EP0759174A1 - Adaptersystem für baugruppen-platinen, zu verwenden in einer prüfeinrichtung - Google Patents
Adaptersystem für baugruppen-platinen, zu verwenden in einer prüfeinrichtungInfo
- Publication number
- EP0759174A1 EP0759174A1 EP96906726A EP96906726A EP0759174A1 EP 0759174 A1 EP0759174 A1 EP 0759174A1 EP 96906726 A EP96906726 A EP 96906726A EP 96906726 A EP96906726 A EP 96906726A EP 0759174 A1 EP0759174 A1 EP 0759174A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- test
- contact
- test device
- contact surfaces
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Definitions
- Adaptersvstem for assembly boards. to be used in a test facility
- the present invention relates to an adapter system for component boards, such as those used in large numbers and in a wide variety of designs in electronic devices of various sizes. Such boards are equipped with individual electronic components.
- a large number of components, assemblies and the like are located on such an assembly board, and numerous contact and soldering points are present, from which it cannot be ruled out that a component, a soldering point and the like may be defective. Because of such errors, the entire assembly board is mostly unusable and, when installed in an electronic device, would not be tolerable or would lead to complaints from the customer. It is therefore intended to check the assembly boards individually for complete error clearance according to a test program to be specified. Among other things, the large number of contact points must be checked to ensure that the conductor tracks, components and assemblies present between them on the circuit board have the specified electronic properties.
- test / test devices have been developed and are available which, for example, have a large number of connections, for example resilient contact tips, on one level. These contact tips are the respective external connections of the test channels of the test-test device, the functions of the individual test channels being defined as standard. If the test points of a component or an assembly are each connected to such a contact tip, ie a test channel of the I if device, the connected device of the assembly board can be checked with the test device to ensure that it is free of errors.
- test devices with a respective special adapter part, with which selected electrical connections are made between a respective test point of an assembly board and a contact tip of the test device.
- the level of these contact tips and the assembly circuit board are arranged parallel to one another and at a distance one above the other, and contact elements are located in the space between the circuit board and the test device, which produce these connections in a selected manner for the respective case.
- contact elements are located in the space between the circuit board and the test device, which produce these connections in a selected manner for the respective case. It is customary for this purpose to provide respective pairs of contact pins which are connected to one another by an electrical wire, one pin of which contacts the selected test site and the other pin contacts a respectively assigned, selected contact tip of the test device.
- a disadvantage of such known arrangements is the fact that individual, sometimes longer, wire connections between the pins of a respective pair are to be provided, which cause high production costs and, if appropriate, have an unfavorable effect in terms of radio frequency technology. Handling and inserting the contact pin pairs is also cumbersome and time-consuming. Problems can also arise with this technique, particularly in the case of boards with a high packing density, because the available space for the two pins per contact connection is not always sufficient.
- the board is oriented in the opposite direction and is distributed across the board. Facing the testing device, length-constant second contact pins are attached in this plate, each one of the first
- This known adapter also includes a second plate, with the second
- Test device and the usual spring contact pins is arranged, with which the individual test points of a circuit board are contacted.
- Circuit board a new printed circuit board with the specially adapted
- test device is known from EP-0374434 AI, but with a kind of universal adapter.
- a first adapter plate for universal use close to axially displaceable, length-constant contact pins.
- individual pins are selected and positioned for the special application, which can lift the corresponding pins of the first adapter plate assigned to this selection and thus only bring them into contact with the respective test point on the board.
- the pins of the second plate are electrically connected to the connections of the test device with respective movable wire connections.
- the second plate with the pins is individually fitted to the circuit board to be tested.
- the above-mentioned disadvantages are eliminated with the present invention, which also offers further advantages which are also discussed below.
- the invention is a device as specified in claim 1 and its further refinements are specified in the subclaims.
- the present invention consists primarily of a universally usable grid plate according to the invention assigned to a test device and also a choice according to the invention of the arrangement of contact areas. Further training concerns more specific designs of the grid plate and special solutions using special spring contact pins.
- FIG. 1 shows a basic illustration of one used in the invention
- FIG. 2 shows a special embodiment of a spring contact pin to be used in the invention.
- Figures 3 to 5 show schemes of an example of an inventive
- FIGS. 6 and 7 show further diagrams of modified specialized distributions according to the invention.
- Figures 8 to 10 show schematic and flow diagrams for a recursive
- FIG. 11 shows an embodiment of a spring contact pin pair that can be used in the invention for special cases.
- Figure 12 shows a preferred structure of an inventive
- FIGS. 13 and 14 show further embodiments of the spring contact pin connections in cooperation with a locking plate according to the invention.
- FIGS. 15 and 16 show further configurations.
- Figures 17 show the execution of a further locking plate for particularly extensive mixing of the contact surfaces of the group with one another.
- Test devices 28 are known which, in the illustration in FIG. 1, have resilient contact tips 29 directed upwards, specifically for each test channel of the test device.
