EP1880032A4 - Tin alloy solder compositions - Google Patents

Tin alloy solder compositions

Info

Publication number
EP1880032A4
EP1880032A4 EP06759560A EP06759560A EP1880032A4 EP 1880032 A4 EP1880032 A4 EP 1880032A4 EP 06759560 A EP06759560 A EP 06759560A EP 06759560 A EP06759560 A EP 06759560A EP 1880032 A4 EP1880032 A4 EP 1880032A4
Authority
EP
European Patent Office
Prior art keywords
alloy composition
lead
tin alloy
tin
alloy solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06759560A
Other languages
German (de)
French (fr)
Other versions
EP1880032A2 (en
Inventor
Karl F Seelig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMERICAN IRON&METAL Co Inc
American Iron & Metal Co
Original Assignee
AMERICAN IRON&METAL Co Inc
American Iron & Metal Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMERICAN IRON&METAL Co Inc, American Iron & Metal Co filed Critical AMERICAN IRON&METAL Co Inc
Publication of EP1880032A2 publication Critical patent/EP1880032A2/en
Publication of EP1880032A4 publication Critical patent/EP1880032A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5.0% antimony; about 85% to about 99% tin and about 0.002% to about 1% of either nickel or cobalt. The alloy composition has a melting temperature of about 217° C, with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
EP06759560A 2005-05-11 2006-05-11 Tin alloy solder compositions Withdrawn EP1880032A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67986905P 2005-05-11 2005-05-11
PCT/US2006/018235 WO2006122240A2 (en) 2005-05-11 2006-05-11 Tin alloy solder compositions

Publications (2)

Publication Number Publication Date
EP1880032A2 EP1880032A2 (en) 2008-01-23
EP1880032A4 true EP1880032A4 (en) 2009-03-04

Family

ID=37397305

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06759560A Withdrawn EP1880032A4 (en) 2005-05-11 2006-05-11 Tin alloy solder compositions

Country Status (5)

Country Link
US (1) US20060263234A1 (en)
EP (1) EP1880032A4 (en)
CA (1) CA2607286A1 (en)
MX (1) MX2007013971A (en)
WO (1) WO2006122240A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051181A1 (en) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. Lead-free solder alloy
CN101918170B (en) * 2008-01-03 2015-09-02 怡德乐纳斯公司 Solder wire construction
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
KR101436714B1 (en) * 2010-06-01 2014-09-01 센주긴조쿠고교 가부시키가이샤 No-clean lead-free solder paste
JP5878290B2 (en) * 2010-12-14 2016-03-08 株式会社日本スペリア社 Lead-free solder alloy
US11229979B2 (en) * 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN107635716B (en) * 2015-05-05 2021-05-25 铟泰公司 High reliability lead-free solder alloys for harsh environment electronic device applications
JP6292342B1 (en) * 2017-09-20 2018-03-14 千住金属工業株式会社 Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
CN109014652A (en) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 A kind of environment-friendly type soldering tin material and its preparation process
FR3101561B1 (en) * 2019-10-06 2023-09-22 Pruvost Jean Claude Lucien Lead-free solder alloy called SIA based on Sn and Bi and Cu and Ag additives limited to 1%.
CN114227057B (en) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 Lead-free solder alloy and preparation method and application thereof
WO2024101041A1 (en) * 2022-11-07 2024-05-16 富士電機株式会社 Solder material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (en) * 1993-04-29 1994-11-10 Seelig Karl F Lead-free and bismuth-free tin alloy solder composition
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
JP2004141910A (en) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd Lead-free solder alloy

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US5762716A (en) * 1997-01-09 1998-06-09 American Iron & Metal Company, Inc. Methods for wiping a metal contaminated surface with a water soluble fabric
KR20010072364A (en) * 1999-06-11 2001-07-31 이즈하라 요조 Lead-free solder

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (en) * 1993-04-29 1994-11-10 Seelig Karl F Lead-free and bismuth-free tin alloy solder composition
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
JP2004141910A (en) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd Lead-free solder alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KARIM Z S ET AL: "LEAD-FREE SOLDER BUMP TECHNOLOGIES FOR FLIP-CHIP PACKAGING APPLICATIONS", PROCEEDINGS OF THE SPIE, SPIE, vol. 4587, 9 November 2001 (2001-11-09), pages 581 - 587, XP008029398 *

Also Published As

Publication number Publication date
EP1880032A2 (en) 2008-01-23
MX2007013971A (en) 2008-02-22
WO2006122240A3 (en) 2007-02-01
US20060263234A1 (en) 2006-11-23
CA2607286A1 (en) 2006-11-16
WO2006122240A2 (en) 2006-11-16

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20070919

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20090130

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 13/02 20060101AFI20070110BHEP

Ipc: B23K 35/26 20060101ALI20090126BHEP

Ipc: C22C 13/00 20060101ALI20090126BHEP

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20090428