JP2011156558A - Lead-free solder alloy - Google Patents

Lead-free solder alloy Download PDF

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JP2011156558A
JP2011156558A JP2010019819A JP2010019819A JP2011156558A JP 2011156558 A JP2011156558 A JP 2011156558A JP 2010019819 A JP2010019819 A JP 2010019819A JP 2010019819 A JP2010019819 A JP 2010019819A JP 2011156558 A JP2011156558 A JP 2011156558A
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solder
lead
solder alloy
free solder
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Tetsuro Nishimura
西村哲郎
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Nihon Superior Sha Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide at a low cost a lead-free solder alloy enabling solder joining with high reliability though widely coping with objects to be solder-joined without containing lead. <P>SOLUTION: The lead-free solder alloy has high solder joining characteristics with a metal electrode on glass in addition to metal materials of Cu, Ni or the like to be a material of a solder joining part of a conventional electronic part and a print substrate by using an Sn-Zn-Mn lead-free solder alloy formed of 0.01-10 wt.% of Zn, ≤0.1 wt.% of Mn (not including zero as a lower limit value in the range), and a balance Sn. The solder joining characteristics with aluminum or solder joining strength is remarkably improved by adding ≤3.5 wt.% of Ag (not including zero as a lower limit value in a range) and further 0.01-25 wt.% of Bi and 0.1-10 wt.% of Sb to the composition. The lead-free solder has improved solder joining characteristics of joining strength, fluidity of solder, anti-oxidizing effect or the like by totally containing 0.001-1 wt.% of at least one or more elements selected from Ni, Ge, Ga, Al and Si, so that the solder joining excellent in the solder characteristics and having the high reliability is provided. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、鉛フリーはんだに関し、詳しくはＳｎ−Ｚｎ−Ｍｎを基本組成とする鉛フリーはんだ合金及びそのはんだ合金を用いたはんだ接合に関する。 The present invention relates to a lead-free solder, and more particularly to a lead-free solder alloy having a basic composition of Sn—Zn—Mn and a solder joint using the solder alloy.

近年、地球環境保護の観点より、環境に有害な鉛を含まないはんだ合金が広く用いられるようになってきている。例えば、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｚｎ系、Ｓｎ−Ａｇ−Ｂｉ系、Ｓｎ−Ｓｂ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ｉｎ系、Ａｌ-Ｓｉ系、Ｂｉ-Ｚｎ系の鉛フリーはんだ合金、及びそれら鉛フリーはんだ合金にＮｉ、Ｃｏ、Ｇｅ、Ｇａ、Ｃｒ、Ｐ、Ｓｉ、Ｔｉ、Ｖ、Ｍｎ、Ｆｅ、Ｚｒ、Ｎｂ、Ｍｏ、Ｐｄ、Ｔｅ、Ｐｔ、Ａｕ等を適宜添加した鉛フリーはんだ合金が提案され実用化が進んでいる。 In recent years, solder alloys not containing lead harmful to the environment have been widely used from the viewpoint of protecting the global environment. For example, Sn-Cu system, Sn-Ag system, Sn-Ag-Cu system, Sn-Zn system, Sn-Ag-Bi system, Sn-Sb system, Sn-Bi system, Sn-In system, Al-Si system Bi-Zn based lead-free solder alloys, and lead-free solder alloys such as Ni, Co, Ge, Ga, Cr, P, Si, Ti, V, Mn, Fe, Zr, Nb, Mo, Pd, Te, Lead-free solder alloys with appropriate addition of Pt, Au, etc. have been proposed and put into practical use.

例えば、プリント基板と電子部品の接合にはＳｎ−Ａｇ−Ｃｕ系鉛フリーはんだ合金（例えば、特許文献１。）やＳｎ−Ｃｕ系にＮｉを添加したＳｎ−Ｃｕ−Ｎｉ鉛フリーはんだ合金（例えば、特許文献２。）の鉛フリーはんだ合金が、アルミニウムのはんだ接合にはＳｎ−Ｚｎ系（例えば、特許文献３。）、太陽電池等のシリコン基板やガラス上の銀等の電極を対象としたはんだ接合にはＳｎ−Ａｇ−Ｂｉ系（例えば、特許文献４。）はんだ合金が提案されており、はんだ接合の信頼性、はんだ接合特性、使用性、コスト、はんだ接合物の材質等の要素に合ったはんだ合金が選択されている。 For example, an Sn-Ag-Cu-based lead-free solder alloy (for example, Patent Document 1) or a Sn-Cu-Ni lead-free solder alloy in which Ni is added to a Sn-Cu-based solder (for example, Patent Document 1) The lead-free solder alloy of Patent Literature 2) is intended for Sn-Zn-based (for example, Patent Literature 3), aluminum substrates such as solar cells, and electrodes such as silver on glass for solder bonding of aluminum. Sn-Ag-Bi-based (for example, Patent Document 4) solder alloys have been proposed for solder joints, which include factors such as solder joint reliability, solder joint characteristics, usability, cost, and solder joint materials. A matching solder alloy is selected.

