EP1774543B1 - Composant électrique et procédé pour produire un composant électrique - Google Patents

Composant électrique et procédé pour produire un composant électrique Download PDF

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Publication number
EP1774543B1
EP1774543B1 EP05773181A EP05773181A EP1774543B1 EP 1774543 B1 EP1774543 B1 EP 1774543B1 EP 05773181 A EP05773181 A EP 05773181A EP 05773181 A EP05773181 A EP 05773181A EP 1774543 B1 EP1774543 B1 EP 1774543B1
Authority
EP
European Patent Office
Prior art keywords
base body
adhesive layer
ceramic
electrodes
electric component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05773181A
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German (de)
English (en)
Other versions
EP1774543A1 (fr
Inventor
Harald KÖPPEL
Robert Krumphals
Axel Pecina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1774543A1 publication Critical patent/EP1774543A1/fr
Application granted granted Critical
Publication of EP1774543B1 publication Critical patent/EP1774543B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Definitions

  • the invention relates to an electrical component, in particular an NTC component, as well as its production.
  • Out JP 11219846 is a multilayer component with a ceramic base body is known, the internal electrodes are alternately electrically connected to one of two contact bodies.
  • the contact bodies are attached to opposite sides of the base body. Those parts of the surface of the main body, which are not covered by the contacts, are covered with a protective adhesive layer.
  • an NTC component with a base body comprising at least a first and a second spatially shaped each ceramic partial area of different NTC materials, wherein at least a first and a second contact layer are provided on the surface of the base body.
  • the NTC components are produced by varying the material combinations with the same dimensions of the base body.
  • a method for producing an electrical component in which a ceramic base body is produced with a partially ceramic surface, wherein in the interior a plurality of electrodes are formed so that the ends of the electrodes form part of the surface.
  • the surface of the base body is wetted with an adhesive layer, which adheres poorly at a predetermined temperature at the ends of the electrodes.
  • the surface of the base body is wetted with an adhesive layer, wherein the adhesive layer adheres to the ceramic surface in a temperature range and is removed from the ends of the electrodes.
  • the manufacturing method is preferably extended by applying a contact body to the base body, wherein during a thermal fixing phase the electrical component is heated such that the adhesive layer is removed from the parts of the surface of the base body which are formed with electrodes and a through-connection of the Contact body is reached with the ends of the electrodes.
  • thermal fixing phase is understood to mean a thermal phase in which the contact bodies are baked onto the ceramic base body, ie the burning-in of the contact bodies is part of the thermal fixing phase.
  • an electrical component is specified according to claim 7, which is produced directly by the manufacturing process.
  • the electrical component has a ceramic base body with a partially ceramic surface and a plurality of electrodes arranged in the ceramic base body, the ends of which form part of the surface of the base body.
  • the surface of the body is provided with an adhesive layer having a composition chosen to reduce its adhesion when heated at the ends of the electrodes.
  • an electrical component is specified in which only the ends of the electrodes are released from the adhesive layer.
  • the electrical component has at least one electrical contact body, which is applied to the surface of the base body and is electrically conductively connected to the ends of the electrodes.
  • the surface of the base body is provided with an adhesive layer for at least partial connection of the contact body with the ceramic part of the surface of the base body.
