SG130067A1 - Modular socket and method for testing integrated circuit devices - Google Patents
Modular socket and method for testing integrated circuit devicesInfo
- Publication number
- SG130067A1 SG130067A1 SG200505550-4A SG2005055504A SG130067A1 SG 130067 A1 SG130067 A1 SG 130067A1 SG 2005055504 A SG2005055504 A SG 2005055504A SG 130067 A1 SG130067 A1 SG 130067A1
- Authority
- SG
- Singapore
- Prior art keywords
- modular socket
- integrated circuit
- circuit devices
- testing integrated
- modular
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
A modular socket and the method for testing integrated circuit devices using the modular socket. The modular socket comprises an invertible non-conductive housing body and a plurality of compressible probes for establishing electrical contacts disposed therein. An alignment plate for guiding and aligning the integrated circuit devices to be tested with the modular socket is further coupled to the non-conductive housing body. The modular socket with the plurality of compressible probes disposed therein are invertible such that both ends of the plurality of compressible probes are used to establish electrical contacts with the integrated circuit devices before any replacement of damaged or worn out parts is necessary. The life of the modular socket is therefore considerably extended.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200505550-4A SG130067A1 (en) | 2005-08-30 | 2005-08-30 | Modular socket and method for testing integrated circuit devices |
PCT/SG2006/000102 WO2007027155A1 (en) | 2005-08-30 | 2006-04-20 | Invertible modular test device for testing integrated circuit devices |
TW095135340A TW200815773A (en) | 2005-08-30 | 2006-09-25 | Modular socket and method for testing integrated circuit devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200505550-4A SG130067A1 (en) | 2005-08-30 | 2005-08-30 | Modular socket and method for testing integrated circuit devices |
Publications (1)
Publication Number | Publication Date |
---|---|
SG130067A1 true SG130067A1 (en) | 2007-03-20 |
Family
ID=37809156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200505550-4A SG130067A1 (en) | 2005-08-30 | 2005-08-30 | Modular socket and method for testing integrated circuit devices |
Country Status (3)
Country | Link |
---|---|
SG (1) | SG130067A1 (en) |
TW (1) | TW200815773A (en) |
WO (1) | WO2007027155A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101949844B1 (en) * | 2017-03-10 | 2019-02-19 | 주식회사 파인디앤씨 | A test socket for semiconductor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3438967A1 (en) * | 1983-10-27 | 1985-05-09 | Feinmetall Gmbh, 7033 Herrenberg | Spring contact pin and a method for its production |
JPS6358183A (en) * | 1986-08-28 | 1988-03-12 | Teru Hayashi | Sound source search instrument |
US5942906A (en) * | 1994-11-18 | 1999-08-24 | Virginia Panel Corporation | Interface system utilizing engagement mechanism |
DE19507127A1 (en) * | 1995-03-01 | 1996-09-12 | Test Plus Electronic Gmbh | Adapter system for component boards, to be used in a test facility |
JP4197659B2 (en) * | 2003-05-30 | 2008-12-17 | 富士通マイクロエレクトロニクス株式会社 | Contactor for electronic parts and test method using the same |
-
2005
- 2005-08-30 SG SG200505550-4A patent/SG130067A1/en unknown
-
2006
- 2006-04-20 WO PCT/SG2006/000102 patent/WO2007027155A1/en active Application Filing
- 2006-09-25 TW TW095135340A patent/TW200815773A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007027155A1 (en) | 2007-03-08 |
TW200815773A (en) | 2008-04-01 |
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