一方、はんだ接合において、高い信頼性と優れたはんだ接合特性及び使用性を有し、低コストで提供可能な鉛フリーはんだ合金の開発も強く望まれている。
特許文献１は、現在、鉛フリーはんだを代表する組成であるが、高価なＡｇを含有することからメタルコストが高いことやアルミニウムやガラス上の金属電極へのはんだ接合に対して接合特性に課題を残している。
また、特許文献２は、特許文献１同様に鉛フリーはんだを代表する組成であり、プリント基板等への高いはんだ接合特性を有することや特許文献１の組成と比較して安価なこともあり近年急速に普及しているが、アルミニウムやガラス上の金属電極へのはんだ接合に対して、より使いやすいはんだ接合特性が求められている。
そして、特許文献３は、アルミニウムへの接合に対応した組成であるが、プリント基板等一般のはんだ接合に用いる場合に課題を残している。特許文献４は、太陽電池用セル接続用のはんだ合金でシリコン基板上の銀電極をコーティングして接続するためのものであるが、接合強度及び耐久性に課題を残している。
以上のように、ＣｕやＮｉ等の電子部品に使用されている材質やアルミニウムを含む多様な金属に対応し、かつ、太陽電池や車載リアガラス等にみられるシリコン基板上やガラス上の金属電極等に対しても良好なはんだ接合特性及び使用性を有する低コストの鉛フリーはんだ合金は、見当たらないのが現状である。 On the other hand, in solder joints, development of a lead-free solder alloy that has high reliability, excellent solder joint characteristics and usability, and can be provided at low cost is also strongly desired.
Patent Document 1 is a composition that represents lead-free solder at present, but because it contains expensive Ag, the metal cost is high, and there is a problem in bonding characteristics with respect to solder bonding to a metal electrode on aluminum or glass. Is leaving.
In addition, Patent Document 2 is a composition that represents lead-free solder, as in Patent Document 1, and has a high solder joint property to a printed circuit board or the like, and may be less expensive than the composition of Patent Document 1 in recent years. Although rapidly spreading, there is a need for solder joint characteristics that are easier to use for solder joints to metal electrodes on aluminum or glass.
And although patent document 3 is a composition corresponding to the joining to aluminum, the subject remains, when using for general solder joining, such as a printed circuit board. Patent Document 4 is for connecting a silver electrode on a silicon substrate with a solder alloy for connecting a cell for a solar battery, but has problems in bonding strength and durability.
As described above, it corresponds to various metals including aluminum and materials used for electronic parts such as Cu and Ni, and is a metal electrode on a silicon substrate or glass found in a solar cell or an in-vehicle rear glass. However, there is currently no low-cost lead-free solder alloy having good solder joint characteristics and usability.

特許第３０２７４４１号公報Japanese Patent No. 3027441 特許第３１５２９４５号公報Japanese Patent No. 3152945 特開平７−９６３８７号公報JP-A-7-96387 特開２００２−２１７４３４号公報JP 2002-217434 A 特開２００６−６１９１４号公報JP 2006-61914 A 特許第４１４４４１５号公報Japanese Patent No. 4144415 特公平４−６４７６号公報Japanese Patent Publication No. 4-6476 特開２００３−１８８５２９号公報JP 2003-188529 A

本発明の目的は、前記事情に鑑み、鉛を含有することなく、はんだ接合対象物に広く対応可能でありながら、高い信頼性を有したはんだ接合を可能とする鉛フリーはんだ合金を低コストにて提供することである。   In view of the above circumstances, the object of the present invention is to provide a lead-free solder alloy that can be widely used for solder joints without containing lead and that enables highly reliable solder joints at low cost. Is to provide.

