EP0738572A1 - Method for orienting monocrystals for cutting in a cutting machine and device for performing the method - Google Patents

Method for orienting monocrystals for cutting in a cutting machine and device for performing the method Download PDF

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Publication number
EP0738572A1
EP0738572A1 EP96105699A EP96105699A EP0738572A1 EP 0738572 A1 EP0738572 A1 EP 0738572A1 EP 96105699 A EP96105699 A EP 96105699A EP 96105699 A EP96105699 A EP 96105699A EP 0738572 A1 EP0738572 A1 EP 0738572A1
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EP
European Patent Office
Prior art keywords
single crystal
cutting
plane
machine
support
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EP96105699A
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German (de)
French (fr)
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EP0738572B1 (en
Inventor
Charles Hauser
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Applied Materials Switzerland SARL
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Individual
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Priority claimed from CH113695A external-priority patent/CH690423A5/en
Priority claimed from CH113595A external-priority patent/CH690422A5/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Definitions

  • the present invention relates to a method for orienting single crystals for cutting in a cutting machine according to a predetermined cutting plane.
  • Monocrystals generally for optical or semiconductor uses require that they be cut according to very precise orientations relative to the axes of the crystal lattice.
  • their manufacture does not allow perfect control of the orientation of the axes of the crystal lattice relative to the geometric axes. It is therefore necessary for correct cutting to correct on the one hand the manufacturing error and on the other hand, take into account the angles formed between the cutting plane and the crystalline plane chosen or imposed by the subsequent uses or processes. Since the cutting is done from a geometric single crystal, it will have to be positioned and maintained in space so that the movement of the cutting system is parallel to the desired cutting plane.
  • the present invention aims to remedy the aforementioned drawbacks and to allow precise adjustment of the positioning of the single crystal in a clean environment and to increase the productivity of cutting.
  • the invention is characterized for this purpose by the characteristics appearing in the independent claims and is characterized by the fact that the single crystal is oriented by means of a positioning device outside the cutting machine in a predetermined orientation relative to a cutting support, which the single crystal is fixed in accordance with said predetermined orientation on the cutting support, the positioning of which in the machine cutting is geometrically defined with respect to the cutting plane of the machine, and that the cutting support is available after fixing the single crystal in the cutting machine according to said geometrically defined positioning to obtain said predetermined orientation of the single crystal in the machine cutting.
  • the invention is characterized in that said predetermined orientation is obtained by placing the single crystal on the positioning device so that one of its geometric axes of the geometric shape of the single crystal is included in a reference plane corresponding to the working plane of the cutting machine perpendicular to the cutting plane, by rotating the single crystal by a first predetermined angle around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane , and by performing a relative rotation between the cutting support and the single crystal of a second predetermined angle about an axis perpendicular to said reference plane so that the normal to the cutting plane is oriented in a reference direction corresponding to the normal in the cutting plane of the machine, said geometric axis and the normal to the cutting plane of the single crystal being included in the reference plane.
  • the disadvantage of having an inclined position of the single crystal relative to the direction of advance of the cutting elements of the machine is thus remedied in a precise and easy manner, which is particularly unfavorable in wire saws.
  • the main geometrical axis of the single crystal can thus be oriented perfectly parallel to the work surface or to the ply of wires, an optimal cutting is therefore obtained while minimizing the cutting length.
  • the method is characterized in that the orientation of the cutting plane of the single crystal is defined relative to the crystal lattice, in that the orientation of the crystal lattice is measured in relation to the geometric shape of the single crystal, and in what the first and second angles of rotation are calculated taking into account the orientation of the cutting plane with respect to the crystal lattice and with respect to the geometric shape of the single crystal.
  • the method according to the invention is particularly advantageously applicable to the use of a single crystal of which the geometric shape is substantially circular cylindrical, said geometric axis corresponding to the main axis of the single crystal and by placing the single crystal on two parallel rotating cylinders of the positioning device, the axes of the two cylinders being parallel to said reference plane.
  • the invention also applies to a device for implementing the method which is characterized in that it comprises a positioning device intended to orient the single crystal out of the cutting machine in accordance with a predetermined orientation relative to a cutting support on which the single crystal is intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes are parallel to the axes of the cutting machine.
  • This device for implementing the method is advantageously characterized in that it comprises first means for supporting the single crystal in an orientation such that one of the geometric axes of the geometric shape of the single crystal is included in a corresponding reference plane to the working plane of the cutting machine and to perform a rotation of the single crystal by a first predetermined angle about said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane and second means for carrying out a relative rotation between the cutting support and the single crystal of a second predetermined angle around an axis perpendicular to said reference plane so that the normal to the cutting plane is oriented along a reference direction corresponding to the normal to the cutting plane of the machine, and by the fact that it comprises third means for effecting a relative translational movement between the single crystal and the cutting support intended to bring the cutting support closer and the single crystal in order to fix the latter on the cutting support, in said predetermined orientation.
  • a favorable embodiment is characterized in that the first means comprise two parallel cylindrical supports rotatably mounted on a chassis of the positioning device and arranged so as to support the single crystal and a first angular measurement member capable of determining the first predetermined angle of rotation, by the fact that the second means comprise a rotary plate rotatably mounted with respect to said chassis and the main plane of which is parallel to the axes of said cylindrical supports, this rotary plate being arranged so as to maintain the support of cutting in a geometrically defined position, a second angular measuring member being provided for determining said second predetermined angle of rotation, by the fact that the third means comprise a translation mechanism allowing the cutting support to be brought closer to the single crystal and by the fact that the cutting support is shaped so that its positioning in the cutting machine is effected according to a geometric position corresponding to the geometric position defined on said rotary table so that the reference plane and the reference direction correspond to the work plan and normal to the cutting plane of the machine.