  • An electrical component designed in this way has the advantage that the adhesive layer is removed from the electrode ends when it is heated, and the region thus exposed makes it possible to contact bodies with the electrode ends, without an adhesive layer changing the resistance of the electrical component between the electrodes End of the electrode and the contact body remains to a considerable extent.
  • the ceramic base body is provided there with an adhesive layer which protects against aggressive environmental conditions, where the contact body is not arranged on the base body.
  • the Köntakt Score can of course be implemented as contact layers, or as the ends of contact wires which connect to an external power and voltage source.
  • the contact bodies are connected to the ceramic regions of the ceramic surface, although they are plated through simultaneously with the electrode ends arranged in the same region.
  • Another advantage is the fact that the contact bodies adhere more strongly to the ceramic body and thus have a high peel strength.
  • the contact body could be burned during a thermal fixing phase only on the ceramic body with simultaneous, significant change in the basic resistance value of the electrical component.
  • the ceramic base body is electrically insulated from the eccentric bodies, so that a reduced change in the basic resistance value of the electrical component can also be achieved here.
  • the adhesive layer is electrically insulating and thus also a decoupling layer.
  • the reduced adhesion of the adhesive layer at the ends of the electrodes be in a temperature range of between 50 and 200 K below the stoving temperature of the contact body. This results in the advantage that during the firing of the contact body on the ceramic base body takes place such a sufficient softening of the adhesive layer that the adhesive layer from the ends of the electrodes can be discharged by itself.
  • the adhesive layer comprises a lead-borosilicate mixture so that it is particularly thoroughly dissipated when softened from the ends of the electrodes.
  • FIG. 1 shows how a ceramic base body 2, which preferably comprises a manganese-nickel mixed oxide, is provided with mutually parallel electrodes 3, which each extend with one end 6 to the surface and thus form part of the surface. At the same time, an adhesive and decoupling layer 5 is applied to the ceramic base body.
  • a ceramic base body 2 which preferably comprises a manganese-nickel mixed oxide
  • the electrodes preferably have a silver-palladium (Ag-Pd) alloy.
  • the contact bodies have a base metallization of silver (Ag), which is preferably reinforced galvanically with a nickel and a tin layer.
  • Such an NTC electrical component is preferably manufactured as follows: A glass layer 5 is applied to the sintered ceramic base 2. This is preferably done by a method for depositing thin layers, such. B. by immersion in a glass slip, spraying a glass slip and subsequent or process-accompanying drying.
  • the glass slip is advantageously mixed with a binder which improves the adhesion of the dried layer. Typical layer thicknesses, dried in green, are in the range between 1 and 20 ⁇ m.
  • An exemplary glass slip composition could consist of 100 grams of glass powder, 3 to 20 grams of binder, and 500 to 1000 grams of water.
  • binders cellulose derivatives such as. As carboxymethyl cellulose, hydroxypropylmethyl cellulose, polyvinyl alcohol, polyethylene glycol and silicone resins can be used.
  • the composition of the glass is based on the wetting, in particular of the ceramic body, ie the ceramic surface of the ceramic body, to align.
  • a typical composition of the glass may come from the systems B-Si (borosilicate), in particular lead borosilicate (Pb-B-Si), or Zn-B-Si (tin borosilicate), optionally with other additives, such as. B. Ba, Al., Cu, Fe, Cr, Mg.
  • B. Ba, Al., Cu, Fe, Cr, Mg additives
  • the adhesive layer already adheres to the surface of the contact body, since this has a surface composition which causes the adhesive layer to penetrate between the particles of the contact body surface.
  • thermal fixation usually in the range between 650 ° C and 850 ° C.
  • the glass is selected so that its softening point is about 50 to 200 K below the baking temperature of the contact body or the termination.
