EP1824638A4 - Alliage de soudure sans plomb - Google Patents

Alliage de soudure sans plomb

Info

Publication number
EP1824638A4
EP1824638A4 EP05726536A EP05726536A EP1824638A4 EP 1824638 A4 EP1824638 A4 EP 1824638A4 EP 05726536 A EP05726536 A EP 05726536A EP 05726536 A EP05726536 A EP 05726536A EP 1824638 A4 EP1824638 A4 EP 1824638A4
Authority
EP
European Patent Office
Prior art keywords
free solder
solder alloy
alloy
free
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05726536A
Other languages
German (de)
English (en)
Other versions
EP1824638A1 (fr
Inventor
Back Ki Sung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP1824638A1 publication Critical patent/EP1824638A1/fr
Publication of EP1824638A4 publication Critical patent/EP1824638A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP05726536A 2004-11-13 2005-02-02 Alliage de soudure sans plomb Withdrawn EP1824638A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040092857A KR20050030237A (ko) 2004-11-13 2004-11-13 무연 솔더 합금
PCT/KR2005/000305 WO2006052049A1 (fr) 2004-11-13 2005-02-02 Alliage de soudure sans plomb

Publications (2)

Publication Number Publication Date
EP1824638A1 EP1824638A1 (fr) 2007-08-29
EP1824638A4 true EP1824638A4 (fr) 2009-07-08

Family

ID=36336697

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05726536A Withdrawn EP1824638A4 (fr) 2004-11-13 2005-02-02 Alliage de soudure sans plomb

Country Status (6)

Country Link
US (1) US20090129970A1 (fr)
EP (1) EP1824638A4 (fr)
JP (1) JP2008518791A (fr)
KR (1) KR20050030237A (fr)
CN (1) CN101048258A (fr)
WO (1) WO2006052049A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
CN101356293B (zh) * 2006-01-10 2010-12-29 伊利诺斯工具制品有限公司 低铜溶解的无铅焊料
CN1803381A (zh) * 2006-01-11 2006-07-19 黄守友 无铅焊料及其制备方法
WO2007081006A1 (fr) * 2006-01-16 2007-07-19 Hitachi Metals, Ltd. Alliage de soudure, bille de soudure et joint de soudure l’utilisant
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
JP5051633B2 (ja) * 2006-10-12 2012-10-17 富士電機株式会社 はんだ合金
WO2009104271A1 (fr) * 2008-02-22 2009-08-27 株式会社日本スペリア社 Procédé de régulation de la concentration en nickel d'une soudure sans plomb contenant du nickel
JP2011044571A (ja) * 2009-08-20 2011-03-03 Renesas Electronics Corp 半導体装置、外部接続端子、半導体装置の製造方法、及び外部接続端子の製造方法
EP2405469B1 (fr) * 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Procédé pour la formation de dépôts d'alliage de soudure sur des substrats
ES2665854T3 (es) * 2012-06-30 2018-04-27 Senju Metal Industry Co., Ltd. Bola de soldadura sin plomo
CN103624415A (zh) * 2012-08-22 2014-03-12 北京有色金属研究总院 一种含硼锡基无铅焊料及其制备方法
CN105290640A (zh) * 2015-11-30 2016-02-03 苏州龙腾万里化工科技有限公司 一种无铅焊锡条
JP7068370B2 (ja) * 2020-03-19 2022-05-16 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0847829A1 (fr) * 1996-12-16 1998-06-17 Ford Motor Company Composition pour soudure tendre sans plomb
WO1998034755A1 (fr) * 1997-02-10 1998-08-13 Iowa State University Research Foundation, Inc. Soudure sans plomb
EP1088615A2 (fr) * 1999-09-29 2001-04-04 Nec Corporation Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08215880A (ja) * 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk 無鉛はんだ
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3296289B2 (ja) * 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JP3575311B2 (ja) * 1998-01-28 2004-10-13 株式会社村田製作所 Ｐｂフリー半田および半田付け物品
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
JP3796181B2 (ja) * 2002-02-14 2006-07-12 新日本製鐵株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
KR100445350B1 (ko) * 2003-04-17 2004-08-26 희성금속 주식회사 납땜용 무연합금

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0847829A1 (fr) * 1996-12-16 1998-06-17 Ford Motor Company Composition pour soudure tendre sans plomb
WO1998034755A1 (fr) * 1997-02-10 1998-08-13 Iowa State University Research Foundation, Inc. Soudure sans plomb
EP1088615A2 (fr) * 1999-09-29 2001-04-04 Nec Corporation Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KIM K S ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS AND RELIABILITY, ELSEVIER SCIENCE LTD, GB, vol. 43, no. 2, 1 January 2003 (2003-01-01), pages 259 - 267, XP008067189, ISSN: 0026-2714 *
See also references of WO2006052049A1 *

Also Published As

Publication number Publication date
US20090129970A1 (en) 2009-05-21
WO2006052049A1 (fr) 2006-05-18
CN101048258A (zh) 2007-10-03
JP2008518791A (ja) 2008-06-05
KR20050030237A (ko) 2005-03-29
EP1824638A1 (fr) 2007-08-29

Similar Documents

Publication Publication Date Title
GB2421030B (en) Solder alloy
GB2433944B (en) Solder alloy
EP1824638A4 (fr) Alliage de soudure sans plomb
EP1825011A4 (fr) Alliage de brasure sans plomb
TWI371499B (en) Copper alloy
EP1889684A4 (fr) Alliage de brasage sans plomb
EP1796155A4 (fr) Procédé de formation de perle et perle de brasage
EP1873266A4 (fr) Alliage de cuivre
ZA200700825B (en) Antimicrobical silver compositions
TWI346590B (en) Soldering method
TWI347243B (en) Solder alloy for bonding oxide
PL1922175T3 (pl) Kompozycja lutu
EP1777032A4 (fr) Poudre d'alliage au-sn pour soudure en pate
EP1772225A4 (fr) Alliage de brasage sans plomb
EP1930117A4 (fr) Pâte de soudure à basse température sans plomb
GB0519254D0 (en) Silver alloy
ZA200803347B (en) Metal passivation
GB2410965B (en) Connection Between Well Components
TWI366497B (en) Pb-free solder alloy
GB2431412B (en) Lead-free solder alloy
EP1980355A4 (fr) Alliage de brasage sans plomb
GB2429115B (en) Metal complex
GB0513860D0 (en) Silver alloy
NO20054557D0 (no) Kobberlegering
GB0408952D0 (en) Precious metal salts

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070605

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE GB NL

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE GB NL

RBV Designated contracting states (corrected)

Designated state(s): DE GB NL

A4 Supplementary search report drawn up and despatched

Effective date: 20090608

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/34 20060101ALI20090602BHEP

Ipc: C22C 13/00 20060101ALI20090602BHEP

Ipc: B23K 35/22 20060101AFI20060529BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090908