JP2016127115A5 - - Google Patents
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- JP2016127115A5 JP2016127115A5 JP2014266139A JP2014266139A JP2016127115A5 JP 2016127115 A5 JP2016127115 A5 JP 2016127115A5 JP 2014266139 A JP2014266139 A JP 2014266139A JP 2014266139 A JP2014266139 A JP 2014266139A JP 2016127115 A5 JP2016127115 A5 JP 2016127115A5
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- JP
- Japan
- Prior art keywords
- adhesive sheet
- semiconductor chips
- pressure
- sensitive adhesive
- interval
- Prior art date
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- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Description
本発明の一態様によれば、第一の粘着シートに貼付されたウエハをダイシングにより個片化し、複数の半導体チップを形成する工程と、前記第一の粘着シートを引き延ばして、前記複数の半導体チップ同士の間隔を拡げる工程と、前記複数の半導体チップを、第二の粘着シートに転写する工程と、前記第一の粘着シートを剥離する工程と、前記第二の粘着シートを引き延ばして、前記複数の半導体チップ同士の間隔をさらに拡げる工程と、を備える、半導体装置の製造方法を提供できる。 According to one aspect of the present invention, the step of dicing the wafer attached to the first pressure-sensitive adhesive sheet to form a plurality of semiconductor chips, and extending the first pressure-sensitive adhesive sheet, the plurality of semiconductors stretching a step of widening the interval between chips, the plurality of semiconductor chips, a step of transferring the second tacky Chakushi over preparative, a step of peeling the first adhesive sheet, the second adhesive sheet And a step of further widening the interval between the plurality of semiconductor chips.
本発明の一態様において、前記第二の粘着シートを引き延ばして、前記複数の半導体チップ同士の間隔を拡げた後、前記複数の半導体チップの回路面を残して封止部材で覆う工程をさらに備えることも好ましい。
この態様によれば、半導体チップの取り扱い性を低下させることなく複数の半導体チップ間の間隔を大きく拡げたうえで、封止部材で複数の半導体チップを覆うことができる。しかも、この態様によれば、個片化された半導体チップを、１個ずつ第一の粘着シートから別の粘着シートや支持体にピック・アンド・プレイスによって再配列することなく、封止部材で覆うことができる。それゆえ、この態様によれば、ＷＬＰの製造プロセスの工程を簡略化することができる。
1 aspect of this invention WHEREIN: After extending said 2nd adhesive sheet and expanding the space | interval of these semiconductor chips, it further includes the process of leaving the circuit surface of these semiconductor chips, and covering with a sealing member. It is also preferable.
According to this aspect, it is possible to cover the plurality of semiconductor chips with the sealing member after greatly increasing the interval between the plurality of semiconductor chips without reducing the handling of the semiconductor chips. Moreover, according to this aspect, the separated semiconductor chips can be sealed one by one with the sealing member without being rearranged by pick and place from the first adhesive sheet to another adhesive sheet or support. Can be covered. Soreyu example, according to this embodiment, it is possible to simplify the manufacturing process step of the WLP.
［第一のエキスパンド工程］
図１（Ｃ）には、複数の半導体チップＣＰを保持する第一の粘着シート１０を引き延ばす工程（第一のエキスパンド工程と称する場合がある。）を説明する図が示されている。
ダイシングにより複数の半導体チップＣＰに個片化した後、第一の粘着シート１０を引き延ばして、複数の半導体チップＣＰ間の間隔を拡げる。第一のエキスパンド工程において第一の粘着シート１０を引き延ばす方法は、特に限定されない。第一の粘着シート１０を引き延ばす方法としては、例えば、環状または円状のエキスパンダを押し当てて第一の粘着シート１０を引き延ばす方法や、把持部材などを用いて第一の粘着シート１０の外周部を掴んで引き延ばす方法などが挙げられる。
[First expanding process]
FIG. 1C shows a diagram illustrating a process of extending the first adhesive sheet 10 that holds a plurality of semiconductor chips CP (sometimes referred to as a first expanding process).
