EP1774543B1 - Electric component and method for the production of an electric component - Google Patents

Electric component and method for the production of an electric component Download PDF

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Publication number
EP1774543B1
EP1774543B1 EP05773181A EP05773181A EP1774543B1 EP 1774543 B1 EP1774543 B1 EP 1774543B1 EP 05773181 A EP05773181 A EP 05773181A EP 05773181 A EP05773181 A EP 05773181A EP 1774543 B1 EP1774543 B1 EP 1774543B1
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EP
European Patent Office
Prior art keywords
base body
adhesive layer
ceramic
electrodes
electric component
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EP05773181A
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German (de)
French (fr)
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EP1774543A1 (en
Inventor
Harald KÖPPEL
Robert Krumphals
Axel Pecina
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TDK Electronics AG
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Epcos AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Definitions

  • the invention relates to an electrical component, in particular an NTC component, as well as its production.
  • Out JP 11219846 is a multilayer component with a ceramic base body is known, the internal electrodes are alternately electrically connected to one of two contact bodies.
  • the contact bodies are attached to opposite sides of the base body. Those parts of the surface of the main body, which are not covered by the contacts, are covered with a protective adhesive layer.
  • an NTC component with a base body comprising at least a first and a second spatially shaped each ceramic partial area of different NTC materials, wherein at least a first and a second contact layer are provided on the surface of the base body.
  • the NTC components are produced by varying the material combinations with the same dimensions of the base body.
  • a method for producing an electrical component in which a ceramic base body is produced with a partially ceramic surface, wherein in the interior a plurality of electrodes are formed so that the ends of the electrodes form part of the surface.
  • the surface of the base body is wetted with an adhesive layer, which adheres poorly at a predetermined temperature at the ends of the electrodes.
  • the surface of the base body is wetted with an adhesive layer, wherein the adhesive layer adheres to the ceramic surface in a temperature range and is removed from the ends of the electrodes.
  • the manufacturing method is preferably extended by applying a contact body to the base body, wherein during a thermal fixing phase the electrical component is heated such that the adhesive layer is removed from the parts of the surface of the base body which are formed with electrodes and a through-connection of the Contact body is reached with the ends of the electrodes.
  • thermal fixing phase is understood to mean a thermal phase in which the contact bodies are baked onto the ceramic base body, ie the burning-in of the contact bodies is part of the thermal fixing phase.
  • an electrical component is specified according to claim 7, which is produced directly by the manufacturing process.
  • the electrical component has a ceramic base body with a partially ceramic surface and a plurality of electrodes arranged in the ceramic base body, the ends of which form part of the surface of the base body.
  • the surface of the body is provided with an adhesive layer having a composition chosen to reduce its adhesion when heated at the ends of the electrodes.
  • an electrical component is specified in which only the ends of the electrodes are released from the adhesive layer.
  • the electrical component has at least one electrical contact body, which is applied to the surface of the base body and is electrically conductively connected to the ends of the electrodes.
  • the surface of the base body is provided with an adhesive layer for at least partial connection of the contact body with the ceramic part of the surface of the base body.
  • An electrical component designed in this way has the advantage that the adhesive layer is removed from the electrode ends when it is heated, and the region thus exposed makes it possible to contact bodies with the electrode ends, without an adhesive layer changing the resistance of the electrical component between the electrodes End of the electrode and the contact body remains to a considerable extent.
  • the ceramic base body is provided there with an adhesive layer which protects against aggressive environmental conditions, where the contact body is not arranged on the base body.
  • the Köntakt Score can of course be implemented as contact layers, or as the ends of contact wires which connect to an external power and voltage source.
  • the contact bodies are connected to the ceramic regions of the ceramic surface, although they are plated through simultaneously with the electrode ends arranged in the same region.
  • Another advantage is the fact that the contact bodies adhere more strongly to the ceramic body and thus have a high peel strength.
  • the contact body could be burned during a thermal fixing phase only on the ceramic body with simultaneous, significant change in the basic resistance value of the electrical component.
  • the ceramic base body is electrically insulated from the eccentric bodies, so that a reduced change in the basic resistance value of the electrical component can also be achieved here.
  • the adhesive layer is electrically insulating and thus also a decoupling layer.
  • the reduced adhesion of the adhesive layer at the ends of the electrodes be in a temperature range of between 50 and 200 K below the stoving temperature of the contact body. This results in the advantage that during the firing of the contact body on the ceramic base body takes place such a sufficient softening of the adhesive layer that the adhesive layer from the ends of the electrodes can be discharged by itself.
  • the adhesive layer comprises a lead-borosilicate mixture so that it is particularly thoroughly dissipated when softened from the ends of the electrodes.
  • FIG. 1 shows how a ceramic base body 2, which preferably comprises a manganese-nickel mixed oxide, is provided with mutually parallel electrodes 3, which each extend with one end 6 to the surface and thus form part of the surface. At the same time, an adhesive and decoupling layer 5 is applied to the ceramic base body.
  • a ceramic base body 2 which preferably comprises a manganese-nickel mixed oxide
  • the electrodes preferably have a silver-palladium (Ag-Pd) alloy.
  • the contact bodies have a base metallization of silver (Ag), which is preferably reinforced galvanically with a nickel and a tin layer.
  • Such an NTC electrical component is preferably manufactured as follows: A glass layer 5 is applied to the sintered ceramic base 2. This is preferably done by a method for depositing thin layers, such. B. by immersion in a glass slip, spraying a glass slip and subsequent or process-accompanying drying.
  • the glass slip is advantageously mixed with a binder which improves the adhesion of the dried layer. Typical layer thicknesses, dried in green, are in the range between 1 and 20 ⁇ m.
  • An exemplary glass slip composition could consist of 100 grams of glass powder, 3 to 20 grams of binder, and 500 to 1000 grams of water.
  • binders cellulose derivatives such as. As carboxymethyl cellulose, hydroxypropylmethyl cellulose, polyvinyl alcohol, polyethylene glycol and silicone resins can be used.
  • the composition of the glass is based on the wetting, in particular of the ceramic body, ie the ceramic surface of the ceramic body, to align.
  • a typical composition of the glass may come from the systems B-Si (borosilicate), in particular lead borosilicate (Pb-B-Si), or Zn-B-Si (tin borosilicate), optionally with other additives, such as. B. Ba, Al., Cu, Fe, Cr, Mg.
  • B. Ba, Al., Cu, Fe, Cr, Mg additives
  • the adhesive layer already adheres to the surface of the contact body, since this has a surface composition which causes the adhesive layer to penetrate between the particles of the contact body surface.
  • thermal fixation usually in the range between 650 ° C and 850 ° C.
  • the glass is selected so that its softening point is about 50 to 200 K below the baking temperature of the contact body or the termination.
  • the adhesive layer is heated to a temperature at which it begins to soften, and finally dissipated from the ends of the electrodes.
  • the adhesive layer adheres to the ceramic surface of the ceramic base body, but not at the ends of the electrodes, so that a through-connection of the termination or the contact body is made possible to the ends of the electrodes.
  • the through-contact of the contact body to the electrode ends occurs in that the contact body partially softened during the thermal fixing phase and thus flows to the electrode ends. This liquefied contact body material can then harden and thus forms a solid electrical contact with the electrodes.
  • composition of the adhesive layer should be chosen such that the general interaction between the glass and the electrode material is taken into account so that the removal of the softened glass layer in the thermal fixing phase is correspondingly facilitated.
  • care is also taken that the electrode ends are made of a different material than the contact bodies, to the extent that the adhesive layer adheres much worse to the electrode ends than on the contact bodies.
  • the thickness of the adhesive layer applied to the surface of the ceramic base body should also be selected such that complete softening of the adhesive layer at the ends of the electrodes can be achieved during the thermal fixing phase.
  • the remaining adhesive layer between the contact bodies and the ceramic surface of the ceramic base body results in an increased peel strength of the contact body, so that a peel strength of the contact body of up to 50 Newton can be achieved.
  • reference parts without an adhesive layer between the contact bodies and the ceramic surface have a defect content in a peel-off test of typically 10 to 20%, whereas the device proposed according to the invention passes this test with 100%.
  • the change in the basic resistance value of the electrical component due to the burning-in of the contact bodies can be lowered from about 12% to less than 4% with the electrical component according to the invention.
  • the change in the resistance of the ceramic body in the galvanic reinforcement of the contact bodies, caused by the ceramic removal on the exposed surface of the ceramic body in acidic electroplating baths, is reduced from 2% to less than 0.5% (see FIG. 3 ).
  • a reduction in the sensitivity of the resistance value of the ceramic component to the firing of terminations on the ceramic base body is achieved in particular by means of the adhesion and decoupling layer.
  • the ceramic base body is produced in a known multilayer technique.
  • a protective layer which is resistant to aggressive environmental conditions in further process steps, such.
  • FIG. 2 shows a view of the electrical component 1 in the direction of in FIG. 1 shown arrow.
  • the area 8 exposed by the adhesive layer is shown schematically around the one electrode end 6.
  • the contact body 4, which with this perspective between the observer of the electrical component and the ceramic body is not shown for free view of the cross section of the electrical component.
  • FIG. 3 shows the change of the resistance value ⁇ W of 3 basic ceramic bodies with or without an adhesive and decoupling layer in certain production steps at different temperatures.
  • the middle bar group shows the case when the ceramic base body is also provided with an adhesive layer according to the invention, this time with a thicker layer order, here a waiting time of 20 minutes after the above times 1 to 3 was inserted until the measurement of Resistance value was.
  • a waiting time of 20 minutes after the above times 1 to 3 was inserted until the measurement of Resistance value was.
  • the left Group of beams here is also a high stability of the resistance of the ceramic body to see.
  • the right-hand group of bars shows the reference case where according to the prior art there is no adhesive and decoupling layer between the contact body or the termination and the ceramic base body. In this case, the changes in the resistance values of the ceramic base body in the above-described cases 1 to 3 are much higher.

