EP1266730A1 - Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) - Google Patents
Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) Download PDFInfo
- Publication number
- EP1266730A1 EP1266730A1 EP01850102A EP01850102A EP1266730A1 EP 1266730 A1 EP1266730 A1 EP 1266730A1 EP 01850102 A EP01850102 A EP 01850102A EP 01850102 A EP01850102 A EP 01850102A EP 1266730 A1 EP1266730 A1 EP 1266730A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chips
- formaldehyde
- tannin
- fibers
- chipboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
Definitions
- the invention relates to a method for producing moisture-resistant Chipboard and fiberboard in the dry process, such as medium density fiberboard (MDF).
- MDF medium density fiberboard
- Wood chips and fiberboard are manufactured by using chips or Fibers glued with a binder, the glued chips or fibers to mats scatters and then at temperatures of 140 ° C to 220 ° C to chip or Fiberboard presses.
- chipboard gluing is usually carried out afterwards Drying the chips can be used in the manufacture of medium density fiberboard (MDF) the fibers are glued before or after the fibers have dried.
- MDF medium density fiberboard
- the wood fibers are usually made in a so-called blow-line process first glued and then dried in one or two stages.
- a binder for the production of chipboard and fiberboard mainly aminoplast resins, especially urea formaldehyde (UF resins) and urea-melamine formaldehyde resins (MUF resins) are used. It can too other binders such as alkaline curing phenol formaldehyde resins (PF resins), Tannin formaldehyde resins (TF resins) and adhesives based on polymers Diisocyanates (PMDI) can be used. So far, these binders have one comparatively minor importance. In multi-layer chipboard and fiberboard different binders can be used in the different layers come.
- PF resins alkaline curing phenol formaldehyde resins
- TF resins Tannin formaldehyde resins
- PMDI polymers Diisocyanates
- oriented beach boards frequently used PMDI in the middle layer and MUF resins in the outer layers.
- So-called chipboard can also be produced, in which the Cover layers consist of fibers and the middle layers consist of chips.
- binders in the chip and fiber layers be used.
- UF resins The urea-formaldehyde resins adhere as two binders Disadvantages. These are the subsequent release of formaldehyde and the low Moisture resistance of wood-based materials made with UF resins. With UF resins can not produce chipboard or fiberboard that the Pass the cooking strength test according to DIN 68763. With UF resins are also Spanund Fiberboard with extremely low thickness swelling hardly or not producible. This is particularly true when the molar ratio of formaldehyde: urea in the UF resins is low. From a certain molar ratio (formaldehyde : Urea) increases with a decrease in the formaldehyde content in the resin Thickness swelling clearly.
- the formaldehyde release from chipboard this will reduce if the chips have dried to a moisture content of a maximum of 12% can be treated with formaldehyde-active substances such as urea.
- formaldehyde-active substances such as urea.
- the chips before treatment with the formaldehyde scavenger or with the urea have a maximum moisture content of 12%, the urea penetrates deep into the Wood structure stays on during the hardening process of the binder spatially separated and unfolds its effect only after the hardening process and during the subsequent storage of the chipboard produced.
- This The disadvantage of this method is that the moisture resistance is based on Formaldehyde used Binedffen reduced. Your commitment is with the Use of resins with a molar ratio of formaldehyde: urea of 1: 1 and among them very critical (DE 3222195).
- melamine resin or Melamine urea resin with phenol in the presence of formaldehyde or one Melamine methylol compound.
- MUPF resins Melamine urea phenol formaldehyde resins
- MUPF and MUF resins are expensive.
- the introduction of melamine in Urea-formaldehyde resins also reduce the curing speed of the Harzes and therefore leads, albeit slightly, to an extension of the required pressing times.
- melamine as a formaldehyde scavenger in UF resins with a high molar ratio of formaldehyde: urea (1.5: 1) is also known (DE-OS 1653167).
- the addition of melamine to urea formaldehyde resins with a low molar ratio of formaldehyde: urea (1: 1 to about 1.2: 1) is also known from EP 0062389.
- the moisture resistance which is determined according to DIN 68763 as the V100 value, drops considerably if the amount of formaldehyde in the binder is reduced.
