EP1754012A1 - Formkörper aus lignocellulosehaltigen materialien - Google Patents
Formkörper aus lignocellulosehaltigen materialienInfo
- Publication number
- EP1754012A1 EP1754012A1 EP05744784A EP05744784A EP1754012A1 EP 1754012 A1 EP1754012 A1 EP 1754012A1 EP 05744784 A EP05744784 A EP 05744784A EP 05744784 A EP05744784 A EP 05744784A EP 1754012 A1 EP1754012 A1 EP 1754012A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- microcapsules
- shaped body
- heat storage
- latent heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/10—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products
- E04C2/16—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products of fibres, chips, vegetable stems, or the like
Definitions
- Shaped body made of lignocellulose-containing materials
- the present application relates to moldings made of lignocellulose-containing materials and a size resin, a process for their preparation and a binder composition containing size resin and microcapsules.
- the mass of building materials in a building stores the inflowing heat during the day in summer and ideally keeps the inside temperature constant. In the cooler night, the stored heat is released back into the outside air. In order to achieve a pleasant indoor climate even in summer without active air conditioning, the thermal mass of the building is essential. However, modern buildings lack such a large thermal mass due to their construction.
- chipboard is not able to store heat at all, but rather has an insulating effect.
- latent heat storage has been investigated as a new material combination in building materials. Their mode of operation is based on the enthalpy of conversion occurring during the solid / liquid phase transition, which means energy absorption or energy release to the environment. They can therefore be used to keep the temperature constant within a defined temperature range. Since the latent heat storage materials are also available in liquid form depending on the temperature, they cannot be processed directly with building materials, as there is a risk of emissions to the room air and separation from the building material.
- EP-A-1 029 018 teaches the use of microcapsules with a capsule wall made of a highly crosslinked methacrylic acid ester polymer and a latent heat storage core in binding materials such as concrete or gypsum.
- the capsule walls since the capsule walls only have a thickness in the range from 5 to 500 nm, they are very sensitive to pressure, an effect which is used when they are used in carbonless papers. However, this limits their use.
- DE-A-101 39 171 describes the use of microencapsulated latent heat storage materials in plasterboard.
- the object of the present invention was to find further possibilities for effective heat storage and thus air conditioning of buildings.
- molded articles made of lignocellulose-containing materials containing 5-20% by weight glue resin, calculated as a solid, based on the weight of the molded article, and 1-30% by weight microcapsules with a polymer as the capsule wall and a capsule core consisting predominantly of latent heat storage materials ,
- the microcapsules contained in the moldings according to the invention are particles with a capsule core consisting predominantly, to more than 95% by weight, of latent heat storage materials and a polymer as the capsule wall.
- the capsule core is solid or liquid, depending on the temperature.
- the average particle size of the capsules (Z-means by means of light scattering) is 0.5 to 100 ⁇ m, preferably 1 to 80 ⁇ m, in particular 1 to 50 ⁇ m.
- the weight ratio of capsule core to capsule wall is generally from 50:50 to 95: 5.
- a core / wall ratio of 70:30 to 90:10 is preferred.
- latent heat storage materials are substances which have a phase transition in the temperature range in which heat transfer is to be carried out.
- the latent heat storage materials preferably have a solid / liquid phase transition in the temperature range from -20 to 120 ° C.
- the latent heat stores are organic, preferably lipophilic substances.
- Suitable substances are: aliphatic hydrocarbon compounds such as saturated or unsaturated C 1 -C 8 -hydrocarbons which are branched or preferably linear, for example such as n-tetradecane, n-pentadecane, n-hexadecane, n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-heneicosane, n-docosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, n-octacosane and cyclic hydrocarbons, for example cyclohexane, cyclooctane, cyclodecane;
- aromatic hydrocarbon compounds such as benzene, naphthalene, biphenyl, o- or n-terphenyl, C 1 -C 0 alkyl-substituted aromatic hydrocarbons such as dodecylbenzene, tetradecylbenzene, hexadecylbenzene, hexylnaphthalene or decylnaphthalene; saturated or unsaturated C 6 -C 30 fatty acids such as lauric, stearic, oleic or behenic acid, preferably eutectic mixtures of decanoic acid with, for example, myristic, palmitic or lauric acid;
- Fatty alcohols such as lauryl, stearyl, oleyl, myristyl, cetyl alcohol, mixtures such as coconut fatty alcohol and the so-called oxo alcohols which are obtained by hydroformylating ⁇ -olefins and other reactions;
- C 6 -C 3 o-fatty amines such as decylamine, dodecylamine, tetradecylamine or hexadecylamine;
- esters such as C 1 -C 4 -alkyl esters of fatty acids such as propyl palmitate, methyl stearate or methyl palmitate and preferably their eutectic mixtures or methyl cinnamate;
- Natural and synthetic waxes such as montanic acid waxes, montan ester waxes, carnauba wax, polyethylene wax, oxidized waxes, polyvinyl ether wax, ethylene vinyl acetate wax or hard waxes according to the Fischer-Tropsch process;
- Halogenated hydrocarbons such as chlorinated paraffin, bromooctadecane, bromopentadecane, bromononadecane, bromeicosane, bromdocosane.
