EP1763495A1 - Substrat metal-ceramique - Google Patents

Substrat metal-ceramique

Info

Publication number
EP1763495A1
EP1763495A1 EP05747680A EP05747680A EP1763495A1 EP 1763495 A1 EP1763495 A1 EP 1763495A1 EP 05747680 A EP05747680 A EP 05747680A EP 05747680 A EP05747680 A EP 05747680A EP 1763495 A1 EP1763495 A1 EP 1763495A1
Authority
EP
European Patent Office
Prior art keywords
ceramic
metal
ceramic substrate
ceramic layer
substrate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP05747680A
Other languages
German (de)
English (en)
Inventor
Jürgen SCHULZ-HARDER
Karl Exel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Germany GmbH
Original Assignee
Curamik Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH filed Critical Curamik Electronics GmbH
Publication of EP1763495A1 publication Critical patent/EP1763495A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/16—Two dimensionally sectional layer
    • Y10T428/163—Next to unitary web or sheet of equal or greater extent
    • Y10T428/164—Continuous two dimensionally sectional layer
    • Y10T428/166—Glass, ceramic, or metal sections [e.g., floor or wall tile, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • the invention relates to a metal-ceramic substrate according to the preamble of claim 1.
  • Metal-ceramic substrates, and in particular copper-ceramic substrates are increasingly being used as base substrates or printed circuit boards in power modules intended for higher operating voltages, e.g. for operating voltages of 600 V and higher.
  • One of the requirements of such power modules is a sufficiently high partial discharge resistance. This requirement corresponds to the recognition that partial discharges that occur during the operation of such a module, lead over a long time in the insulating regions of the module to electrically conductive paths that weaken the insulation and ultimately can cause massive voltage breakdowns, so then it comes to a failure of the relevant module.
  • the requirement for the highest possible partial discharge resistance refers to the entire module, d. H.
  • Each individual component of the module must meet the requirement of the highest possible partial discharge resistance. Since the respective metal-ceramic substrate constitutes an essential component of the respective module, this requirement also applies to this substrate, although partial discharges which occur solely within the metal-ceramic substrate do not cause any damage to the insulating effect there.
  • the requirement that each individual component has the required partial discharge resistance results i.a. from the fact that it is fundamentally impossible to determine with measurements on the finished module which individual component of the module is responsible for partial discharges at the module.
  • the measurement of partial discharge resistance is specified in the standard IEC 1278.
  • the respective test object is subjected to an initial measuring or test phase initially subjected to a significantly higher than the operating voltage insulation voltage and then in a second, subsequent measurement or test phase, first with a reduced, preparatory measurement voltage and finally with the actual measurement or test voltage at which then the partial discharge is measured.
  • the preparatory test voltage is above the maximum operating voltage of the relevant module and the actual test voltage below the maximum operating voltage of the module.
  • the partial discharge must not exceed a value of 10 pico Coulomb (pC) in this measurement.
  • Copper sheets having on their surface sides a layer or coating (reflow layer) of a chemical compound of the metal and a reactive gas, preferably oxygen.
  • this layer or coating forms a eutectic with a melting temperature below the melting temperature of the metal (eg copper), so that by placing the Film on the ceramic and by heating all the layers can be joined together, by melting the metal or copper substantially only in the region of the reflow layer or oxide layer.
  • the metal eg copper
  • the DCB method then has, for example, the following method steps: - Oxidizing a copper foil such that a uniform copper oxide layer results;
  • the object of the invention is to show a metal-ceramic substrate which reliably complies with the required partial discharge strength of ⁇ 10 pC. To solve this problem, a metal-ceramic substrate is formed according to claim 1.
  • the metallizations are formed, for example, by metal foils, for example by foils of copper or copper alloys.
  • the connection between the respective ceramic layer and the metallization is then realized, for example, using the direct bonding method, for example the DCB process.
  • metal-ceramic substrate is to be understood more generally as meaning a substrate or a layer sequence which has at least one ceramic layer and at least one metallization provided on at least one surface side of the ceramic layer Invention to understand that portion of the surface area of the transition between the respective metallization and the ceramic layer, which (area fraction) does not have defects and at which thus there is a direct connection of the metal layer to the ceramic.
  • the metallizations are connected to the ceramic layer with an adhesive strength of at least 25 N / cm, which is easily achievable with the DCB technique.
  • the adhesive strength of the metallization on the ceramic layer can be determined by a standardized measuring method.
  • a sample substrate is produced which consists of a rectangular ceramic layer and of a metallization formed on one surface side of the ceramic layer by means of the DCB method and formed by a copper foil.
  • the ceramic layer is provided in the transverse direction, for example by laser with a predetermined breaking line.
  • the ceramic layer is broken along the predetermined breaking line and then the respective end of the ceramic layer is bent upwards.
  • the remaining part of the ceramic layer is placed flat on a base and fixed there. On the upturned end of a peel force is applied vertically upwards.
  • the adhesive strength then results as a quotient of the vertical force required for the detachment or removal of the metal layer from the ceramic layer and the width of the strip-shaped sample substrate.
