EP1950834A1 - Module sans fil comprenant une antenne à fentes intégrée - Google Patents

Module sans fil comprenant une antenne à fentes intégrée Download PDF

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Publication number
EP1950834A1
EP1950834A1 EP07001518A EP07001518A EP1950834A1 EP 1950834 A1 EP1950834 A1 EP 1950834A1 EP 07001518 A EP07001518 A EP 07001518A EP 07001518 A EP07001518 A EP 07001518A EP 1950834 A1 EP1950834 A1 EP 1950834A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
wireless radio
frequency module
slot antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07001518A
Other languages
German (de)
English (en)
Other versions
EP1950834B1 (fr
Inventor
Peter Schoss
Axel Schaab
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to EP20070001518 priority Critical patent/EP1950834B1/fr
Publication of EP1950834A1 publication Critical patent/EP1950834A1/fr
Application granted granted Critical
Publication of EP1950834B1 publication Critical patent/EP1950834B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Definitions

  • the present invention relates in general to the field of wireless radio-frequency (RF) modules, and in particular to wireless RF modules used in communication devices. More particular, the present invention relates to a wireless RF module having a grounded or non-grounded metal case, such as a RF circuit module provided with a metal shielding or metal casing on top, in combination with a slot antenna formed at said metal casing.
  • a wireless RF module in combination with said slot antenna can be adapted for use in wireless communication apparatuses such as mobile phones or Bluetooth devices.
  • the size of such apparatuses can be reduced, and the antenna characteristics thereof can be improved.
  • a wireless RF module which is provided with a metal shielding or metal casing.
  • the wireless radio-frequency circuit (RF circuit) of the wireless RF module provided on a printed circuit board (PCB) of the RF module and the antenna are separate components which are usually miniaturized separately from each other.
  • PCB printed circuit board
  • a notch portion is formed in a shield case formed of conductive material that covers a radio-frequency wireless communication circuit provided on a printed wiring board so as to house the radio-frequency wireless communication circuit within the shield case.
  • the slot is formed as a trench that is soldered on its walls to the printed circuit board (PCB) of the component.
  • PCB printed circuit board
  • WO 02/095869 A1 and US 2005/0237251 A1 both relate to radio-frequency communication devices provided with different slot antenna arrangements.
  • these documents have their focus on varying resonant frequencies and bandwidth but do not disclose any teachings with respect to the miniaturization of RF modules and the coupling between a slot antenna and the related RF circuit.
  • the present invention comprises two main ideas:
  • Figure 1 shows an exploded and perspective view from above of a wireless RF module 100 according to a first embodiment of the present invention
  • Figure 2 shows a perspective view from above of the wireless RF module 100 of Figure 1 after assembly thereof.
  • the wireless RF module 100 includes a conductive or metal casing 101 and a RF circuit module formed by a printed circuit board 102 comprising several electronic components 103a - 103c (see Figure 1 ) of an electronic RF circuit (for example a transceiver circuit), and other electronic means as required for a wireless communication device.
  • the metal casing 101 is adapted to be attached to the printed circuit board 102. Details of different attachment configurations and attachment methods are explained below with reference to the present and alternative embodiments of the present invention.
  • Figure 3 shows a top view of a metal sheet 150 prior to forming the metal casing 101 for the wireless RF module 100 of Figures 1 and 2 .
  • the metal sheet 150 formed by punching of a metal plate for example, comprises a rectangular main surface 151, left and right side walls 154, 155, and upper and lower side walls 156, 157 which can be bent downwards along the connection lines C, preferably with an angle of 90°, to form the metal casing 101.
  • the metal casing has a cubic configuration with an open bottom side wherein the side walls 154, 155, 156, 157 extend substantially perpendicular to the main surface 151.
  • the metal casing 101 serves as an electromagnetic wave shielding member for blocking undesired electromagnetic waves emitted from the printed circuit board 102 of the wireless RF module 100, and in particular from the RF circuit, the electronic components 103a - 103c, and the conducting structure thereof.
  • the inventive concept preferably relates to forming a meander-shaped slot 158 in the metal sheet 150 for the slot antenna wherein the production process for forming the slot antenna is no additional production step.
