EP1028388A2 - Elément d'identification et procédé de fabrication d'un élément d'identification - Google Patents

Elément d'identification et procédé de fabrication d'un élément d'identification Download PDF

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Publication number
EP1028388A2
EP1028388A2 EP00100695A EP00100695A EP1028388A2 EP 1028388 A2 EP1028388 A2 EP 1028388A2 EP 00100695 A EP00100695 A EP 00100695A EP 00100695 A EP00100695 A EP 00100695A EP 1028388 A2 EP1028388 A2 EP 1028388A2
Authority
EP
European Patent Office
Prior art keywords
antenna coil
integrated circuit
identification element
bumps
element according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00100695A
Other languages
German (de)
English (en)
Other versions
EP1028388B1 (fr
EP1028388A3 (fr
Inventor
Richard Altwasser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meto International GmbH
Original Assignee
Meto International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meto International GmbH filed Critical Meto International GmbH
Publication of EP1028388A2 publication Critical patent/EP1028388A2/fr
Publication of EP1028388A3 publication Critical patent/EP1028388A3/fr
Application granted granted Critical
Publication of EP1028388B1 publication Critical patent/EP1028388B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Definitions

  • the invention relates to an identification element consisting of a integrated circuit with contacts and an antenna coil ( ⁇ RF / ID Transponder), the antenna coil comprising at least one conductor track there is at least one turn, the antenna coil with the Integrated circuit is electrically connected and the integrated Circuit and the antenna coil are arranged on a carrier layer. Furthermore, the invention relates to a method for producing a such identification element.
  • RFID transponders over those in particular in the area
  • the barcode used primarily for product labeling consists of that they allow a direct exchange of information, d. H. It is not Visual contact for the transmission of information between the query device and Transponder required. In addition, it is in the case of RFID transponders In contrast to barcodes, their information content is easily possible Change need immediately.
  • RFID transponders are used in a wide variety of areas. They can be used, for example, in production, further processing, the transport and securing of goods as well as the Use personal controls and animal identification.
  • a method for contacting an integrated circuit with a resonant circuit, which is attached to a flexible carrier, and a corresponding transponder are described in EP 0 821 406 A1.
  • the resonant circuit is formed from two electrically conductive patterns which are arranged on both sides of the flexible carrier.
  • the resonant circuit has a predetermined inductance and a predetermined capacitance.
  • the contact area on the flexible carrier is cleaned first.
  • the integrated circuit is then connected to the resonant circuit via what is known as a wire connection (wire bonding), which is known from semiconductor technology.
  • the integrated circuit and the contact area are covered with a protective layer.
  • the disadvantage of this known method and the known transponder are the relatively high manufacturing costs. This also contributes to the fact that the circuit, and in particular the contact area between the circuit and the resonant circuit, must be subsequently covered with a protective layer, since there is otherwise the risk that the contact will be destroyed during use. For many applications, it is essential that the transponders can be easily integrated into labels. Since the transponder of the known solution is much thicker in the area of the chip than in the other areas, this leads to considerable problems when printing in a label printer. Another disadvantage of the known solution is that the conductor tracks forming the resonant circuit are produced by etching. Etching is a relatively expensive process, which is also extremely harmful to the environment.
  • EP 0 595 549 B1 is a removable identification tag become known in which the electrical contact between the chip and the antenna is manufactured using an electrically conductive adhesive ( ⁇ Flip chip bonding). This type of contacting isotropic and anisotropic electrically conductive adhesive substances for use. To do this the electrically conductive adhesive substance in the contact area on the antenna upset. The contact areas of the chip are in the electrically conductive Glue pressed in; then the adhesive is applied by applying heat hardened.
  • the problem here is that the electrically conductive adhesive must be dosed accordingly and applied to the antenna structure in a locally defined manner.