- a raster plate 21 provided that is adapted to the test device 28 according to one embodiment.
- This locking plate 21 has contact surfaces 22 on its upper surface in FIG. 1. Further contact surfaces 27 are provided on its underside. Each of these has electrical contact with a respective one of the contact tips 29 of the test device 28, namely when the detent plate 21 is placed on the field of the contact tips 29.
- the number of contact surfaces 22 on the top of the detent plate 21 according to the invention is n times greater than that of the contact surfaces 27 on the underside, the number of which is generally equal to that of the resilient contact tips 29.
- n contact areas 22 as a group Nol, No2, ... are electrically connected to a respective contact surface of a respective terminal 27. Via the contact of a contact tip 29 with the contacting area of a connection 27, these n contact areas 22 are thus connected to a respective assigned test channel of the test device. How these n contact areas 22 of a group with the n contact areas of other groups, which are connected to one of the other contacting areas of the connections 27, are mixed / distributed with one another on the latching plate 21 is described in more detail below with reference to several exemplary embodiments.
- the detent plate 21 according to the invention can also be a component of the test device 28, so that this test device is designed in such a way that is individual to the invention.
- the individual test channels of the test device are then directly connected to the contacting surfaces 27 or corresponding connections in a manner not yet known (which can save the field of the resilient contact tips 29).
- FIG. 1 shows 1 ′, referred to according to a further feature of FIG
- Adapter part designed and used according to the invention for holding spring contact pins used according to the invention of which two pins 2, 3 are shown.
- 10, 1 1 and 12 necessarily at least two, shown here, three inventive guide perforated plates are designated, which serve to guide the pins 2 and 3.
- Each of these perforated guide plates has bores 13 through which these spring contact pins are guided.
- the perforated plates 10, 11, 12 are arranged at a distance from one another and the bores 13 are positioned one above the other in the individual perforated plates or more or less offset from one another.
- the spring contact pins 2, 3 receive a predefinable defined orientation in the space between the locking plate 21 and the assembly board 31, both of which are arranged in relation to the adapter part 1, as described in more detail.
- test points 32 of the circuit board 31 and contact surfaces 22 of the detent plate 21 can be connected to only one single spring contact pin 2, 3, even if the test point 32 and the contact surface 22 (based on the normal direction of the board 31 and the locking plate 21) are laterally offset from one another.
- This oblique orientation is stable, ie the spring contact pins 2, 3 can not move sideways in any way according to the invention.
- such spring contact pins have inclinations which are oriented differently from one another.
- the distance between the locking plate 21 and the assembly board 31 may be mentioned.
- the distance between adjacent contact surfaces 22 of a locking plate 21 according to the invention is dimensioned, for example, about 1 mm.
- a common grid dimension of components of the assembly board is, for example, 1.27 mm.
- the two test points 32, 32 ' which are contacted with spring contact pins on the assembly board and to which components 33 and 33' are each connected with a connection have a distance which is several times this pitch 1.27 mm from each other.
- the component connections at the test points 32, 32 '... as can be seen in FIG.
- test facility has, for example, 1000 test channels and the number of (n times as many) contact areas 22 can be, for example, 50,000. How many test points 32 of the board are to be contacted depends on the individual case, ie on the special board.
- the assembly board 31 is held in a holder to be provided for it, however, because it is known, but not discussed in more detail, in such a way that the predetermined distance from the test device 28 or to the raster plate 21 is maintained, even against the spring forces of a large one Number of spring contact pins 2, 3, .... Mechanically acting hold-down devices or suction using vacuum technology are common practice as a holder for component boards. In the latter case, vacuum-tight sealing below the circuit board 31 is required. It is known from the prior art to use spring contact pins, the outer sleeve of which, as shown in FIG. 2, is inserted in a plate 112 in a vacuum-tight manner.
- At least one further perforated guide plate 10, namely for the pin portion 1002 to be deflected, is to be provided for the plate 112.
- the guide perforated plates are, adapted to the individual case, provided with the bores 13 and connected rigidly at a distance from one another in such a way that later lateral displacement of the perforated plates 10, 11, 12 (1 12) against one another is excluded. This is done, for example, with conventional mechanical means, for example (not shown) connecting rods 16, with which the adapter part is also free of displacement with respect to the locking plate 21 and is too hard at a defined distance.
- conventional mechanical means for example (not shown) connecting rods 16, with which the adapter part is also free of displacement with respect to the locking plate 21 and is too hard at a defined distance.
- a large number of ordering schemes can be specified for the distribution of the contact surfaces 22 of different test channels among one another, with which the presence or accessibility of the test channels to the test device can be made more or less uniformly distributed over the surface of the raster plate 21.
- the invention provides that such individual spring contact pins 2, 3 are also used in an inclined position, namely by means of the adapter part 1 'hooked at an angle. Obviously, only a predetermined amount of maximum inclination can be allowed.