Description

Die Erfindung betrifft ein elektrisches Bauelement, insbesondere ein NTC-Bauelement, sowie dessen Herstellung.The invention relates to an electrical component, in particular an NTC component, as well as its production.

Herkömmliche elektrokeramische Bauelemente weisen normalerweise auf der Oberfläche des keramischen Grundkörpers Kontaktkörper auf, die zur elektrischen Kontaktierung des Bauelements dienen und unter anderem die SMD (Surface Mounted Device)-Fähigkeit des Bauelements gewährleisten. Diese elektrisch leitenden Kontaktkörper bzw. Terminierungen bestehen dabei in der Regel aus einem anderen Material als der keramische Grundkörper, mit der Folge, dass Probleme betreffend die Haftung der Kontaktkörper auf dem Grundkörper auftreten.Conventional electro-ceramic devices typically have on the surface of the ceramic base body to the contact body, which serve for the electrical contacting of the component and among other things the SMD (S urface M ounted D evice) capability of the device ensure. As a rule, these electrically conductive contact bodies or terminations consist of a different material than the ceramic base body, with the result that problems relating to the adhesion of the contact bodies to the base body occur.

Aus US 5,245,309 sind keramische NTC-Bauelemente bekannt, bei denen der keramische Grundkörper in Vielschichttechnologie gefertigt ist und aus keramischen Schichten mit darin angeordneten Innenelektroden besteht. Diese Innenelektroden kontaktieren jeweils einen äußeren Kontaktkörper und bilden ein Elektrodenterminal. Weiterhin kann hier eine äußere Passivierungsschicht, z. B. Glas auf der Oberfläche des Bauelements, aufgebracht sein. Mit dieser Technik ist es möglich, durch Variation der Anordnung der Innenelektroden bei Bauteilen mit gleicher Bauteilnorm unterschiedliche Widerstände zu realisieren.Out US 5,245,309 ceramic NTC components are known in which the ceramic base body is made in multilayer technology and consists of ceramic layers with internal electrodes arranged therein. These internal electrodes each contact an external contact body and form an electrode terminal. Furthermore, here an outer passivation layer, for. As glass on the surface of the device, be applied. With this technique, it is possible to realize different resistances by varying the arrangement of the internal electrodes for components with the same component standard.

