the wavelength ⁇ of the used frequency.
  • the width and depth of the slot 158 is about 1/50 or more of said wavelength.
  • other configurations (instead of the meander-shaped configuration) and dimensions can be used is appropriate and described with respect to other preferred embodiments.
  • top and lower side walls 156, 157 are provided with projections or elongated pins 160a to 160d for mounting the formed metal casing 101 to the printed circuit board 102 (see Figures 1 to 3 ) of the wireless RF module.
  • other means for attaching the metal casing 101 to the printed circuit board 102 are possible and obvious for a person skilled in the art.
  • Figure 2 shows a perspective view from above of the wireless RF module 100 of Figure 1 after assembly thereof, i.e., after the metal casing 101 is attached to the top surface of the printed circuit board 102.
  • the metal casing 101 is attached to the printed circuit board 102 by means of the projections 160a to 160d formed at the upper and lower side walls 156 and 157 of the metal casing. It is obvious that said projections can also be formed at the left and right side walls 154 and 155, or at all side walls.
  • the front and rear edges (and/or the left and right edges) of the printed circuit board 102 are provided with corresponding recesses 110a to 110d which are adapted for receiving the projections 160a to 160d as best shown in Figure 2 .
  • the outer dimensions of the metal casing 101 defined by the bent side walls 154, 155, 156, 157 correspond to or are slightly smaller than the outer dimensions of the printed circuit board 102.
  • the printed circuit board 102 is made of non-conductive material, such as epoxy resin, and (as shown schematically in Figure 1 and 2 ) at least the upper surface of the printed circuit board 102 is provided with a conducting layer 120 which forms, after a suitable etching process, at least part of the wiring for the RF circuit and a coplanar waveguide (details are described below).
  • the lower surface of the printed circuit board 102 is also provided with a conductive layer to form at least part the wiring of the electronic circuit, i.e. the electronic components 103a, 103b, 103c, provided on the printed circuit board 102, and/or the ground element for a coplanar waveguide, as described below.
  • alternative wiring solutions are possible.
  • the wiring for the electronic components 103a, 103b and 103c could be provided or embedded within the non-conductive material of the printed circuit board.
  • the printed circuit board 102 may have a multi-layer configuration comprising a plurality of non-conductive layers and layers with conducting paths and/or conducting ground layers disposed therebetween.
  • the conductive layer 120 at the upper surface of the printed circuit board at least partially extends up to the outer edges of the printed circuit board 102.
  • the lower edges (the bottom surfaces of these edges) of the metal casing sidewalls which abut against the top surface of the printed circuit board are at least partially in conductive contact with the conductive layer 120 on the top surface of the printed circuit board 102.
  • the recesses 110a to 110d for receiving the projections 160a to 160d are provided with a conductive (metal) liner which is in electric contact with the top conductive layer 120 of the printed circuit board 102.
  • the electric coupling between the casing 101 and the conductive layer 120 is improved because of the electric contact between the projections 160a to 160d and the conductive liners in the recesses 110a to 110d which are in electric contact with the top conductive layer 120.
  • the metal casing 101 can be attached to the top conductive layer 120 by welding, i.e., welding points or welding beads can be made at the projections 160a-160d and the conductive liners in the recesses 110a-110d and/or at the contact areas between the casing 101 and the top conductive layer 120.
  • the length of the projections 160a-160d can be elongated such that the lower ends of projections can be bent around the lower edges towards the bottom surface of the printed circuit board 102 (similar to the embodiment shown in Figures 4 and 5 ). In this case, welding is not required as the contact forces between the lower edges/bottom surfaces of the sidewalls of the metal casing 101 and the top conductive layer 120 of the printed circuit board 102 are sufficient to provide the required electric contact.
  • a coplanar waveguide 125 is provided at the upper surface of the printed circuit board, a first end of which is connected to the RF input/output of the RF circuit, and in particular to the electronic component 103a, as shown in Figure 1 .
  • the coplanar waveguide 125 is formed by an elongated strip element 130 formed in the conductive layer 120.
  • the non-conductive circuit board 102 and (preferably) a conductive ground layer (not shown) at the bottom of the circuit board are used for forming the coplanar waveguide 125.
  • the conductive strip element 130 is formed by etching an elongated strip in the conductive layer 120.
  • insulation areas or insulation grooves 135 for isolating the strip element 130 against the remaining surface of the conductive layer 120 are made by etching or other known methods.
  • the input/output end of the conductive strip 130 i.e. first end
  • the electronic RF circuit e.g. electronic component 103a
  • the dimensions of the conductive strip 130 i.e. shape, length, thickness, and width thereof, and thickness of the non-conductive material of the printed circuit board 102
  • the coplanar waveguide 125 i.e.