- Lock plate 21 i.e. e.g. limited to the dimension +1.4 mm. That is, e.g. starting from a test point 32 to be connected to a test channel, by means of the spring contact pin 2, 3 ... only the (essentially) vertically underneath contact point and optionally one of the eight further contact points present in the surface, which directly surround this vertical underneath contact point, are contacted can be. This means that, taking into account the above-mentioned limitation, this contact point 32 can optionally control nine contact points 22.
- the spring contact pin can be used correspondingly selected positioning of the bores 13 in the perforated plates 10, 11, 12 (as shown in FIG. 1), starting from the test point 32, an adjacent contact surface 22 of another test channel can be contacted.
- FIG. 3 shows, as a first example, a division or distribution of the contact areas, generally preferred for the invention, of a contact plate designed according to the invention.
- the raster plate which is assumed to be square only for the sake of simplicity, is conceptually divided into the four sectors A / B, B / C. Split C / D and D / A.
- only 20 channels aj to a20 for sector A / B are given as an example only.
- Another quarter of the available test channels b ⁇ to b20 are connected to sector B / C. The same applies to the other two sectors.
- the contact areas of the test channels b ⁇ to b20 and cj to C20 are correspondingly available in the sector B / C, the channels c j to C20 being connected, for example, to the outer edge of the sector C / D are.
- sector C / D there are contact areas of the test channels cj to C20 and d ⁇ to d2fj. and contact areas of the test channels dj to d20 and aj to a20 are available in sector D / A.
- contact areas of three quarters of all test channels available are available in two neighboring sectors (eg A / B and B / C).
- such a distribution of the contact areas assigned to the test channels among one another is a sufficiently uniform distribution, even if, as can be seen, regions of the raster surface can be specified in which not all test channels at all are available next to one another.
- a recursive selection procedure is additionally provided.
- FIG. 4 shows a detail of how, according to a preferred further embodiment of the exemplary embodiment in FIG. 4, the test channels can be distributed within a respective sector with their respective multiple contact areas in the plane.
- FIG. 4 shows how the contact areas of the test channels a j to a20 and bj to b20 can advantageously be distributed among one another in rows and nested rows.
- the bottom row of the sector A / B in FIG. 4 contains contact areas of the channels aj to a20 next to one another.
- the second row above lying further inward and thus shortened in length, contains the numbers assigned to the test channels b ⁇ to b20 in FIG. 4 with the numbers 21 to 40 designated contact areas, except contact areas No. 27 and No. 34, which (due to the shortening of the line) are inserted in the third line above.
- this third, even more shortened line again contains contact areas No. belonging to the channels aj to a20. 1 to No. 20. Except for six contact areas that are already inserted in the fourth line above.
- the fourth line and in this example completely the fifth line again contain contact areas No. 21 to No. 40 of the group of test channels b ⁇ to b20 •
- the individual sub-areas to be tested must be supplied with electrical voltage in a controllable manner in the assembly board to be tested, and as a rule without other, currently un-tested sub-areas being put into operation by the presence of voltage. Accordingly, it is useful, as well as how to contact one of the test points, to effect grounding and the supply of the current from the test device to the circuit board to be tested via spring contact pins.
- individual contact surfaces are connected to ground or to operating voltage (controlled by the test device).
- there is also the distribution of ground and potential connections for example, instead of the nine selection options given above, e.g. only eight options are available and the ninth option is reserved for supplying voltage. However, this does not imply any practical effect on the usability of the invention, since the variation options available according to the invention are very large.
- FIG. 5 in turn shows a detail of a distribution corresponding to FIGS. 3 and 4, in which contact surfaces for grounding and power supply are also taken into account in an exemplary manner.
- the bottom line contains contact areas of channels a ⁇ to a2fj. namely with No. 1 to No. Designated 20.
- the contact surfaces No. 21 to No. 40 are assigned to test channels b ⁇ to b20.
- Contact areas with the numbers 41 to 60 are assigned to the test channels cj to C20.
- These contact surfaces are included in sector B / C, which extends triangularly from the right vertical edge of the illustration in FIG. 5 to the center.
- FIG. 5 shows how. As already stated above, three quarters of all available channels with contact surface are distributed among one another within the lower / right diagonal half of the locking plate 21 of FIG.
- FIGS. 6 and 7 show a second example of a distribution of the multiple assigned to the test channels assigned to the example of FIGS. 3 to 5 existing contact areas.
- the diagram of FIG. 6 has a lower uniformity in the distribution of the contact areas of the individual test channels, but has the advantage that the electrical connection to be provided on the locking plate of the individual distributed contact areas to their assigned test channel connection can be made relatively short.
- the connections of eight test channels of a first group are denoted by a1 to a8.
- the connections of test channels of further groups are denoted by b] to bg, c j to cg and dj to dg.