- the V100 value decreases considerably when the ratio F / NH 2 (formaldehyde / NH 2 groups) in the resin drops below 0.65. This seems to be due to the fact that as the proportion of formaldehyde in the resin decreases, the crosslinking density of the cured resin decreases.
- an increase in the proportion of formaldehyde has the disadvantage that the release of formaldehyde from the chipboard or fiberboard produced is increased.
- EP-A-0013447 also proposes aminoplast resins in combination use with 2 to 20% soluble or dispersible protein as a binder.
- PMDI diisocyanates
- the object of this invention was therefore to find a new way to produce moisture-resistant chipboard and fiberboard without the Curing speed of the binders used, especially those Base of MUF resins, to reduce or the moisture resistance of the reduce manufactured plates or increase formaldehyde release. It is also the object of the invention, panels with high moisture resistance Manufactured using extremely low MUF resins Formaldehyde content.
- the condensed tannin added to the fibers in a blow-line before gluing.
- gluing in Glue mixers also use the tannin before the fibers dry added. This procedure has the advantage that the condensed tannins can also be applied in diluted form to the chips or to the fibers.
- the teaching of the present invention also differs from the teaching of DE-OS 4402341, the treatment of chips with alkaline Tannin formaldehyde resins, preferably at a pH above 12 and subsequent drying of the glued chips before the pressing process.
- the aim of DE-OS 4402341 is to self-condense the tannins without Addition of a crosslinking agent such as formaldehyde. Up to which Moisture content of the chips must be dried can be found in DE-OS 4402341 do not remove.
- the example listed in DE-OS 4402341 does not contain any Information about the pressing temperature. With the procedure according to DE-OS 440234A1, boards with moisture-resistant gluing cannot be achieved. However, this is the object of the present invention.
- the amount of Tannin solution, based on the weight of the chips, is 3.33% (or 1% Solid tannin based on dry chips).
- the chips were removed immediately afterwards dried to a moisture of 1-2%.
- the dried chips were with glued with a MUF resin.
- the binder expenditure was 11% (based on the atro weight of the chips).
- the glued chips then became mats sprinkled and hot pressed to 19 mm thick chipboard.
- the pine wood chips were without Add condensed tannins to a moisture of 1-2% and dried with an MUF resin in quantities of 12% based on the atomic weight of the chips glued and then sprinkled into mats and hot pressed.
- the chips are pre-condensed with tannins treated after drying and after drying - as usual - with a mixture glued with tannin formaldehyde resin and melamine urea formaldehyde resin Scattered mats and then pressed to chipboard.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Inorganic Fibers (AREA)
Abstract
Description
Eigenschaft | Versuch 1 Späne mit Tannin vor der Trocknung behandelt und an- schließend mit 11 % eines MUF-Harzes beleimt und zu Platten gepreßt | Versuch 2 Späne ohne Tanninbehand lung getrocknet und an- schließend mit 12 % MUF-Harz beleimt und zu Platten gepreßt |
Biegefestigkeit (N/mm2) | 18,7 | 18,0 |
Querzugfestigkeit (N/mm2) | 0,8 | 0,7 |
Dickenquellung (2 h/24 h) | 4,0%/8,7 % | 4,7 %/8,9 % |
Formaldehydabgabe (mg/1 kg) | 4,2 | 5,3 |
V 313-Test (N/mm2) | 0,25 | 0,23 |
Eigenschaft | Versuch 1 Späne vor der Trocknung mit Tannin behandelt und an- schließend mit 10,8 % eines MUF-Harzes beleimt | Versuch 2 Späne ohne Behandlung mit Tannin vor der Trocknung und mit 12 % eines MUF- Harzes beleimt |
Querzugfestigkeit N/mm2 | 1,45 | 1,49 |
Dickenquellung 24 h % | 7,2 | 5,9 |
Kochquerzugfestigkeit N/mm2 (V100-Wert) | 0,35 | 0,34 |
Formaldehydabgabe (Perforatorwert) mg/100 g | 4,4 | 4,9 |
Flaschenwert mg/1000 g | 7,3 | 8,0 |
Rohdichte der Platte g/cm3 | 719 | 738 |
Plattendicke mm | 16 | 16 |
Claims (14)
- Verfahren zur Herstellung von feuchtebeständigen Span- oder Faserplatten nach dem Trockenprozeß mit Phenol-Formaldehydharzen oder Melamin-Harnstoff-Formaldehydharzen oder Melamin-Harnstoffphenolharzen oder Tanninformaldehydharzen oder PMDI als Bindemittel, dadurch gekennzeichnet, daß die nassen Späne oder Fasern vor dem Beleimen mit dem Bindemitel mit kondensierten Tanninen behandelt werden und anschließend die Späne bis zu einer Feuchte von höchstens 5 % und die Fasern bis zu einer Feuchte von maximal 15 % getrocknet werden.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß als Tannin Extrakte aus dem Quebrachoholz eingesetzt werden.