本発明の課題を解決すべく発明者は鋭意検討した結果、Ｚｎを０．０１〜１０重量％、Ｍｎを０．１重量％以下（範囲下限値の零を含まず）、残部がＳｎからなるＳｎ−Ｚｎ−Ｍｎ鉛フリーはんだ合金を用いることにより、従来の電子部品とプリント基板のはんだ接合部の材質であるＣｕやＮｉ等の金属材質に加えて、ガラス上の金属電極に対する高いはんだ接合特性を有することを見いだし、本発明の完成に至った。 As a result of intensive studies by the inventors to solve the problems of the present invention, Zn is 0.01 to 10% by weight, Mn is 0.1% by weight or less (not including the lower limit of zero), and the balance is Sn. By using Sn-Zn-Mn lead-free solder alloy, in addition to conventional metal parts such as Cu and Ni, which are materials for solder joints of printed circuit boards, high solder joint properties for metal electrodes on glass As a result, the present invention has been completed.

そして、上記組成に３．５重量％以下（範囲下限値の零を含まず）のＡｇ、更に０.０１〜２５重量％のＢｉ、及び０．１〜１０重量％のＳｂを添加することにより、アルミニウムとのはんだ接合特性やはんだ接合強度が著しく向上する。更に、Ｎｉ、Ｇｅ、Ｇａ、Ａｌ、及びＳｉから選ばれる少なくとも一種類以上を合計で０．００１〜１重量％含有することにより、接合強度向上、はんだの流動性向上、酸化防止効果向上等のはんだ接合特性の向上を有する。 By adding 3.5 wt% or less (not including the lower limit of zero) Ag, 0.01 to 25 wt% Bi, and 0.1 to 10 wt% Sb to the above composition The solder joint characteristics and solder joint strength with aluminum are remarkably improved. Furthermore, by containing 0.001 to 1% by weight in total of at least one selected from Ni, Ge, Ga, Al, and Si, it is possible to improve joint strength, improve solder fluidity, improve antioxidant effect, etc. Has improved solder joint characteristics.

本発明のはんだ合金は、鉛を含有しない組成から構成されるため、環境に配慮したはんだ接合の提供を可能とすることは勿論のこと、アルミニウムを含む多様な種類の金属やシリコンやガラス上の金属電極等に、高い信頼性を有するはんだ接合が可能である。従来の電子部品のはんだ接合に加え、アルミニウムの接合、太陽電池やＬＥＤ等を対象物としたはんだ接合にも応用が可能となる。 Since the solder alloy of the present invention is composed of a composition that does not contain lead, it is possible to provide environment-friendly solder joints as well as various types of metals including aluminum, silicon, and glass. A highly reliable solder joint can be applied to a metal electrode or the like. In addition to the conventional solder joining of electronic components, the present invention can be applied to aluminum joining, solder joining for solar cells, LEDs, and the like.

本発明の鉛フリーはんだ合金を用いて、ガラス上の金属電極をはんだ接合したときのはんだ接合部を示すモデル図。The model figure which shows the solder joint part when the metal electrode on glass is solder-joined using the lead-free solder alloy of this invention. 本発明の鉛フリーはんだ合金を用いて、アルミニウムをはんだ接合したときのはんだ接合部を示すモデル図。The model figure which shows a solder joint part when aluminum is solder-joined using the lead-free solder alloy of this invention. 「Ｓｎ−Ｍｎ」２成分状態図。“Sn—Mn” two-component phase diagram. 本発明のＳｎ−Ｚｎ−Ｍｎはんだ合金とガラス上の銀電極とのはんだ接合部分の断面の顕微鏡写真。The microscope picture of the cross section of the solder joint part of the Sn-Zn-Mn solder alloy of this invention and the silver electrode on glass. Ｓｎ-Ｃｕ-Ｍｎはんだ合金とＳｎ-Ｃｕはんだ合金による銅とのはんだ接合部分の断面の電子顕微鏡写真。The electron micrograph of the cross section of the solder joint part of Sn-Cu-Mn solder alloy and copper by Sn-Cu solder alloy.