Aus JP 11219846 ist ein Vielschichtbauelement mit einem keramischen Grundkörper bekannt, dessen Innenelektroden alternierend mit je einem von zwei Kontaktkörpern elektrisch verbunden sind. Die Kontaktkörper sind an gegenüberliegenden Seiten des Grundkörpers angebracht. Diejenigen Teile der Oberfläche des Grundkörpers, die nicht von den Kontaktierungen bedeckt sind, sind mit einer schützenden Haftschicht bedeckt.Out JP 11219846 is a multilayer component with a ceramic base body is known, the internal electrodes are alternately electrically connected to one of two contact bodies. The contact bodies are attached to opposite sides of the base body. Those parts of the surface of the main body, which are not covered by the contacts, are covered with a protective adhesive layer.

Aus DE 10159451 A1 ist ein NTC-Bauelement mit einem Grundkörper bekannt, der zumindest einen ersten und einen zweiten jeweils räumlich ausgeformten keramischen Teilbereich aus unterschiedlichen NTC-Materialien umfasst, wobei wenigstens eine erste und eine zweite Kontaktschicht auf der Oberfläche des Grundkörpers vorgesehen sind. Ebenfalls werden durch Variation sowohl der relativen Anordnung und der relativen Anteile der beiden keramischen Teilbereiche im Grundkörper als auch durch geeignete Materialkombinationen bei gleichen Abmessungen des Grundkörpers NTC-Bauelemente mit unterschiedlichen elektrischen Eigenschaften hergestellt.Out DE 10159451 A1 an NTC component with a base body is known, comprising at least a first and a second spatially shaped each ceramic partial area of different NTC materials, wherein at least a first and a second contact layer are provided on the surface of the base body. Likewise, by varying both the relative arrangement and the relative proportions of the two ceramic subregions in the base body and NTC components having different electrical properties, the NTC components are produced by varying the material combinations with the same dimensions of the base body.

Aus DE 4207915 ist bekannt, dass sich der Widerstandswert eines Thermistorelements variieren lässt, indem man den Abstand zwischen den Enden der Innenelektroden variiert. Dadurch wird vermieden, dass NTC-Bauelemente, die einen niedrigen Widerstandswert aufweisen, besonders dünn ausfallen und dadurch durch Brüche oder Risse beschädigt werden können.Out DE 4207915 It is known that the resistance of a thermistor element can be varied by varying the distance between the ends of the internal electrodes. This avoids that NTC devices, which have a low resistance value, are particularly thin and can therefore be damaged by fractures or cracks.

Es liegt der vorliegenden Erfindung die Aufgabe zugrunde, ein elektrisches Bauelement bereitzustellen, welches gegenüber aggressiven Umgebungsbedingungen resistent ist.It is the object of the present invention to provide an electrical component which is resistant to aggressive environmental conditions.

Die Aufgabe wird hinsichtlich eines elektrischen Bauelements und hinsichtlich seiner Herstellung durch die Merkmale der Ansprüche 1, 7 und 8 gelöst.The object is achieved with regard to an electrical component and with respect to its manufacture by the features of claims 1, 7 and 8.

Vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen.Advantageous embodiments of the invention will become apparent from the dependent claims.

Bezüglich der Herstellung wird gemäß Patentanspruch 1 ein Verfahren zur Herstellung eines elektrischen Bauelements angegeben, bei dem ein keramischer Grundkörper mit einer teilweise keramischen Oberfläche erzeugt wird, wobei in dessen Inneren mehrere Elektroden so ausgeformt werden, dass die Enden der Elektroden einen Teil der Oberfläche bilden. Die Oberfläche des Grundkörpers wird mit einer Haftschicht benetzt, welche bei einer vorgegebenen Temperatur schlecht an den Enden der Elektroden haftet.With regard to the production, according to claim 1, a method for producing an electrical component is specified, in which a ceramic base body is produced with a partially ceramic surface, wherein in the interior a plurality of electrodes are formed so that the ends of the electrodes form part of the surface. The surface of the base body is wetted with an adhesive layer, which adheres poorly at a predetermined temperature at the ends of the electrodes.

Insbesondere wird die Oberfläche des Grundkörpers mit einer Haftschicht benetzt, wobei die Haftschicht in einem Temperaturbereich an der keramischen Oberfläche haften bleibt und von den Enden der Elektroden abgeführt wird.In particular, the surface of the base body is wetted with an adhesive layer, wherein the adhesive layer adheres to the ceramic surface in a temperature range and is removed from the ends of the electrodes.

Unter einer schlechten Haftung wird auch verstanden, dass die Haftschicht im erwärmten Zustand überhaupt nicht mehr an den Enden der Elektroden haftet.Under a bad adhesion is also understood that the adhesive layer in the heated state no longer adheres to the ends of the electrodes.

Das Herstellungsverfahren wird vorzugsweise dadurch erweitert, dass ein Kontaktkörper auf den Grundkörper aufgebracht wird, wobei während einer thermischen Fixierungsphase das elektrische Bauelement so erwärmt wird, dass die Haftschicht von den Teilen der Oberfläche des Grundkörpers, welche mit Elektroden ausgebildet sind, abgeführt und eine Durchkontaktierung des Kontaktkörpers mit den Enden der Elektroden erreicht wird.The manufacturing method is preferably extended by applying a contact body to the base body, wherein during a thermal fixing phase the electrical component is heated such that the adhesive layer is removed from the parts of the surface of the base body which are formed with electrodes and a through-connection of the Contact body is reached with the ends of the electrodes.

Mit dem Begriff "thermische Fixierungsphase" wird eine thermische Phase verstanden, bei der die Kontaktkörper auf den keramischen Grundkörper eingebrannt werden- das Einbrennen der Kontaktkörper ist also ein Teil der thermischen Fixierungsphase.The term "thermal fixing phase" is understood to mean a thermal phase in which the contact bodies are baked onto the ceramic base body, ie the burning-in of the contact bodies is part of the thermal fixing phase.

Hinsichtlich des elektrischen Bauelements wird gemäß Patentanspruch 7 ein elektrisches Bauelement angegeben, welche durch das Herstellungsverfahren unmittelbar erzeugt wird.With regard to the electrical component, an electrical component is specified according to claim 7, which is produced directly by the manufacturing process.

