SG130067A1 - Modular socket and method for testing integrated circuit devices - Google Patents

Modular socket and method for testing integrated circuit devices

Info

Publication number
SG130067A1
SG130067A1 SG200505550-4A SG2005055504A SG130067A1 SG 130067 A1 SG130067 A1 SG 130067A1 SG 2005055504 A SG2005055504 A SG 2005055504A SG 130067 A1 SG130067 A1 SG 130067A1
Authority
SG
Singapore
Prior art keywords
modular socket
integrated circuit
circuit devices
testing integrated
modular
Prior art date
Application number
SG200505550-4A
Inventor
Boo Thiam Hee
Original Assignee
Knight Auto Prec Engineering P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knight Auto Prec Engineering P filed Critical Knight Auto Prec Engineering P
Priority to SG200505550-4A priority Critical patent/SG130067A1/en
Priority to PCT/SG2006/000102 priority patent/WO2007027155A1/en
Priority to TW095135340A priority patent/TW200815773A/en
Publication of SG130067A1 publication Critical patent/SG130067A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A modular socket and the method for testing integrated circuit devices using the modular socket. The modular socket comprises an invertible non-conductive housing body and a plurality of compressible probes for establishing electrical contacts disposed therein. An alignment plate for guiding and aligning the integrated circuit devices to be tested with the modular socket is further coupled to the non-conductive housing body. The modular socket with the plurality of compressible probes disposed therein are invertible such that both ends of the plurality of compressible probes are used to establish electrical contacts with the integrated circuit devices before any replacement of damaged or worn out parts is necessary. The life of the modular socket is therefore considerably extended.
SG200505550-4A 2005-08-30 2005-08-30 Modular socket and method for testing integrated circuit devices SG130067A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200505550-4A SG130067A1 (en) 2005-08-30 2005-08-30 Modular socket and method for testing integrated circuit devices
PCT/SG2006/000102 WO2007027155A1 (en) 2005-08-30 2006-04-20 Invertible modular test device for testing integrated circuit devices
TW095135340A TW200815773A (en) 2005-08-30 2006-09-25 Modular socket and method for testing integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200505550-4A SG130067A1 (en) 2005-08-30 2005-08-30 Modular socket and method for testing integrated circuit devices

Publications (1)

Publication Number Publication Date
SG130067A1 true SG130067A1 (en) 2007-03-20

Family

ID=37809156

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200505550-4A SG130067A1 (en) 2005-08-30 2005-08-30 Modular socket and method for testing integrated circuit devices

Country Status (3)

Country Link
SG (1) SG130067A1 (en)
TW (1) TW200815773A (en)
WO (1) WO2007027155A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101949844B1 (en) * 2017-03-10 2019-02-19 주식회사 파인디앤씨 A test socket for semiconductor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3438967A1 (en) * 1983-10-27 1985-05-09 Feinmetall Gmbh, 7033 Herrenberg Spring contact pin and a method for its production
JPS6358183A (en) * 1986-08-28 1988-03-12 Teru Hayashi Sound source search instrument
US5942906A (en) * 1994-11-18 1999-08-24 Virginia Panel Corporation Interface system utilizing engagement mechanism
DE19507127A1 (en) * 1995-03-01 1996-09-12 Test Plus Electronic Gmbh Adapter system for component boards, to be used in a test facility
JP4197659B2 (en) * 2003-05-30 2008-12-17 富士通マイクロエレクトロニクス株式会社 Contactor for electronic parts and test method using the same

Also Published As

Publication number Publication date
WO2007027155A1 (en) 2007-03-08
TW200815773A (en) 2008-04-01

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