- the black filled dots represent the contact areas assigned to the two test channels, which, as can be seen from the figure, are connected to their test channel connection by short electrical conductor tracks. Also apparent from the figure and needing no further explanation, the contact surfaces of different test channels in their neighborhood are vertically distributed. Such a less evenly distributed arrangement of the contact surfaces of the test channels is advantageous if very short connections between the test channel connection and the test point 32 of the circuit board are important. Only the short conductor tracks and the single spring contact pin form the total length of the connection between the test channel connection and the test center.
- FIG. 7 shows a diagram very similar to that of FIG. 6, but with a more extensive distribution of the contact areas among one another than that shown in FIG. 6, as indicated with a few names of the contact area not shown here.
- the connections of the contact areas are, however, sometimes somewhat longer. For each individual case, it must be considered which degree of uniformity of distribution on the one hand and minimized length of the connections on / in the raster plate on the other hand is more favorable for solving the individual problem.
- test channels are also present there with assigned contact areas and are already contacted with other test centers.
- the following solution to the problem is provided. If there are no adjacent contact surfaces in a region below the test point 32, the test channel of which is still free, one can search recursively for another possibility in another region in which one of these test channels is already occupied on its contact surface , by relocating this contact, ie by aligning the spring contact pin located there on another contact surface of a still free test channel to clear the previously occupied contact point. This then results in a contactable contact surface of a test channel that has now become free in the area of the test center 32 that was initially discussed. Of course, as described in more detail below, this selection is previously "on paper", i.e. software, e.g.
- FIG. 8 serves to explain the recursive method of the distribution algorithm further. It is assumed that in the invention
- Grid distance 1 of the contact surfaces of the Raste ⁇ latte can be inclined.
- Regions I, II, III the middle of the nine adjacent contact surfaces is a ground connection or potential connection. Now is the case that a test center 32 located above (see also FIG. 1) with one of the
- Test channel contact areas of field I are to be contacted by means of a spring contact pin and the test channels belonging to these further eight contact areas of this area I are already occupied elsewhere in the entire field of contact areas of the detent plate, for example contact area No. 1 is-
- the contact surface No. connected to this test channel is then 1 by using e.g. in area II the (still free) test channel of contact surface No. 2 is occupied. Since the contact area 1 there and thus the associated test channel is now free in the area II, the contact area 1 of the area 1 is then available for contacting the spring contact pin, which brings about the connection with the test point 32 of the circuit board. In extreme cases, the contact surface No.
- the flowchart diagram of FIG. 9 specifies such a program with reading in and presorting the input data, these being the coordinates of the test points of the assembly board.
- the pre-sorting takes into account, for example, criteria that may make sense due to the internal structures of the test systems.
- the best conflict-free contact position is selected on the grid plate for a given test center. Once this has been done, the same selection is made for the next test center to be connected. Once all the test points have been assigned, the coordinates for the bores 13 in the perforated guide plates 10, 11, 12 can be calculated and the further work can be carried out. If free test channels could not be found for all test points, the program goes back to the step Ib
- FIG. 10 shows the scheme of the recursive method already described above.
- a selection of a contact position in an area I was selected, which can be reached with an inclined spring contact pin. This is a first order position. If a free position is found, the scheme immediately goes to the transfer of the selected contact position to the main program of FIG. 9. If no free position could be found, a contact position is selected by repositioning in another area ⁇ , HI with contact positions already set (positions higher Order), namely to create a free position in the area of direct access (first order position). The scheme then transfers the selected contact position to the main program.
- test facilities where, due to the internal structure (e.g. multiplexed pin electronics), certain restrictions are placed on the assignment between test centers and test channels, the manufacturer of the test facility must also adhere to the rules specified when selecting the contact areas. In this case, the selection procedure is carried out in the same way. However, in addition to the criterion, the test channel is not already occupied. the criterion also takes into account whether the assignment rate of the I if device is met.
- an auxiliary measure can be carried out, which is shown in FIG.
- This extreme case can occur more frequently if, for electrical reasons in particular, latching plates 21 are used which have an n-fold number of contact surfaces 22 for a predetermined number of contactable test channels, in which the number n is chosen to be only a small number.
- This measure is a pair of spring contact pins, but with an extremely short electrical wire connection, which only extends over a few grid lengths of the locking plate, compared to the state of the Tecinik.
- the pin 202 provided on one side with spring contact is connected via the conductive wire 205 to the second spring contact pin 203 with only one spring contact tip.
- Electrically insulating bodies 204 are provided at the respective other ends of the pins 202 and 203.
- the spring contact pins 202 and 203 are supported on the Plates 21 and 12 from. With such a spring contact pin pair, it is possible to bridge several grid lengths, whereas with the generally provided inclined spring contact pins 2 and 3, only phis / minus one or two grid lengths (across and in the diagonal) can be avoided widely.
- This auxiliary measure does not contradict the principle according to the invention, because on the one hand it only serves to offer a solution only in special cases and on the other hand it is compatible with regard to the perforated guide plates of the adapter part provided according to the invention.