Das elektrische Bauelement weist einen keramischen Grundkörper mit einer teilweise keramischen Oberfläche und mehreren im keramischen Grundkörper angeordneten Elektroden auf, deren Enden einen Teil der Oberfläche des Grundkörpers bilden. Die Oberfläche des Grundkörpers ist mit einer Haftschicht versehen, welche eine Zusammensetzung aufweist, die so gewählt ist, dass sich deren Haftung bei Erwärmung an den Enden der Elektroden vermindert.The electrical component has a ceramic base body with a partially ceramic surface and a plurality of electrodes arranged in the ceramic base body, the ends of which form part of the surface of the base body. The surface of the body is provided with an adhesive layer having a composition chosen to reduce its adhesion when heated at the ends of the electrodes.

Auch wird gemäß Patentanspruch 8 ein elektrisches Bauelement angegeben, bei dem nur die Enden der Elektroden von der Haftschicht freigelassen sind.Also, according to claim 8, an electrical component is specified in which only the ends of the electrodes are released from the adhesive layer.

Gemäß einer Ausführungsform wird vorgeschlagen, dass das elektrische Bauelement mindestens einen elektrischen Kontaktkörper aufweist, welcher auf der Oberfläche des Grundkörpers aufgebracht und mit den Enden der Elektroden elektrisch leitend verbunden ist. Die Oberfläche des Grundkörpers ist dabei mit einer Haftschicht zur wenigstens teilweisen Verbindung des Kontaktkörpers mit dem keramischen Teil der Oberfläche des Grundkörpers versehen.According to one embodiment, it is proposed that the electrical component has at least one electrical contact body, which is applied to the surface of the base body and is electrically conductively connected to the ends of the electrodes. The surface of the base body is provided with an adhesive layer for at least partial connection of the contact body with the ceramic part of the surface of the base body.

Ein so ausgebildetes elektrisches Bauelement hat den Vorteil, dass die Haftschicht bei ihrer Erwärmung von den Elektrodenenden von selbst abgeführt wird und der hierdurch freigelegte Bereich eine Kontaktierung von Kontaktkörpern mit den Elektrodenenden ermöglicht, ohne dass eine den Widerstandswert des elektrischen Bauelements verändernde Haftschicht zwischen den Elektrodenenden und der Kontaktkörper in nennenswerten Umfang bestehen bleibt.An electrical component designed in this way has the advantage that the adhesive layer is removed from the electrode ends when it is heated, and the region thus exposed makes it possible to contact bodies with the electrode ends, without an adhesive layer changing the resistance of the electrical component between the electrodes End of the electrode and the contact body remains to a considerable extent.

Es wird also vorteilhafterweise die maximale Fläche der keramischen Oberfläche des Grundkörpers für die Haftung mit dem Kontaktkörper ausgenutzt. Gleichzeitig ist der keramische Grundkörper dort mit einer vor aggressiven Umgebungsbedingungen schützenden Haftschicht versehen, wo der Kontaktkörper nicht auf dem Grundkörper angeordnet ist.It is thus advantageously utilized the maximum surface of the ceramic surface of the body for the adhesion with the contact body. At the same time, the ceramic base body is provided there with an adhesive layer which protects against aggressive environmental conditions, where the contact body is not arranged on the base body.

Die Köntaktkörper können selbstverständlich auch als Kontaktschichten realisiert sein, oder auch als Enden von Kontaktdrähten welche eine Verbindung zu einer externen Strom- und Spannungsquelle herstellen.The Köntaktkörper can of course be implemented as contact layers, or as the ends of contact wires which connect to an external power and voltage source.

Vorteilhafterweise sind die Kontaktkörper aufgrund der speziellen Eigenschaft der Haftschicht mit den keramischen Bereichen der keramischen Oberfläche verbunden, obwohl sie gleichzeitig mit den im selben Bereich angeordneten Elektrodenenden durchkontaktiert sind.Advantageously, because of the special nature of the adhesive layer, the contact bodies are connected to the ceramic regions of the ceramic surface, although they are plated through simultaneously with the electrode ends arranged in the same region.

Ein weiterer Vorteil ist darin zu sehen, dass die Kontaktkörper verstärkt auf dem keramischen Grundkörper haften und dadurch eine hohe Abzugsfestigkeit aufweisen.Another advantage is the fact that the contact bodies adhere more strongly to the ceramic body and thus have a high peel strength.

Bisher konnten die Kontaktkörper während einer thermischen Fixierungsphase nur auf den keramischen Grundkörper bei gleichzeitiger, erheblicher Veränderung des Grundwiderstandswerts des elektrischen Bauelements eingebrannt werden. Mittels eines der hier vorgeschlagenen elektrischen Bauelemente ist es also besonders günstig, dass der Einfluss des Einbrennens der Kontaktkörper auf den Widerstandswert des elektrischen Bauelements durch die Beschichtung des keramischen Grundkörpers reduziert wird, da keine Haft- und Entkopplungsschicht mehr an den Elektrodenenden haftet und die Durchkontaktierung der Elektroden zum Kontaktkörper besonders rein ist. Zudem ist der keramische Grundkörper von den Köntaktkörpern elektrisch isoliert, so dass hier auch eine verringerte Veränderung des Grundwiderstandswerts des elektrischen Bauelements erreichbar ist. Zu diesem Zweck wird also bevorzugt, dass die Haftschicht elektrisch isolierend ist und somit auch eine Entkopplungsschicht ist.So far, the contact body could be burned during a thermal fixing phase only on the ceramic body with simultaneous, significant change in the basic resistance value of the electrical component. By means of one of the electrical components proposed here, it is therefore particularly favorable that the influence of the burning of the contact bodies on the resistance of the electrical component by the coating of the ceramic Body is reduced because no adhesive and decoupling layer more adheres to the electrode ends and the through-contact of the electrodes to the contact body is particularly pure. In addition, the ceramic base body is electrically insulated from the eccentric bodies, so that a reduced change in the basic resistance value of the electrical component can also be achieved here. For this purpose, it is therefore preferred that the adhesive layer is electrically insulating and thus also a decoupling layer.

