EP1526556A1 - SMD ferritkernspule und Verfahren zu ihrer Herstellung - Google Patents

SMD ferritkernspule und Verfahren zu ihrer Herstellung Download PDF

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Publication number
EP1526556A1
EP1526556A1 EP03023878A EP03023878A EP1526556A1 EP 1526556 A1 EP1526556 A1 EP 1526556A1 EP 03023878 A EP03023878 A EP 03023878A EP 03023878 A EP03023878 A EP 03023878A EP 1526556 A1 EP1526556 A1 EP 1526556A1
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EP
European Patent Office
Prior art keywords
core body
cored coil
terminals
coil structure
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03023878A
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English (en)
French (fr)
Inventor
Yun-Kuang Fan
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP03023878A priority Critical patent/EP1526556A1/de
Publication of EP1526556A1 publication Critical patent/EP1526556A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Definitions

  • the present invention relates to a ferrite cored coil structure for SMD, and fabrication method of the same, and more particularly, to an innovative ferrite cored coil structure for SMD (surface mounting device) in which a stud is protruded out of each of the two ends thereof and associated with a conducting bracket, and the fabrication of the same involves molding technology and punching technology.
  • Fig. 1(A) shows a ferrite cored coil structure for SMD fabricated according to the conventional technique.
  • an Ag-Pd alloy is electroplated on the bottom surface 811 of a ferrite core 81 to form two electrodes 812, and the two terminals 821 of a coil 82 wound around the core 81 are fastened thereat by electroplating such that fabrication of the ferrite cored coil structure for SMD 8 is accomplished.
  • the ferrite cored coil structure for SMD fabricated as such is disadvantageous owing to the fact that the Ag-Pd alloy used for electroplating is quite expensive, and the treatment of waste water produced by electroplating to meet the requirement of standards for environmental protection is rather difficult to attain. Should the treatment of waste water be incomplete, an immediate impact to the environmental ecological state could not be avoided.
  • Figs. 1(B) and 1(C) show another ferrite cored coil structure 9 for SMD fabricated according to the conventional technique.
  • a coil 92 is wound around a fabricated ferrite core 91 which is adhered to a base 93 having an electrode 931 with an AB binder so as to form a ferrite cored coil structure 9 for SMD.
  • the ferrite cored coil 9 fabricated as such can do without using Ag-Pd alloy.
  • using an extra base causes the increase of the volume and height of the product resulting in increasing the production cost due to complicated fabrication process.
  • the inventor of the present invention disclosed an innovated fabrication technique (refer to Taiwan Pat. No. 458351) shown in Fig. 1(D).
  • the invention effectively rectified the shortcomings inherent to the conventional technique and made it possible for promoting mass production, reducing the production cost and eliminating problematic environmental contamination.
  • the invention still remains some disadvantages to be overcome.
  • the stand type SMD structure results in excessive product height that is not well fitted for installing in thin and tiny electronic devices whose available inner space is usually limited.
  • the ferrite cored coil structure of the present invention has two studs each protruded out of the right and the left sides of the core body for engaging with a conductor plate provided on the conducting bracket, and then both ends of the core body are respectively enclosed to form an insulation block.
  • the unenclosed portion of the core body is wound with a conductor to form a coil, then afterwards both terminals of the coil are soldered to emerge terminals of the conductor plates thereby forming a wound type inductor element for SMD.
  • the fabrication method of the same provided by the present invention is not only able to simplify complicated fabrication steps involved in the conventional technique, but also causes it possible for mass production. Meanwhile, the assembled structure of the present invention can be laid horizontally that contributes to saving space when being equipped with associated components in an electronic device.
  • the ferrite cored coil structure for SMD is essentially composed of a core body 1, two conductor plates 2, two insulation blocks 3 and a coil 4.
  • the core body 1 is configured into an approximate H shape having two studs 11 each of them being protruded out of a side surface of the core body 1.
  • the conductor plates 2 has a contact terminal 21 at one end, and an extension conducting terminal 22 at the other end, the front tip portion of the conducting terminal 22 is cambered to form a detention portion 23 which and the conducting terminal 22 are each respectively fixed to and rests on one of the studs formed at both ends of the core body 1 firmly.
  • the insulation block 3 is made of an insulation material such as epoxy resin or the like. Before enclosing, the insulation material is heated to melt into liquid state so as to be easily enclosed over both end portions of the core body 1, the insulation material recovers its solid state to form into the insulation block 3 after being cooled down.
  • the coil 4 is an electrical conducting member formed with continuously and spirally wound conductor on part of the core body 1 where it is not enclosed with the insulation body 3 with its both terminals 41, 42 respectively connected to corresponding conducting terminals 22 of the conductor plate 2.
  • the ferrite cored coil structure is laid horizontally when in operation so as to enable attaching a substrate 5 by SMD technology (see Figs. 3(A),3(B)) thereby minimizing the occupied space by the substrate 5 as small as possible to utilize the limited available space in the electronic device effectively.
  • the fabrication method of the ferrite cored coil structure for SMD comprises the following steps:
  • the widely applicable ferrite cored coil structure for SMD is well suitable for mass production in effectively shortened time and with curtailed production cost.
  • the detention portions 23 of the component unit 61 for the conducting bracket 6 are omitted, but alternatively, the conducting terminals 22 of the conductor plate 2 symmetrically formed at two ends of the component unit 61 for the conducting bracket 6 are restrained respectively by the studs 11 protruded out of the two ends of the core body 1.
  • the ferrite cored coil structure for SMD which being constructed as such can also be fabricated according to the same steps as describe above.
EP03023878A 2003-10-21 2003-10-21 SMD ferritkernspule und Verfahren zu ihrer Herstellung Withdrawn EP1526556A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP03023878A EP1526556A1 (de) 2003-10-21 2003-10-21 SMD ferritkernspule und Verfahren zu ihrer Herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03023878A EP1526556A1 (de) 2003-10-21 2003-10-21 SMD ferritkernspule und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
EP1526556A1 true EP1526556A1 (de) 2005-04-27

Family

ID=34384583

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03023878A Withdrawn EP1526556A1 (de) 2003-10-21 2003-10-21 SMD ferritkernspule und Verfahren zu ihrer Herstellung

Country Status (1)

Country Link
EP (1) EP1526556A1 (de)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010129349A1 (en) * 2009-05-04 2010-11-11 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US7986208B2 (en) 2008-07-11 2011-07-26 Cooper Technologies Company Surface mount magnetic component assembly
US8183967B2 (en) 2008-07-11 2012-05-22 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8188824B2 (en) 2008-07-11 2012-05-29 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8310332B2 (en) 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US8400245B2 (en) 2008-07-11 2013-03-19 Cooper Technologies Company High current magnetic component and methods of manufacture
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US8910373B2 (en) 2008-07-29 2014-12-16 Cooper Technologies Company Method of manufacturing an electromagnetic component
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118364A (en) * 1994-03-30 2000-09-12 Matsushita Electric Industrial Co., Ltd. Chip inductor
WO2001093284A1 (fr) * 2000-06-01 2001-12-06 Fan Yun Kuang Structure en noyau de ferrite a extremite rapportee

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118364A (en) * 1994-03-30 2000-09-12 Matsushita Electric Industrial Co., Ltd. Chip inductor
WO2001093284A1 (fr) * 2000-06-01 2001-12-06 Fan Yun Kuang Structure en noyau de ferrite a extremite rapportee

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9275787B2 (en) 2006-09-12 2016-03-01 Cooper Technologies Company High current magnetic component and methods of manufacture
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
US7986208B2 (en) 2008-07-11 2011-07-26 Cooper Technologies Company Surface mount magnetic component assembly
US8183967B2 (en) 2008-07-11 2012-05-22 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8188824B2 (en) 2008-07-11 2012-05-29 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8400245B2 (en) 2008-07-11 2013-03-19 Cooper Technologies Company High current magnetic component and methods of manufacture
US8910373B2 (en) 2008-07-29 2014-12-16 Cooper Technologies Company Method of manufacturing an electromagnetic component
US8310332B2 (en) 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
CN102428527B (zh) * 2009-05-04 2014-05-28 库柏技术公司 表面安装磁性部件及其制造方法
WO2010129349A1 (en) * 2009-05-04 2010-11-11 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
CN102428527A (zh) * 2009-05-04 2012-04-25 库柏技术公司 表面安装磁性部件及其制造方法
WO2010129352A1 (en) * 2009-05-04 2010-11-11 Cooper Technologies Company Magnetic component assembly
WO2010129256A1 (en) * 2009-05-04 2010-11-11 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same

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