- Verfahren gemäß Anspruch 1 und 2 dadurch gekennzeichnet, daß die Tanninlösung einen Stoffgehalt von 30 % hat.
- Verfahren nach Anspruch 1, 2 und 3 dadurch gekennzeichnet, daß der pH-Wert der Tanninlösung im sauren Bereich liegt.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß der pH-Wert der Tanninlösung im alkalischen Bereich liegt.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die vor der Trocknung mit Tanninen behandelten Späne nur in den Deckschichten von dreischichtigen Holzspanplatten eingesetzt werden.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die vor der Trocknung mit Tanninen behandelten Späne nur in der Mittelschicht von dreichschichtigen Spanplatten eingesetzt werden.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die vor der Trocknung mit Tanninen behandelten Fasern nur in der Mittelschicht von dreischichtigen Faserplatten eingesetzt werden.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die vor dem Trocknen mit Tannin behandelten Fasern in der Deckschicht von Span-Faserplatten eingesetzt werden.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß das als Bindemittel verwendete MUF-Harz ein Molverhältnis F/NH2 von unter 0,7 aufweist.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß das als Bindemittel verwendete MUF-Harz ein Molverhältnis F/NH2 von unter 0,5 hat.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß in den Schichten, deren Späne vor dem Trocknen nicht mit Tannin behandelt wurden, das verwendete Bindemittel für die Herstellung von Span- und Faserplatten eine Mischung aus Tanninformaldehyd- und Melamin-Harnstoff-Formaldehydharzen ist.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die Späne oder die Fasern vor der Behandlung mit Tannin eine Feuchte von über 12 % haben.
- Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die Späne oder die Fasern vor dem Behandeln mit Tannin eine Feuchte von über 50 % haben.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT01850102T ATE321636T1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur herstellung von feuchtebeständigen span- und mitteldichten faserplatten (mdf) |
DE50109378T DE50109378D1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) |
EP01850102A EP1266730B1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01850102A EP1266730B1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1266730A1 true EP1266730A1 (de) | 2002-12-18 |
EP1266730B1 EP1266730B1 (de) | 2006-03-29 |
Family
ID=8184874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01850102A Expired - Lifetime EP1266730B1 (de) | 2001-06-12 | 2001-06-12 | Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF) |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1266730B1 (de) |
AT (1) | ATE321636T1 (de) |
DE (1) | DE50109378D1 (de) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004058843A1 (en) * | 2002-12-24 | 2004-07-15 | Borden Chemical Australia Pty Ltd | A tannin, aldehyde, amino compound- based resin composition and its use as a binding agent for composite wood products |
FR2850414A1 (fr) * | 2003-01-24 | 2004-07-30 | Espace Production Internationa | Revetement de sol stratifie astatique |
WO2006039914A1 (de) * | 2004-10-15 | 2006-04-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur verminderung der abgabe von flüchtigen organischen verbindungen (voc) aus holz und holzzerkleinerungsprodukten und aus daraus hergestellten holzwerkstoffen, insbesondere holzspanplatten |
WO2006114089A1 (de) * | 2005-04-26 | 2006-11-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur herstellung von mitteldichten faserplatten und faserformteilen mit verringerter emission und niedriger dickenquellung |
WO2009020438A1 (en) | 2007-08-08 | 2009-02-12 | Kronospan Sk S.R.O. | Single - layer particle construction board |