以下に本発明のはんだ材料について詳細に説明する。
本発明の鉛フリーはんだ合金は、Ｚｎを０．０１〜１０重量％、Ｍｎを０．１重量％以下（範囲下限値の零を含まず）、残部がＳｎからなるＳｎ−Ｚｎ−Ｍｎを基本組成とし、３．５重量％以下（範囲下限値の零を含まず）のＡｇを添加した組成、更に、０．０１〜２５重量％のＢｉ添加した組成、そして、前記組成に０．１〜３重量％のＣｕ、０．００１〜１重量％のＮｉ、及び０．１〜１０重量％のＳｂから選ばれる少なくとも一種以上を添加した組成、更に、Ｇｅ、Ｇａ、Ａｌ、及びＳｉから選ばれる少なくとも一種類以上を合計で０．００１〜１重量％を添加した組成よりなる其々の鉛フリーはんだ合金である。 The solder material of the present invention will be described in detail below.
The lead-free solder alloy of the present invention is based on Sn—Zn—Mn, which consists of 0.01 to 10% by weight of Zn, 0.1% by weight or less of Mn (not including the lower limit of zero), and the balance being Sn. A composition in which 3.5% by weight or less (not including the lower limit of zero) of Ag is added, a composition in which 0.01 to 25% by weight of Bi is added, and 0.1 to 0.1% in the composition. A composition in which at least one selected from 3% by weight of Cu, 0.001 to 1% by weight of Ni, and 0.1 to 10% by weight of Sb is added, and further selected from Ge, Ga, Al, and Si. Each lead-free solder alloy having a composition in which at least one kind or more is added in total in an amount of 0.001 to 1% by weight.

ところで、ＺｎやＭｎを含有した鉛フリー合金には、特許文献５〜特許文献８が提案されている。特許文献５は、半田ごてのこて先の劣化を防止するはんだ合金に関するもので、Ｓｎ−Ｃｕ−Ｆｅ−Ｇａを基本組成とし、機械的特性を改善する目的でＭｎやＡｇ等を選択して添加するものである。特許文献６は、電子機器のはんだ付け用のはんだ合金に関するもので、Ｓｎ−Ａｇ−Ｃｕの基本組成にＰ、Ｇｅ、Ａｌ、Ｓｉの各成分を選択して配合し、更にＭｎを添加した組成であり、耐ヒートサイクル向上を目的としているものである。特許文献７は、低融点銀ろう材に関するもので、Ｚｎ−Ａｇ−Ｍｎ−Ｓｎ−Ｎｉ−Ｃｕを基本組成として、銀含有量が少ないろう材に関するものである。特許文献８は、鉛フリー高温はんだに関するもので、Ｓｎ−Ｚｎを基本組成としてＭｎ、Ａｌ及びＡｇを選択して添加するものである。 By the way, Patent Literature 5 to Patent Literature 8 have been proposed for lead-free alloys containing Zn and Mn. Patent Document 5 relates to a solder alloy that prevents the deterioration of the tip of the soldering iron. Sn-Cu-Fe-Ga is used as a basic composition, and Mn, Ag, or the like is selected for the purpose of improving mechanical properties. To be added. Patent Document 6 relates to a solder alloy for soldering electronic devices. A composition in which each component of P, Ge, Al, and Si is selected and blended with a basic composition of Sn—Ag—Cu, and Mn is further added. It is intended to improve heat cycle resistance. Patent Document 7 relates to a low-melting-point silver brazing material, and relates to a brazing material having a small silver content with Zn-Ag-Mn-Sn-Ni-Cu as a basic composition. Patent Document 8 relates to a lead-free high-temperature solder, and selects and adds Mn, Al, and Ag with Sn—Zn as a basic composition.

特許文献５〜８は、特許文献５がＳｎ−Ｃｕ−Ｆｅ−ＧａにＭｎを添加した成分、特許文献６がＳｎ−Ａｇ−Ｃｕの基本組成にＰ、Ｇｅ、Ａｌ、Ｓｉの各成分を選択して配合し、更にＭｎを添加した組成からなる成分、特許文献７がＺｎ−Ａｇ−Ｍｎ−Ｓｎ−Ｎｉ−Ｃｕからなる成分、特許文献８がＳｎ−Ｚｎに２０〜４０重量％のＭｎを添加した組成からなる成分である。また、特許文献５〜８は、発明の効果も本発明と大きく異なるものであり、当該先行特許を基に本発明を想定することは困難である。 Patent Documents 5 to 8 select a component in which Mn is added to Sn-Cu-Fe-Ga in Patent Document 5 and each component of P, Ge, Al, and Si is selected as a basic composition of Sn-Ag-Cu in Patent Document 6 In addition, a component composed of a composition in which Mn is added, Patent Document 7 is a component composed of Zn-Ag-Mn-Sn-Ni-Cu, and Patent Document 8 is composed of 20 to 40 wt% Mn in Sn-Zn. It is a component consisting of the added composition. In addition, Patent Documents 5 to 8 are greatly different from the present invention in the effects of the invention, and it is difficult to assume the present invention based on the prior patents.