- Mixtures of these substances are also suitable as long as there is no lowering of the melting point outside the desired range or the heat of fusion of the mixture becomes too low for a sensible application.
- n-alkanes n-alkanes with a purity of greater than 80% or of alkane mixtures which are obtained as technical distillate and are commercially available as such.
- the capsule core-forming substances may be advantageous to add compounds soluble in the capsule core-forming substances in order to prevent the lowering of the freezing point which sometimes occurs with the non-polar substances.
- compounds with a melting point 20 to 120 K higher than the actual core substance are advantageously used.
- Suitable compounds are the fatty acids, fatty alcohols, fatty amides and aliphatic hydrocarbon compounds mentioned above as lipophilic substances. They are added in amounts of 0.1 to 10% by weight based on the capsule core.
- the latent heat storage materials are selected.
- latent heat storage materials whose solid / liquid phase transition is in the temperature range from 0 to 60 ° C. are preferably used for heat stores in building materials in a temperate climate.
- single substances or mixtures with transition temperatures of 15 to 30 ° C are selected for indoor applications.
- Preferred latent heat storage materials are aliphatic hydrocarbons, particularly preferably those listed above by way of example.
- aliphatic hydrocarbons with 16, 17 or 18 carbon atoms and mixtures thereof are preferred.
- the materials known for the microcapsules for carbonless papers can be used as the polymer for the capsule wall.
- thermosetting polymers are thermosetting polymers.
- Thermosetting is understood to mean wall materials that do not soften due to the high degree of crosslinking, but decompose at high temperatures.
- Suitable thermosetting wall materials are, for example, highly crosslinked formaldehyde resins, highly crosslinked polyureas and highly crosslinked polyurethanes and highly crosslinked methacrylic acid ester polymers.
- Formaldehyde resins are reaction products made from formaldehyde
- Triazines such as melamine, carbamides such as urea, phenols such as phenol, m-cresol and resorcinol, amino and amido compounds such as aniline, p-toluenesulfonamide, ethylene urea and guanidine,
- Formaldehyde resins preferred as capsule wall material are urea-formaldehyde resins, urea-resorcinol-formaldehyde resins, urea-melamine resins and melamine-formaldehyde resins.
- the C 1 -C 4 -alkyl- in particular methyl ethers of these formaldehyde resins and the mixtures with these formaldehyde resins are preferred.
- melamine-formaldehyde resins and / or their methyl ethers are preferred. In the processes known from carbonless papers, the resins are used as prepolymers.
- the prepolymer is still soluble in the aqueous phase and migrates to the interface in the course of the polycondensation and encloses the oil droplets.
- Methods for microencapsulation with formaldehyde resins are generally known and are described, for example, in EP-A-562 344 and EP-A-974 394.
- Capsule walls made of polyureas and polyurethanes are also known from carbonless papers.
- the capsule walls are formed by reacting NH 2 groups or reactants carrying OH groups with di- and / or polyisocyanates.
- Suitable isocyanates are, for example, ethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate and 2,4- and 2,6-tolylene diisocyanate.
- polyisocyanates such as derivatives with a biuret structure, polyurethane-imines and isocyanurates may be mentioned.
- Possible reactants are: hydrazine, guanidine and its salts, hydroxylamine, di- and polyamines and amino alcohols.
- Such interfacial polyaddition processes are known for example from US 4,021,595, EP-A 0392 876 and EP-A 0 535384.