  • the adhesive layer is heated to a temperature at which it begins to soften, and finally dissipated from the ends of the electrodes.
  • the adhesive layer adheres to the ceramic surface of the ceramic base body, but not at the ends of the electrodes, so that a through-connection of the termination or the contact body is made possible to the ends of the electrodes.
  • the through-contact of the contact body to the electrode ends occurs in that the contact body partially softened during the thermal fixing phase and thus flows to the electrode ends. This liquefied contact body material can then harden and thus forms a solid electrical contact with the electrodes.
  • composition of the adhesive layer should be chosen such that the general interaction between the glass and the electrode material is taken into account so that the removal of the softened glass layer in the thermal fixing phase is correspondingly facilitated.
  • care is also taken that the electrode ends are made of a different material than the contact bodies, to the extent that the adhesive layer adheres much worse to the electrode ends than on the contact bodies.
  • the thickness of the adhesive layer applied to the surface of the ceramic base body should also be selected such that complete softening of the adhesive layer at the ends of the electrodes can be achieved during the thermal fixing phase.
  • the remaining adhesive layer between the contact bodies and the ceramic surface of the ceramic base body results in an increased peel strength of the contact body, so that a peel strength of the contact body of up to 50 Newton can be achieved.
  • reference parts without an adhesive layer between the contact bodies and the ceramic surface have a defect content in a peel-off test of typically 10 to 20%, whereas the device proposed according to the invention passes this test with 100%.
  • the change in the basic resistance value of the electrical component due to the burning-in of the contact bodies can be lowered from about 12% to less than 4% with the electrical component according to the invention.
  • the change in the resistance of the ceramic body in the galvanic reinforcement of the contact bodies, caused by the ceramic removal on the exposed surface of the ceramic body in acidic electroplating baths, is reduced from 2% to less than 0.5% (see FIG. 3 ).
  • a reduction in the sensitivity of the resistance value of the ceramic component to the firing of terminations on the ceramic base body is achieved in particular by means of the adhesion and decoupling layer.
  • the ceramic base body is produced in a known multilayer technique.
  • a protective layer which is resistant to aggressive environmental conditions in further process steps, such.
  • FIG. 2 shows a view of the electrical component 1 in the direction of in FIG. 1 shown arrow.
  • the area 8 exposed by the adhesive layer is shown schematically around the one electrode end 6.
  • the contact body 4, which with this perspective between the observer of the electrical component and the ceramic body is not shown for free view of the cross section of the electrical component.
  • FIG. 3 shows the change of the resistance value ⁇ W of 3 basic ceramic bodies with or without an adhesive and decoupling layer in certain production steps at different temperatures.
  • the middle bar group shows the case when the ceramic base body is also provided with an adhesive layer according to the invention, this time with a thicker layer order, here a waiting time of 20 minutes after the above times 1 to 3 was inserted until the measurement of Resistance value was.
  • a waiting time of 20 minutes after the above times 1 to 3 was inserted until the measurement of Resistance value was.
  • the left Group of beams here is also a high stability of the resistance of the ceramic body to see.
  • the right-hand group of bars shows the reference case where according to the prior art there is no adhesive and decoupling layer between the contact body or the termination and the ceramic base body. In this case, the changes in the resistance values of the ceramic base body in the above-described cases 1 to 3 are much higher.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)