CN105583934A (zh) * | 2015-11-30 | 2016-05-18 | 万华生态板业股份有限公司 | 作为防霉剂使用的硼酸锌在秸秆板生产中的应用 |
WO2017023218A1 (en) | 2015-04-21 | 2017-02-09 | Kastamonu Entegre Agac Sanayi Anonim Sirketi | Production process of the resins containing polyflavonoid and derivatives and their application in the wood based composite board products |
WO2019117799A1 (en) * | 2017-12-15 | 2019-06-20 | Nsr Ab | Hybrid resin particle-board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4402341A1 (de) * | 1994-01-27 | 1995-08-03 | Ruetgerswerke Ag | Bindemittellösungen für cellulosehaltige Produkte |
EP0699510A2 (de) * | 1994-09-02 | 1996-03-06 | Schlingmann GmbH & Co. | Verfahren zur Verminderung der Formaldehydabgabe von Lignocellulose-Erzeugnissen |
DE19528492A1 (de) * | 1995-08-03 | 1997-02-06 | Raffael Etmone Prof Dr Ing | Verfahren zur Herstellung von mit Tanninformeldehydharzen gebundenen mitteldichten Holzfaserplatten (MDF) |
EP0788866A2 (de) * | 1996-02-09 | 1997-08-13 | Schlingmann GmbH & Co. | Verfahren zur Herstellung von formaldehydarmen tanningebundenen Holzspan- und Faserplatten |
-
2001
- 2001-06-12 DE DE50109378T patent/DE50109378D1/de not_active Expired - Lifetime
- 2001-06-12 AT AT01850102T patent/ATE321636T1/de not_active IP Right Cessation
- 2001-06-12 EP EP01850102A patent/EP1266730B1/de not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4402341A1 (de) * | 1994-01-27 | 1995-08-03 | Ruetgerswerke Ag | Bindemittellösungen für cellulosehaltige Produkte |
EP0699510A2 (de) * | 1994-09-02 | 1996-03-06 | Schlingmann GmbH & Co. | Verfahren zur Verminderung der Formaldehydabgabe von Lignocellulose-Erzeugnissen |
DE19528492A1 (de) * | 1995-08-03 | 1997-02-06 | Raffael Etmone Prof Dr Ing | Verfahren zur Herstellung von mit Tanninformeldehydharzen gebundenen mitteldichten Holzfaserplatten (MDF) |
EP0788866A2 (de) * | 1996-02-09 | 1997-08-13 | Schlingmann GmbH & Co. | Verfahren zur Herstellung von formaldehydarmen tanningebundenen Holzspan- und Faserplatten |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004058843A1 (en) * | 2002-12-24 | 2004-07-15 | Borden Chemical Australia Pty Ltd | A tannin, aldehyde, amino compound- based resin composition and its use as a binding agent for composite wood products |
FR2850414A1 (fr) * | 2003-01-24 | 2004-07-30 | Espace Production Internationa | Revetement de sol stratifie astatique |
EP1445992A1 (de) * | 2003-01-24 | 2004-08-11 | Espace Production International EPI (Société Anonyme) | Antistatischer Laminatfussboden |
WO2006039914A1 (de) * | 2004-10-15 | 2006-04-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur verminderung der abgabe von flüchtigen organischen verbindungen (voc) aus holz und holzzerkleinerungsprodukten und aus daraus hergestellten holzwerkstoffen, insbesondere holzspanplatten |
WO2006114089A1 (de) * | 2005-04-26 | 2006-11-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur herstellung von mitteldichten faserplatten und faserformteilen mit verringerter emission und niedriger dickenquellung |
WO2009020438A1 (en) | 2007-08-08 | 2009-02-12 | Kronospan Sk S.R.O. | Single - layer particle construction board |
WO2017023218A1 (en) | 2015-04-21 | 2017-02-09 | Kastamonu Entegre Agac Sanayi Anonim Sirketi | Production process of the resins containing polyflavonoid and derivatives and their application in the wood based composite board products |
CN105583934A (zh) * | 2015-11-30 | 2016-05-18 | 万华生态板业股份有限公司 | 作为防霉剂使用的硼酸锌在秸秆板生产中的应用 |
WO2019117799A1 (en) * | 2017-12-15 | 2019-06-20 | Nsr Ab | Hybrid resin particle-board |
Also Published As
Publication number | Publication date |
---|---|
EP1266730B1 (de) | 2006-03-29 |
ATE321636T1 (de) | 2006-04-15 |
DE50109378D1 (de) | 2006-05-18 |
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