  • the meander-shaped slot 158 is made by punching, etching or laser cutting, for example, the metal sheet 150 prior to forming the metal sheet 150 into the metal casing 101 by means of an appropriate forming tool.
  • the punching or etching technique is well known and best suited for high production volumes.
  • the manufacturing of the slot 158 is part of the production process for the metal casing sheet 150 such that no additional production steps for forming the slot are needed.
  • the meander-shaped slot 158 is provided in the main surface 151 and in the lower side wall 157, and the meander-shaped slot 158 ends at the lower edge of the lower side wall 157 as shown in Figures 1 to 3 , thus forming a terminal portion 159 at the lower side wall 157, the function thereof is described below in detail. However, it is obvious for a person skilled in the art after studying the present specification that alternative configurations are possible.
  • the metal sheet 150 is made of conductive metal or any other suitable conductive material or material composition. It is also possible that the metal sheet 150 includes a resin or ceramic layer which is plated with copper or silver or any other conductive materials.
  • the term "metal casing" is used to describe a conductive casing. However, other conductive materials or material compositions can be used instead of metal.
  • the total length of the meander-shaped slot 158 is about 1/2 of the wavelength ⁇ of the used frequency.
  • the width and depth of the slot 158 is about 1/50 or more of said wavelength.
  • other configurations (instead of the meander-shaped configuration) and dimensions can be used is appropriate and described with respect to other preferred embodiments.
  • top and lower side walls 156, 157 are provided with projections or elongated pins 160a to 160d for mounting the formed metal casing 101 to the printed circuit board 102 (see Figures 1 to 3 ) of the wireless RF module.
  • other means for attaching the metal casing 101 to the printed circuit board 102 are possible and obvious for a person skilled in the art.
  • Figure 2 shows a perspective view from above of the wireless RF module 100 of Figure 1 after assembly thereof, i.e., after the metal casing 101 is attached to the top surface of the printed circuit board 102.
  • the metal casing 101 is attached to the printed circuit board 102 by means of the projections 160a to 160d formed at the upper and lower side walls 156 and 157 of the metal casing. It is obvious that said projections can also be formed at the left and right side walls 154 and 155, or at all side walls.
  • the front and rear edges (and/or the left and right edges) of the printed circuit board 102 are provided with corresponding recesses 110a to 110d which are adapted for receiving the projections 160a to 160d as best shown in Figure 2 .
  • the outer dimensions of the metal casing 101 defined by the bent side walls 154, 155, 156, 157 correspond to or are slightly smaller than the outer dimensions of the printed circuit board 102.
  • the printed circuit board 102 is made of non-conductive material, such as epoxy resin, and (as shown schematically in Figure 1 and 2 ) at least the upper surface of the printed circuit board 102 is provided with a conducting layer 120 which forms, after a suitable etching process, at least part of the wiring for the RF circuit and a coplanar waveguide (details are described below).
  • the lower surface of the printed circuit board 102 is also provided with a conductive layer to form at least part the wiring of the electronic circuit, i.e. the electronic components 103a, 103b, 103c, provided on the printed circuit board 102, and/or the ground element for a coplanar waveguide, as described below.
  • alternative wiring solutions are possible.
  • the wiring for the electronic components 103a, 103b and 103c could be provided or embedded within the non-conductive material of the printed circuit board.
  • the printed circuit board 102 may have a multi-layer configuration comprising a plurality of non-conductive layers and layers with conducting paths and/or conducting ground layers disposed therebetween.
  • the conductive layer 120 at the upper surface of the printed circuit board at least partially extends up to the outer edges of the printed circuit board 102.
  • the lower edges (the bottom surfaces of these edges) of the metal casing sidewalls which abut against the top surface of the printed circuit board are at least partially in conductive contact with the conductive layer 120 on the top surface of the printed circuit board 102.
  • the recesses 110a to 110d for receiving the projections 160a to 160d are provided with a conductive (metal) liner which is in electric contact with the top conductive layer 120 of the printed circuit board 102.