- Microcapsules are preferred, the capsule wall of which is a highly crosslinked methacrylic acid ester polymer.
- the degree of crosslinking is achieved with a crosslinker fraction> 10% by weight, based on the total polymer.
- the wall-forming polymers are from 30 to 30 to
- the polymers can contain up to 80% by weight, preferably 5 to 60% by weight, in particular 10 to 50% by weight, of a bi- or polyfunctional monomer as monomer II which is insoluble or sparingly soluble in water, polymerized included.
- the polymers can contain up to 40% by weight, preferably up to 30% by weight, of other monomers III in copolymerized form.
- C 1 -C 24 -Alkyl esters of acrylic and / or methacrylic acid are suitable as monomers I.
- Particularly preferred monomers I are methyl, ethyl, n-propyl and n-butyl acrylate and / or the corresponding methacrylates.
- Isopropyl, isobutyl, sec-butyl and tert-butyl acrylate and the corresponding methacrylates are preferred.
- Methacrylonitrile should also be mentioned.
- the methacrylates are generally preferred.
- Suitable monomers II are bifunctional or polyfunctional monomers which are insoluble or sparingly soluble in water, but have a good to limited solubility in the lipophilic substance.
- Low solubility means a solubility of less than 60 g / l at 20 ° C.
- Bifunctional or polyfunctional monomers are understood to mean compounds which have at least 2 non-conjugated ethylenic double bonds. In front- Divinyl and polyvinyl monomers which crosslink the capsule wall during the polymerization are usually suitable.
- Preferred bifunctional monomers are the diesters of diols with acrylic acid or methacrylic acid, furthermore the diallyl and divinyl ethers of these diols.
- Preferred divinyl monomers are ethanediol diacrylate, divinylbenzene, ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, methallyl methacrylamide and allyl methacrylate.
- Propanediol, butanediol, pentanediol and hexanediol diacrylate or the corresponding methacrylates are particularly preferred.
- Preferred polyvinyl monomers are trimethylolpropane triacrylate and methacrylate, pentaerythritol triallyl ether and pentaerythritol tetraacrylate.
- monomers III are suitable as monomers III, preference is given to monomers purple, such as styrene, ⁇ -methylstyrene, ⁇ -methylstyrene, butadiene, isoprene, vinyl acetate, vinyl propionate and vinyl pyridine.
- the water-soluble monomers IIIb e.g. Acrylonitrile, methacrylamide, acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride,
- N-vinyl pyrrolidone 2-hydroxyethyl acrylate and methacrylate and acrylamido-2-methylpropanesulfonic acid.
- N-methylolacrylamide N-
- methylol methacrylamide dimethylaminoethyl methacrylate and diethylaminoethyl methacrylate.
- microcapsules suitable for use according to the invention can be produced by a so-called in-situ polymerization.
- microcapsules and their preparation are known from EP-A-457 154, DE-A-10 139 171, DE-A-102 30 581, EP-A-1 321 182, to which express reference is made.
- the microcapsules are produced in such a way that a stable oil-in-water emulsion is produced from the monomers, a radical initiator, a protective colloid and the lipophilic substance to be encapsulated, in which they are present as a disperse phase.
- the polymerization of the monomers is then triggered by heating and controlled by a further increase in temperature, the resulting polymers forming the capsule wall which encloses the lipophilic substance.
- the polymerization is carried out at 20 to 100 ° C., preferably at 40 to 80 ° C.
- the dispersion and polymerization temperature should be above the melting temperature of the lipophilic substances.
- the polymerization is expediently continued for a period of up to 2 hours in order to lower the residual monomer content.
- microcapsules with an average particle size in the range from 0.5 to 100 ⁇ m can be produced, the particle size being adjustable in a manner known per se via the shear force, the stirring speed, the protective colloid and its concentration.
- Preferred protective colloids are water-soluble polymers, since these reduce the surface tension of the water from 73 mN / m to a maximum of 45 to 70 mN / m and thus ensure the formation of closed capsule walls and microcapsules with preferred particle sizes between 1 and 30 ⁇ m, preferably 3 and 12 ⁇ m, form.
- the microcapsules are produced in the presence of at least one organic protective colloid, which can be both anionic and neutral.
- organic protective colloid which can be both anionic and neutral.
- Anionic and nonionic protective colloids can also be used together.
- Inorganic protective colloids are preferably used, optionally in a mixture with organic protective colloids.
- Organic neutral protective colloids are cellulose derivatives such as hydroxyethyl cellulose, carboxymethyl cellulose and methyl cellulose, polyvinyl pyrrolidone, copolymers of vinyl pyrrolidone, gelatin, gum arabic, xanthan, sodium alginate, casein, polyethylene glycols, preferably polyvinyl alcohols and partially hydrolysed polyols.
- Suitable anionic protective colloids are polymethacrylic acid, the copolymers of sulfoethyl acrylate and methacrylate, sulfopropyl acrylate and methacrylate, N- (sulfoethyl) maleimide, 2-acrylamido-2-alkyl sulfonic acids, styrene sulfonic acid and vinyl sulfonic acid.
- Preferred anionic protective colloids are naphthalenesulfonic acid and naphthalenesulfonic acid-formaldehyde condensates, and especially polyacrylic acids and phenolsulfonic acid-formaldehyde condensates.
- the anionic protective colloids are generally used in amounts of 0.1 to 10% by weight, based on the water phase of the emulsion.
- inorganic protective colloids so-called Pickering systems, which enable stabilization by very fine solid particles and which are insoluble but dispersible in water or insoluble and non-dispersible in water but wettable by the lipophilic substance.
- a Pickering system can consist of the solid particles alone or in addition of auxiliaries which improve the dispersibility of the particles in water or the wettability of the particles by the lipophilic phase.
- the inorganic solid particles can be metal salts such as salts, oxides and hydroxides of calcium, magnesium, iron, zinc, nickel, titanium, aluminum, silicon, barium and manganese.
- metal salts such as salts, oxides and hydroxides of calcium, magnesium, iron, zinc, nickel, titanium, aluminum, silicon, barium and manganese.
- These include magnesium hydroxide, magnesium carbonate, magnesium oxide, calcium oxalate, calcium carbonate, barium carbonate, barium sulfate, titanium dioxide, aluminum oxide, aluminum hydroxide and zinc sulfide.
- Silicates, bentonite, hydroxyapatite and hydrotalcites are also mentioned. Highly disperse silicas, magnesium pyrophosphate and tricalcium phosphate are particularly preferred.
- the Pickering systems can either be added to the water phase first, or added to the stirred oil-in-water emulsion. Some fine, solid particles are produced by precipitation, as described in EP-A-1 029 018 and EP-A-1 321 182.
- the highly disperse silicas can be dispersed as fine, solid particles in water.
- colloidal dispersions of silica in water.
- the colloidal dispersions are alkaline, aqueous mixtures of silica. The particles are swollen in the alkaline pH range and stable in water.
- the pH is adjusted to pH 2 to 7 with an acid during the oil-in-water emulsion.
- the inorganic protective colloids are generally used in amounts of 0.5 to 15% by weight, based on the water phase.
- the organic neutral protective colloids are used in amounts of 0.1 to 15% by weight, preferably 0.5 to 10% by weight, based on the water phase.
- the dispersion conditions for producing the stable oil-in-water emulsion are preferably chosen in a manner known per se such that the oil droplets have the size of the desired microcapsules.
- microcapsules can be incorporated into glue resins commonly used for lignocellulose-containing materials.
- lignocellulose-containing materials are, for example, wood chips from machined logs and billets, sawmill and veneer waste, planing and peeling chips and other lignocellulose-containing raw materials, e.g. Bagasse, flax slices, cotton stems, jute, sisal, straw, flax, coconut fibers, banana fibers, hemp and cork. Wood fibers or wood chips are particularly preferred.
- the raw materials can be in the form of granules, flour, or preferably chips, fibers and / or chips.
- Amine resins, phenolic resins, isocyanate resins and polycarbonate resins are preferred as glue resins.
- Suitable aminoplast resins are binders based on formaldehyde condensates of urea or melamine. They are commercially available as aqueous solutions or powders under the names Kaurit ® and Kauramin ® (manufacturer BASF) and contain urea and / or melamine-formaldehyde precondensates. Mixed condensates and condensates, which may contain other components such as phenol or other aldehydes, are common.
- Suitable aminoplast resins and phenolic resins are urea-melamine-formaldehyde condensates, melamine-urea-formaldehyde phenol condensates, phenol-formaldehyde condensates, phenol-resorcinol
- Formaldehyde condensates, urea-formaldehyde condensates and melamine formaldehyde condensates and their mixtures Their manufacture and use is generally known. As a rule, the precondensation of the starting materials is carried out up to a viscosity of 200 to 500 mPas (based on a 66% by weight resin solution).
- Urea-formaldehyde resins are preferred, in particular those with a molar ratio of 1 mol of urea to 1.1 to 1.4 mol of formaldehyde.
- the soluble and meltable aminoplast precondensates are converted into infusible and insoluble products.
- curing it is known that cross-linking of the pre-condensates, which is usually accelerated by hardeners.
- the hardeners known to those skilled in the art for urea, phenol and / or melamine-formaldehyde resins such as acid-reacting and / or acid-releasing compounds, e.g. Ammonium or amine salts.
- the hardener content in a glue resin liquor is 1 to 5% by weight based on the liquid resin content.
- MDI methylene diphenylene isocyanates
- Suitable isocyanate resins are for example as Lupranat® ® grades (from E lastogran) are commercially available.
- glue resins are polycarboxylic acid resins which are Suitable as glue resins.
- Polymers which contain maleic acid and / or maleic anhydride as monomers a) are particularly preferred.
- Preferred monomers b) are acrylic acid, methacrylic acid, ethene, propene, butene, isobutene, cyclopentene, methyl vinyl ether, ethyl vinyl ether, acrylamide, 2-acrylamido-2-methylpropanesulfonic acid, vinyl acetate, styrene, butadiene, acrylonitrile or mixtures thereof.
- Acrylic acid, methacrylic acid, ethene, acrylamide, styrene and acrylonitrile or mixtures thereof are particularly preferred.
- the monomer b) comprises at least one C 3 -C 6 monocarboxylic acid, preferably acrylic acid, as comonomer b).
- the polymers can be prepared by conventional polymerization processes, e.g. by substance, emulsion, suspension, dispersion, precipitation and solution polymerization.
- the usual equipment is used for all polymerization methods, e.g. Stirred tanks, stirred tank cascades, autoclaves, tubular reactors and kneaders. As is known to the person skilled in the art, the process is carried out in the absence of oxygen.
- the method of solution and emulsion polymerization is preferably used.
- the polymerization is carried out in water, optionally with proportions of up to 60% by weight of alcohols or glycols, as solvents or diluents.
- the ethylenically unsaturated carboxylic acids can be completely or partially neutralized by bases before or during the polymerization.
- bases are, for example, alkali or alkaline earth metal compounds, ammonia, primary, secondary and tertiary amines such as diethanolamin and triethanolamine, and polybasic amines.
- the ethylenically unsaturated carboxylic acids are particularly preferably not neutralized either before or during the polymerization.
- a large number of variants can be used to carry out the polymerization continuously or batchwise.
- some of the monomers are initially introduced, if appropriate, in a suitable diluent or solvent and, if appropriate, in the presence of an emulsifier, a protective colloid or other auxiliaries, and the temperature is increased until the desired polymerization temperature is reached.
- the radical initiator, further monomers and other auxiliaries, such as regulators or crosslinking agents, are each metered in, if appropriate, in a diluent within a defined period.
- the polymers A) are preferably in the form of an aqueous dispersion or solution with solids contents of preferably 10 to 80% by weight, in particular 40 to 65% by weight.
- Alkanolamines with at least two OH groups such as diethanolamine, triethanolamine, diisopropanolamine, triisopropanolamine, methyldiethanolamine, butyldiethanolamine and methyldiisopropanolamine, are mentioned as component B). Triethanolamine is preferred.
- the polymer A) and the alkanol laminate B) are preferably used in such a ratio to one another that the molar ratio of carboxyl groups of component A) and the hydroxyl groups of component B) is 20: 1 to 1: 1, preferably 8 : 1 to 1.5: 1 and particularly preferably 5: 1 to 1.7: 1 (the anhydride groups are calculated here as 2 carboxyl groups).
- polycarboxylic acid resins takes place e.g. simply by adding the alkanolamine to the aqueous dispersion or solution of the polymers A).
- microcapsules can be added to the mixture of wood fibers or chips and binder used as the basis for the shaped bodies in various ways and at different points in the manufacturing process.
- microcapsules can be incorporated into the binder composition as a powder or, preferably, as a dispersion. 2 to 30% by weight, preferably 5 to 15% by weight, of microcapsules, based on the shaped body, are incorporated. However, it is also possible to dry the microcapsules together with the lignocellulose-containing materials in a first process step and then to thermally harden them with the glue resin.
- the present invention further relates to binder compositions containing 40-95% by weight, preferably 40-65% by weight, in particular 50-60% by weight of glue resin, calculated as a solid, 5-40% by weight, preferably 10-35% by weight .-%, in particular 20-30% by weight of microcapsules and optionally water based on 100% by weight of binder composition.
- auxiliaries and additives such as the hardeners, buffers, insecticides, fungicides, fillers, water repellents such as silicone oils, paraffins, waxes, fatty soaps, water retention agents, wetting agents and Flame retardants such as borates and aluminum hydroxide. Accordingly, these auxiliaries and additives can also be contained in the binder compositions according to the invention.
- the moldings according to the invention are in particular plates. Depending on the size of the lignocellulose-containing particles used, a distinction is made between OSB (oriented structural board) boards, chipboard and medium-density (MDF) and high-density (HDF) fiber boards.
- OSB oriented structural board
- MDF medium-density
- HDF high-density
- the binder composition according to the invention is preferably used for chipboard materials, in particular panels.
- the lignocellulose-containing materials can be coated directly with the microcapsules or the binder composition according to the invention.
- the lignocellulose-containing materials are mixed with the binder composition and this mixture is cured thermally, the binder composition comprising 40-95% by weight of glue resin and 5-40% by weight of microcapsules with a polymer as the capsule wall and a capsule core consisting predominantly of latent heat storage materials and 0 - Contains 20 wt .-% water.
- 9 to 30% by weight, preferably 12 to 20% by weight, of the aqueous binder composition are added to the lignocellulose-containing materials, based on the total amount of lignocellulose-containing material and binder composition.
- the viscosity of the aqueous binder composition is preferably (in particular in the production of moldings from wood fibers or wood chips) to 10 to 10,000, particularly preferably to 50 to 1,500 and very particularly preferably to 100 to 1,000 mPa-s (DIN 53019, rotational viscometer at 41 sec -1 ).
- the mixture of lignocellulose-containing materials and the binder composition can be predried, for example, at temperatures from 10 to 150 ° C and then to the shaped articles, e.g. at temperatures of 50 to 300 ° C, preferably 100 to 250 ° C and particularly preferably 140 to 225 ° C and pressures of generally 2 to 200 bar, preferably 5 to 100 bar, particularly preferably 20 to 50 bar to the moldings be pressed.
- temperatures from 10 to 150 ° C and then to the shaped articles e.g. at temperatures of 50 to 300 ° C, preferably 100 to 250 ° C and particularly preferably 140 to 225 ° C and pressures of generally 2 to 200 bar, preferably 5 to 100 bar, particularly preferably 20 to 50 bar to the moldings be pressed.
- the microcapsules are not destroyed, although the mold temperatures are usually above the softening temperatures of the capsule wall materials.
- binder compositions according to the invention are particularly suitable for the production of wood-based materials such as chipboard and wood fiber boards (cf. Wood chips and wood fibers can be produced.
- chipboard is generally known and is described for example in H. Deppe, K. Ernst Taschenbuch der Spanplattenentechnik, 2nd edition, Verlag Leinfelden 1982, described.
- the glue is dried on the previously dried chips in continuous mixers. Different chip fractions are usually glued differently in separate mixers and then separated (multi-layer boards) or poured together.
- the microcapsules can be added to the chips in aqueous solution before the dryer in a continuous mixer or during gluing. men or separately from the glue. A combination of the two methods is also possible.
- Chips are preferably used whose average chip thickness is 0.1 to 2 mm, in particular 0.2 to 0.5 mm, and which contain less than 6% by weight of water.
- the binder composition is applied to the wood chips as evenly as possible, for example by spraying the binder composition onto the chips in finely divided form.
- the glued wood chips are then spread to form a layer with a surface that is as uniform as possible, the thickness of the layer depending on the desired thickness of the finished chipboard.
- the scattering layer is cold pre-compressed if necessary and at a temperature of e.g. 100 to 250 ° C, preferably from 140 to 225 ° C by using pressures of usually 10 to 750 bar pressed to a dimensionally stable plate.
- the pressing times required can vary within a wide range and are generally between 15 seconds and 30 minutes.
- the wood fibers of suitable quality required to produce medium-density wood fiber boards (MDF) from the binders can be made from bark-free wood chips by grinding in special mills or so-called refiners at temperatures of approx. 180 ° C.
- the fibers are glued in the blowline after the refiner.
- the wood fibers are generally whirled up with an air stream and the binder composition is injected into the fiber stream thus produced ("blow-line" process).
- the glued fibers then pass through a dryer in which they are dried to a residual moisture of 7 to 13% by weight. Occasionally the fibers are first dried and subsequently glued in special continuous mixers.
- a combination of blowline and mixer gluing is also possible.
- the microcapsules can be added to the fibers in an aqueous solution in the blowline or separately from the glue.
- the ratio of wood fibers to binder composition based on the dry content or solids content is usually 40: 1 to 3: 1, preferably 20: 1 to 4: 1.
- the glued fibers are in the fiber stream at temperatures of e.g. Dried 130 to 180 ° C, spread into a nonwoven fabric, if necessary cold pre-compressed, and compressed to plates or moldings at pressures of 20 to 40 bar.
- the wood chips are dried to a residual moisture content of 1 - 4%, separated into the middle and top layer material and glued separately in a continuous mixer.
- the addition of the microcapsules to the wood chips can be done in aqueous solution before the dryer in a continuous mixer, or at the Gluing takes place together or separately from the glue. A combination of the two methods is also possible.
- the glued wood chips are then poured into mats, if necessary cold pre-compressed and pressed into boards in heated presses at temperatures of 170 to 240 ° C.
- the glued wood fibers can also, e.g. described in DE-OS 2417 243, processed into a transportable fiber mat.
- This semi-finished product can then be made into plates or molded parts, e.g. Interior door panels of motor vehicles are processed.
- binder compositions according to the invention are furthermore suitable for the production of plywood and blockboard by the generally known production processes.
- natural fiber materials such as sisal, jute, hemp, straw, flax, coconut fiber, banana fiber and other natural fibers can also be processed with the binders into sheets and moldings.
- the natural fiber materials can also be mixed with plastic fibers, e.g. Polypropylene, polyethylene, polyester, polyamide or polyacrylonitrile can be used. These plastic fibers can also act as cobinders in addition to the binder composition according to the invention.
- the proportion of plastic fibers is preferably less than 50% by weight, in particular less than 30% by weight and very particularly preferably less than 10% by weight, based on all chips, chips or fibers.
- the fibers can be processed using the method practiced with wood fiber boards.
- preformed natural fiber mats can also be impregnated with the binders according to the invention, optionally with the addition of a wetting aid.
- the impregnated mats are then e.g. at temperatures between 100 and 250 ° C and pressures between 10 and 100 bar pressed into sheets or molded parts.
- the moldings according to the invention are outstandingly suitable for interior applications such as wall and ceiling cladding. Furthermore, they can be surface-coated by coating, for example for the manufacture of furniture and laminate flooring. They have good heat storage properties.
- the plates according to the invention unexpectedly show good results in water absorption and in thickness swelling after water storage.
- Feed 1 1.09 g of t-butyl hydroperoxide, 70% by weight in water
- Feed 2 0.34 g of ascorbic acid, 0.024 g of NaOH, 56 g of H 2 O.
- the above water phase was introduced at room temperature and adjusted to pH 4 with 3 g of 10% nitric acid. After the oil phase had been added, the mixture was dispersed at 4800 rpm using a high-speed dissolver stirrer. After 40 minutes of dispersion, a stable emulsion with a particle size of 1 to 9 ⁇ m in diameter was obtained.
- the emulsion was heated with stirring with an anchor stirrer to 56 ° C. in 40 minutes, to 58 ° C. within a further 20 minutes, to 71 ° C. within a further 60 minutes and to 85 ° C. within a further 60 minutes. The resulting microcapsule dispersion was cooled to 70 ° C. with stirring and feed 1 was added.
- Feed 2 was metered in with stirring at 70 ° C. over 80 minutes. It was then cooled.
- the microcapsule dispersion formed had a solids content of 47.2% by weight and an average particle size of 5.8 ⁇ m (volume average, measured by means of Fraunhofer diffraction).
- the dispersion could easily be dried in a laboratory spray dryer with a two-fluid nozzle and cyclone separation with 130 ° C inlet temperature of the heating gas and 70 ° C outlet temperature of the powder from the spray tower.
- Microcapsule dispersion and powder showed a melting point between 24.5 and 27.5 ° C. with a conversion enthalpy of 110 J / g alkane mixture when heated in differential calorimetry at a heating rate of 1 K / minute.
- Example 1 Chipboard with latent heat storage
- Thickness swelling The percentage increase in plate thickness due to water storage was determined using a caliper.
- Example 2 MDF board with latent heat storage
- the MDF board contained 14% solid resin / dry fibers, 0.5% solid wax / dry fibers and 5% microcapsules / dry fibers.
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Panels For Use In Building Construction (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57342004P | 2004-05-24 | 2004-05-24 | |
PCT/EP2005/005522 WO2005116559A1 (de) | 2004-05-24 | 2005-05-21 | Formkörper aus lignocellulosehaltigen materialien |
Publications (1)
Publication Number | Publication Date |
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EP1754012A1 true EP1754012A1 (de) | 2007-02-21 |
Family
ID=34968335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05744784A Withdrawn EP1754012A1 (de) | 2004-05-24 | 2005-05-21 | Formkörper aus lignocellulosehaltigen materialien |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080033075A1 (de) |
EP (1) | EP1754012A1 (de) |
JP (1) | JP2008501809A (de) |
WO (1) | WO2005116559A1 (de) |
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EP1858635B1 (de) | 2005-03-04 | 2016-03-02 | Basf Se | Mikrokapselpulver |
WO2008006762A2 (de) | 2006-07-13 | 2008-01-17 | Basf Se | Polyelektrolyt-modifizierte mikrokapseln |
US8163207B2 (en) | 2006-10-17 | 2012-04-24 | Basf Aktiengesellschaft | Microcapsules |
EP2099557B1 (de) | 2006-12-13 | 2016-03-23 | Basf Se | Mikrokapseln |
DE102007026170A1 (de) * | 2007-06-04 | 2008-12-11 | Akzenta Paneele + Profile Gmbh | Laminierte Dekorplatte und Verfahren zu deren Herstellung |
EP2234712B1 (de) | 2007-12-19 | 2016-07-13 | Basf Se | Verfahren zur herstellung von mikrokapseln |
EP2223786B1 (de) * | 2009-02-26 | 2014-09-17 | Kronotec AG | Holzwerkstoffplatte sowie ein Verfahren zum Herstellen einer Holzwerkstoffplatte |
KR20120046166A (ko) * | 2009-06-15 | 2012-05-09 | 바스프 에스이 | 가교제로서 고도 분지형 중합체를 갖는 마이크로캡슐 |
AU2010270141B2 (en) | 2009-07-10 | 2015-05-07 | Basf Se | Microcapsules having polyvinyl monomers as cross-linking agents |
JP5538556B2 (ja) | 2009-11-20 | 2014-07-02 | ビーエーエスエフ ソシエタス・ヨーロピア | 微小中空球を含有する樹脂発泡体 |
KR20120120954A (ko) | 2010-02-03 | 2012-11-02 | 바스프 에스이 | 구조 내로 혼입된 마이크로캡슐을 갖는 멜라민/포름알데히드 발포체 |
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US9181466B2 (en) | 2011-02-16 | 2015-11-10 | Basf Se | Microcapsules with a paraffin composition as capsule core |
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WO2012156345A1 (de) | 2011-05-16 | 2012-11-22 | Basf Se | Melamin-/formaldehyd-schaumstoff enthaltend mikrohohlkugeln |
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CN116890378B (zh) * | 2023-06-06 | 2024-06-11 | 索菲亚家居股份有限公司 | 一种片材及其制备方法和应用 |
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- 2005-05-21 WO PCT/EP2005/005522 patent/WO2005116559A1/de not_active Application Discontinuation
- 2005-05-21 EP EP05744784A patent/EP1754012A1/de not_active Withdrawn
- 2005-05-21 JP JP2007513770A patent/JP2008501809A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
JP2008501809A (ja) | 2008-01-24 |
WO2005116559A1 (de) | 2005-12-08 |
US20080033075A1 (en) | 2008-02-07 |
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