  • Figure 1 illustrates in perspective an example of a single crystal with its geometric and crystallographic axes and the chosen cutting plane.
  • FIGS. 2A and 2B illustrate in two orthogonal views the position of the single crystal obtained by a known and commonly used method.
  • Figures 3A and 3B show in two orthogonal views the position of the single crystal obtained in accordance with the present invention.
  • FIG. 4 represents a vector diagram of the various reference systems used.
  • FIGS. 5A, 5B, 5C illustrate the positions occupied by the single crystal following the orientation method according to the invention.
  • Figure 6 is a perspective view of an embodiment of the device for the implementation of the method.
  • the invention gives the possibility of installing pre-oriented single crystals on the cutting machine, the cutting plane of which is oriented parallel to the cutting plane of the machine and rotated along a perpendicular axis (normal to the cutting plane), so as to minimize the cutting length.
  • This determination will be made mathematically from the measurements carried out to determine the error of the geometric single crystal with respect to the crystal lattice by including the requirements of the subsequent process in relation to the crystal axes.
  • the mounting of the single crystal on its support can then be done using a positioning device which allows the exact measurement of the angles of rotation of the geometric single crystal, and to mount it as is on a cutting support which is a part with indexing belonging to the cutting machine.
  • the single crystal can be clamped or preferably glued to the support, support which once transferred to the cutting machine will present a perfectly preoriented single crystal ready to be sawed without subsequent adjustment.
  • the cutting precision will be independent of the machine used or of the operator in the case of production lines.
  • the positioning device will be in the form of a table or a frame with a rotary table having its axis of rotation z '''vertical on which is posed the support of the single crystal on which it will be fixed later.
  • This support has an indexing system identical to that of the cutting machine.
  • the single crystal support is an interface piece between the positioning device and the cutting machine. It will therefore have the same position on the positioning device and on the cutting machine.
  • Above the rotary table but fixed relative to the table is a mechanism for holding the single crystal and rotating it along its horizontal axis x. This system is composed in the case of cylindrical single crystals of two cylinders on which the single crystal rests. The single crystal can then rotate along its x axis.
  • the movement of the plate and the rotation of the single crystal x allow it to be positioned in any orientation.
  • the value of the two angles of rotation will be determined by the requirements of the finished product and calculated mathematically.
  • a mechanism brings the support into contact with the single crystal itself while retaining their relative position. This can be done either by raising the turntable or by lowering the single crystal. Once brought into contact, the single crystal will be clamped or glued in position.
  • the single crystal support can then be transferred to the cutting machine.
  • the single crystal is then oriented, ready to be cut.
  • FIG. 1 represents an example of a single crystal to be cut 2 which has a cylindrical geometric shape with geometric axes x, y, z, the x axis being the main axis.
  • the axes x ', y', z 'of the crystal lattice of this single crystal are not parallel to the geometric axes.
  • the angles a and f between the axes y ', y and z', z are determined by optical or X-ray measurement and generally define the manufacturing error of the single crystal.
  • Figure 1 also shows the chosen or imposed cutting plane 16 of the single crystal with its axes y '' and Z '' inclined by the angular values p and t relative to the axes y ', z' of the crystal lattice and the normal x '' on the cutting plane.
  • the angular values p and t are generally defined according to the needs of the subsequent use of the cut single crystal. It is understood that these angles p and t may for example be equal to zero in the case where it is desired to obtain silicon wafers cut parallel to the plane (100).
  • FIGS. 2A and 2B show in lateral and plan view, the position of the single crystal 2 obtained by the known method and commonly used before the present invention by performing an orientation of the single crystal by rotation around the geometric axes y and z.
  • the single crystal 2 is then not parallel to the plane of the ply of wires 17 in the case of the use of a wire saw as a cutting means.
  • the machine plane x ''',y''' of the cutting machine is not parallel to the geometrical axis x of the single crystal 1.
  • the direction of advance along z '''of the ply of wires 17 n ' is not perpendicular to the single crystal, which is detrimental to the quality of the cut.
  • Figures 3A and 3B illustrate the orientation of the single crystal obtained by the method according to the present invention by performing an orientation of the single crystal by rotation around the geometric axes x and z '' '.
  • the ply of wires 17 of the saw used as a cutting machine is located in the plane x '' 'y' '' and the geometric axis x of the single crystal is parallel to this plane x '' ', y' ''.
  • the single crystal is therefore in an optimal position relative to the cutting means, so as to obtain a very precise cutting.
  • the vector diagram of the various reference systems used for positioning is shown in FIG. 4 and includes the reference system x, y, z linked to the geometric shape of the single crystal, the reference system x ', y', z 'linked to the crystal lattice of the single crystal, the reference frame x '', y '', z '' corresponding to the cutting plane of the single crystal and the reference frame x '' ', y' ', z '' 'used for the positioning device and the cutting machine.
  • the cutting plane corresponds to the y '', z '' plane and its normal corresponds to the x '' direction.
  • the misalignment of the geometric shape of the single crystal 2 with the crystal lattice is determined by the angles a and f, corresponding to the angles y'y and z'z.
  • the angles p and t corresponding to the angles y''y 'and z''z' determine the orientation of the chosen cutting planes with respect to the reference frame of the crystal lattice.
  • the normal x '' to the cutting plane y''z '' defines a vector x '' (x, y, z) which makes an angle g with the geometric axis x and the projection of the vector X '' (x, y, z) on the y-plane, z makes an angle d with y.
  • the angle d therefore corresponds to the angle of rotation around the geometric axis x to bring the normal x '' to the cutting plane y '', z '' in a reference plane corresponding to the work plane x '' ', y' '' of the machine.
  • the angle g corresponds to the angle of rotation around the vertical axis z '' 'so that the normal x' 'to the cutting plane is oriented in a reference direction corresponding to the normal x' '' to the plane cutting y '' 'z' '' of the machine to make the desired cutting plane coincide with the cutting plane of the cutting machine.
  • FIGS. 5A, 5B and 5C illustrating three successive positions.
  • the single crystal is placed on the positioning device and its geometric axes x, y, z are aligned with the axes x ''',y''', z '''of the alignment device and the cutting machine.