  • the electric coupling between the casing 101 and the conductive layer 120 is improved because of the electric contact between the projections 160a to 160d and the conductive liners in the recesses 110a to 110d which are in electric contact with the top conductive layer 120.
  • the metal casing 101 can be attached to the top conductive layer 120 by welding, i.e., welding points or welding beads can be made at the projections 160a-160d and the conductive liners in the recesses 110a-110d and/or at the contact areas between the casing 101 and the top conductive layer 120.
  • the length of the projections 160a-160d can be elongated such that the lower ends of projections can be bent around the lower edges towards the bottom surface of the printed circuit board 102 (similar to the embodiment shown in Figures 4 and 5 ). In this case, welding is not required as the contact forces between the lower edges/bottom surfaces of the sidewalls of the metal casing 101 and the top conductive layer 120 of the printed circuit board 102 are sufficient to provide the required electric contact.
  • a coplanar waveguide 125 is provided at the upper surface of the printed circuit board, a first end of which is connected to the RF input/output of the RF circuit, and in particular to the electronic component 103a, as shown in Figure 1 .
  • the coplanar waveguide 125 is formed by an elongated strip element 130 formed in the conductive layer 120.
  • the non-conductive circuit board 102 and (preferably) a conductive ground layer (not shown) at the bottom of the circuit board are used for forming the coplanar waveguide 125.
  • the conductive strip element 130 is formed by etching an elongated strip in the conductive layer 120.
  • insulation areas or insulation grooves 135 for isolating the strip element 130 against the remaining surface of the conductive layer 120 are made by etching or other known methods.
  • the input/output end of the conductive strip 130 i.e. first end
  • the electronic RF circuit e.g. electronic component 103a
  • the dimensions of the conductive strip 130 i.e. shape, length, thickness, and width thereof, and thickness of the non-conductive material of the printed circuit board 102
  • the coplanar waveguide 125 i.e.
  • the conductive strip 130 is open-ended with a distance (defined by the gap 140) to the right edge of the printed circuit board 102 (see Figure 1 ).
  • the coplanar waveguide 125 extends from the electronic component 103a towards the front edge of the circuit board, and is curved with an angle of 90° to extend in parallel to the front edge of the circuit board.
  • the length of the conductive strip 130 (defined by the length of gap 140 at the second end of the strip 130 opposite to the first end thereof) is adjusted with the goal that, at the position of a recess 170 (see Figure 1 ) for feeding the signals into the slot antenna 158 formed in the metal casing 101, a maximum coupling to the slot antenna 158 is achieved after assembly. Details of the coupling features are described below.
  • this invention is not limited to using a coplanar waveguide 125 as the coupling element to the slot antenna 158, any other transmission line like micro-strips etc. can be used similarly.
  • the feeding mechanism between the coplanar waveguide 125 and the slot antenna 158 according to the present invention can be realized without soldering an additional part of the metal casing 101 to the printed circuit board 102 of the wireless RF module 100, but by providing a coplanar RF wave guide 125 coupled to an opening or recess 170 which is provided at the top conductive layer 120 of the printed circuit board 102 which recess is adapted for communication with the slot antenna as described in detail below.
  • the RF signals from the electronic RF circuit (e.g. electronic component 103a) provided at the printed circuit board are transmitted by means of recess 170 which is coupled to the coplanar waveguide into the slot antenna 158 of the metal casing 101.
  • the terminal portion 159 of the slot antenna 8 is in alignment with the recess 170 for transmission of signals between the slot antenna and the coplanar waveguide.
  • the conductive strip 130 is provided on the printed circuit board 102, wherein the conductive strip 130 is isolated at both longitudinal sides thereof against the remaining area of the top conductive layer 120 by means of insulation areas or grooves 135 etched in the conductive layer 120. Thereby, at both longitudinal sides, conductive areas are provided which are insulted against the conductive strip portion 130 of the coplanar waveguide 125.
  • Such a configuration is conventional in the technical area of coplanar waveguides.
