AU6509500A - Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies - Google Patents

Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies

Info

Publication number
AU6509500A
AU6509500A AU65095/00A AU6509500A AU6509500A AU 6509500 A AU6509500 A AU 6509500A AU 65095/00 A AU65095/00 A AU 65095/00A AU 6509500 A AU6509500 A AU 6509500A AU 6509500 A AU6509500 A AU 6509500A
Authority
AU
Australia
Prior art keywords
waferprobe
integrated circuit
manufacturing processes
card assemblies
construction structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU65095/00A
Inventor
Fu Chiung Chong
Sammy Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoNexus Inc
Original Assignee
NanoNexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NanoNexus Inc filed Critical NanoNexus Inc
Publication of AU6509500A publication Critical patent/AU6509500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU65095/00A 1999-07-28 2000-07-28 Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies Abandoned AU6509500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14624199P 1999-07-28 1999-07-28
US60146241 1999-07-28
PCT/US2000/021012 WO2001009623A1 (en) 1999-07-28 2000-07-28 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Publications (1)

Publication Number Publication Date
AU6509500A true AU6509500A (en) 2001-02-19

Family

ID=22516461

Family Applications (1)

Application Number Title Priority Date Filing Date
AU65095/00A Abandoned AU6509500A (en) 1999-07-28 2000-07-28 Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies

Country Status (4)

Country Link
EP (1) EP1200843A1 (en)
JP (1) JP2003506686A (en)
AU (1) AU6509500A (en)
WO (1) WO2001009623A1 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6856150B2 (en) * 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
JP2004534957A (en) 2001-07-11 2004-11-18 フォームファクター，インコーポレイテッド Method of manufacturing probe card
DE10162983B4 (en) * 2001-12-20 2010-07-08 Qimonda Ag Contact spring arrangement for the electrical contacting of a semiconductor wafer for test purposes and method for its production
US6756244B2 (en) * 2002-01-29 2004-06-29 Hewlett-Packard Development Company, L.P. Interconnect structure
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6853209B1 (en) * 2002-07-16 2005-02-08 Aehr Test Systems Contactor assembly for testing electrical circuits
TW200525675A (en) * 2004-01-20 2005-08-01 Tokyo Electron Ltd Probe guard
CN100539061C (en) * 2004-03-31 2009-09-09 Jsr株式会社 Probe device is equipped with the wafer inspection equipment of this probe device and chip detection method
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
JP4727948B2 (en) 2004-05-24 2011-07-20 東京エレクトロン株式会社 Multilayer substrate used for probe card
DE102004027887B4 (en) 2004-05-28 2010-07-29 Feinmetall Gmbh Testing device for electrical testing of a test object
CN100419433C (en) * 2004-09-24 2008-09-17 京元电子股份有限公司 Integrated circuit plug socket having signal switching device and electron element testing method
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
KR101304031B1 (en) * 2005-07-08 2013-09-04 폼팩터, 인코포레이티드 Probe card assembly with an interchangeable probe insert
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
JP2008082912A (en) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd Electrical connection device
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
EP1956376A1 (en) * 2007-02-08 2008-08-13 Feinmetall GmbH Electrical testing device for testing electrical test items
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
CN101424702B (en) * 2007-10-29 2010-07-28 京元电子股份有限公司 Probe, test socket and tester thereof
JP5276836B2 (en) * 2007-12-14 2013-08-28 日本電子材料株式会社 Probe card
GB0809252D0 (en) 2008-05-21 2008-06-25 Ntnu Technology Transfer As Underwater hyperspectral imaging
JP2010038726A (en) * 2008-08-05 2010-02-18 Japan Electronic Materials Corp Probe card
CN102033193A (en) * 2009-06-03 2011-04-27 康代有限公司 Method and system for measuring the electricity behavior of a circuit
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
WO2014009980A1 (en) 2012-07-11 2014-01-16 Technoprobe S.P.A. Interface board of a testing head for a test equipment of electronic devices and corresponding testing head
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
KR102280651B1 (en) * 2018-12-26 2021-07-23 주식회사 아이에스시 Connector for electrical connection and manufacturing method thereof
KR20240027784A (en) 2021-06-30 2024-03-04 델타 디자인, 인코포레이티드 Temperature control system including contactor assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518358A1 (en) * 1981-12-10 1983-06-17 Everett Charles Inc Vacuum actuated test head having programming plate - has contact probes mounted in base with corresp. plate aligner
JPS6453429A (en) * 1987-08-24 1989-03-01 Mitsubishi Electric Corp Device for testing semiconductor chip
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JP2966671B2 (en) * 1991-11-18 1999-10-25 東京エレクトロン株式会社 Probe card
US5534784A (en) * 1994-05-02 1996-07-09 Motorola, Inc. Method for probing a semiconductor wafer
EP1610375A3 (en) * 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3022312B2 (en) * 1996-04-15 2000-03-21 日本電気株式会社 Method of manufacturing probe card
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits

Also Published As

Publication number Publication date
WO2001009623A1 (en) 2001-02-08
JP2003506686A (en) 2003-02-18
EP1200843A1 (en) 2002-05-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase