EP1598866A1 - Kühlvorrichtung - Google Patents
Kühlvorrichtung Download PDFInfo
- Publication number
- EP1598866A1 EP1598866A1 EP04011767A EP04011767A EP1598866A1 EP 1598866 A1 EP1598866 A1 EP 1598866A1 EP 04011767 A EP04011767 A EP 04011767A EP 04011767 A EP04011767 A EP 04011767A EP 1598866 A1 EP1598866 A1 EP 1598866A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cooling device
- chambers
- condensation
- evaporation
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a cooling device for preferably large-area units to be cooled, give off the high heat outputs.
- a cooling device which has a multiplicity of side by side arranged, one-sided open evaporation chambers with boundary walls made of thermally conductive material, arranged on the inner surfaces of each a fleece which is saturated with a liquid and which are capable of being over its outer surfaces with to be brought into contact with a material to be cooled, and one of the number of evaporation chambers corresponding plurality of juxtaposed, one-sided open condensation chambers with boundary walls made of thermally conductive material, which are adapted to give off heat to the environment via their outer surfaces, wherein a vaporization chamber and a condensation chamber each across their open sides are connected such that between evaporation chamber and condensation chamber a gastight closed, partially evacuated space area is formed, so that in Operation the liquid contained in the web of a vaporization chamber in the space area evaporated, condensed on the inner surface of the associated condensation chamber and is fed back to the web, wherein the boundary walls of the evaporation chambers and the boundary walls of the condensation chamber
- Such a cooling device according to the invention now makes it possible even large Heat in the shortest time due to the small distance from the evaporator surface to be removed to the condensation surface.
- Through the electrical and thermal decoupling of evaporation and Condensation surfaces is the heat transfer resistance of the cooling device according to the invention very low. Outdoor use is also possible as well as cooling high-voltage components.
- the boundary walls and connecting webs of the evaporation chambers and condensation chambers each in one piece as an extruded profile educated. It is in particular an advantage of the present invention that the profile is such is formed, that the evaporation and condensation chambers in cross section respectively U-shaped with intermediate connecting webs arranged side by side are. This allows cooling systems of the type according to the invention are very simple and inexpensive produce and offer a variety of design and customization options.
- the formed from evaporation and condensation chambers Spaces areas on their sides, each gas-tight with cover elements.
- cover elements are made of polyurethane.
- Such Plastic cover elements are simple and inexpensive to manufacture and provide for maintaining the vacuum very good properties, since they contract under vacuum and thus additionally seal.
- the cooling device according to the invention preferably comprises plastic elements as between arranged on the profiles sealing strips on which the thermal and electrical decoupling ensure the evaporation and condensation chambers.
- the outer surfaces of the condensation chambers are surface enlarged. This significantly increases the heat dissipation performance of the cooling system.
- each condensation chamber is above the associated evaporation chamber arranged, whereby the condensed liquid is quickly supplied to the web and a continuously high heat output performance is ensured.
- FIG. 1 shows a first preferred embodiment of the present invention, wherein the Cooling device 1 is shown in cross-section and a symmetry with respect to the by A-A has defined level.
- the cooling device 1 has four evaporation chambers 10, which are bounded by boundary walls 11, each with Connecting webs 14 are interconnected.
- the outer surfaces 12 of the evaporation chambers 10 are thermally in communication with the unit to be cooled (not shown).
- a fleece 15 is arranged, which is soaked in liquid, such as distilled water or alcohol.
- the cooling device 1 four condensation chambers 20, the are limited by boundary walls 21, each in turn with connecting webs 24 are interconnected.
- the outer surfaces 22 of the condensation chambers 20 are suitable to give heat to their environment.
- a gauze 25, preferably made of metal, is arranged in addition to it serves to receive the condensed liquid and the web 15 of the evaporation chamber 10 attributed.
- the use of gauze 25 is due to capillary action convenient, because the cooling device is then also e.g. can work "upside down" but not necessary for the function of the cooling device according to the invention.
- the gauze 25 prevents u.a. Also, that drops of condensed liquid directly into the evaporation chambers 10 fall behind.
- the one-sided openings of the evaporation chambers 10 and the condensation chambers 20 are substantially opposite each other in the plane A-A, resulting in each case by an evaporation chamber 10 and condensation chamber 20 results in a space area 3, which is evacuated.
- the boundary walls 11, 21 and connecting webs 14, 24 of the adjacent evaporation chambers 10 or condensation chambers 20 are preferably U-shaped in cross-section or cartridge-shaped profile, which in the preferred embodiment of extruded Aluminum is made.
- the evaporation profile of the lower half is from the condensation profile of the upper half in a predetermined distance away, this distance being through the thickness of plastic elements 5, which are located between the connecting webs 14, 24 determined is.
- plastic elements 5 the evaporation chambers 10 and condensation chambers 20 thermally and electrically decoupled from each other.
- material of Plastic elements 5 can be plastics with suitable thermal and electrical properties be used. Of course, for the evaporation and condensation profiles also metals other than aluminum or other thermally conductive materials possible.
- FIG. 2 shows the main components of the cooling device according to the invention from FIG. 1 mapped using the same reference numerals in an exploded view.
- the profiles 16, 26 are arranged one above the other, being between the connecting webs 14, 24, the plastic elements 5 are located.
- the connecting webs 14, 24 can, for example be shaped so that the plastic elements 5 can be inserted like a rail are, resulting in a tensile and gas-tight composite of the two profiles 16, 26 results.
- the thus firmly interconnected profiles 16, 26 are laterally with the cover 7 completed.
- These cover elements 7 are preferably made of polyurethane plastic carried out when (partial) evacuation of the space areas by means of deformed such known vacuum pump towards an even better seal.
- Cooling device 1 are the evaporation and condensation brackets 10, 20th arranged vertically.
- a use of this embodiment of the cooling device 1 at not vertical arrangement is of course also possible, although thereby the Efficiency of the cooling device is slightly lowered.
- FIG. 3 shows a second preferred embodiment of the cooling device according to the invention 1, in which the evaporation chambers 10 and condensation chambers 20 are not are arranged mirror-symmetrically with respect to the symmetry plane defined by C-C.
- the evaporation chambers 10 and condensation chambers 20 at 20 ° with respect to the plane perpendicular to the connection C-C plane inclined downwards or obliquely upwards parallel next to each other.
- other angles of inclination can be selected.
- a particular advantage of this embodiment is that when tilting the entire Cooling device 1 in the plane defined by C-C chimney-like air ducts can form between the condensation chambers 20, the cooling capacity of the device increase.
- Figure 4 shows an exploded view of the main components of the cooling device according to the invention from Figure 3. It will find the same reference numerals as in Figure 2 use.
- the boundary walls 11 of the evaporation chambers 10 consist of very good heat conducting material and those in the fleece 15 contained liquid evaporates in the partially evacuated space area 3 already at relatively low temperatures, because of the vacuum, the boiling temperature decreases.
- the liquid vapor migrates due to the temperature difference in the direction of the condensation chambers 20, diffuses through the gauze 25 and condenses on the inner wall 23 This causes heat to the boundary walls 21 of the Condensation chambers 20 are discharged, via the outer wall 22 of the condensation chamber 20 is transferred to the environment.
- the cooled, condensed liquid runs on the inner wall 23 and the metal gauze 25 again in the direction of the evaporation chambers 10 and is returned to the web 15.
- This heat transfer mechanism via vaporized liquid is extremely effective, especially because the paths from the evaporator surface to the condensation surface are very high are small. It also has the advantage that in the cooling device relatively low temperatures to rule. In this way, significant amounts of heat in the shortest possible time be transported.
- the cooling device according to the invention can be such design that the evaporator and condensation surfaces are arbitrarily large. Compared to conventional cooling devices that work on the heat pipe principle points the subject of the present invention to a much higher efficiency. This high efficiency and the electrical and thermal decoupling of evaporator and condensation surfaces causes the thermal resistance of the Cooling system is very low.
- a cooling device which also large-area units to be cooled effectively cools, can be used in a variety of environments such as outdoors is that has a high efficiency, i. can dissipate high heat outputs, and both simple and relatively inexpensive to produce.
- this is the principle a passive cooling device for large areas not on the exact embodiment limited, as disclosed in the previous description.
- the cooling device according to the invention can be flexibly connected to a large number of external ones Framework conditions are adjusted. It is thus created a solution that extremely effective heat dissipation and environmentally friendly and maintenance-free works.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- Fig. 1
- eine Querschnittansicht einer ersten Ausführungsform der erfindungsgemäßen Kühlvorrichtung;
- Fig. 2
- eine Explosionsdarstellung der Kühlvorrichtung aus Figur 1;
- Fig. 3
- eine Querschnittansicht einer zweiten Ausführungsform der erfindungsgemäßen Kühlvorrichtung; und
- Fig. 4
- eine Explosionsdarstellung der Kühlvorrichtung aus Figur 3.
Claims (10)
- Kühlvorrichtung mit einer Vielzahl von nebeneinander angeordneten, einseitig offenen Verdampfungskammern (10) mit Begrenzungswänden (11) aus wärmeleitendem Material, an deren Innenflächen (13) jeweils ein Vlies (15) angeordnet ist, das mit einer Flüssigkeit getränkt ist, und die geeignet sind, über ihre Außenflächen (12) mit einem zu kühlenden Material in Kontakt gebracht zu werden, und einer der Anzahl von Verdampfungskammern (10) entsprechenden Vielzahl von nebeneinander angeordneten, einseitig offenen Kondensationskammern (20) mit Begrenzungswänden (21) aus wärmeleitendem Material, die geeignet sind, über ihre Außenflächen (22) Wärme an die Umgebung abzugeben, wobei jeweils eine Verdampfungskammer (10) und eine Kondensationskammer (20) über ihre offenen Seiten derart verbunden sind, dass zwischen Verdampfungskammer (10) und Kondensationskammer (20) ein gasdicht abgeschlossener, teilevakuierter Raumbereich (3) ausgebildet ist, so dass im Betrieb die im Vlies (15) einer Verdampfungskammer (10) enthaltene Flüssigkeit im Raumbereich (3) verdampft, an der Innenfläche (23) der zugeordneten Kondensationskammer (20) kondensiert und wieder dem Vlies (15) zugeführt wird, wobei die Begrenzungswände (11) der Verdampfungskammern (10) und die Begrenzungswände (21) der Kondensationskammern (20) durch geeignete Kunststoffelemente (5) thermisch und elektrisch voneinander entkoppelt sind.
- Kühlvorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass an den Innenflächen (23) der Kondensationskammern (20) jeweils eine Gaze (25) angeordnet ist.
- Kühlvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Begrenzungswände (11, 21) der Verdampfungs- (10) und Kondensationskammern (20) jeweils aus einem stranggepressten Profil (16, 26) gebildet sind.
- Kühlvorrichtung nach Anspruch 3, dadurch gekennzeichnet, dass das Profil (16, 26) derart ausgebildet ist, dass die Verdampfungs- (10) und Kondensationskammern (20) im Querschnitt jeweils U-förmig mit dazwischen liegenden Verbindungsstegen (14, 24) geformt sind.
- Kühlvorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Raumbereiche (3) an ihren Seiten jeweils mit Abdeckelementen (7) gasdicht abgeschlossen sind.
- Kühlvorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Abdeckelemente (7) aus Polyurethan gebildet sind.
- Kühlvorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Kunststoffelemente (5) als zwischen den Profilen (16, 26) angeordnete Dichtleisten ausgebildet sind.
- Kühlvorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Flüssigkeit Alkohol oder destilliertes Wasser ist.
- Kühlvorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Außenflächen (22) der Kondensationskammern (20) oberflächenvergrößert sind.
- Kühlvorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass jede Kondensationskammer (20) oberhalb der zugehörigen Verdampfungskammer (10) angeordnet ist.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04011767A EP1598866B1 (de) | 2004-05-18 | 2004-05-18 | Kühlvorrichtung |
DE502004007887T DE502004007887D1 (de) | 2004-05-18 | 2004-05-18 | Kühlvorrichtung |
ES04011767T ES2312878T3 (es) | 2004-05-18 | 2004-05-18 | Dispositivo de enfriamiento. |
AT04011767T ATE405948T1 (de) | 2004-05-18 | 2004-05-18 | Kühlvorrichtung |
JP2005141553A JP3890349B2 (ja) | 2004-05-18 | 2005-05-13 | 冷却装置 |
US11/131,629 US20050257915A1 (en) | 2004-05-18 | 2005-05-18 | Cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04011767A EP1598866B1 (de) | 2004-05-18 | 2004-05-18 | Kühlvorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1598866A1 true EP1598866A1 (de) | 2005-11-23 |
EP1598866B1 EP1598866B1 (de) | 2008-08-20 |
Family
ID=34925041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04011767A Expired - Lifetime EP1598866B1 (de) | 2004-05-18 | 2004-05-18 | Kühlvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050257915A1 (de) |
EP (1) | EP1598866B1 (de) |
JP (1) | JP3890349B2 (de) |
AT (1) | ATE405948T1 (de) |
DE (1) | DE502004007887D1 (de) |
ES (1) | ES2312878T3 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201437591A (zh) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | 熱管結構 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0348838A2 (de) * | 1988-06-27 | 1990-01-03 | THE TEXAS A&M UNIVERSITY SYSTEM | Ausdehnbares Wärmeleitungsrohr für die thermische Regulierung von elektronischen Bauelementen |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2446139A1 (de) * | 1974-09-27 | 1976-04-15 | Barmag Barmer Maschf | Verfahren zur herstellung texturierter garne |
ES2241948T3 (es) * | 2002-12-20 | 2005-11-01 | Innowert Gmbh | Dispositivo de refrigeracion para una unidad electrica o electronica. |
DE10320838B4 (de) * | 2003-05-08 | 2014-11-06 | Rogers Germany Gmbh | Faserverstärktes Metall-Keramik/Glas-Verbundmaterial als Substrat für elektrische Anwendungen, Verfahren zum Herstellen eines derartigen Verbundmaterials sowie Verwendung dieses Verbundmaterials |
-
2004
- 2004-05-18 EP EP04011767A patent/EP1598866B1/de not_active Expired - Lifetime
- 2004-05-18 ES ES04011767T patent/ES2312878T3/es not_active Expired - Lifetime
- 2004-05-18 DE DE502004007887T patent/DE502004007887D1/de not_active Expired - Fee Related
- 2004-05-18 AT AT04011767T patent/ATE405948T1/de not_active IP Right Cessation
-
2005
- 2005-05-13 JP JP2005141553A patent/JP3890349B2/ja not_active Expired - Fee Related
- 2005-05-18 US US11/131,629 patent/US20050257915A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0348838A2 (de) * | 1988-06-27 | 1990-01-03 | THE TEXAS A&M UNIVERSITY SYSTEM | Ausdehnbares Wärmeleitungsrohr für die thermische Regulierung von elektronischen Bauelementen |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
Also Published As
Publication number | Publication date |
---|---|
DE502004007887D1 (de) | 2008-10-02 |
EP1598866B1 (de) | 2008-08-20 |
ATE405948T1 (de) | 2008-09-15 |
ES2312878T3 (es) | 2009-03-01 |
JP2005331234A (ja) | 2005-12-02 |
JP3890349B2 (ja) | 2007-03-07 |
US20050257915A1 (en) | 2005-11-24 |
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