  • the conductive strip 130 is open-ended with a distance (defined by the gap 140) to the right edge of the printed circuit board 102 (see Figure 1 ).
  • the coplanar waveguide 125 extends from the electronic component 103a towards the front edge of the circuit board, and is curved with an angle of 90° to extend in parallel to the front edge of the circuit board.
  • the length of the conductive strip 130 (defined by the length of gap 140 at the second end of the strip 130 opposite to the first end thereof) is adjusted with the goal that, at the position of a recess 170 (see Figure 1 ) for feeding the signals into the slot antenna 158 formed in the metal casing 101, a maximum coupling to the slot antenna 158 is achieved after assembly. Details of the coupling features are described below.
  • this invention is not limited to using a coplanar waveguide 125 as the coupling element to the slot antenna 158, any other transmission line like micro-strips etc. can be used similarly.
  • the feeding mechanism between the coplanar waveguide 125 and the slot antenna 158 according to the present invention can be realized without soldering an additional part of the metal casing 101 to the printed circuit board 102 of the wireless RF module 100, but by providing a coplanar RF wave guide 125 coupled to an opening or recess 170 which is provided at the top conductive layer 120 of the printed circuit board 102 which recess is adapted for communication with the slot antenna as described in detail below.
  • the RF signals from the electronic RF circuit (e.g. electronic component 103a) provided at the printed circuit board are transmitted by means of recess 170 which is coupled to the coplanar waveguide into the slot antenna 158 of the metal casing 101.
  • the terminal portion 159 of the slot antenna 8 is in alignment with the recess 170 for transmission of signals between the slot antenna and the coplanar waveguide.
  • the conductive strip 130 is provided on the printed circuit board 102, wherein the conductive strip 130 is isolated at both longitudinal sides thereof against the remaining area of the top conductive layer 120 by means of insulation areas or grooves 135 etched in the conductive layer 120. Thereby, at both longitudinal sides, conductive areas are provided which are insulted against the conductive strip portion 130 of the coplanar waveguide 125.
  • Such a configuration is conventional in the technical area of coplanar waveguides.
  • a conductive elongated strip portion 136 is provided between the front edge of the circuit board 102 and the insulation groove 135 of the coplanar wave guide 125. Further, an opening or recess 170 is formed in the conductive elongated strip portion 136, for example by means of etching or similar techniques. Therefore, the recess 170 is as a non-conductive (isolating) area between the insulation groove 135 and the front edge of the printed circuit board 102. In the first embodiment, the recess 170 has a tapered configuration, i.e., the recess 170 is tapered from the insulation groove 135 towards the front edge of the printed circuit board.
  • Said recess 170 is arranged in alignment with the terminal portion 159 of the slot antenna 158 formed in the metal casing 101, after assembly of the RF module 100.
  • the width of the groove of the slot antenna 158 and the width of the terminal portion 159 correspond to the width of the narrow end of the tapered recess 170. Therefore, improved coupling between the coplanar waveguide 125 and the slot antenna 158 can be achieved.
  • the recess 170 and the terminal portion 159 of the slot antenna 125 are adapted to provide a feeding mechanism between the coplanar waveguide 125 and the slot antenna 158.
  • the non-conductive gap 140 (i.e. by varying the length thereof) is used for tuning the efficiency of feeding RF waves from the coplanar waveguide 125 into the recess 170 and, therefore, into the slot antenna 158.
  • Figure 4 shows an exploded and perspective view from above of a wireless RF module 200 according to a second embodiment of the present invention
  • Figure 5 shows a perspective view of said wireless RF module of Figure 4 after assembly.
  • corresponding reference numbers the value 100 has been added to the reference numbers in Figures 1 to 3 ) are used.
  • the wireless RF module 200 also includes a metal casing 201 and a printed circuit board 202 as in the embodiment of Figures 1 and 2 .
  • the metal casing 201 is made by means of a procedure as described with reference to Figure 3 .
  • a meander-shaped slot 258 is formed in the metal casing 201 by punching, for example, as described with reference to Figures 1 to 3 .
  • the meander-shaped slot 258 is longer than the slot 158 in Figures 1 to 3 , i.e. comprises more turns.
  • the antenna of the second embodiment can be used for lower frequencies. Due to crosstalk between the different turns, careful layout can lead to a multi-band capability in addition to the lower operating frequency.
  • the top and lower side walls 256, 257 are provided with projections or elongated pins 260a to 260d for mounting the formed metal casing 201 to the printed circuit board 202 (see Figure 5 ) of the RF module.