  • the geometric single crystal x, y, z is oriented parallel to the plane x '' ', y' '' with an angle g relative to the normal X '' 'to the cutting plane corresponding to the requirements of the process used later.
  • the resulting sawing will have the angles t and p relative to the crystallographic axes y 'and z'. It is understood that the second rotation may also be carried out by rotating the cutting support by an angle -g, the single crystal remaining stationary as is done in the embodiment illustrated in FIG. 6.
  • the latter is constituted by a positioning device 1 which makes it possible to orient the single crystal 2 out of a cutting machine in accordance with a predetermined orientation with respect to a cutting support which is in the form of a support 3 on which the single crystal will be fixed after proper orientation.
  • the positioning device 1 for this purpose comprises a table or a frame 5 with an upper part 6 and a lower part 7.
  • the single crystal 2 is carried by two support cylinders 8 mounted rotating on the upper part 6 with their main axis oriented parallel to the x axis.
  • An angular measuring member, in the form of an encoder 10 makes it possible to measure the angle of rotation d of the single crystal around the x axis.
  • a rotary plate 12 is mounted to rotate along the axis z '' 'on the lower part 7 of the chassis.
  • An angular measurement system integrated in the rotary plate 12 makes it possible to measure the angle of rotation g around the axis z '' '.
  • the support 3 is maintained in a precise predetermined orientation on the rotary plate 12.
  • the turntable 12 is also slidably mounted in the direction z '''on the lower part 7 of the chassis in order to be able to bring the support 3 closer to the single crystal 2 by means of a lifting mechanism 14 to fix the single crystal 2 to the support 3.
  • the support 3 and the single crystal 2 can be placed in the cutting machine according to a predetermined geometric position so that the reference plane x ''' s , y''' s of the support 3 corresponds to the plane x ''',y''' of the cutting machine and so that the perpendicular x '''to the cutting plane of the machine is parallel to the reference direction x''' s of the support.
  • the method and the device described allow the positioning of a single crystal on a support outside the cutting machine so that the single crystal, once mounted with its support on a cutting machine, is cut with a given orientation of the axes crystalline with respect to the saw plane.
  • the position of a cylindrical single crystal is such that the generators thereof are placed parallel to the ply of wires 17 in the case of a wire saw or parallel to the direction of movement defining the thickness of the slices if it is a cut with cam.
  • the orientation of the crystal lattice is measured with respect to the geometric shape of the single crystal optically or by means of X-rays.
  • the positioning device or the cutting support can advantageously be arranged for this purpose so that they can be mounted on a generator X-rays so that the positioning of the single crystal can be carried out and controlled simultaneously.
  • the orientation of the cutting plane y '', z '' with respect to the crystal lattice x ', y,' z 'being imposed by the subsequent application, the values of the two angles of rotation of the single crystal d along the x axis and g along the z axis''' of the positioning device are determined mathematically. Once the two rotations carried out according to the calculated values, the single crystal will be in the position sought for the cutting machine, namely perpendicular to the cutting advance having in addition its cutting plane parallel to that of the machine.
  • the positioning device will allow the single crystal to be fixed either by clamping or by gluing on a pre-indexed support relative to the cutting machine.
  • the orientation given by the method minimizes in the case of cylindrical single crystals the sawing length.
  • the cutting machine therefore does not require any adjustment device to ensure cutting according to the angular specifications required after the transfer of the single crystal onto its cutting support and of the latter into the cutting machine.
  • the wire table of a wire saw remains parallel to the geometrical single crystal throughout the cutting while ensuring an adequate orientation of the slices thus produced. Likewise, the saw blade of a blade machine remains perpendicular to the single crystal.
  • the embodiment described above has no limiting character and that it can receive any desirable modifications inside the frame as defined by claim 1.
  • the two angles of rotation around x and z axes' '' could be replaced by angles taken and calculated with respect to other geometric and crystallographic reference frames, but which lead to the same result as the normal to the cutting plane of the single crystal is oriented in a reference direction corresponding to the normal to the cutting plane of the machine and that a predetermined geometric axis of the single crystal and the normal to the cutting plane are included in a reference plane corresponding to the working plane of the machine.
  • the cutting plane can be determined by other angles than p and t relative to the crystal lattice and the shift of the crystal lattice relative to the geometric shape of the single crystal can be indicated by other angles measured than a and f.
  • the two support cylinders 8 could be replaced by other means for supporting the single crystal and for performing a rotation of the single crystal such as for example a single support in or on which the single crystal is temporarily fixed and which is mounted to rotate on the table or the chassis.
  • This rotation support could be arranged at one or two opposite ends of the single crystal.
  • the relative rotation between the single crystal and the cutting support around the axis z '''could also be obtained by rotating the single crystal with respect to the cutting support which would remain stationary on the table or the chassis of the positioning device.
  • the rotary table would then be replaced by a rotary member along z '''and carrying the temporary support of the single crystal.
  • the angular measurement members could be electronic, optical or mechanical.
  • the approximation or bringing into contact of the single crystal and the cutting support could be carried out from the bottom or from the top and by moving either the cutting support or the single crystal.
  • the rotations around the two horizontal and vertical axes x, z '''could be inverted over time by first performing the rotation around the z axis' '' and then the rotation around the horizontal x axis.
  • the method and the device could also be used for the oriented cutting of single crystals of any other geometric shape or of any material other than a single crystal, such as polycrystalline assemblies with predetermined crystal orientation, crystals with simple or polysynthetic rings, aggregates. oriented crystallines, alloys, oriented crystalline substances contained in an amorphous substance, for example polarizing materials.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The method involves aligning a monocrystal (2) on a positioning unit (1) situated outside the cutting machine. Two parallel cylindrical supports (8) rotate on a frame (5). An angle measuring element (10) determines a first angle of rotation. A rotary plate (12) can turn relative to the frame, and has its main plane parallel to the cylindrical supports. The monocrystal is fixed in a predetermined position on a support (3). The positioning unit is then inserted into the machine in a definite geometrical situation and fixed in place. The predetermined alignment of the monocrystal is obtained by placing it on the positioning unit. One of the monocrystal geometrical axes (x) is located within the corresponding reference plane of the cutting machine. The angles used are determined mathematically.