  • a conductive elongated strip portion 136 is provided between the front edge of the circuit board 102 and the insulation groove 135 of the coplanar wave guide 125. Further, an opening or recess 170 is formed in the conductive elongated strip portion 136, for example by means of etching or similar techniques. Therefore, the recess 170 is as a non-conductive (isolating) area between the insulation groove 135 and the front edge of the printed circuit board 102. In the first embodiment, the recess 170 has a tapered configuration, i.e., the recess 170 is tapered from the insulation groove 135 towards the front edge of the printed circuit board.
  • Said recess 170 is arranged in alignment with the terminal portion 159 of the slot antenna 158 formed in the metal casing 101, after assembly of the RF module 100.
  • the width of the groove of the slot antenna 158 and the width of the terminal portion 159 correspond to the width of the narrow end of the tapered recess 170. Therefore, improved coupling between the coplanar waveguide 125 and the slot antenna 158 can be achieved.
  • the recess 170 and the terminal portion 159 of the slot antenna 125 are adapted to provide a feeding mechanism between the coplanar waveguide 125 and the slot antenna 158.
  • the non-conductive gap 140 (i.e. by varying the length thereof) is used for tuning the efficiency of feeding RF waves from the coplanar waveguide 125 into the recess 170 and, therefore, into the slot antenna 158.
  • Figure 4 shows an exploded and perspective view from above of a wireless RF module 200 according to a second embodiment of the present invention
  • Figure 5 shows a perspective view of said wireless RF module of Figure 4 after assembly.
  • corresponding reference numbers the value 100 has been added to the reference numbers in Figures 1 to 3 ) are used.
  • the wireless RF module 200 also includes a metal casing 201 and a printed circuit board 202 as in the embodiment of Figures 1 and 2 .
  • the metal casing 201 is made by means of a procedure as described with reference to Figure 3 .
  • a meander-shaped slot 258 is formed in the metal casing 201 by punching, for example, as described with reference to Figures 1 to 3 .
  • the meander-shaped slot 258 is longer than the slot 158 in Figures 1 to 3 , i.e. comprises more turns.
  • the antenna of the second embodiment can be used for lower frequencies. Due to crosstalk between the different turns, careful layout can lead to a multi-band capability in addition to the lower operating frequency.
  • the top and lower side walls 256, 257 are provided with projections or elongated pins 260a to 260d for mounting the formed metal casing 201 to the printed circuit board 202 (see Figure 5 ) of the RF module.
  • the metal casing 201 is attached to the printed circuit board 202 by means of the projections 260a to 260d formed at the upper and lower side walls 256 and 257. It is obvious that said projections can also be formed at the left and right side walls, or at all side walls.
  • the front and rear edges (and/or the left and right edges) of the printed circuit board 202 are provided with corresponding depressions 280a to 280d having a depth corresponding to the thickness of the metal casing 201 and which are adapted for receiving the broader portions of the projections 260a to 260d as best shown in Figure 5 .
  • the length of the projections 260a to 260d is sufficient such that the lower ends of projections can be bent around the lower edges of the printed circuit board 202 towards the bottom surface thereof.
  • additional welding can be used to improve the attachment, however, welding is not required as the contact forces between the lower edges/bottom surfaces of the sidewalls of the casing 201 and the top conductive layer of the printed circuit board 202 are sufficient to provide the required electric contact.
  • the coplanar waveguide 225 is similar to that described in connection with Figures 1 and 2 . Thus, a detailed description is omitted.
  • the opening or recess 270 has a rectangular configuration, instead of the tapered shape as in the first embodiment.
  • the width of the groove of the slot antenna 258 and the width of the terminal portion 259 corresponds to the width of the rectangular recess 270.
  • the recess 270 in combination with the terminal portion 259 form the feeding mechanism as described with respect to the first embodiment.
  • Figure 6 shows an exploded and perspective view from above of a wireless RF module according to a third embodiment of the present invention, wherein Figure 6A shows a modified version of the wireless RF module of Figure 6 .
  • Figures 7 and 7A show the wireless RF module of Figures 6 and 6A after assembly.
  • corresponding reference numbers the value 100 has been added to the reference numbers in Figures 4 to 5 .
  • the features not described regarding the third embodiment correspond to the first and second embodiment, thus, the description thereof is omitted.