一方、本発明の鉛フリーはんだ合金は、はんだ接合の際、図１に示すモデル図の状態ではんだ接合していると考えられる。例えば、ガラス上（１）の金属電極（４）がＡｇの場合、電極とはんだ合金の界面に主にＡｇ−Ｚｎ組成からなる金属間化合物（２）が形成され、ガラス上（１）の金属電極（４）がＣｕの場合、電極とはんだ合金の界面に主にＣｕ−Ｚｎ組成からなる金属間化合物（２）が形成される。このように電極とはんだ合金の界面に安定した金属間化合物が形成されることにより、はんだ接合の強度が著しく向上する。
また、Ｓｎ−Ｚｎ−Ｍｎの基本組成にＡｇを添加した本発明鉛フリーはんだ合金を用いてアルミニウムを接合した場合、図２に示すモデル図の状態ではんだ接合していると考えられる。すなわち、アルミニウム（７）とはんだ合金（３）の界面に主にＡｇ−Ｚｎ組成からなる金属間化合物（２）が形成され、強固なはんだ接合が可能となる。
そして、Ｍｎの添加によって、はんだ接合界面に形成する金属間化合物の安定化に寄与する。例えば、金属化合物（５）やはんだ合金中（３）のＳｎ等の粒径が微細化することによって、衝撃等の瞬間的な強度とクリープ強度が向上し、優れた効果を有すると考えられる。 On the other hand, the lead-free solder alloy of the present invention is considered to be soldered in the state of the model diagram shown in FIG. For example, when the metal electrode (4) on the glass (1) is Ag, an intermetallic compound (2) mainly composed of an Ag—Zn composition is formed at the interface between the electrode and the solder alloy, and the metal on the glass (1). When the electrode (4) is Cu, an intermetallic compound (2) mainly composed of a Cu—Zn composition is formed at the interface between the electrode and the solder alloy. Thus, by forming a stable intermetallic compound at the interface between the electrode and the solder alloy, the strength of the solder joint is remarkably improved.
In addition, when aluminum is bonded using the lead-free solder alloy of the present invention in which Ag is added to the basic composition of Sn—Zn—Mn, it is considered that the solder is bonded in the state of the model diagram shown in FIG. That is, the intermetallic compound (2) mainly composed of an Ag—Zn composition is formed at the interface between the aluminum (7) and the solder alloy (3), and a strong solder joint is possible.
The addition of Mn contributes to stabilization of the intermetallic compound formed at the solder joint interface. For example, when the particle size of Sn or the like in the metal compound (5) or the solder alloy (3) is reduced, the instantaneous strength such as impact and the creep strength are improved, and it is considered that there is an excellent effect.

本発明の鉛フリーはんだ合金の基本構成成分であるＺｎは、添加量が０．０１〜１０重量％の範囲であれば本発明の効果を有し、好ましい範囲は１〜１０重量％である。また、Ｍｎに関して、添加量が０．１重量％以下（範囲下限値の零を含まず）であれば本発明の効果を有し、好ましい範囲は０．００１〜０．０５重量％である。Ｍｎの添加量を０．１重量％以下とした理由は、図３に示すＳｎ−Ｍｎ２成分状態図にあるように、急激に液相線温度が上昇し、はんだ付けの作業性が低下する場合が発生するためである。また、Ｍｎの添加量が０．００１〜０．０５重量％の場合、上述したように、はんだ粒子の微細化が顕著となり、その結果、はんだ接合部の結晶構造が安定化し、はんだ接合強度が向上すると考えられる。 Zn, which is a basic component of the lead-free solder alloy of the present invention, has the effect of the present invention when the addition amount is in the range of 0.01 to 10% by weight, and the preferred range is 1 to 10% by weight. Moreover, regarding Mn, if the addition amount is 0.1% by weight or less (not including zero of the lower limit of the range), the effect of the present invention is obtained, and a preferable range is 0.001 to 0.05% by weight. The reason why the amount of Mn added is 0.1% by weight or less is that, as shown in the Sn—Mn2 component phase diagram shown in FIG. 3, the liquidus temperature suddenly increases and the soldering workability decreases. This is because of this. Further, when the amount of Mn added is 0.001 to 0.05% by weight, as described above, the refinement of the solder particles becomes remarkable, and as a result, the crystal structure of the solder joint is stabilized, and the solder joint strength is increased. It is thought to improve.