Description

La présente invention concerne un procédé pour l'orientation de monocristaux en vue d'une découpe dans une machine de découpage selon un plan de découpe prédéterminé.The present invention relates to a method for orienting single crystals for cutting in a cutting machine according to a predetermined cutting plane.

Les monocristaux généralement à usages optiques ou semiconducteurs nécessitent que ceux-ci soient découpés selon des orientations très précises par rapport aux axes du réseau cristallin. De plus, leur fabrication ne permet pas de contrôler de manière parfaite l'orientation des axes du réseau cristallin par rapport aux axes géométriques. Il faut donc pour que la découpe soit correcte corriger d'une part l'erreur de fabrication et d'autre part, tenir compte des angles formés entre le plan de découpe et le plan cristallin choisi ou imposé par les utilisations ou procédés subséquents. Etant donné que la découpe se fait à partir d'un monocristal géométrique, il faudra le positionner et le maintenir dans l'espace de telle manière que le déplacement du système de découpe soit parallèle au plan de découpe désiré. Il existe une infinité de positions possibles, toutefois il n'en n'existe que quatre qui en plus place le monocristal dans un plan perpendiculaire au plan de découpe de la machine. Le positionnement des monocristaux selon l'une de ces quatre positions permet donc de découper non seulement dans l'orientation désirée mais également de minimiser le temps de la découpe donc d'améliorer la productivité du dispositif de découpe.Monocrystals generally for optical or semiconductor uses require that they be cut according to very precise orientations relative to the axes of the crystal lattice. In addition, their manufacture does not allow perfect control of the orientation of the axes of the crystal lattice relative to the geometric axes. It is therefore necessary for correct cutting to correct on the one hand the manufacturing error and on the other hand, take into account the angles formed between the cutting plane and the crystalline plane chosen or imposed by the subsequent uses or processes. Since the cutting is done from a geometric single crystal, it will have to be positioned and maintained in space so that the movement of the cutting system is parallel to the desired cutting plane. There are an infinite number of possible positions, however there are only four which in addition places the single crystal in a plane perpendicular to the cutting plane of the machine. The positioning of the single crystals according to one of these four positions therefore makes it possible to cut not only in the desired orientation but also to minimize the cutting time, thus improving the productivity of the cutting device.

Des dispositifs d'orientation de monocristaux sont déjà connus et utilisés dans l'industrie des semiconducteurs sur des tronçonneuses à diamètre intérieur ou sur des scies à fils. Le positionnement se fait à l'aide de table orientable y''', z''' montée directement sur la machine. L'ajustement se fait après mesure optique ou aux rayons X. La correction est alors introduite selon y''',z'''. Cette manière de pratiquer a le désavantage d'une part d'avoir une position du monocristal inclinée par rapport à l'avance de l'élément de découpe, ce qui est très défavorable dans le cas d'une scie à fils ou la nappe de fils doit être parallèle au monocristal géométrique, et d'autre part de ne pas minimiser la longueur de découpe, ce qui est alors défavorable pour les scies à diamètre intérieur en diminuant leur productivité. De plus, cette manière de pratiquer oblige à régler la table de la machine avant chaque découpe de manière très précise et dans un environnement industriel souvent sale donc peu propice à ce type d'opération. Le temps de réglage de la machine contribue également à la baisse de la productivité.Single crystal orientation devices are already known and used in the semiconductor industry on internal diameter chainsaws or on wire saws. Positioning is done using an adjustable table y '' ', z' '' mounted directly on the machine. The adjustment is made after optical or X-ray measurement. The correction is then introduced according to y '' ', z' ''. This way of practicing has the disadvantage on the one hand of having a position of the single crystal inclined with respect to the advance of the cutting element, which is very unfavorable in the case of a wire saw or the web of wires must be parallel to the geometric single crystal, and on the other hand not to minimize the cutting length, which is then unfavorable for saws with internal diameter by reducing their productivity. In addition, this way of practicing requires adjusting the machine table before each cut very precisely and in an often dirty industrial environment therefore not conducive to this type of operation. Machine set-up time also contributes to lower productivity.

La présente invention a pour but de remédier aux inconvénients précités et de permettre un réglage précis du positionnement du monocristal dans un environnement propre et d'augmenter la productivité du découpage.The present invention aims to remedy the aforementioned drawbacks and to allow precise adjustment of the positioning of the single crystal in a clean environment and to increase the productivity of cutting.

L'invention est caractérisée à cet effet par les caractéristiques figurant aux revendications indépendantes et est caractérisée par le fait qu'on oriente le monocristal au moyen d'un dispositif de positionnement hors de la machine de découpage selon une orientation prédéterminée par rapport à un support de découpage, qu'on fixe le monocristal conformément à ladite orientation prédéterminée sur le support de découpage dont la mise en place dans la machine de découpage est géométriquement définie par rapport au plan de découpage de la machine, et qu'on dispose le support de découpage après fixation du monocristal dans la machine de découpage selon ladite mise en place géométriquement définie pour obtenir ladite orientation prédéterminée du monocristal dans la machine de découpage.The invention is characterized for this purpose by the characteristics appearing in the independent claims and is characterized by the fact that the single crystal is oriented by means of a positioning device outside the cutting machine in a predetermined orientation relative to a cutting support, which the single crystal is fixed in accordance with said predetermined orientation on the cutting support, the positioning of which in the machine cutting is geometrically defined with respect to the cutting plane of the machine, and that the cutting support is available after fixing the single crystal in the cutting machine according to said geometrically defined positioning to obtain said predetermined orientation of the single crystal in the machine cutting.