  • the application is usually carried out using the screen printing process, which is disadvantageous in that residues of the expensive electrically conductive adhesive always remain as residues in the application screens.
  • a certain amount of energy is also required for the curing of the adhesives.
  • this since only limited maximum temperatures may be used for the heat treatment, this has a negative effect on the cycle time required for the curing of the adhesive substances. The consequence of this in turn is the undesirably high manufacturing costs.
  • adhesives are used in which electrically conductive particles are randomly distributed in such a low concentration that the adhesive itself is not conductive ( ⁇ anisotropic adhesives).
  • Precious metals such as z. B. palladium, silver or gold.
  • Plastic balls coated with gold or nickel are also known. Because of the relatively large surface area available and the elastic properties of the plastic material used, these have favorable connection properties, since on the one hand there is a correspondingly large contact surface area and on the other hand because the elastic restoring forces lead to intimate contact between the conductor track and the surface of the contact points is coming.
  • the chip contact points made of a precious metal, eg. B.
  • the invention has for its object a cost-effective identification element and a method for producing such an identification element to propose.
  • the electrically conductive adhesive for contacting integrated Circuit and antenna coil suggests that the expensive Adhesive substances with the anisotropically or isotropically distributed conductive particles can be dispensed with.
  • Adhesives only have to meet the requirement that they harden theirs Reduce volume. With many adhesives, this requirement is fulfilled as soon as they experience a change in state smoothly ⁇ as soon as or as soon as it is Cool higher temperature to a lower temperature.
  • suitable Choice of the adhesive substance and / or the amount of adhesive substance used the strength of the press contact between the bumps and the antenna coil is defined to adjust.
  • the bumps essentially out Palladium are made.
  • Palladium is relatively inexpensive and has the required hardness.
  • a preferred embodiment of the identification element according to the invention provides that the contacted with the surface of the antenna coil Surface of the bumps a surface roughness with a predetermined Has roughness.
  • the roughness is at least 5 ⁇ m.
  • the preference of this Design can be seen in the fact that due to the surface roughness materials located between the antenna coil and bump, which the electrical Impairing contact, broken open and due to the contact pressure may be displaced from the contacting area.
  • these disruptive materials can be, for example, impurities the contact substance act for the contact pressure between the antenna coil and integrated circuit is responsible.
  • disruptive substances are organic protective layers on the conductor track called. It is particularly annoying if the intermediate layer is concerned is an oxide layer. This is how it forms on the surface of conductor tracks an aluminum layer as soon as it is mixed with the oxygen in the air Come in contact.
  • Alumina is a very hard substance and is known to be an insulator, which, of course, in terms of electrical contacting considerable problem.
  • the structure which is basically the roughening of the surface of the bumps taken arbitrarily. For example, it can be used as a cant be designed. But it can just as well be wedge, cone or pyramid-shaped his.
  • the identification element is the contact substance pasty or liquid adhesive or around an adhesive film.
  • the substance is arranged in such a way that at least the areas where the bumps are connected to the antenna coil are sealed gas-tight. This allows atmospheric environmental influences largely exclude.
  • the antenna coil consists of a lower conductor track and an upper conductor track, the two conductor tracks being so are arranged to overlap at least in selected areas; Furthermore, a dielectric layer is provided, which at least in selected areas between the two conductor tracks.
  • identification element provides that the two conductor tracks are in an overlap area are electrically contacted. Furthermore, another Design proposed the integrated circuit between the lower trace and the upper trace to contact.
  • Identification element suggests an advantageous embodiment a coating that covers the surface of the identification element or at least parts of it sealed.
  • coating it can for example, a shrink film.
  • Paint coating one is also possible Paint coating.
  • the object is achieved in that the conductor track / the conductor tracks the antenna coil is punched out of an aluminum foil, that on the contacts of the integrated circuit connection platforms, so-called.