  • the metal casing 201 is attached to the printed circuit board 202 by means of the projections 260a to 260d formed at the upper and lower side walls 256 and 257. It is obvious that said projections can also be formed at the left and right side walls, or at all side walls.
  • the front and rear edges (and/or the left and right edges) of the printed circuit board 202 are provided with corresponding depressions 280a to 280d having a depth corresponding to the thickness of the metal casing 201 and which are adapted for receiving the broader portions of the projections 260a to 260d as best shown in Figure 5 .
  • the length of the projections 260a to 260d is sufficient such that the lower ends of projections can be bent around the lower edges of the printed circuit board 202 towards the bottom surface thereof.
  • additional welding can be used to improve the attachment, however, welding is not required as the contact forces between the lower edges/bottom surfaces of the sidewalls of the casing 201 and the top conductive layer of the printed circuit board 202 are sufficient to provide the required electric contact.
  • the coplanar waveguide 225 is similar to that described in connection with Figures 1 and 2 . Thus, a detailed description is omitted.
  • the opening or recess 270 has a rectangular configuration, instead of the tapered shape as in the first embodiment.
  • the width of the groove of the slot antenna 258 and the width of the terminal portion 259 corresponds to the width of the rectangular recess 270.
  • the recess 270 in combination with the terminal portion 259 form the feeding mechanism as described with respect to the first embodiment.
  • Figure 6 shows an exploded and perspective view from above of a wireless RF module according to a third embodiment of the present invention, wherein Figure 6A shows a modified version of the wireless RF module of Figure 6 .
  • Figures 7 and 7A show the wireless RF module of Figures 6 and 6A after assembly.
  • corresponding reference numbers the value 100 has been added to the reference numbers in Figures 4 to 5 .
  • the features not described regarding the third embodiment correspond to the first and second embodiment, thus, the description thereof is omitted.
  • the RF module 300 according to the third embodiment is similar to the first and second embodiment. However, as shown, the slot antenna 358 has a simple tapered slot configuration leading to a wider operating bandwidth. With respect to the other features, in particular the coplanar waveguide 325, the third embodiment is similar to the first and second embodiments. It is noted that in the third embodiment, a tapered recess 370 and a rectangular recess can be used (see Figure 4 ). Another difference relates to the means for attaching the metal casing 301 to the printed circuit board 302. As shown in Figures 6 and 7 , the metal casing is provided with projections 360a to 360d which are adapted to be inserted into corresponding holes 311a to 311d having a circular or rectangular cross section.
  • the projections may have a sufficient length to be bent at the bottom surface of the printed circuit board. Additionally or alternatively, the metal casing can be welded to the printed circuit board (see weld beads 399 in Figures 7 and 7A ). In case of welding, the projections and the holes may serve as means for correct alignment between the casing and the circuit board.
  • Figure 8 shows an exploded and perspective view from above of a wireless RF module 400 according to a fourth embodiment of the present invention
  • Figure 9 shows the wireless RF module 400 of Figure 8 after assembly. It is obvious from these figures that the general configuration of the fourth embodiment is similar to that of the previous embodiments. Thus, a detailed description is omitted.
  • the slot antenna 458 has a configuration similar to that of Figures 4 and 5 .
  • the top and lower side walls are provided with projections 460a to 460d for mounting the metal casing 401 to the printed circuit board 402 of the RF module.
  • the front and rear edges of the printed circuit board 402 are provided with corresponding depressions 410a to 410d having a depth corresponding to the thickness of the metal casing 401 and which are adapted for receiving the projections 460a to 460d as best shown in Figure 9 .
  • Welding is used for securing the metal casing 401 to the printed circuit board 402 (see welding beads in Figure 9 ).
  • a tapered recess and a rectangular recess for coupling the coplanar waveguide with the slot antenna can be used as described with reference to the previous embodiments.
  • Figure 10 shows an exploded and perspective view from above of a wireless RF module 500 according to a fifth embodiment of the present invention
  • Figure 11 shows a perspective view of the wireless RF module of Figure 10 after assembly.
  • the slot antenna 558 has the same configuration as in Figures 6 , 6A , 7 and 7A .
  • a tapered recess and a rectangular recess 570 for coupling the coplanar waveguide with the slot antenna 558 can be used.
  • the metal casing 501 does not have any projections for securing the casing 501 to the printed circuit board 502. Instead, the metal casing 501 is welded to the circuit board (see welding beads 599).