Par ces caractéristiques, il est possible d'obtenir un positionnement et une orientation précise du monocristal dans un environnement de mesure propice, sans qu'il soit nécessaire d'effectuer aucun réglage de positionnement sur la machine de découpe. Les temps d'arrêt de cette dernière peuvent donc être diminués considérablement de manière a augmenter la productivité.By these characteristics, it is possible to obtain precise positioning and orientation of the single crystal in a suitable measurement environment, without it being necessary to make any positioning adjustment on the cutting machine. The downtime of the latter can therefore be considerably reduced so as to increase productivity.

Dans un mode d'exécution préféré, l'invention est caractérisée par le fait que ladite orientation prédéterminée est obtenue en disposant le monocristal sur le dispositif de positionnement de façon qu'un de ses axes géométriques de la forme géométrique du monocristal soit compris dans un plan de référence correspondant au plan de travail de la machine de découpage perpendiculaire au plan de découpage, en effectuant une rotation du monocristal d'un premier angle prédéterminé autour dudit axe géométrique pour amener la normale au plan de découpe du monocristal dans ledit plan de référence, et en effectuant une rotation relative entre le support de découpage et le monocristal d'un second angle prédéterminé autour d'un axe perpendiculaire audit plan de référence de façon que la normale au plan de découpe soit orientée suivant une direction de référence correspondant à la normale en plan de découpage de la machine, ledit axe géométrique et la normale au plan de découpe du monocristal étant compris dans le plan de référence.In a preferred embodiment, the invention is characterized in that said predetermined orientation is obtained by placing the single crystal on the positioning device so that one of its geometric axes of the geometric shape of the single crystal is included in a reference plane corresponding to the working plane of the cutting machine perpendicular to the cutting plane, by rotating the single crystal by a first predetermined angle around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane , and by performing a relative rotation between the cutting support and the single crystal of a second predetermined angle about an axis perpendicular to said reference plane so that the normal to the cutting plane is oriented in a reference direction corresponding to the normal in the cutting plane of the machine, said geometric axis and the normal to the cutting plane of the single crystal being included in the reference plane.

On remédie ainsi de façon précise et aisée au désavantage d'avoir une position du monocristal inclinée par rapport à la direction de l'avancement des éléments de découpage de la machine, ce qui est particulièrement défavorable dans les scies à fils. L'axe géométrique principal du monocristal peut ainsi être orienté parfaitement parallèlement au plan de travail ou à la nappe de fils, on obtient donc une découpe optimale tout en minimisant la longueur de découpe.The disadvantage of having an inclined position of the single crystal relative to the direction of advance of the cutting elements of the machine is thus remedied in a precise and easy manner, which is particularly unfavorable in wire saws. The main geometrical axis of the single crystal can thus be oriented perfectly parallel to the work surface or to the ply of wires, an optimal cutting is therefore obtained while minimizing the cutting length.

Favorablement, le procédé est caractérisé en ce qu'on définit l'orientation du plan de découpe du monocristal par rapport au réseau cristallin, en ce qu'on mesure l'orientation du reseau cristallin par rapport à la forme géométrique du monocristal, et en ce qu'on calcule les premier et second angles de rotation en tenant compte de l'orientation du plan de découpe par rapport au réseau cristallin et par rapport à la forme géométrique du monocristal.Favorably, the method is characterized in that the orientation of the cutting plane of the single crystal is defined relative to the crystal lattice, in that the orientation of the crystal lattice is measured in relation to the geometric shape of the single crystal, and in what the first and second angles of rotation are calculated taking into account the orientation of the cutting plane with respect to the crystal lattice and with respect to the geometric shape of the single crystal.

Par ces caractéristiques, on obtient une grande précision du positionnement et une rapidité de montage considérable.By these characteristics, great positioning accuracy and considerable assembly speed are obtained.

Le procédé selon l'invention s'applique particulièrement avantageusement à l'utilisation d'un monocristal dont la forme géométrique est sensiblement cylindrique circulaire, ledit axe géométrique correspondant à l'axe principal du monocristal et en disposant le monocristal sur deux cylindres tournants parallèles du dispositif de positionnement, les axes des deux cylindres étant parallèles audit plan de référence.The method according to the invention is particularly advantageously applicable to the use of a single crystal of which the geometric shape is substantially circular cylindrical, said geometric axis corresponding to the main axis of the single crystal and by placing the single crystal on two parallel rotating cylinders of the positioning device, the axes of the two cylinders being parallel to said reference plane.

L'invention s'applique également à un dispositif de mise en oeuvre du procédé qui est caractérisé par le fait qu'il comprend un dispositif de positionnement destiné à orienter le monocristal hors de la machine de découpage conformément à une orientation prédéterminée par rapport à un support de découpage sur lequel le monocristal est destiné à être fixé et dont la mise en place dans la machine de découpage est géométriquement définie et dont les axes principaux sont parallèles aux axes de la machine de découpage.The invention also applies to a device for implementing the method which is characterized in that it comprises a positioning device intended to orient the single crystal out of the cutting machine in accordance with a predetermined orientation relative to a cutting support on which the single crystal is intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes are parallel to the axes of the cutting machine.