- FIG. 12 shows a sectional side view of a raster plate 21 constructed according to a development of the invention in a multilayer structure.
- 22 in turn designates the contact surfaces provided on the (here upper) surface of the locking plate 21.
- the Raste ⁇ latte 21 has 131 designated, the contact surfaces 22 associated holes between the layers 122 and 123 and 124 and 125 are in this example continuous surface metallizations 132 and 133 provided for the connection and transmission of ground potential and power supply potential Vcc are provided.
- Some conductor tracks 141, 142, 143 are shown between layers 121 and 122 on the one hand and 123 and 124 on the other hand.
- the bore 131 belonging to this contact surface 22] is metallized on the inside in such a way that the metalization 132 is brought up to this bore so far that Electrical connection between the metalization 132 and the contact surface 22] is established via this inner metalization 136 of the bore.
- the contact surface 222 n ⁇ t eu ⁇ er ⁇ nenwandigen MetaUleiter of its associated bore 131 and a contact connection with the metallization 133 of the Vcc terminal. Where there is no electrical connection from the If metallizations 132/133 are to exist for contact surfaces 22, these metallizations are expediently cut out in a ring around the bores 131 in question.
- interconnect connections 141 and 142 for example, the plane between the layers 121 and 122 are reserved.
- the inner walls of the respective bores 131 are metaUized. that there is an electrical connection between the conductor track 141 and the respective contact surface.
- the bores 131 associated with the contact surfaces 223 ′ and 22 ′ are metaUized to the associated contacting surfaces 27 of the respective contact tip 28 of the test device 29.
- n 2-fold duplication of the test channel connections on the surface of the locking plate 21.
- the n-fold duplication is generally chosen to be much larger.
- the plane between the layers 123 and 124 is reserved in a corresponding manner for conductor tracks 143 which run in the direction perpendicular to the plane of FIG. 12, i.e. essentially cross the direction of connections 141/142.
- Corresponding inner-wall metallizations of the bores for the electrical connection of contact areas 22 to contacting areas 27 are also provided for interconnect connections 143.
- Securing elements 150 are provided for the learning rail connections of the raster plate. These can be fuses in the manner of a fuse, which are arranged, for example, on the lower surface of the locking plate 21 between the inner wall metallization of a bore 131 and the respective contacting surface 27 (for connecting the test probe 28). There, a blown fuse 150 can be specifically repaired using known methods. Such overloads can occur if a faulty assembly board is checked.
- This embodiment of a locking plate 21 provided according to a feature of the invention described above can, as already mentioned at the beginning, be a separate adapter part to a known test device or can also be an integral part of the test device which is then new.
- the contacting surfaces 27 and the contact tips 29 of the pretensioner device which have a not inconsiderable cost factor, can be saved and direct electrical wire connections can be provided from the connections of the test channels to the inner wall metallizations of the respective bores 131 of the locking plate.
- FIG. 13 shows an alternative embodiment of spring contact pins to be used in connection with the locking plate 21 according to the invention.
- spring contact pins 302 are provided which are inserted firmly and vacuum-tight into the adapter plate 112. With the sprung protrusions protruding upwards, these pins contact the respective test controls on the board (as shown in FIG. 1).
- the opposite end of these spring contact pins 302 is designed as a contacting end 303.
- the further contact connection to the contact surfaces 42 of the detent plate 21 takes place via spring contact pins 2, 3 of the type described above 2 c
- the spring contact pins which are guided in the perforated plates 10, 11, can, as in the example in FIG. 1, contact contacts 22 selected at an angle.
- the spring contact pins 2 can be easily removed from the perforated plates 10, 11, which, as in the example of FIG. 1, are connected to one another in the test device, and the spring contact pins 2 can be removed again in a simple manner and used in another adapter.
- the permanently inserted contact pins 302 can also be reused / further used if they are pulled out of the plate 112 again.
- a still further embodiment of the invention is a predominant to exclusive use of spring contact pin pairs, as already shown in a similar form in FIG. 11.
- spring contact pin pairs are to be used advantageously if the locking plate 21 according to the invention has a not very large n times the number of contact surfaces 42.
- Such spring contact pin pairs 202 ', 203 can be used with short and with longer electrical connection wires 205.
- the upwardly directed spring contact tips 202 ' are inserted and held in a vacuum-tight manner in an adapter plate 12 which is sufficiently stable for suction of the circuit board.
- this embodiment also offers most of the advantages which result from the locking plate 21 according to the invention with a reproduced number of contact control units 22, namely compared to the number of test probes present in the test device. surrender. Precisely because of the possibility of access to contact surfaces 42 of the specified smaller number of test channels, which have been multiplied n-fold according to the invention and are therefore mutually expensive, this embodiment with pin pairs also offers the advantage of using very short connecting wires 205 in each case.
- this measure reduces the outlay for the design of the connection pattern relating to the invention for the above-mentioned connections between the n-fold contact surfaces 22, which are vertical over one surface of the locking plate, and the associated respective contact surfaces of the connections 27 on the other surface.