更に、本発明の鉛フリーはんだ合金の基本組成であるＳｎ−Ｚｎ−Ｍｎに３．５重量％以下（範囲下限値の零を含まず）のＡｇを添加した場合は、前記の如くアルミニウムとの接合特性が著しく向上する。更に０．０１〜２５重量％のＢｉ添加した場合はガルバニック腐食を抑制する効果が向上する。そして、前記組成に０．１〜３重量％のＣｕを添加した場合は金属間化合物の形成が促進されはんだ接合強度が向上する。０．００１〜１重量％のＮｉを添加した場合ははんだの溶解時の流動性が向上してはんだ付け不良が減少する。０．１〜１０重量％のＳｂを添加した場合ははんだ接合部の強度が向上する。更に、Ｇｅ、Ｇａ、Ａｌ及びＳｉから選ばれる少なくとも一種類以上を合計で０．００１〜１重量％含有することにより、Ｇｅ、Ｇａ、Ｓｉの場合ははんだの酸化が防止されドロスの発生が抑制され、Ａｌの場合はアルミニウムへの接合特性が一層向上する。 Further, when Ag of 3.5 wt% or less (not including the lower limit of zero) is added to Sn—Zn—Mn, which is the basic composition of the lead-free solder alloy of the present invention, as described above, Bonding characteristics are significantly improved. Further, when 0.01 to 25% by weight of Bi is added, the effect of suppressing galvanic corrosion is improved. And when 0.1 to 3 weight% of Cu is added to the said composition, formation of an intermetallic compound is accelerated | stimulated and solder joint strength improves. When 0.001 to 1% by weight of Ni is added, the fluidity at the time of melting of the solder is improved and soldering defects are reduced. When 0.1 to 10% by weight of Sb is added, the strength of the solder joint is improved. Furthermore, by containing 0.001 to 1% by weight in total of at least one selected from Ge, Ga, Al and Si, in the case of Ge, Ga and Si, the oxidation of the solder is prevented and the generation of dross is suppressed. In the case of Al, the bonding characteristics to aluminum are further improved.

そして、本発明の鉛フリーはんだ合金は、本発明の効果を損なわない範囲においてその他の成分を任意な範囲において添加しても構わない。
また、本発明の鉛フリーはんだ合金を用いて、任意の形状に加工することも可能であり、例えば、はんだペースト、中央部にフラックスを包接して線状に加工した線状はんだ、プリフォーム、ボールはんだ等が例示できる。 And the lead-free solder alloy of this invention may add another component in arbitrary ranges in the range which does not impair the effect of this invention.
Further, using the lead-free solder alloy of the present invention, it is also possible to process into any shape, for example, solder paste, linear solder that is processed into a linear shape by enclosing flux in the center, a preform, A ball solder etc. can be illustrated.

本発明の鉛フリーはんだは、従来のフローはんだ付け及びリフローはんだ付けは勿論のこと、超音波はんだ付けにも対応が可能である。 The lead-free solder of the present invention can cope with ultrasonic soldering as well as conventional flow soldering and reflow soldering.

なお、本発明の鉛フリーはんだ合金を用いてはんだ接合を行なったはんだ継手も本発明の対象である。 In addition, the solder joint which solder-joined using the lead-free solder alloy of this invention is also the object of this invention.

図４に、本発明のＳｎ−Ｚｎ−Ｍｎはんだ合金とガラス上の銀電極とのはんだ接合部分の断面の顕微鏡写真を示す。ガラス上の銀電極とはんだ合金の接合界面に金属間化合物が形成されていることが確認できる。 In FIG. 4, the microscope picture of the cross section of the solder joint part of the Sn-Zn-Mn solder alloy of this invention and the silver electrode on glass is shown. It can be confirmed that an intermetallic compound is formed at the bonding interface between the silver electrode on the glass and the solder alloy.