  • FIG. 1 shows a very schematic representation of a metal-ceramic substrate, together with a measuring arrangement for measuring the partial discharge strength of the substrate;
  • FIG. 3 shows a simplified representation of a partial section through a metal-ceramic substrate in the connection region between a metallization and the ceramic, in the region of a defect;
  • a metal-ceramic substrate with a structured metallization in the region of a defect is a metal-ceramic substrate consisting of a ceramic layer 2, on both sides of each metallization 3 or 4 is applied.
  • the ceramic layer 2 has a thickness di.
  • the area F of the two surface sides of the ceramic layer 2 covered by the metallizations 3 and 4 in the illustrated embodiment is somewhat smaller than the total area of these surface sides.
  • the ceramic layer 2 consists for example of Al 2 O 3 or a non-oxide ceramic, such as AlN or S ⁇ 3N4. Ceramic materials with additives are also usable for the ceramic layer 2, for example Al 2 O 3 reinforced with ZrO 2 and / or with additives of cerium oxide, yttrium oxide, magnesium oxide and / or potassium oxide, the ceramic material of the ceramic layer 2 then having, for example, the following composition: Al 2 O 3 70-98% by weight
  • Yttrium oxide, magnesium oxide and potassium oxide are formed.
  • the two metallizations 3 and 4 are each formed by a copper foil and have a thickness d 2. Furthermore, the metallizations 3 and 4 are directly connected to the ceramic layer 2 by a suitable technique, for example by the direct bonding technique. If the ceramic layer 2 in this case of a non-oxide ceramic, such as AIN or Si3N4, this ceramic layer 2 is provided at least on both surface sides with a surface coating of Al2O3, wherein the thickness of this surface coating is not more than 10 microns. Through this surface coating, it is then even when using the The above-mentioned non-oxide ceramics possible to fix the metallizations 3 and 4 with the DCB process surface on the ceramic layer 2.
  • a suitable technique for example by the direct bonding technique.
  • FIG. 2 shows the basic profile of the voltage applied to the metallizations 3 and 4 during the test of the partial discharge strength
  • the entire measuring process essentially comprises the two phases I and II, which are carried out in chronological succession.
  • the measuring voltage VM is increased starting at the time 0 to a predetermined by the measurement method value Vi (insulation voltage), approximately within 10 seconds, then held over a period Ti of about 60 seconds at the value Vi and then lowered continuously, so that approximately 80 seconds after the first measurement phase I is completed, in which essentially the dielectric strength of the metal-ceramic substrate 1 has been tested.
  • Vi insulation voltage
  • the second measurement phase II is automatically initiated, ie approximately 10 seconds after the measurement voltage VM has again reached zero in the first measurement phase I, namely the measurement voltage VM is increased from zero to the value Vi within a predetermined time period, for example within 10 seconds, and then kept at this value over a time period Ti of, for example, 60 seconds. Subsequently, the measuring voltage VM is lowered to a value V2 and kept constant at this value over a predetermined time period T2. Before the expiration of the time period T2 takes place in a predetermined measurement interval TM, which is significantly smaller than the time period T2, the measurement of the partial discharge. After this measurement, the measuring voltage VM is continuously returned to zero.
  • the insulation voltage Vi is clearly above the voltage Vi.
  • the latter is also greater than the voltage V2, with which then the partial discharge resistance is measured.
  • the absolute values Vi, Vi and V2 are dependent on the respective maximum operating voltage of the module containing the metal-ceramic substrate 1.
  • the following table shows the voltage values Vi, V2 and V3 for modules with different operating voltages.
  • the thickness di of the ceramic layer 2 plays a decisive role, and in principle irrespective of the type of ceramic material of this layer.
  • the limit value of less than 10 pC for the partial discharge at the voltage V2 can then be easily met if the voltage V2 and the thickness di fulfill the following function: V 2 ( ⁇ 10 pC) ⁇ 6.1 x di [KV] or d1 ( ⁇ 10 pC)> 1 / 6.1 x V 2 [KV] where di is in mm.
  • the invention is further based on the finding that the surface occupied by the metallizations also significantly determines the partial discharge resistance as a further parameter, and that it is therefore expedient, for the particular metal-ceramic substrate 1 of a module, for the metallizations 3 and 4 areas limited to a maximum of 110 cm 2 .
  • Another crucial parameter for the partial discharge resistance are any defects 5 in the form of cavities at the transition between the respective metallization 3 and 4 and the ceramic layer 2, but such flaws with a diameter d3 smaller than 50 microns and with a height h less than 50 microns the Not affect partial discharge resistance, provided that the total area ratio of the defects 5 is based on the occupied by the respective metallization 3 or 4 total area in the range of 5% or less.
  • Metallization 3 or 4 formed defects 5, the partial discharge resistance is also affected by defects 6, the z.
  • the defects 6 occurring in the structuring can be reduced by the fact that the course of the edge 6.1, which the respective defect 6 has on the surface side of the ceramic layer 2, does not fall below a radius of curvature of 80 ⁇ m.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un substrat métal-céramique comportant au moins une couche céramique dont les deux faces superficielles présentent des métallisations. Selon l'invention, pour permettre l'obtention d'une résistance à la décharge partielle inférieure à 10 pC, l'épaisseur de la couche céramique correspond à environ 1/6 d'une tension de mesure prédéfinie.
EP05747680A 2004-07-08 2005-04-23 Substrat metal-ceramique Ceased EP1763495A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200410033227 DE102004033227A1 (de) 2004-07-08 2004-07-08 Metall-Keramik-Substrat
PCT/DE2005/000751 WO2006005280A1 (fr) 2004-07-08 2005-04-23 Substrat metal-ceramique