  • Bumps that are formed over the footprint of the integrated Survive circuit; at least in the area of the bumps becomes a substance applied due to a defined reduction in volume during curing a pressure and / or tensile force between the integrated circuit and Carrier layer generated, causing the bumps with the antenna coil over a Press contact can be connected.
  • An advantageous embodiment of the method according to the invention provides that the bumps are essentially electrolessly deposited palladium are manufactured. Furthermore, the contact with the antenna coil is made Roughened surface of bumps. The roughness is preferably at least 5 ⁇ m. In a final optional step, the identification element at least in the area of the integrated circuit with a Protective film covered.
  • FIG. 1 shows a top view of the lower conductor track 1 of the antenna coil 7. While the lower conductor track 1 has almost three turns 3, the upper conductor track 2 - as can be seen from the top view in FIG. 2 - has almost four turns 3. The relatively high number of turns results in a high inductance and ultimately the provision of a sufficiently high induced voltage to activate the integrated circuit 6.
  • the two conductor tracks 1, 2 are wound in opposite directions. 3 shows the finished identification element 8, which is composed of the two conductor tracks 1, 2.
  • the start area 5a and the end area 5b of the lower conductor track 1 and the end region 5b of the upper conductor track 2 has a greater width than that other areas of the conductor tracks 1, 2.
  • the two conductor tracks 1, 2 are off punched out of an aluminum foil.
  • a dielectric layer 4 is arranged between the two conductor tracks 1, 2, between the two conductor tracks 1, 2, a dielectric layer 4 is arranged.
  • the two conductor tracks 1, 2 are positioned relative to each other such that they are essentially only selected Areas 5a, 5b overlap.
  • the two conductor tracks 1, 2 in the overlap area 5b of the outer one Windings 3 electrically contacted with each other. In the simplest case, this is done Contacting by punching the two conductor tracks in the Overlap area 5b.
  • other methods of contacting are also applicable.
  • the dielectric layer 4 which is between the two conductor tracks 1, 2 arranged, it is preferably a dielectric Hot glue.
  • the dielectric layer 4 insulates the two conductor tracks 1, 2 electrically from each other. Due to the offset positioning of the two Conductor tracks 1, 2 is achieved in that the majority of the capacity from the Overlap areas 5a originates while the other overlap areas 10, in which the two conductor tracks 1, 2 intersect, only make insignificant contributions to total capacity. Through this configuration the capacity and thus the energy of the antenna coil 7 in the area concentrated in which it is needed, namely in the immediate vicinity to the chip.
  • the integrated circuit 6, that is to say the preferably unpackaged chip 6, is arranged between the end region of the lower conductor track 1 and the end region of the upper conductor track 2 in the immediate vicinity of the central axis 11 of the antenna coil 7. Contact is made between chip 6 and conductor tracks 1, 2.
  • the antenna coil 7 and thus the identification element 8th would deactivate is at least in these areas 10 an additional dielectric film 9 or another additional dielectric layer intended.
  • the 4 is a cross section through the identification element 8 in the area of the Integrated circuit 6 shown.
  • the integrated circuit 6 has Bumps 13 that protrude beyond its base 14.
  • the z. B. is made of PVC or PET is one Trace 1; 2; 1, 2 applied.
  • the conductor track 1, 2 is - as already on described above - preferably from an aluminum foil punched out.
  • This contact substance 15 has in addition to the usual Adhesive properties also have the property that they harden during curing experienced defined volume reduction. The curing can be done by Energy supply can be accelerated.
  • the volume reduction of the Contact substance 15 becomes an intimate and pretensioned Traction between the integrated circuit 6 and the carrier layer 12 reached.
  • the protruding bumps 13 of the integrated Circuit 6 pressed onto the conductor track 1, 2.
  • the structure of the contact surface of the bumps 13 can vary widely be designed. In addition to a raised edge, the surface can also have a wedge, cone or pyramid shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Ceramic Capacitors (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Radar Systems Or Details Thereof (AREA)
EP00100695A 1999-02-11 2000-01-14 Elément d'identification et procédé de fabrication d'un élément d'identification Expired - Lifetime EP1028388B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19905886A DE19905886A1 (de) 1999-02-11 1999-02-11 Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
DE19905886 1999-02-11