- the n-fold, paired contact surfaces 22, which are assigned to a contact surface of a respective connection 27 on the other side of the locking plate are on one surface of the locking plate within at least a region of this surface with additional n-fold contact surfaces, which are respectively are assigned to other contact surfaces of the terminals 27, mixed with one another.
- wire connections With wire connections, practically corrected electrically insulated crossings with wire connections of other contact surfaces can be carried out, which unfortunately is not easy or very complex for the FaU to carry out for conductor tracks. Above all, such wire connections for the n-fold contact surfaces 22, assigned to the respective connections 27, enable even greater mixing to be achieved over even larger areas or over the entire surface of the locking plate 21.
- FIG. 15a shows two plates 1210 and 121 1 intended for a complete locking plate.
- the first 1210 of the two plates has holes 71 in the number and optional positioning of the contact surfaces 22 of a locking plate 21 used for the examples described above.
- the second plate 1211 has the holes 72, which are present in the number corresponding to the contact areas of the terminals 27. As above, these positions are predetermined by the (standardized) test device 28 and its contact pins 29. Initially at a greater distance A between the two plates, shaped contact pins 73, preferably with a head for a contact surface 22, are preferably clamped / pressed into the first plate 1210, as shown by way of example in FIG. 15a.
- Such a contact pin 73 has, for example, an axial bore in the pin part through which a thin lead wire 77 is pulled.
- This wire is attached in contact with / on pin 73, for example soldered on, and has an electrically insulating jacket.
- the respective wire 77 can also be fastened in a contacting manner on the (lower) end of the pin 73.
- this respective wire 77 is / is further guided through a hole 72 of the second plate 121 1 which can be predetermined, whereby as a rule more or less large lateral offset of the respective hole 1 to the hole 72 is provided.
- the distribution of the contact surfaces 22 tons according to the invention provided / predefined according to the invention and mixed with one another on the raster plate, here now the first plate, is namely the wires of the pins or contact surfaces 22 that are consequently n times as many, which according to the invention each one Contact surface 27 are assigned to the opposite surface of the locking plate, led to the respective hole 72 of the second plate, in particular passed through this hole.
- the wires of the respective hole 72 are then electrically contacted, in particular soldered, connected and fastened to the respective contact surface of the connections 27, as also described in more detail below. Because of the n-fold number of contact surfaces 22 compared to the contact surfaces 27 specified by the test device, the number n wires e.g. passed through and consequently electrically connected to one another there.
- FIG. 15b shows an example of the wiring of individual contact areas 27 j and 272, each with three pins or contact areas 22] and 222 positioned distributed among one another. In practice, a large number of contact areas 22 of other groups are located between two contact areas 22 of a group
- FIG. 16 shows a special embodiment which can be used as a further development for a particular embodiment according to FIGS. 5b but also one according to the embodiments described above. In particular with very extensive mixing of the
- Positioning of the contact surfaces 22 with respect to one another means that, depending on the lateral offset of a respective contact surface 22 from the associated contact surface of the connection 27, relatively long connections are also required. This is particularly good for the measure with wire connections of FIGS. 15a / 15b, with the practically unlimited mixing of the
- FIG. 16 provides for the contact surfaces of the connections 27, as shown, to be close in area to several 2. «. to open partial contact surfaces 27 times each other.
- two partial contact areas 27] and 272 are visibly formed, two further contact areas being concealed behind them.
- FIG. 16a shows a cutout of this, for example, fourfold expansion of a contact surface of a connection 27.
- (spring) contact pins 81 which are illustrated by way of example and which, according to this development (as indicated in the figure for an axis) are preferably designed to be pivotable somewhat biaxially, a connection between a respective one of the contact surfaces 27], 272.. relevant test input 29 of the test device 28 can be optionally selected. Because of such an increase in the contact area of the connection 27, it can be achieved in accordance with the example shown that the respective connection provided from a test input 29 of the test device 28 to the selected contact 32 of the circuit board 31 to be tested is designed such that only one quarter of the existing one electrical connections, e.g. of the connecting wires to the n-fold contact surfaces 22 in which the locking plate is electrically connected to this test input 29.
- the pivotable pins 81 are held, for example, by an additional perforated plate 82.
- This perforated plate 82 is made based on the selection made of the partial contact surface used in the individual case, provided with correspondingly positioned guide holes 83.
- This additional perforated plate is no longer usable like the raster plates 21, 21 '.
- this is not a limitation of the invention, because the reduced effort for the specific additional perforated plate is largely eliminated by the reduced antenna effect in the respective requirement.
- the pivotable contact pins 81 are then generally in the TeU of the test device 28 and the additional perforated plate 82 is then used for a special circuit board together with the already described plates 10, 11,... Or canceled / prepared for the respective use.