Es wird bevorzugt, dass die verminderte Haftung der Haftschicht an den Enden der Elektroden in einem Temperaturbereich von zwischen 50 bis 200 K unterhalb der Einbrenntemperatur des Kontaktkörpers liegt. Dadurch ergibt sich der Vorteil, dass beim Einbrennen des Kontaktkörpers auf den keramischen Grundkörper eine derart ausreichende Erweichung der Haftschicht stattfindet, dass die Haftschicht von den Enden der Elektroden von selbst abführbar ist. Zu diesem Zweck wird bevorzugt, dass die Haftschicht eine Blei-BorosilikatMischung aufweist, sodass sie bei Erweichung von den Enden der Elektroden besonders gründlich abführbar ist.It is preferred that the reduced adhesion of the adhesive layer at the ends of the electrodes be in a temperature range of between 50 and 200 K below the stoving temperature of the contact body. This results in the advantage that during the firing of the contact body on the ceramic base body takes place such a sufficient softening of the adhesive layer that the adhesive layer from the ends of the electrodes can be discharged by itself. For this purpose, it is preferred that the adhesive layer comprises a lead-borosilicate mixture so that it is particularly thoroughly dissipated when softened from the ends of the electrodes.

Die Erfindung wird anhand der folgenden Ausführungsbeispiele und Figuren näher erläutert. Dabei zeigen:

  • Figuren 1 und 2 jeweils eine Längs- und Querschnittsansicht einer bevorzugten Ausführungsform eines elektrischen NTC-Bauelements,
  • Figur 3 das Verhalten von 3 keramischen Grundkörpern mit oder ohne einer Haft- und Entkopplungsschicht in bestimmten Herstellungsschritten bei unterschiedlichen Temperaturen.
The invention will be explained in more detail with reference to the following embodiments and figures. Showing:
  • Figures 1 and 2 each a longitudinal and cross-sectional view of a preferred embodiment of an NTC electrical device,
  • FIG. 3 the behavior of 3 basic ceramic bodies with or without an adhesive and decoupling layer in certain production steps at different temperatures.

Figur 1 zeigt, wie ein keramischer Grundkörper 2, welcher vorzugsweise ein Mangan-Nickel-Mischoxid aufweist, mit parallel zueinander angeordneten Elektroden 3 versehen ist, welche sich jeweils mit einem Ende 6 bis zur Oberfläche erstrecken und somit einen Teil der Oberfläche bilden. Gleichzeitig ist eine Haft- und Entkopplungsschicht 5 auf den keramischen Grundkörper aufgebracht. FIG. 1 shows how a ceramic base body 2, which preferably comprises a manganese-nickel mixed oxide, is provided with mutually parallel electrodes 3, which each extend with one end 6 to the surface and thus form part of the surface. At the same time, an adhesive and decoupling layer 5 is applied to the ceramic base body.

Die Elektroden weisen vorzugsweise eine Silber-Palladium (Ag-Pd) Legierung auf. Die Kontaktkörper weisen eine Grundmetallisierung aus Silber (Ag) auf, welche vorzugsweise galvanisch mit einer Nickel- und einer Zinnschicht verstärkt ist.The electrodes preferably have a silver-palladium (Ag-Pd) alloy. The contact bodies have a base metallization of silver (Ag), which is preferably reinforced galvanically with a nickel and a tin layer.

Ein solches elektrisches NTC-Bauelement wird vorzugsweise folgendermaßen hergestellt: Auf den gesinterten KeramikGrundkörper 2 wird eine Glasschicht 5 aufgebracht. Dies geschieht vorzugsweise durch ein Verfahren zur Abscheidung dünner Schichten, wie z. B. durch Tauchen in einen Glasschlicker, Aufsprühen eines Glasschlickers und anschließende oder prozessbegleitende Trocknung. Der Glasschlicker wird vorteilhafterweise mit einem Bindemittel versetzt, welches die Haftung der getrockneten Schicht verbessert. Typische Schichtstärken, grün getrocknet, liegen im Bereich zwischen 1 und 20 µm. Eine beispielhafte Glasschlicker-Zusammensetzung könnte aus 100 g Glaspulver, 3 bis 20 g Bindemittel und 500 bis 1000 g Wasser bestehen. Als Bindemittel können Zellulose-Derivate, wie z. B. Carboxymethylzellulose, Hydroxypropylmethylzellulose, Polyvinylalkohol, Polyethylenglykol und Silikonharze verwendet werden.Such an NTC electrical component is preferably manufactured as follows: A glass layer 5 is applied to the sintered ceramic base 2. This is preferably done by a method for depositing thin layers, such. B. by immersion in a glass slip, spraying a glass slip and subsequent or process-accompanying drying. The glass slip is advantageously mixed with a binder which improves the adhesion of the dried layer. Typical layer thicknesses, dried in green, are in the range between 1 and 20 μm. An exemplary glass slip composition could consist of 100 grams of glass powder, 3 to 20 grams of binder, and 500 to 1000 grams of water. As binders cellulose derivatives, such as. As carboxymethyl cellulose, hydroxypropylmethyl cellulose, polyvinyl alcohol, polyethylene glycol and silicone resins can be used.

Die Zusammensetzung des Glases ist auf die Benetzung, insbesondere des Keramikkörpers, d. h. der keramischen Oberfläche des keramischen Grundkörpers, auszurichten. Eine typische Zusammensetzung des Glases kann aus den Systemen B-Si (Borosilikat), insbesondere Blei-Borosilikat (Pb-B-Si), oder Zn-B-Si (Zinn-Borosilikat) kommen, gegebenenfalls mit weiteren Zusätzen, wie z. B. Ba, Al., Cu, Fe, Cr, Mg. Der so erhaltene beschichtete keramische Grundkörper 2 wird nun in bekannter Weise durch Tauchen und Trocknen mit den Kontaktkörpern bzw. den Terminierungen 4 versehen. Nachdem mit diesem Schritt die Kontaktkörper erstmals auf den keramischen Grundkörper aufgebracht sind, haftet die Haftschicht bereits mit der Oberfläche des Kontaktkörpers, da dieser eine Oberflächenzusammensetzung aufweist, welche dazu führt, dass die Haftschicht zwischen den Partikeln der Kontaktkörperoberfläche eindringt. Somit ist eine bleibende Haftung zwischen dem Kontaktkörper und der Haftschicht auch in der späteren thermischen Fixierungsphase gewährleistet. Danach folgt die thermische Fixierung, üblicherweise im Bereich zwischen 650° C und 850° C.The composition of the glass is based on the wetting, in particular of the ceramic body, ie the ceramic surface of the ceramic body, to align. A typical composition of the glass may come from the systems B-Si (borosilicate), in particular lead borosilicate (Pb-B-Si), or Zn-B-Si (tin borosilicate), optionally with other additives, such as. B. Ba, Al., Cu, Fe, Cr, Mg. The coated ceramic base body 2 thus obtained is now provided in a known manner by dipping and drying with the contact bodies or the terminations 4. After the contact bodies are first applied to the ceramic base body with this step, the adhesive layer already adheres to the surface of the contact body, since this has a surface composition which causes the adhesive layer to penetrate between the particles of the contact body surface. Thus, a permanent adhesion between the contact body and the adhesive layer is ensured even in the later thermal fixing phase. This is followed by thermal fixation, usually in the range between 650 ° C and 850 ° C.