図５は、Ｓｎ-０．９Ｃｕはんだ合金及びＳｎ-０．９Ｃｕはんだ合金に０．００２重量％のＭｎを添加したＳｎ-０．９Ｃｕ-０．００２Ｍｎはんだ合金を用いてはんだ付けをしたはんだ接合部の断面の顕微鏡写真組成である。形成した金属間化合物を比較すると、Ｓｎ-０．９Ｃｕはんだ合金の場合は金属間化合物がはんだ層にも広く点在し、また、クラックの発生も確認できる。それに対して、本発明の鉛フリーはんだ合金の構成成分であるＭｎを添加したＳｎ-０．９Ｃｕ-０．００２Ｍｎはんだ合金の場合は金属間化合物がはんだ層に広く点在しておらず接合界面に集中しており、クラックの発生も少ない。以上のことから、Ｍｎ添加により、Ｓｎ-０．９Ｃｕ-０．００２Ｍｎ組成のはんだ合金はＳｎ-０．９Ｃｕ組成のはんだ合金よりも、はんだ接合界面が安定していることが分かる。 FIG. 5 shows a solder joint in which Sn-0.9Cu-0.002Mn solder alloy obtained by adding 0.002% by weight of Mn to Sn-0.9Cu solder alloy and Sn-0.9Cu solder alloy is soldered. It is a microscope picture composition of the cross section of a part. When the formed intermetallic compounds are compared, in the case of Sn-0.9Cu solder alloy, the intermetallic compounds are widely scattered in the solder layer, and the occurrence of cracks can also be confirmed. On the other hand, in the case of Sn-0.9Cu-0.002Mn solder alloy to which Mn, which is a component of the lead-free solder alloy of the present invention, is added, the intermetallic compound is not widely scattered in the solder layer and the bonding interface There are few cracks. From the above, it can be seen that by adding Mn, the solder joint interface of the Sn-0.9Cu-0.002Mn composition is more stable than that of the Sn-0.9Cu composition.

１ ガラス
２ 金属間化合物
３ はんだ層
４ 金属電極
５ 金属化合物
６ Ｓｎ
７ アルミニウム
1 Glass 2 Intermetallic Compound 3 Solder Layer 4 Metal Electrode 5 Metal Compound 6 Sn
7 Aluminum

Claims (6)

Ｚｎを０．０１〜１０重量％、Ｍｎを０．１重量％以下（範囲下限値の零を含まず）、残部Ｓｎ及び不可避不純物からなることを特徴とする鉛フリーはんだ合金。 A lead-free solder alloy comprising 0.01 to 10% by weight of Zn, 0.1% by weight or less of Mn (not including the lower limit of zero), the remainder Sn and inevitable impurities. ３．５重量％以下（範囲下限値の零を含まず）のＡｇを添加したことを特徴とする請求項１記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1, wherein 3.5% by weight or less of Ag (not including the lower limit of zero) is added. ０．０１〜２５重量％のＢｉ添加したことを特徴とする請求項１〜請求項２記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1, wherein 0.01 to 25% by weight of Bi is added. ０．１〜３重量％のＣｕ、０．００１〜１重量％のＮｉ、及び０．１〜１０重量％のＳｂから選ばれる少なくとも一種以上を添加することを特徴とする請求項１〜請求項３記載の鉛フリーはんだ合金。 At least one selected from 0.1 to 3% by weight of Cu, 0.001 to 1% by weight of Ni, and 0.1 to 10% by weight of Sb is added. The lead-free solder alloy according to 3. Ｇｅ、Ｇａ、Ａｌ、及びＳｉから選ばれる少なくとも一種類以上を合計で０．００１〜１重量％含有することを特徴とする請求項１〜請求項４記載の鉛フリーはんだ合金。 5. The lead-free solder alloy according to claim 1, wherein the lead-free solder alloy contains 0.001 to 1 wt% in total of at least one selected from Ge, Ga, Al, and Si. 請求項１〜請求項５記載の鉛フリーはんだを用いてはんだ付けを行なったはんだ継手。


The solder joint which soldered using the lead-free solder of Claims 1-5.