Claims (15)

  1. Procédé de production d'un composant (1) électrique, dans lequel
    - on produit un corps (2) de base en céramique ayant une surface (7) en partie en céramique, dans lequel on forme en son intérieur plusieurs électrodes de façon à ce que les extrémités (6) des électrodes forment une partie de la surface (7), dans lequel
    - on mouille la surface du corps de base par une couche (5) d'adhérence, la couche d'adhérence étant chauffée à une température, de sorte qu'elle reste en adhérence sur la surface céramique tandis qu'elle est enlevée des extrémités des électrodes.
  2. Procédé suivant la revendication 1, dans lequel on fixe thermiquement un corps (4) de contact sur le corps (2) de base, de manière à enlever la couche (5) d'adhérence des parties de la surface du corps de base qui sont formées par les extrémités (6) d'électrodes et à obtenir une mise en contact du corps de contact avec les extrémités (6) des électrodes.
  3. Procédé suivant la revendication 2, dans lequel on fixe thermiquement le corps (4) de contact entre 650°C et 850°C.
  4. Procédé suivant l'une des revendications précédentes, dans lequel la plage de température dans laquelle la couche (5) d'adhérence est enlevée des extrémités d'électrodes est comprise entre 50 et 200 K en dessous du point de calcination du corps (4) de contact.
  5. Procédé suivant l'une des revendications précédentes, dans lequel on utilise une couche (5) d'adhérence qui contient une matière choisie parmi un mélange de borosilicate, un mélange de borosilicate de plomb.
  6. Procédé suivant l'une des revendications précédentes, dans lequel on produit le corps (2) de base en technique stratifiée.
  7. Composant électrique qui est produit au moyen d'un procédé suivant l'une des revendications précédentes.
  8. Composant électrique comprenant :
    - un corps (2) de base en céramique ayant une surface (7) en partie en céramique,
    - plusieurs électrodes (3) qui sont disposées dans le corps de base en céramique et dont les extrémités forment une partie (6) de la surface du corps de base, dans lequel
    - la surface du corps de base est munie d'une couche (5) d'adhérence, caractérisée en ce que seules les extrémités des électrodes sont laissées exemptes de la couche d'adhérence.
  9. Composant (1) électrique suivant la revendication 8 ayant au moins un corps (4) de contact électrique qui est déposé sur la surface du corps (2) de base et qui est relié d'une manière conductrice de l'électricité aux extrémités des électrodes (3).
  10. Composant (1) électrique suivant l'une des revendications 8 ou 9, dans lequel la couche (5) d'adhérence contient une matière qui est choisie parmi : un mélange de borosilicate, un mélange de borosilicate de plomb.
  11. Composant (1) électrique suivant l'une des revendications 8 à 10, dans lequel le corps (2) de base en céramique comporte un oxyde mixte de manganèse et de nickel.
  12. Composant (1) électrique suivant l'une des revendications 8 à 11, dans lequel le corps (4) de contact comporte une métallisation de base en argent.
  13. Composant (1) électrique suivant la revendication 12, dans lequel le corps de contact est renforcé galvaniquement par une couche de nickel et par une couche d'étain.
  14. Composant (1) électrique suivant l'une des revendications 8 à 13, dans lequel le corps (2) de base est produit en technique stratifiée.
  15. Composant (1) électrique suivant l'une des revendications 8 à 14, qui est un composant à coefficient de température négatif.
EP05773181A 2004-08-03 2005-08-03 Composant électrique et procédé pour produire un composant électrique Active EP1774543B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004037588A DE102004037588A1 (de) 2004-08-03 2004-08-03 Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
PCT/DE2005/001377 WO2006012889A1 (fr) 2004-08-03 2005-08-03 Composant electrique muni d'electrodes externes et procede pour produire un composant electrique muni d'electrodes externes

Publications (2)

Publication Number Publication Date
EP1774543A1 EP1774543A1 (fr) 2007-04-18
EP1774543B1 true EP1774543B1 (fr) 2008-10-08

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Family Applications (1)

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EP05773181A Active EP1774543B1 (fr) 2004-08-03 2005-08-03 Composant électrique et procédé pour produire un composant électrique

Country Status (5)

Country Link
US (1) US8194388B2 (fr)
EP (1) EP1774543B1 (fr)
JP (1) JP5174459B2 (fr)
DE (2) DE102004037588A1 (fr)
WO (1) WO2006012889A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100189882A1 (en) * 2006-09-19 2010-07-29 Littelfuse Ireland Development Company Limited Manufacture of varistors with a passivation layer
DE102007044604A1 (de) * 2007-09-19 2009-04-09 Epcos Ag Elektrisches Vielschichtbauelement
CN201146087Y (zh) * 2008-01-14 2008-11-05 爱普科斯电子元器件(珠海保税区)有限公司 新型过热短路型压敏电阻
KR101412950B1 (ko) * 2012-11-07 2014-06-26 삼성전기주식회사 적층 세라믹 커패시터
DE112019003625T5 (de) 2018-07-18 2021-04-22 Avx Corporation Varistor-Passivierungsschicht und Verfahren zu ihrer Herstellung
JP2022133831A (ja) * 2021-03-02 2022-09-14 Tdk株式会社 積層コンデンサ

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JP3036567B2 (ja) 1991-12-20 2000-04-24 三菱マテリアル株式会社 導電性チップ型セラミック素子及びその製造方法
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Also Published As

Publication number Publication date
DE102004037588A1 (de) 2006-02-23
JP2008508735A (ja) 2008-03-21
JP5174459B2 (ja) 2013-04-03
EP1774543A1 (fr) 2007-04-18
DE502005005633D1 (de) 2008-11-20
WO2006012889A1 (fr) 2006-02-09
US8194388B2 (en) 2012-06-05
US20080095991A1 (en) 2008-04-24

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