Das Glas wird so ausgewählt, dass sein Erweichungspunkt ca. 50 bis 200 K unterhalb der Einbrenntemperatur der Kontaktkörper bzw. der Terminierung liegt. In dieser thermischen Fixierungsphase wird die Haftschicht auf eine Temperatur erwärmt bei der sie beginnt zu erweichen, und schließlich von den Enden der Elektroden abgeführt wird. Somit bleibt die Haftschicht auf der keramischen Oberfläche des keramischen Grundkörpers haften, nicht aber an den Enden der Elektroden, sodass eine Durchkontaktierung der Terminierung bzw. der Kontaktkörper zu den Enden der Elektroden ermöglicht wird. Die Durchkontaktierung der Kontaktkörper zu den Elektrodenenden geschieht dadurch, dass der Kontaktkörper während der thermischen Fixierungsphase teilweise erweicht und somit auf die Elektrodenenden fließt. Dieses verflüssigte Kontaktkörpermaterial kann sich anschließend aushärten und bildet damit eine feste elektrische Kontaktierung zu den Elektroden.The glass is selected so that its softening point is about 50 to 200 K below the baking temperature of the contact body or the termination. In this thermal fixation phase, the adhesive layer is heated to a temperature at which it begins to soften, and finally dissipated from the ends of the electrodes. Thus, the adhesive layer adheres to the ceramic surface of the ceramic base body, but not at the ends of the electrodes, so that a through-connection of the termination or the contact body is made possible to the ends of the electrodes. The through-contact of the contact body to the electrode ends occurs in that the contact body partially softened during the thermal fixing phase and thus flows to the electrode ends. This liquefied contact body material can then harden and thus forms a solid electrical contact with the electrodes.

Die Zusammensetzung der Haftschicht ist so zu wählen, dass die allgemeine Wechselwirkung zwischen dem Glas und dem Elektrodenmaterial dahingehend berücksichtigt wird, dass die Abfuhr der erweichten Glasschicht in der thermischen Fixierungsphase entsprechend erleichtert wird. Im allgemeinen wird auch darauf geachtet, dass die Elektrodenenden aus einem anderen Material bestehen als die Kontaktkörper, und zwar dahingehend, dass die Haftschicht wesentlich schlechter an den Elektrodenenden haftet als an den Kontaktkörpern.The composition of the adhesive layer should be chosen such that the general interaction between the glass and the electrode material is taken into account so that the removal of the softened glass layer in the thermal fixing phase is correspondingly facilitated. In general, care is also taken that the electrode ends are made of a different material than the contact bodies, to the extent that the adhesive layer adheres much worse to the electrode ends than on the contact bodies.

Durch die Abfuhr der Haftschicht von den Elektrodenenden während der thermischen Fixierungsphase wird erreicht, dass der bisher übliche Prozessschritt, in dem die an den Enden von Elektroden noch haftenden Haftschichtanteile abgeschliffen werden mussten, eingespart wird. Selbstverständlich ist auch die auf die Oberfläche des keramischen Grundkörpers aufgetragene Dicke der Haftschicht so zu wählen, dass eine vollständige Erweichung der Haftschicht an den Enden der Elektroden während der thermischen Fixierungsphase erreichbar ist.As a result of the removal of the adhesive layer from the electrode ends during the thermal fixing phase, it is achieved that the hitherto customary process step in which the adhesive layer portions still adhering to the ends of electrodes have been sanded is saved. Of course, the thickness of the adhesive layer applied to the surface of the ceramic base body should also be selected such that complete softening of the adhesive layer at the ends of the electrodes can be achieved during the thermal fixing phase.

Die bestehen gebliebene Haftschicht zwischen den Kontaktkörpern und der keramischen Oberfläche des keramischen Grundkörpers ergibt eine verstärkte Abzugsfestigkeit der Kontaktkörper, so dass eine Abzugsfestigkeit der Kontaktkörper von bis zu 50 Newton erreicht werden kann. Dagegen weisen Referenzteile ohne eine Haftschicht zwischen den Kontaktkörpern und der keramischen Oberfläche einen Fehleranteil bei einem Peel-Off-Test von typisch 10 bis 20 % auf, wogegen das erfindungsgemäß vorgeschlagene Bauelement diesen Test mit 100 % besteht.The remaining adhesive layer between the contact bodies and the ceramic surface of the ceramic base body results in an increased peel strength of the contact body, so that a peel strength of the contact body of up to 50 Newton can be achieved. By contrast, reference parts without an adhesive layer between the contact bodies and the ceramic surface have a defect content in a peel-off test of typically 10 to 20%, whereas the device proposed according to the invention passes this test with 100%.

Die Änderung des Grundwiderstandswerts des elektrischen Bauelements durch das Einbrennen der Kontaktkörper kann mit dem erfindungsgemäßen elektrischen Bauelement von ca. 12 % auf unter 4 % abgesenkt werden. Die Veränderung des Widerstands des keramischen Grundkörpers bei der galvanischen Verstärkung der Kontaktkörper, hervorgerufen durch den Keramik-Abtrag an der freiliegenden Oberfläche des keramischen Grundkörpers in sauren Galvanikbädern, wird von 2 % auf unter 0,5 % reduziert (siehe dazu Figur 3). Im Falle von NTC-Bauelementen auf Spinellbasis wird insbesondere mittels der Haft- und Entkopplungsschicht eine Verringerung der Empfindlichkeit des Widerstandswerts des keramischen Bauelements gegenüber dem Einbrennen von Terminierungen auf den keramischen Grundkörper erreicht.The change in the basic resistance value of the electrical component due to the burning-in of the contact bodies can be lowered from about 12% to less than 4% with the electrical component according to the invention. The change in the resistance of the ceramic body in the galvanic reinforcement of the contact bodies, caused by the ceramic removal on the exposed surface of the ceramic body in acidic electroplating baths, is reduced from 2% to less than 0.5% (see FIG. 3 ). In the case of spinel-based NTC components, a reduction in the sensitivity of the resistance value of the ceramic component to the firing of terminations on the ceramic base body is achieved in particular by means of the adhesion and decoupling layer.