Ce dispositif pour la mise en oeuvre du procédé est avantageusement caractérisé par le fait qu'il comprend des premiers moyens pour supporter le monocristal dans une orientation telle qu'un des axes géométriques de la forme géométrique du monocristal est compris dans un plan de référence correspondant au plan de travail de la machine de découpage et pour effectuer une rotation du monocristal d'un premier angle prédéterminé autour dudit axe géométrique pour amener la normale au plan de découpe du monocristal dans ledit plan de référence et des seconds moyens pour effectuer une rotation relative entre le support de découpage et le monocristal d'un second angle prédéterminé autour d'un axe perpendiculaire audit plan de référence de façon que la normale au plan de découpe soit orientée suivant une direction de référence correspondant à la normale au plan de découpage de la machine, et par le fait qu'il comprend des troisièmes moyens pour effectuer un mouvement de translation relatif entre le monocristal et le support de découpage destiné à rapprocher le support de découpage et le monocristal en vue de fixer ce dernier sur le support de découpage, dans ladite orientation prédéterminée.This device for implementing the method is advantageously characterized in that it comprises first means for supporting the single crystal in an orientation such that one of the geometric axes of the geometric shape of the single crystal is included in a corresponding reference plane to the working plane of the cutting machine and to perform a rotation of the single crystal by a first predetermined angle about said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane and second means for carrying out a relative rotation between the cutting support and the single crystal of a second predetermined angle around an axis perpendicular to said reference plane so that the normal to the cutting plane is oriented along a reference direction corresponding to the normal to the cutting plane of the machine, and by the fact that it comprises third means for effecting a relative translational movement between the single crystal and the cutting support intended to bring the cutting support closer and the single crystal in order to fix the latter on the cutting support, in said predetermined orientation.

Par ces caractéristiques, on obtient un positionnement rapide, précis et adapté aux machines de découpage permettant un découpage exact dans un temps minimum. De plus, la précision de la découpe sera indépendante de la machine utilisée ou de l'opérateur dans le cas de chaînes de production.By these characteristics, we obtain a fast, precise positioning adapted to cutting machines allowing an exact cutting in a minimum time. In addition, the cutting precision will be independent of the machine used or of the operator in the case of production lines.

Un mode d'exécution favorable est caractérisé par le fait que les premiers moyens comprennent deux supports cylindriques parallèles montés de façon tournante sur un châssis du dispositif de positionnement et agencés de façon à supporter le monocristal et un premier organe de mesure angulaire susceptible de déterminer le premier angle de rotation prédéterminé, par le fait que les seconds moyens comprennent un plateau rotatif monté de façon tournante par rapport audit châssis et dont le plan principal est parallèle aux axes desdits supports cylindriques, ce plateau rotatif étant agencé de façon à maintenir le support de découpage dans une position géométriquement définie, un second organe de mesure angulaire étant prévu pour déterminer ledit second angle de rotation prédéterminé, par le fait que les troisièmes moyens comprennent un mécanisme de translation permettant le rapprochement du support de découpage et du monocristal et par le fait que le support de découpage est conformé de façon que son positionnement dans la machine de découpage s'effectue selon une position géométrique correspondant à la position géométrique définie sur ledit plateau rotatif de façon que le plan de référence et la direction de référence correspondent au plan de travail et à la normale au plan de découpage de la machine.A favorable embodiment is characterized in that the first means comprise two parallel cylindrical supports rotatably mounted on a chassis of the positioning device and arranged so as to support the single crystal and a first angular measurement member capable of determining the first predetermined angle of rotation, by the fact that the second means comprise a rotary plate rotatably mounted with respect to said chassis and the main plane of which is parallel to the axes of said cylindrical supports, this rotary plate being arranged so as to maintain the support of cutting in a geometrically defined position, a second angular measuring member being provided for determining said second predetermined angle of rotation, by the fact that the third means comprise a translation mechanism allowing the cutting support to be brought closer to the single crystal and by the fact that the cutting support is shaped so that its positioning in the cutting machine is effected according to a geometric position corresponding to the geometric position defined on said rotary table so that the reference plane and the reference direction correspond to the work plan and normal to the cutting plane of the machine.

Ces caractéristiques permettent une construction du dispositif de positionnement particulièrement simple et peu onéreuse, tout en assurant une grande précision de découpe.These characteristics allow a particularly simple and inexpensive construction of the positioning device, while ensuring high cutting precision.

D'autres avantages ressortent des caractéristiques exprimées dans les revendications dépendantes et de la description exposant ci-après l'invention plus en détail à l'aide de dessins qui représentent schématiquement et à titre d'exemple un mode d'exécution.Other advantages emerge from the characteristics expressed in the dependent claims and from the description setting out the invention below in more detail with the aid of drawings which diagrammatically represent an embodiment by way of example.

La figure 1 illustre en perspective un exemple de monocristal avec ses axes géométriques et cristallographiques et le plan de découpe choisi.Figure 1 illustrates in perspective an example of a single crystal with its geometric and crystallographic axes and the chosen cutting plane.

Les figures 2A et 2B illustrent selon deux vues orthogonales la position du monocristal obtenu par un procédé connu et couramment utilisé.FIGS. 2A and 2B illustrate in two orthogonal views the position of the single crystal obtained by a known and commonly used method.

Les figures 3A et 3B représentent selon deux vues orthogonales la position du monocristal obtenu conformement à la présente invention.Figures 3A and 3B show in two orthogonal views the position of the single crystal obtained in accordance with the present invention.

La figure 4 représente un schéma vectoriel des différents référentiels utilisés.FIG. 4 represents a vector diagram of the various reference systems used.

Les figures 5A, 5B, 5C illustrent les positions occupées par le monocristal en suivant le procédé d'orientation conformément à l'invention.FIGS. 5A, 5B, 5C illustrate the positions occupied by the single crystal following the orientation method according to the invention.

La figure 6 est une vue en perspective d'un mode d'exécution du dispositif pour la mise en oeuvre du procédé.Figure 6 is a perspective view of an embodiment of the device for the implementation of the method.