- An actuator-controlled optional alignment of the pins 81 can also be provided. With the respective actuator there is an angular alignment which e.g. can be controlled by means of a program. Instead of storing a perforated plate specific for a specific circuit board, the control program for the pins 81, which is special for a specific circuit board, is then kept.
- FIGS. 3 to 5 relate to schemes for mixing the positions of contact surfaces 22 assigned to different connections 27 with one another.
- the distribution pattern is designed from the edge of the surface to the center.
- FIGS. 17a, 17b relate to a further new diagram of costing, which provides crosswise, in particular diagonal, internal supply lines running in different planes of the locking plate to the one-to-one contact areas 22 of the surface of the universe that can be used in groups of n-fold.
- FIGS. 17a and 17b show two levels with conductor tracks 91 and 92, respectively.
- the scheme with the conductor tracks 91 on one level and the scheme of the conductor tracks 92 on the other level are superimposed in practice in the latching plate 21.
- electrical connections from the respective line 91/92 to the relevant contact hole 1 133 are provided with the respective connections 93 in the respective level.
- Contact bores can be seen in section in the figures and they have internal metal alloys as electrical lines. These interior metal coatings usually extend to the surface of the locking plate on which the numerous contact surfaces 22 are located. A respective number of contact surfaces 22 of the surface of the locking plate 21 are thus electrically connected to one another via a respective line 91/92 via respective connections 93 (to the relevant level) via these metallizations of the bores 1133. In addition or included under the contact surfaces 22, holes are closed those contact surfaces which are provided for the ground connection or the connection of supply voltages Vcc and which can also be connected in some other way, for example to an even further inner contacting level of the detent plate 21.
- FIG. 17c shows a plane which is closer to the contact surfaces 22 in the raster plate of the surface mk.
- FIG. 17c shows, to the illustration, also non-designed circles, each of which indicates the cross section of further bores in the detent plate 21 that reach less deeply.
- These bores 1134 extend e.g. only two layers deep into the plate, so they do not reach the levels of the Verbkodungstechnisch 91/92.
- These further bores lie between the positions of the bores 1133 in the regular distribution of the contact surfaces 22 provided on the surface of the locking plate 21. With further connections 95 in this plane, as shown in FIG. 17c, there are individual bores 1133 with bores 1 134 in the interior of the plate electrically connected.
- FIG. 17d shows a side view in a purely schematic representation of the position of the above-described levels of conductor tracks and bores 1133 and 1134, as described above. Insofar as the edges of the bores are drawn with a thick line, the interior meta-finishes are sufficient. It can be seen from the illustration in FIG. 17d how various contact surfaces 22 of the locking plate 21 present on the surface can be connected internally to the levels described, ie to lines 91/92 present in these levels. Between the plane of FIG. 17c and the surface with the contact surfaces 22, a further plane 17c 'has been entered, which may be provided in addition and whose design corresponds in principle to FIG. 17c, but has conductor tracks oriented orthogonally to FIG. 17c.
- FIG. 17d can only convey clarity in principle, since it cannot reproduce the second dimension of the plane perpendicular to the illustration, over which the cost of connections of the interior metalizations of the different bores extends.
- the conductor tracks 91/92 run in the locking plate at locations of the holes 1134 below their hole depth. Due to the smaller depth of the bores 1134 and greater depth of the bores 1133, in this embodiment of the locking plate according to the invention, space can be gained for the conductor tracks 91/92 running diagonally (FIGS. 17a / 17b) to the grid of the contacts 22, these conductor tracks also each from the edge can run to the edge of the entire locking plate, but can also be electrically interrupted (as shown in FIGS. 17a / b).
- FIG. 17e shows how a respective bore 1 133 ′ can also serve as a connection between a conductor track 91 of one level with a conductor track 92 of the corresponding other level running at right angles thereto.
- the contact surfaces of the terminals 27 are located on the underside of the plate (in the figures). These connections are electrically connected to the through holes 1133 which are continuous and internally metallized to the underside of the plate.