Es wird bevorzugt, dass der keramische Grundkörper in bekannter Vielschichttechnik erzeugt wird.It is preferred that the ceramic base body is produced in a known multilayer technique.

Die an den Bereichen des Grundkörpers aufgebrachte Haftschicht, welche nicht zwischen dem Kontaktkörper und dem Grundkörper liegt, dient als Schutzschicht welche gegenüber aggressiven Umgebungsbedingungen in weiteren Prozessschritten resistent ist, wie z. B. bei der galvanischen Verstärkung der Terminierung mit Nickel-Zinn-Schichten oder beim Flussmittelangriff beim Löten.The applied to the areas of the body adhesion layer, which is not between the contact body and the body, serves as a protective layer which is resistant to aggressive environmental conditions in further process steps, such. As in the galvanic reinforcement of the termination with nickel-tin layers or the flux attack during soldering.

Figur 2 zeigt eine Ansicht auf das elektrische Bauelement 1 in der Richtung des in Figur 1 gezeigten Pfeils. Der von der Haftschicht freigelegte Bereich 8 wird schematisch um das eine Elektrodenende 6 herum dargestellt. Der Kontaktkörper 4, welcher mit dieser Perspektive zwischen dem Beobachter des elektrischen Bauelements und dem keramischen Grundkörper liegt, ist zur freien Ansicht des Querschnitts des elektrischen Bauelements nicht eingezeichnet. FIG. 2 shows a view of the electrical component 1 in the direction of in FIG. 1 shown arrow. The area 8 exposed by the adhesive layer is shown schematically around the one electrode end 6. The contact body 4, which with this perspective between the observer of the electrical component and the ceramic body is not shown for free view of the cross section of the electrical component.

Figur 3 zeigt die Änderung des Widerstandswertes ΔW von 3 keramischen Grundkörpern mit oder ohne einer Haft- und Entkopplungsschicht in bestimmten Herstellungsschritten bei unterschiedlichen Temperaturen. FIG. 3 shows the change of the resistance value ΔW of 3 basic ceramic bodies with or without an adhesive and decoupling layer in certain production steps at different temperatures.

Die linke Balkengruppe zeigt den Fall, wenn der keramische Grundkörper mit einer erfindungsgemäßen Haftschicht versehen ist. Dabei zeigt:

  1. 1. der linke Balken B1 eine geringe Änderung des Widerstandswerts ΔW1 des keramischen Grundkörpers in einem Zeitraum von 10 Minuten vor und nach der galvanischen Verstärkung der Terminierung bei 25°C.
  2. 2. der mittlere Balken B2 eine geringe Änderung des Widerstandswerts des Grundkörpers in einem Zeitraum von 10 Minuten vor und nach der galvanischen Verstärkung der Terminierung bei Temperaturen zwischen 25 und 100°C.
  3. 3. der rechte Balken B3 die negative Änderung des Widerstandswerts des keramischen Grundkörpers während der thermischen Fixierungsphase.
The left bar group shows the case when the ceramic base body is provided with an adhesive layer according to the invention. Showing:
  1. 1. the left bar B1 a small change in the resistance value ΔW 1 of the ceramic body in a period of 10 minutes before and after the galvanic amplification of the termination at 25 ° C.
  2. 2. the middle bar B2 a small change in the resistance of the body in a period of 10 minutes before and after the galvanic amplification of the termination at temperatures between 25 and 100 ° C.
  3. 3. the right bar B3 the negative change of the resistance of the ceramic body during the thermal fixing phase.

Die mittlere Balkengruppe zeigt den Fall, wenn der keramische Grundkörper ebenfalls mit einer erfindungsgemäßen Haftschicht, diesmal mit einem dickeren Schichtauftrag, versehen ist, wobei hier eine Wartezeit von 20 Minuten nach den oben geschilderten Zeitpunkten 1. bis 3. eingelegt wurde, bis die Messung des Widerstandswerts erfolgte. Wie bei der linken Gruppe von Balken ist hier ebenfalls eine hohe Stabilität des Widerstandswerts des keramischen Grundkörpers zu sehen.The middle bar group shows the case when the ceramic base body is also provided with an adhesive layer according to the invention, this time with a thicker layer order, here a waiting time of 20 minutes after the above times 1 to 3 was inserted until the measurement of Resistance value was. As with the left Group of beams here is also a high stability of the resistance of the ceramic body to see.

Die rechte Balkengruppe zeigt den Referenzfall, wo gemäß des Standes der Technik keine Haft- und Entkopplungsschicht zwischen dem Kontaktkörper bzw. der Terminierung und dem keramischen Grundkörper vorliegt. In diesem Fall sind die Änderungen der Widerstandswerte des keramischen Grundkörpers in den oben geschilderten Fällen 1. bis 3. sehr viel höher.The right-hand group of bars shows the reference case where according to the prior art there is no adhesive and decoupling layer between the contact body or the termination and the ceramic base body. In this case, the changes in the resistance values of the ceramic base body in the above-described cases 1 to 3 are much higher.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
elektrisches Bauelementelectrical component
22
keramischer Grundkörperceramic body
33
Elektrodenelectrodes
44
Terminierungtermination
55
Haftschichtadhesive layer
66
Elektrodenendenelectrode ends
77
keramische Oberflächeceramic surface
88th
von Haftschicht freigelegter Bereichof adhesive layer exposed area
B1B1
erster Balken Änderung Widerstandswertfirst bar change resistance
B2B2
zweiter Balken Änderung Widerstandswertsecond bar change resistance
B3B3
dritter Balken Änderung Widerstandswertthird bar change resistance

Claims (15)