De façon générale, l'invention donne la possibilité d'installer sur la machine de découpage des monocristaux préorientés dont le plan de découpe est orienté parallèlement au plan de découpage de la machine et tourné selon un axe perpendiculaire (normale au plan de découpage), de manière à minimiser la longueur de découpe. Cette détermination se fera mathématiquement à partir des mesures effectuées pour déterminer l'erreur du monocristal géométrique par rapport au réseau cristallin en y incluant les exigences du procédé subséquent en relation avec les axes cristallins. Le montage du monocristal sur son support pourra se faire alors à l'aide d'un dispositif de positionnement qui autorise la mesure exacte des angles de rotation du monocristal géométrique, et de le monter tel quel sur un support de découpage qui est une pièce avec indexation appartenant à la machine de découpage. Le monocristal peut être bridé ou de préférence collé sur le support, support qui une fois transféré sur la machine de découpage présentera un monocristal parfaitement préorienté prêt à être scier sans ajustement subséquent. De plus, la précision de la découpe sera indépendante de la machine utilisée ou de l'opérateur dans le cas de chaînes de production.In general, the invention gives the possibility of installing pre-oriented single crystals on the cutting machine, the cutting plane of which is oriented parallel to the cutting plane of the machine and rotated along a perpendicular axis (normal to the cutting plane), so as to minimize the cutting length. This determination will be made mathematically from the measurements carried out to determine the error of the geometric single crystal with respect to the crystal lattice by including the requirements of the subsequent process in relation to the crystal axes. The mounting of the single crystal on its support can then be done using a positioning device which allows the exact measurement of the angles of rotation of the geometric single crystal, and to mount it as is on a cutting support which is a part with indexing belonging to the cutting machine. The single crystal can be clamped or preferably glued to the support, support which once transferred to the cutting machine will present a perfectly preoriented single crystal ready to be sawed without subsequent adjustment. In addition, the cutting precision will be independent of the machine used or of the operator in the case of production lines.

Le dispositif de positionnement se présentera sous la forme d'une table ou d'un châssis avec un plateau rotatif ayant son axe de rotation z''' vertical sur lequel est posé le support du monocristal sur lequel il sera ultérieurement fixé. Ce support a un système d'indexation identique a celui de la machine de découpage. Le support du monocristal est une pièce interface entre le dispositif de positionnement et la machine de découpage. Il aura donc la même position sur le dispositif de positionnement et sur la machine de découpage. Au dessus du plateau rotatif mais fixe par rapport à la table se trouve un mécanisme permettant la tenue du monocristal et de le faire tourner selon son axe horizontal x. Ce système est composé dans le cas de monocristaux cylindriques de deux cylindres sur lesquels repose le monocristal. Le monocristal peut alors tourner selon son axe x. Le mouvement du plateau et la rotation du monocristal x permettent de le positionner dans n'importe quelle orientation. La valeur des deux angles de rotation sera déterminée par les exigences du produit terminé et calculé mathématiquement. Une fois les deux rotations effectuées, un mécanisme fait mettre en présence le support avec le monocristal lui-même tout en conservant leur position relative. Ceci peut se faire soit par l'élévation du plateau rotatif soit par l'abaissement du monocristal. Une fois mis en contact le monocristal sera bridé ou collé en position. Le support de monocristal pourra alors être transféré sur la machine de découpage. Le monocristal est alors orienté, prêt à être découpé. Les angles de rotation selon x et z''' sont mesurés par des dispositifs électroniques intégrés tels qu'encodeurs ou mécaniques par verniers par exemple.The positioning device will be in the form of a table or a frame with a rotary table having its axis of rotation z '''vertical on which is posed the support of the single crystal on which it will be fixed later. This support has an indexing system identical to that of the cutting machine. The single crystal support is an interface piece between the positioning device and the cutting machine. It will therefore have the same position on the positioning device and on the cutting machine. Above the rotary table but fixed relative to the table is a mechanism for holding the single crystal and rotating it along its horizontal axis x. This system is composed in the case of cylindrical single crystals of two cylinders on which the single crystal rests. The single crystal can then rotate along its x axis. The movement of the plate and the rotation of the single crystal x allow it to be positioned in any orientation. The value of the two angles of rotation will be determined by the requirements of the finished product and calculated mathematically. Once the two rotations have been carried out, a mechanism brings the support into contact with the single crystal itself while retaining their relative position. This can be done either by raising the turntable or by lowering the single crystal. Once brought into contact, the single crystal will be clamped or glued in position. The single crystal support can then be transferred to the cutting machine. The single crystal is then oriented, ready to be cut. The angles of rotation along x and z '''are measured by integrated electronic devices such as encoders or mechanical by verniers for example.

La figure 1 représente un exemple de monocristal à découper 2 qui possède une forme géométrique cylindrique avec des axes géométriques x,y,z, l'axe x étant l'axe principal. Les axes x',y',z' du réseau cristallin de ce monocristal ne sont pas parallèles aux axes géométriques. Les angles a et f entre les axes y',y et z',z sont déterminés par mesure optique ou aux rayons X et définissent généralement l'erreur de fabrication du monocristal. La figure 1 montre également le plan de découpe 16 choisi ou imposé du monocristal avec ses axes y'' et Z'' inclinés des valeurs angulaires p et t par rapport aux axes y', z' du réseau cristallin et la normale x'' au plan de découpe. Les valeurs angulaires p et t sont généralement définies en fonction des nécessités de l'utilisation ultérieure du monocristal découpé. Il est bien entendu que ces angles p et t pourront par exemple être égaux à zéro au cas où l'on désire obtenir des plaquettes de silicium découpées parallèlement au plan (100).FIG. 1 represents an example of a single crystal to be cut 2 which has a cylindrical geometric shape with geometric axes x, y, z, the x axis being the main axis. The axes x ', y', z 'of the crystal lattice of this single crystal are not parallel to the geometric axes. The angles a and f between the axes y ', y and z', z are determined by optical or X-ray measurement and generally define the manufacturing error of the single crystal. Figure 1 also shows the chosen or imposed cutting plane 16 of the single crystal with its axes y '' and Z '' inclined by the angular values p and t relative to the axes y ', z' of the crystal lattice and the normal x '' on the cutting plane. The angular values p and t are generally defined according to the needs of the subsequent use of the cut single crystal. It is understood that these angles p and t may for example be equal to zero in the case where it is desired to obtain silicon wafers cut parallel to the plane (100).