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Transceivers (AREA)

Claims (18)

  1. Module radiofréquence sans fil (100 ; 200 ; 300 ; 400 ; 500) comprenant :
    - une carte de circuit imprimé (102 ; 202 ; 302 ; 402 ; 502) pourvue d'un circuit radiofréquence électrique (103a, 103b, 103c) ;
    - un boîtier métallique (101 ; 201 ; 301 ; 401 ; 501) monté sur la carte de circuit imprimé ; et
    - une antenne à fente (158 ; 258 ; 358 ; 458 ; 558) formée dans le boîtier métallique ;
    - la carte de circuit imprimé (102 ; 202 ; 302 ; 402 ; 502) étant pourvue d'un guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525) ;
    - le guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525) étant couplé au circuit de radiofréquence ; et
    - le guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525) étant couplé à l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) par l'intermédiaire d'un mécanisme d'alimentation (170 ; 270 ; 370 ; 470 ; 570 ; 159 ; 259 ; 359 ; 459 ; 595) ;
    caractérisé en ce que
    - l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) est pourvue d'une partie terminale (159 ; 259 ; 359 ; 459 ; 559) sur un bord extérieur du boîtier métallique, et le guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525) comporte un évidement (170 ; 270 ; 370 ; 470 ; 570), et la partie terminale (159 ; 259 ; 359 ; 459 ; 559) étant placée en alignement avec l'évidement (170 ; 270 ; 370 ; 470 ; 570) pour coupler le guide d'onde coplanaire de la carte de circuit imprimé à l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) du boîtier métallique.
  2. Module radiofréquence sans fil selon la revendication 1, dans lequel le boîtier métallique (101 ; 201 ; 301 ; 401 ; 501) est formé par une feuille de métal (150) comprenant une surface principale rectangulaire (151), des parois latérales gauche et droite (154, 155) et des parois latérales supérieure et inférieure (156, 157).
  3. Module radiofréquence sans fil selon la revendication 2, dans lequel les parois latérales gauche et droite (154, 155) et les parois latérales supérieure et inférieure (156, 157) sont courbées, de telle manière que les parois latérales (154, 155, 156, 157) s'étendent substantiellement perpendiculairement à la surface principale (151) pour former le boîtier métallique (101 ; 201 ; 301 ; 401 ; 501) ayant une configuration cubique avec un fond ouvert.
  4. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la fente de l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) est formée par poinçonnage ou par gravage d'une feuille de métal (150) avant que la feuille de métal (150) soit mise sous la forme du boîtier métallique (101 ; 201 ; 301 ; 401 ; 501).
  5. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la fente est formée dans la surface principale (151) et au niveau d'une paroi latérale (157) du boîtier métallique (101 ; 201 ; 301 ; 401 ; 501) et se termine au niveau du bord inférieur de ladite paroi latérale (157), formant ainsi une partie terminale (159) dans ladite paroi latérale (157).
  6. Module radiofréquence sans fil selon l'une quelconque des revendications 2 à 5, dans lequel les parois latérales supérieure et inférieure (156, 157) et/ou les parois latérales gauche et droite (154, 155) sont munies de protubérances (160a, 160b, 160c, 160d ; 260a, 260b, 260c, 260d ; 360a, 360b, 360c, 360d ; 460a, 460b, 460c, 460d) pour monter le boîtier métallique formé (101 ; 201 ; 301 ; 401) sur une carte de circuit imprimé du module de circuit.
  7. Module radiofréquence sans fil selon l'une quelconque des revendications 2 à 6, dans lequel la feuille de métal (150) est faite d'un métal conducteur ou de tout autre matériau ou composition de matériaux conducteur approprié.
  8. Module radiofréquence sans fil selon l'une quelconque des revendications 2 à 7, dans lequel la feuille de métal (150) est faite d'une couche de résine qui est plaquée avec du cuivre ou de l'argent ou n'importe quel autre matériau conducteur.
  9. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la fente de l'antenne à fente a une longueur totale d'environ la moitié de la longueur d'onde λ de la fréquence utilisée.
  10. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la fente de l'antenne à fente a une largeur et une profondeur supérieure ou égale à environ 1/50e de la longueur d'onde utilisée.
  11. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel le circuit de radiofréquence de la carte de circuit imprimé comprend plusieurs composants électroniques (103a, 103b, 103c) pour fournir un circuit émetteur-récepteur.
  12. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel le boîtier métallique (101 ; 201 ; 301 ; 401 ; 501) est monté sur la carte de circuit imprimé (102 ; 202 ; 302 ; 402 ; 502) avec les surfaces inférieures des parois latérales du boîtier en appui contre la surface supérieure de la carte de circuit imprimé.