After dicing into several semiconductor chips CP by dicing, the 1st adhesive sheet 10 is extended and the space | interval between several semiconductor chips CP is expanded. The method for extending the first pressure-sensitive adhesive sheet 10 in the first expanding step is not particularly limited. Examples of the method of stretching the first pressure-sensitive adhesive sheet 10 include a method of stretching the first pressure-sensitive adhesive sheet 10 by pressing an annular or circular expander, and an outer periphery of the first pressure-sensitive adhesive sheet 10 using a gripping member or the like. For example, a method of grasping and extending the part.
Claims (1)
前記第一の粘着シートを引き延ばして、前記複数の半導体チップ同士の間隔を拡げる工程と、
前記複数の半導体チップを、第二の粘着シートに転写する工程と、
前記第一の粘着シートを剥離する工程と、
前記第二の粘着シートを引き延ばして、前記複数の半導体チップ同士の間隔をさらに拡げる工程と、を備える、半導体装置の製造方法。 Separating the wafer affixed to the first pressure-sensitive adhesive sheet by dicing and forming a plurality of semiconductor chips;
Extending the first pressure-sensitive adhesive sheet and widening the interval between the plurality of semiconductor chips; and
Said plurality of semiconductor chips, a step of transferring the second tacky Chakushi over preparative,
Peeling the first pressure-sensitive adhesive sheet;
Extending the second pressure-sensitive adhesive sheet to further increase the interval between the plurality of semiconductor chips.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014266139A JP6482865B2 (en) | 2014-12-26 | 2014-12-26 | Manufacturing method of semiconductor device |
| TW104143853A TWI676210B (en) | 2014-12-26 | 2015-12-25 | Semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014266139A JP6482865B2 (en) | 2014-12-26 | 2014-12-26 | Manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016127115A JP2016127115A (en) | 2016-07-11 |
| JP2016127115A5 true JP2016127115A5 (en) | 2017-11-16 |
| JP6482865B2 JP6482865B2 (en) | 2019-03-13 |
Family
ID=56358112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014266139A Active JP6482865B2 (en) | 2014-12-26 | 2014-12-26 | Manufacturing method of semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6482865B2 (en) |
| TW (1) | TWI676210B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102571926B1 (en) * | 2017-05-22 | 2023-08-28 | 가부시끼가이샤 레조낙 | Semiconductor device manufacturing method and expand tape |
| JP2019012714A (en) * | 2017-06-29 | 2019-01-24 | 株式会社ディスコ | Manufacturing method of semiconductor package |
| CN111295739B (en) * | 2017-11-16 | 2023-08-25 | 琳得科株式会社 | Method for manufacturing semiconductor device |
| KR102515684B1 (en) * | 2017-11-16 | 2023-03-30 | 린텍 가부시키가이샤 | Manufacturing method of semiconductor device |
| TWI785161B (en) * | 2017-12-07 | 2022-12-01 | 日商琳得科股份有限公司 | Adhesive laminate, method of using adhesive laminate, and method of manufacturing semiconductor device |
| JP7084228B2 (en) * | 2018-06-26 | 2022-06-14 | 日東電工株式会社 | Semiconductor device manufacturing method |
| JP7250468B6 (en) * | 2018-10-12 | 2023-04-25 | 三井化学株式会社 | Electronic device manufacturing method and adhesive film |
| KR102123419B1 (en) * | 2018-10-29 | 2020-06-17 | 한국기계연구원 | Sheet for controlling gap between device and method of controlling gap between device using the same |
| KR20210123318A (en) * | 2019-01-31 | 2021-10-13 | 린텍 가부시키가이샤 | Expand method and semiconductor device manufacturing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010058646A1 (en) * | 2008-11-21 | 2010-05-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Semiconductor package and method for manufacturing same |
| JP2011077235A (en) * | 2009-09-30 | 2011-04-14 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for retaining element, and method of manufacturing element |
| JP5350980B2 (en) * | 2009-11-02 | 2013-11-27 | シチズン電子株式会社 | LED element manufacturing method |
| JP5460374B2 (en) * | 2010-02-19 | 2014-04-02 | シチズン電子株式会社 | Manufacturing method of semiconductor device |
| WO2014002535A1 (en) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | Semiconductor device manufacturing method |
-
2014
- 2014-12-26 JP JP2014266139A patent/JP6482865B2/en active Active
-
2015
- 2015-12-25 TW TW104143853A patent/TWI676210B/en active
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