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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012245554A (en) * 2011-05-30 2012-12-13 Hitachi Cable Ltd Pb-FREE SOLDER, SOLDER-COVERED CONDUCTOR, AND ELECTRICAL COMPONENT USING THE CONDUCTOR
WO2014142153A1 (en) 2013-03-13 2014-09-18 株式会社日本スペリア社 Solder alloy and joint thereof
EP2839920A4 (en) * 2012-04-18 2015-12-09 Senju Metal Industry Co Solder alloy
WO2016119096A1 (en) * 2015-01-29 2016-08-04 苏州天兼新材料科技有限公司 Lead-free welding material and method for preparing scaling powder thereof
JP2017094368A (en) * 2015-11-26 2017-06-01 株式会社リソー技研 Solder for enamel-coated electric cable, and soldering method for enamel-coated electric cable
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
CN110402181A (en) * 2018-12-13 2019-11-01 北京联金高新科技有限公司 SnZn series lead-free solder and preparation method thereof
CN111843279A (en) * 2020-07-22 2020-10-30 昆山市宏嘉焊锡制造有限公司 High-temperature oxidation-resistant SnSbCu lead-free solder
CN112342417A (en) * 2020-11-17 2021-02-09 昆明理工大学 Tin-based solder and preparation method thereof
CN112752630A (en) * 2018-08-10 2021-05-04 日本斯倍利亚社股份有限公司 Lead-free solder alloy

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015478A (en) * 1998-06-30 2000-01-18 Toshiba Corp Soldering material
JP2002018589A (en) * 2000-07-03 2002-01-22 Senju Metal Ind Co Ltd Lead-free solder alloy
JP2002248596A (en) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd Leadless solder ball excellent in oxidation resistance
JP2006289493A (en) * 2005-03-17 2006-10-26 Tamura Kaken Co Ltd Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate
JP2007299722A (en) * 2006-04-06 2007-11-15 Hitachi Cable Ltd Wiring conductor, its manufacturing method, terminal connection part, and pb-free solder alloy

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015478A (en) * 1998-06-30 2000-01-18 Toshiba Corp Soldering material
JP2002018589A (en) * 2000-07-03 2002-01-22 Senju Metal Ind Co Ltd Lead-free solder alloy
JP2002248596A (en) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd Leadless solder ball excellent in oxidation resistance
JP2006289493A (en) * 2005-03-17 2006-10-26 Tamura Kaken Co Ltd Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate
JP2007299722A (en) * 2006-04-06 2007-11-15 Hitachi Cable Ltd Wiring conductor, its manufacturing method, terminal connection part, and pb-free solder alloy

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012245554A (en) * 2011-05-30 2012-12-13 Hitachi Cable Ltd Pb-FREE SOLDER, SOLDER-COVERED CONDUCTOR, AND ELECTRICAL COMPONENT USING THE CONDUCTOR
US10661393B2 (en) 2011-08-17 2020-05-26 Honeywell International Inc. Lead-free solder compositions
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
US9808890B2 (en) 2012-04-18 2017-11-07 Senju Metal Industry Co., Ltd. Solder alloy
EP2839920A4 (en) * 2012-04-18 2015-12-09 Senju Metal Industry Co Solder alloy
WO2014142153A1 (en) 2013-03-13 2014-09-18 株式会社日本スペリア社 Solder alloy and joint thereof
EP2974818A4 (en) * 2013-03-13 2016-09-28 Nihon Superior Co Ltd Solder alloy and joint thereof
JPWO2014142153A1 (en) * 2013-03-13 2017-02-16 株式会社日本スペリア社 Solder joint and solder joint method
CN105189003A (en) * 2013-03-13 2015-12-23 日本斯倍利亚社股份有限公司 Solder alloy and joint thereof
US10329642B2 (en) 2013-03-13 2019-06-25 Nihon Superior Co., Ltd. Solder alloy and joint thereof
WO2016119096A1 (en) * 2015-01-29 2016-08-04 苏州天兼新材料科技有限公司 Lead-free welding material and method for preparing scaling powder thereof
JP2017094368A (en) * 2015-11-26 2017-06-01 株式会社リソー技研 Solder for enamel-coated electric cable, and soldering method for enamel-coated electric cable
CN112752630A (en) * 2018-08-10 2021-05-04 日本斯倍利亚社股份有限公司 Lead-free solder alloy
CN110402181A (en) * 2018-12-13 2019-11-01 北京联金高新科技有限公司 SnZn series lead-free solder and preparation method thereof
CN111843279A (en) * 2020-07-22 2020-10-30 昆山市宏嘉焊锡制造有限公司 High-temperature oxidation-resistant SnSbCu lead-free solder
CN112342417A (en) * 2020-11-17 2021-02-09 昆明理工大学 Tin-based solder and preparation method thereof
CN112342417B (en) * 2020-11-17 2022-03-15 昆明理工大学 Tin-based solder and preparation method thereof

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