- the contact plate 22 containing the contact surfaces 22 can be found in practically every tea area of the entire surface, making it possible to find a contact surface of a special test unit 32 that is remotely posited Circuit board 31 via spring contact pins 2, 3 (see also FIG. 1) to realize a connection to a test input 29 of the test device 28, even if this test input (viewed to FIG.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19507127 | 1995-03-01 | ||
DE19507127A DE19507127A1 (de) | 1995-03-01 | 1995-03-01 | Adaptersystem für Baugruppen-Platinen, zu verwenden in einer Prüfeinrichtung |
PCT/EP1996/000880 WO1996027136A1 (de) | 1995-03-01 | 1996-03-01 | Adaptersystem für baugruppen-platinen, zu verwenden in einer prüfeinrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0759174A1 true EP0759174A1 (de) | 1997-02-26 |
Family
ID=7755346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96906726A Withdrawn EP0759174A1 (de) | 1995-03-01 | 1996-03-01 | Adaptersystem für baugruppen-platinen, zu verwenden in einer prüfeinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6140830A (de) |
EP (1) | EP0759174A1 (de) |
JP (1) | JPH09512640A (de) |
AU (1) | AU5002796A (de) |
DE (1) | DE19507127A1 (de) |
WO (1) | WO1996027136A1 (de) |
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US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US20100065963A1 (en) | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
JP3099873B2 (ja) * | 1996-12-05 | 2000-10-16 | 日本電産リード株式会社 | プリント基板検査装置およびユニバーサル型プリント基板検査装置の使用方法 |
JP2000502812A (ja) * | 1996-09-13 | 2000-03-07 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | ウエハ・レベルのテストおよびバーンインのための集積化コンプライアント・プローブ |
TW360790B (en) * | 1996-10-28 | 1999-06-11 | Atg Test Systems Gmbh | Printed circuit board test apparatus and method |
DE19718637A1 (de) * | 1997-05-02 | 1998-11-05 | Atg Test Systems Gmbh | Vorrichtung und Verfahren zum Prüfen von Leiterplatten |
US5945836A (en) * | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
US6407565B1 (en) | 1996-10-29 | 2002-06-18 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US6194908B1 (en) * | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
EP0943924A3 (de) * | 1998-03-19 | 1999-12-01 | Hewlett-Packard Company | Prüfadapter mit Nadelführung für bestückte Leiterplatten |
US6373269B1 (en) * | 1998-10-13 | 2002-04-16 | Frederick J. Holmes | Circuit board particularly adapted for use with high density test point in-circuit testers |
DE19943388B4 (de) * | 1999-09-10 | 2010-04-08 | Atg Luther & Maelzer Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
US7262611B2 (en) | 2000-03-17 | 2007-08-28 | Formfactor, Inc. | Apparatuses and methods for planarizing a semiconductor contactor |
US6424166B1 (en) * | 2000-07-14 | 2002-07-23 | David W. Henry | Probe and test socket assembly |
DE10057456A1 (de) * | 2000-11-20 | 2002-05-23 | Test Plus Electronic Gmbh | Anordnung zum Verbinden von Testnadeln eines Testadapters mit einer Prüfeinrichtung |
JP3767810B2 (ja) * | 2001-04-27 | 2006-04-19 | 株式会社ヨコオ | スプリングコネクタ |
US6729019B2 (en) | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
DE10203638A1 (de) * | 2002-01-30 | 2003-07-31 | Test Plus Electronic Gmbh | Testadaptersystem zum Verbinden von Testnadeln eines Testadapteres mit einer Prüfeinrichtung |
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US7709777B2 (en) * | 2003-06-16 | 2010-05-04 | Micron Technology, Inc. | Pumps for CMOS imagers |
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DE102010043554A1 (de) | 2010-11-08 | 2012-05-10 | Atx Hardware Gmbh | Grundkassette sowie Prüfnadelkassette zum Testen von Leiterplatten |
US9182440B1 (en) * | 2012-01-30 | 2015-11-10 | Marvell International Ltd. | Pressure activated high density switch array |
KR101431915B1 (ko) * | 2012-12-21 | 2014-08-26 | 삼성전기주식회사 | 예비 공간 변환기 및 이를 이용하여 제조된 공간 변환기, 그리고 상기 공간 변환기를 구비하는 반도체 소자 검사 장치 |
US9274166B2 (en) | 2013-08-26 | 2016-03-01 | Fujitsu Limited | Pin verification device and method |
US9887478B2 (en) * | 2015-04-21 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Thermally insulating electrical contact probe |
US11818842B1 (en) * | 2020-03-06 | 2023-11-14 | Amazon Technologies, Inc. | Configurable circuit board for abstracting third-party controls |
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US5818248A (en) * | 1996-07-29 | 1998-10-06 | Delaware Capital Formation, Inc | Loaded board test fixture with integral translator fixture for testing closely spaced test sites |
-
1995
- 1995-03-01 DE DE19507127A patent/DE19507127A1/de not_active Withdrawn
-
1996
- 1996-03-01 US US08/737,014 patent/US6140830A/en not_active Expired - Fee Related
- 1996-03-01 WO PCT/EP1996/000880 patent/WO1996027136A1/de not_active Application Discontinuation
- 1996-03-01 JP JP8526034A patent/JPH09512640A/ja active Pending
- 1996-03-01 EP EP96906726A patent/EP0759174A1/de not_active Withdrawn
- 1996-03-01 AU AU50027/96A patent/AU5002796A/en not_active Abandoned
Non-Patent Citations (1)
Title |
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See references of WO9627136A1 * |
Also Published As
Publication number | Publication date |
---|---|
US6140830A (en) | 2000-10-31 |
DE19507127A1 (de) | 1996-09-12 |
WO1996027136A1 (de) | 1996-09-06 |
AU5002796A (en) | 1996-09-18 |
JPH09512640A (ja) | 1997-12-16 |
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