Publications (3)

Publication Number Publication Date
EP1028388A2 true EP1028388A2 (fr) 2000-08-16
EP1028388A3 EP1028388A3 (fr) 2002-01-23
EP1028388B1 EP1028388B1 (fr) 2006-05-31

Family

ID=7897300

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00100695A Expired - Lifetime EP1028388B1 (fr) 1999-02-11 2000-01-14 Elément d'identification et procédé de fabrication d'un élément d'identification

Country Status (7)

Country Link
US (1) US6333721B1 (fr)
EP (1) EP1028388B1 (fr)
JP (1) JP2000242762A (fr)
AT (1) ATE328333T1 (fr)
AU (1) AU758260B2 (fr)
DE (2) DE19905886A1 (fr)
ES (1) ES2265809T3 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826153B1 (fr) † 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
DE10311964A1 (de) * 2003-03-18 2004-10-07 Infineon Technologies Ag Chipmodul und Herstellungsverfahren
DE20314836U1 (de) 2003-09-23 2003-11-20 Feig electronic GmbH, 35781 Weilburg RFID-Reader-Antenne
US7755484B2 (en) * 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
WO2005089143A2 (fr) * 2004-03-12 2005-09-29 A K Stamping Co. Inc. Fabrication de marqueurs rfid et de leurs produits intermediaires
US7255782B2 (en) 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
NL1026275C2 (nl) * 2004-05-26 2005-12-08 Wiebe Van Der Meer Holding B V Draagbare inrichting en werkwijze voor het gebruik daarvan.
DE602005021823D1 (de) * 2004-12-22 2010-07-22 Texas Instruments Deutschland Verfahren und vorrichtung zum kontaktlosen prüfen von rfid-schlaufen
JP2006301827A (ja) * 2005-04-19 2006-11-02 Aruze Corp 非接触ｉｃカードシステム、並びに非接触ｉｃカードの取付体
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
WO2010066955A1 (fr) 2008-12-11 2010-06-17 Yves Eray Circuit d'antenne rfid
DE102009005570B4 (de) * 2009-01-21 2012-11-29 Mühlbauer Ag Verfahren zum Herstellen einer Antenne auf einem Substrat
DE102009037627A1 (de) * 2009-08-14 2011-02-17 Giesecke & Devrient Gmbh Portabler Datenträger
US9231290B2 (en) 2010-06-14 2016-01-05 Avery Dennison Corporation Method for making short run radio frequency identification tags and labels
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
DE102013009698A1 (de) * 2013-06-10 2014-12-11 Giesecke & Devrient Gmbh Elektronikbauteil mit Antenne

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665705A2 (fr) * 1993-12-30 1995-08-02 Kabushiki Kaisha Miyake Feuille comportant feuille métallique en forme de circuit ou similaire et procédé de production
EP0737935A2 (fr) * 1995-04-13 1996-10-16 Sony Chemicals Corporation Carte à puce sans contact et méthode de production
FR2753819A1 (fr) * 1996-09-20 1998-03-27 Solaic Sa Carte a circuit integre a connexion mixte

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4017217A1 (de) * 1990-05-29 1991-12-19 Texas Instruments Deutschland Elektronisches bauelement
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
DE4407810C2 (de) * 1994-03-09 1998-02-26 Semikron Elektronik Gmbh Schaltungsanordnung (Modul)
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
ATE191288T1 (de) * 1996-08-06 2000-04-15 Meto International Gmbh Resonanzschwingkreis für die elektronische artikelsicherung
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
US6140146A (en) * 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665705A2 (fr) * 1993-12-30 1995-08-02 Kabushiki Kaisha Miyake Feuille comportant feuille métallique en forme de circuit ou similaire et procédé de production
EP0737935A2 (fr) * 1995-04-13 1996-10-16 Sony Chemicals Corporation Carte à puce sans contact et méthode de production
FR2753819A1 (fr) * 1996-09-20 1998-03-27 Solaic Sa Carte a circuit integre a connexion mixte

Also Published As

Publication number Publication date
ES2265809T3 (es) 2007-03-01
JP2000242762A (ja) 2000-09-08
EP1028388B1 (fr) 2006-05-31
DE50012836D1 (de) 2006-07-06
DE19905886A1 (de) 2000-08-17
AU758260B2 (en) 2003-03-20
EP1028388A3 (fr) 2002-01-23
AU1486800A (en) 2000-08-17
ATE328333T1 (de) 2006-06-15
US6333721B1 (en) 2001-12-25

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