  13. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la carte de circuit imprimé (102 ; 202 ; 302 ; 402 ; 502) est pourvue d'un guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525) qui est couplé à un évidement (170 ; 270 ; 370 ; 470 ; 570) formé sur la carte de circuit imprimé pour introduire des signaux RF provenant du circuit RF dans l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) du boîtier (101 ; 201 ; 301 ; 401 ; 501).
  14. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel l'antenne à fente (158 ; 258 ; 358 ; 458 ; 558) est pourvue d'une partie terminale (159 ; 259 ; 359 ; 459 ; 559) au niveau d'un bord extérieur du boîtier métallique qui est en communication avec le guide d'onde coplanaire (125 ; 225 ; 325 ; 425 ; 525).
  15. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel la surface supérieure de la carte de circuit imprimé est pourvue d'une couche conductrice (120), le guide d'onde coplanaire étant formé par ladite couche conductrice (120).
  16. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel le mécanisme d'alimentation comprend un évidement (170 ; 270 ; 370 ; 470 ; 570) ayant une configuration rectangulaire ou à rétrécissement.
  17. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel l'antenne à fente (158 ; 258 ; 458) a une configuration en forme de méandre.
  18. Module radiofréquence sans fil selon l'une quelconque des revendications précédentes, dans lequel l'antenne à fente (358 ; 558) a une configuration linéaire et à rétrécissement.
EP20070001518 2007-01-24 2007-01-24 Module sans fil comprenant une antenne à fentes intégrée Expired - Fee Related EP1950834B1 (fr)

Priority Applications (1)

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US20140125528A1 (en) * 2012-11-08 2014-05-08 Htc Corporation Mobile device and antenna structure
US9186828B2 (en) 2012-06-06 2015-11-17 Apple Inc. Methods for forming elongated antennas with plastic support structures for electronic devices
US9318793B2 (en) 2012-05-02 2016-04-19 Apple Inc. Corner bracket slot antennas
US9455489B2 (en) 2011-08-30 2016-09-27 Apple Inc. Cavity antennas

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FR2986110A1 (fr) 2012-01-20 2013-07-26 Thomson Licensing Perfectionnement a l'isolation d'antennes montees sur une carte de circuit imprime
US9178268B2 (en) 2012-07-03 2015-11-03 Apple Inc. Antennas integrated with speakers and methods for suppressing cavity modes
EP2854214A1 (fr) * 2013-09-27 2015-04-01 Thomson Licensing Ensemble d'antenne pour dispositif électronique
EP2940789A1 (fr) * 2014-04-28 2015-11-04 King Slide Technology Co., Ltd. Antenne de dispositif de communication
CN203950905U (zh) * 2014-05-26 2014-11-19 比亚迪股份有限公司 用于电子设备的天线和具有该天线的电子设备
CN105515599A (zh) * 2014-09-30 2016-04-20 深圳富泰宏精密工业有限公司 无线通信装置
JP6567475B2 (ja) * 2016-08-05 2019-08-28 株式会社東芝 無線装置
WO2018028372A1 (fr) 2016-08-08 2018-02-15 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Boîtier, procédé de fabrication d'un boîtier et terminal mobile ayant un boîtier
WO2018028486A1 (fr) * 2016-08-08 2018-02-15 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Boîtier, procédé de fabrication d'un boîtier et terminal mobile possédant un boîtier
JP6668197B2 (ja) * 2016-08-18 2020-03-18 株式会社東芝 無線装置
JP6956361B2 (ja) * 2017-02-22 2021-11-02 パナソニックＩｐマネジメント株式会社 点灯装置及び照明装置
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US9318793B2 (en) 2012-05-02 2016-04-19 Apple Inc. Corner bracket slot antennas
US9186828B2 (en) 2012-06-06 2015-11-17 Apple Inc. Methods for forming elongated antennas with plastic support structures for electronic devices
US20140125528A1 (en) * 2012-11-08 2014-05-08 Htc Corporation Mobile device and antenna structure
US9716307B2 (en) * 2012-11-08 2017-07-25 Htc Corporation Mobile device and antenna structure
US10490883B2 (en) 2012-11-08 2019-11-26 Htc Corporation Mobile device and antenna structure
US10516202B2 (en) 2012-11-08 2019-12-24 Htc Corporation Mobile device and antenna structure
US10833398B2 (en) 2012-11-08 2020-11-10 Htc Corporation Mobile device and antenna structure
US10879591B2 (en) 2012-11-08 2020-12-29 Htc Corporation Mobile device and antenna structure
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