  • the RF module 300 according to the third embodiment is similar to the first and second embodiment. However, as shown, the slot antenna 358 has a simple tapered slot configuration leading to a wider operating bandwidth. With respect to the other features, in particular the coplanar waveguide 325, the third embodiment is similar to the first and second embodiments. It is noted that in the third embodiment, a tapered recess 370 and a rectangular recess can be used (see Figure 4 ). Another difference relates to the means for attaching the metal casing 301 to the printed circuit board 302. As shown in Figures 6 and 7 , the metal casing is provided with projections 360a to 360d which are adapted to be inserted into corresponding holes 311a to 311d having a circular or rectangular cross section.
  • the projections may have a sufficient length to be bent at the bottom surface of the printed circuit board. Additionally or alternatively, the metal casing can be welded to the printed circuit board (see weld beads 399 in Figures 7 and 7A ). In case of welding, the projections and the holes may serve as means for correct alignment between the casing and the circuit board.
  • Figure 8 shows an exploded and perspective view from above of a wireless RF module 400 according to a fourth embodiment of the present invention
  • Figure 9 shows the wireless RF module 400 of Figure 8 after assembly. It is obvious from these figures that the general configuration of the fourth embodiment is similar to that of the previous embodiments. Thus, a detailed description is omitted.
  • the slot antenna 458 has a configuration similar to that of Figures 4 and 5 .
  • the top and lower side walls are provided with projections 460a to 460d for mounting the metal casing 401 to the printed circuit board 402 of the RF module.
  • the front and rear edges of the printed circuit board 402 are provided with corresponding depressions 410a to 410d having a depth corresponding to the thickness of the metal casing 401 and which are adapted for receiving the projections 460a to 460d as best shown in Figure 9 .
  • Welding is used for securing the metal casing 401 to the printed circuit board 402 (see welding beads in Figure 9 ).
  • a tapered recess and a rectangular recess for coupling the coplanar waveguide with the slot antenna can be used as described with reference to the previous embodiments.
  • Figure 10 shows an exploded and perspective view from above of a wireless RF module 500 according to a fifth embodiment of the present invention
  • Figure 11 shows a perspective view of the wireless RF module of Figure 10 after assembly.
  • the slot antenna 558 has the same configuration as in Figures 6 , 6A , 7 and 7A .
  • a tapered recess and a rectangular recess 570 for coupling the coplanar waveguide with the slot antenna 558 can be used.
  • the metal casing 501 does not have any projections for securing the casing 501 to the printed circuit board 502. Instead, the metal casing 501 is welded to the circuit board (see welding beads 599).

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Transceivers (AREA)
EP20070001518 2007-01-24 2007-01-24 Module sans fil comprenant une antenne à fentes intégrée Expired - Fee Related EP1950834B1 (fr)

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Application Number Priority Date Filing Date Title
EP20070001518 EP1950834B1 (fr) 2007-01-24 2007-01-24 Module sans fil comprenant une antenne à fentes intégrée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20070001518 EP1950834B1 (fr) 2007-01-24 2007-01-24 Module sans fil comprenant une antenne à fentes intégrée

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EP1950834A1 true EP1950834A1 (fr) 2008-07-30
EP1950834B1 EP1950834B1 (fr) 2012-02-29

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2190065A1 (fr) * 2008-11-24 2010-05-26 Huawei Device Co., Ltd. Terminal sans fil et carte d'interface de réseau sans fil
WO2013165700A1 (fr) * 2012-05-02 2013-11-07 Apple Inc. Antennes à fentes à support en coin
EP2854214A1 (fr) * 2013-09-27 2015-04-01 Thomson Licensing Ensemble d'antenne pour dispositif électronique