  1. Method for the production of an electric component (1), in which
    - a ceramic base body (2) with a partially ceramic surface (7) is created, a number of electrodes being formed inside it in such a way that the ends (6) of the electrodes form part of the surface (7),
    - the surface of the base body being wetted with an adhesive layer (5), the adhesive layer being heated to a temperature such that it remains adhering to the ceramic surface while it is removed from the ends of the electrodes.
  2. Method according to Claim 1, in which a contact body (4) is thermally fixed on the base body (2), whereby the adhesive layer (5) is removed from the parts of the surface of the base body that are formed by the electrode ends (6), and a plated-through connection of the contact body to the ends (6) of the electrodes is achieved.
  3. Method according to Claim 2, in which the contact body (4) is thermally fixed between 650°C and 850°C.
  4. Method according to one of the preceding claims, in which the temperature range in which the adhesive layer (5) is removed from the ends of the electrodes lies between 50 and 200 K below the firing temperature of the contact body (4).
  5. Method according to one of the preceding claims, in which an adhesive layer (5) that contains a material chosen as either a borosilicate mixture or a lead-borosilicate mixture is used.
  6. Method according to one of the preceding claims, in which the base body (2) is created by a multi-layer technique.
  7. Electric component created by means of a method according to one of the preceding claims.
  8. Electric component, comprising:
    - a ceramic base body (2) with a partially ceramic surface (7),
    - a number of electrodes (3) that are arranged in the ceramic base body and the ends of which form part (6) of the surface of the base body,
    - the surface of the base body being provided with an adhesive layer (5), characterized in that only the ends of the electrodes are left free from the adhesive layer.
  9. Electric component (1) according to Claim 8 with at least one electric contact body (4), which is applied to the surface of the base body (2) and is connected to the ends of the electrodes (3) in an electrically conducting manner.
  10. Electric component (1) according to either of Claims 8 and 9, in which the adhesive layer (5) contains a material chosen as either a borosilicate mixture or a lead-borosilicate mixture.
  11. Electric component (1) according to one of Claims 8 to 10, in which the ceramic base body (2) comprises a manganesenickel mixed oxide.
  12. Electric component (1) according to one of Claims 8 to 11, in which the contact body (4) comprises a base metallization of silver.
  13. Electric component (1) according to Claim 12, in which the contact body (4) is galvanically reinforced with a nickel layer and a tin layer.
  14. Electric component (1) according to one of Claims 8 to 13, in which the base body (2) is created by a multi-layer technique.
  15. Electric component (1) according to one of Claims 8 to 14 that is an NTC component.
EP05773181A 2004-08-03 2005-08-03 Electric component and method for the production of an electric component Active EP1774543B1 (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101506912B (en) * 2006-09-19 2011-10-12 东莞令特电子有限公司 Manufacture of varistors comprising a passivation layer
DE102007044604A1 (en) * 2007-09-19 2009-04-09 Epcos Ag Electrical multilayer component
CN201146087Y (en) * 2008-01-14 2008-11-05 爱普科斯电子元器件(珠海保税区)有限公司 Novel superheating short circuit type varistor
KR101412950B1 (en) * 2012-11-07 2014-06-26 삼성전기주식회사 Multilayer ceramic capacitor
DE112019003625T5 (en) 2018-07-18 2021-04-22 Avx Corporation Varistor passivation layer and process for its manufacture
JP2022133831A (en) * 2021-03-02 2022-09-14 Tdk株式会社 multilayer capacitor

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701827A (en) * 1986-02-10 1987-10-20 Kyocera Corporation Multilayer ceramic capacitor
JPH01135501A (en) 1987-11-19 1989-05-29 Toshiba Corp Flow quantity control apparatus for mixer settler
JP2833242B2 (en) * 1991-03-12 1998-12-09 株式会社村田製作所 NTC thermistor element
JP3036567B2 (en) * 1991-12-20 2000-04-24 三菱マテリアル株式会社 Conductive chip type ceramic element and method of manufacturing the same
JPH08115845A (en) 1994-10-14 1996-05-07 Tokin Corp Monolithic ceramic capacitor
KR100255906B1 (en) * 1994-10-19 2000-05-01 모리시타 요이찌 Electronic component and method for fabricating the same
JPH097877A (en) * 1995-04-18 1997-01-10 Rohm Co Ltd Multilayered ceramic chip capacitor and manufacture thereof
JP3494508B2 (en) * 1995-06-26 2004-02-09 日本碍子株式会社 Combustible gas sensor, method for measuring combustible gas concentration, and method for detecting catalyst deterioration
JPH10149942A (en) 1996-11-20 1998-06-02 Tokin Corp Multilayered ceramic capacitor and manufacture of multilayered chip inductor
DE19714686A1 (en) * 1997-04-09 1998-10-15 Siemens Matsushita Components Surface-mountable electrical ceramic component
JPH11219846A (en) 1998-01-29 1999-08-10 Tama Electric Co Ltd Surface-mounting part and manufacture thereof
JP2001135501A (en) * 1999-11-02 2001-05-18 Mitsubishi Materials Corp Chip type thermistor
DE10018377C1 (en) 2000-04-13 2001-12-06 Epcos Ag Ceramic multilayered component used as a PTC resistance element comprises a stack of PTC ceramic layers with tungsten electrodes on both sides connected to a monolithic body
DE10144364A1 (en) 2001-09-10 2003-04-03 Epcos Ag Electrical multilayer component
DE10147898A1 (en) 2001-09-28 2003-04-30 Epcos Ag Electrochemical component with multiple contact surfaces
DE10159451A1 (en) * 2001-12-04 2003-06-26 Epcos Ag Electrical component with a negative temperature coefficient
DE10202915A1 (en) 2002-01-25 2003-08-21 Epcos Ag Electro-ceramic component with internal electrodes
JP4211510B2 (en) * 2002-08-13 2009-01-21 株式会社村田製作所 Manufacturing method of laminated PTC thermistor
US6813137B2 (en) * 2002-10-29 2004-11-02 Tdk Corporation Chip shaped electronic device and a method of producing the same
DE10313891A1 (en) 2003-03-27 2004-10-14 Epcos Ag Electrical multilayer component
US6965167B2 (en) * 2003-06-17 2005-11-15 Inpaq Technology Co., Ltd. Laminated chip electronic device and method of manufacturing the same

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