Publications (1)

Publication Number Publication Date
EP1763495A1 true EP1763495A1 (fr) 2007-03-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05747680A Ceased EP1763495A1 (fr) 2004-07-08 2005-04-23 Substrat metal-ceramique

Country Status (5)

Country Link
US (1) US7811655B2 (fr)
EP (1) EP1763495A1 (fr)
JP (1) JP2008505502A (fr)
DE (1) DE102004033227A1 (fr)
WO (1) WO2006005280A1 (fr)

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Publication number Priority date Publication date Assignee Title
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
WO2008128944A1 (fr) * 2007-04-24 2008-10-30 Ceramtec Ag Composant présentant un corps céramique dont la surface est métallisée
US20100147795A1 (en) * 2007-04-24 2010-06-17 Claus Peter Kluge Method for the selective surface treatment of non-flat workpieces
KR101519925B1 (ko) 2007-04-24 2015-05-14 세람테크 게엠베하 금속화된 표면을 갖는 세라믹 베이스를 구비한 컴포넌트

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593076A (ja) * 1982-06-29 1984-01-09 株式会社東芝 セラミツク部材と金属との接合方法
DE3376829D1 (en) * 1982-06-29 1988-07-07 Toshiba Kk Method for directly bonding ceramic and metal members and laminated body of the same
JPS5930763A (ja) * 1982-08-11 1984-02-18 日産自動車株式会社 炭化ケイ素焼結体の製造方法
DE4004844C1 (de) 1990-02-16 1991-01-03 Abb Ixys Semiconductor Gmbh Verfahren zur Herstellung einer strukturierten Kupfermetallisierung auf einem Keramiksubstrat
JP3176815B2 (ja) * 1995-01-19 2001-06-18 富士電機株式会社 半導体装置用基板
US5675181A (en) * 1995-01-19 1997-10-07 Fuji Electric Co., Ltd. Zirconia-added alumina substrate with direct bonding of copper
JP3491414B2 (ja) * 1995-11-08 2004-01-26 三菱電機株式会社 回路基板
US5912066A (en) 1996-03-27 1999-06-15 Kabushiki Kaisha Toshiba Silicon nitride circuit board and producing method therefor
JP2000236052A (ja) * 1999-02-15 2000-08-29 Fuji Electric Co Ltd 半導体装置用基板およびその製造方法
JP3818947B2 (ja) * 2002-09-18 2006-09-06 電気化学工業株式会社 接合体の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006005280A1 *

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US7811655B2 (en) 2010-10-12
US20070264463A1 (en) 2007-11-15
JP2008505502A (ja) 2008-02-21
WO2006005280A1 (fr) 2006-01-19

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