US9178268B2 (en) 2012-07-03 2015-11-03 Apple Inc. Antennas integrated with speakers and methods for suppressing cavity modes
EP2940789A1 (fr) * 2014-04-28 2015-11-04 King Slide Technology Co., Ltd. Antenne de dispositif de communication
US9203164B2 (en) 2012-01-20 2015-12-01 Thomson Licensing Isolation of antennas mounted on a printed circuit board
WO2015180618A1 (fr) * 2014-05-26 2015-12-03 Byd Company Limited Dispositif électronique et antenne de celui-ci
CN105515599A (zh) * 2014-09-30 2016-04-20 深圳富泰宏精密工业有限公司 无线通信装置
JP2018023060A (ja) * 2016-08-05 2018-02-08 株式会社東芝 無線装置
WO2018028486A1 (fr) * 2016-08-08 2018-02-15 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Boîtier, procédé de fabrication d'un boîtier et terminal mobile possédant un boîtier
JP2018029286A (ja) * 2016-08-18 2018-02-22 株式会社東芝 無線装置
JP2018137152A (ja) * 2017-02-22 2018-08-30 パナソニックＩｐマネジメント株式会社 点灯装置及び照明装置
EP3474377A1 (fr) * 2017-10-19 2019-04-24 Raspberry PI (Trading) Limited Module radio
US10568221B2 (en) 2016-08-08 2020-02-18 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, method for manufacturing antenna, and mobile terminal having housing

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US9455489B2 (en) 2011-08-30 2016-09-27 Apple Inc. Cavity antennas
US9186828B2 (en) 2012-06-06 2015-11-17 Apple Inc. Methods for forming elongated antennas with plastic support structures for electronic devices
US9716307B2 (en) 2012-11-08 2017-07-25 Htc Corporation Mobile device and antenna structure

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EP1533867A1 (fr) 2003-11-18 2005-05-25 Alps Electric Co., Ltd. Antenne à fente à polarisation circulaire capable d'être miniaturisée facilement
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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2190065A1 (fr) * 2008-11-24 2010-05-26 Huawei Device Co., Ltd. Terminal sans fil et carte d'interface de réseau sans fil
US9203164B2 (en) 2012-01-20 2015-12-01 Thomson Licensing Isolation of antennas mounted on a printed circuit board
WO2013165700A1 (fr) * 2012-05-02 2013-11-07 Apple Inc. Antennes à fentes à support en coin
US9178268B2 (en) 2012-07-03 2015-11-03 Apple Inc. Antennas integrated with speakers and methods for suppressing cavity modes
EP2854214A1 (fr) * 2013-09-27 2015-04-01 Thomson Licensing Ensemble d'antenne pour dispositif électronique
CN104518280A (zh) * 2013-09-27 2015-04-15 汤姆逊许可公司 电子设备的天线组件
US9735461B2 (en) 2013-09-27 2017-08-15 Thomson Licensing Antenna assembly for electronic device
EP2940789A1 (fr) * 2014-04-28 2015-11-04 King Slide Technology Co., Ltd. Antenne de dispositif de communication
US10199716B2 (en) 2014-05-26 2019-02-05 Byd Company Limited Electronic device and antenna of the same
WO2015180618A1 (fr) * 2014-05-26 2015-12-03 Byd Company Limited Dispositif électronique et antenne de celui-ci
CN105515599A (zh) * 2014-09-30 2016-04-20 深圳富泰宏精密工业有限公司 无线通信装置
JP2018023060A (ja) * 2016-08-05 2018-02-08 株式会社東芝 無線装置
WO2018028486A1 (fr) * 2016-08-08 2018-02-15 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Boîtier, procédé de fabrication d'un boîtier et terminal mobile possédant un boîtier
US10382601B2 (en) 2016-08-08 2019-08-13 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, method for manufacturing housing, and mobile terminal having housing
US10568221B2 (en) 2016-08-08 2020-02-18 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, method for manufacturing antenna, and mobile terminal having housing
US10637976B2 (en) 2016-08-08 2020-04-28 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, method for manufacturing housing, and mobile terminal having housing
US10827047B2 (en) 2016-08-08 2020-11-03 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, method for manufacturing housing, and mobile terminal having housing
JP2018029286A (ja) * 2016-08-18 2018-02-22 株式会社東芝 無線装置
JP2018137152A (ja) * 2017-02-22 2018-08-30 パナソニックＩｐマネジメント株式会社 点灯装置及び照明装置
EP3474377A1 (fr) * 2017-10-19 2019-04-24 Raspberry PI (Trading) Limited Module radio

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