Les figures 2A et 2B représentent en vue latérale et en plan, la position du monocristal 2 obtenue par le procédé connu et couramment utilisé avant la présente invention en effectuant une orientation du monocristal par rotation autour des axes géométriques y et z. Le monocristal 2 n'est alors pas parallèle au plan de la nappe des fils 17 dans le cas de l'utilisation d'une scie à fils comme moyen de découpage. Le plan de machines x''',y''' de la machine de découpage n'est pas parallèle à l'axe géométrique x du monocristal 1. La direction d'avancement selon z''' de la nappe de fils 17 n'est pas perpendiculaire au monocristal, ce qui est préjudiciable pour la qualité de la découpe.FIGS. 2A and 2B show in lateral and plan view, the position of the single crystal 2 obtained by the known method and commonly used before the present invention by performing an orientation of the single crystal by rotation around the geometric axes y and z. The single crystal 2 is then not parallel to the plane of the ply of wires 17 in the case of the use of a wire saw as a cutting means. The machine plane x ''',y''' of the cutting machine is not parallel to the geometrical axis x of the single crystal 1. The direction of advance along z '''of the ply of wires 17 n 'is not perpendicular to the single crystal, which is detrimental to the quality of the cut.

Les figures 3A et 3B illustrent l'orientation du monocristal obtenu par le procédé conformément à la présente invention en effectuant une orientation du monocristal par rotation autour des axes géométriques x et z'''. La nappe de fils 17 de la scie utilisée comme machine de découpage se trouve dans le plan x'''y''' et l'axe géométrique x du monocristal est parallèle à ce plan x''',y'''. Le monocristal se trouve donc dans une position optimale par rapport aux moyens de découpage, de façon à obtenir une découpe très précise.Figures 3A and 3B illustrate the orientation of the single crystal obtained by the method according to the present invention by performing an orientation of the single crystal by rotation around the geometric axes x and z '' '. The ply of wires 17 of the saw used as a cutting machine is located in the plane x '' 'y' '' and the geometric axis x of the single crystal is parallel to this plane x '' ', y' ''. The single crystal is therefore in an optimal position relative to the cutting means, so as to obtain a very precise cutting.

Le schéma vectoriel des divers référentiels utilisés pour le positionnement est représenté à la figure 4 et comprend le référentiel x,y,z lié à la forme géométrique du monocristal, le référentiel x',y',z' lié au réseau cristallin du monocristal, le référentiel x'',y'',z'' correspondant au plan de découpe du monocristal et le référentiel x''',y''',z''' utilisé pour le dispositif de positionnement et la machine de découpage.The vector diagram of the various reference systems used for positioning is shown in FIG. 4 and includes the reference system x, y, z linked to the geometric shape of the single crystal, the reference system x ', y', z 'linked to the crystal lattice of the single crystal, the reference frame x '', y '', z '' corresponding to the cutting plane of the single crystal and the reference frame x '' ', y' '', z '' 'used for the positioning device and the cutting machine.

Le plan de découpe correspond au plan y'',z'' et sa normale correspond à la direction x''. Le défaut d' alignement de la forme géométrique du monocristal 2 avec le reseau cristallin est déterminé par les angles a et f, correspondant aux angles y'y et z'z. Les angles p et t correspondant aux angles y''y' et z''z' déterminent l'orientation des plans de découpe choisis par rapport au référentiel du réseau cristallin. La normale x'' au plan de découpe y''z'' définit un vecteur x''(x,y,z) qui fait un angle g avec l'axe géométrique x et la projection du vecteur X''(x,y,z) sur le plan y,z fait un angle d avec y.The cutting plane corresponds to the y '', z '' plane and its normal corresponds to the x '' direction. The misalignment of the geometric shape of the single crystal 2 with the crystal lattice is determined by the angles a and f, corresponding to the angles y'y and z'z. The angles p and t corresponding to the angles y''y 'and z''z' determine the orientation of the chosen cutting planes with respect to the reference frame of the crystal lattice. The normal x '' to the cutting plane y''z '' defines a vector x '' (x, y, z) which makes an angle g with the geometric axis x and the projection of the vector X '' (x, y, z) on the y-plane, z makes an angle d with y.

L'angle d correspond donc à l'angle de rotation autour de l'axe géométrique x pour amener la normale x'' au plan de découpe y'',z'' dans un plan de référence correspondant au plan de travail x''',y''' de la machine.The angle d therefore corresponds to the angle of rotation around the geometric axis x to bring the normal x '' to the cutting plane y '', z '' in a reference plane corresponding to the work plane x '' ', y' '' of the machine.

L'angle g correspond à l'angle de rotation autour de l'axe vertical z''' de façon que la normale x'' au plan de découpe soit orientée suivant une direction de référence correspondant à la normale x''' au plan de découpage y'''z''' de la machine pour faire coïncider le plan de découpe souhaité avec le plan de découpage de la machine de découpage.The angle g corresponds to the angle of rotation around the vertical axis z '' 'so that the normal x' 'to the cutting plane is oriented in a reference direction corresponding to the normal x' '' to the plane cutting y '' 'z' '' of the machine to make the desired cutting plane coincide with the cutting plane of the cutting machine.

Les angles d et g peuvent être calculés et la solution mathématique se présentera sous la forme suivante : X' = M(a,f)X

Figure imgb0001
avec M(a,f) matrice de rotation pour les angles a,f et X'' = M(t,p)X'
Figure imgb0002
 avec M(t,p) matrice de rotation pour les angles p,t.The angles d and g can be calculated and the mathematical solution will appear in the following form: X '= M (a, f) X
Figure imgb0001
 with M (a, f) rotation matrix for angles a, f and X '' = M (t, p) X '
Figure imgb0002
 with M (t, p) rotation matrix for the angles p, t.

On en déduit que les deux angles d et g que l'on fera effectuer au monocristal géométrique selon x et z''' seront obtenus par les composantes X''x, X''y, X''z de X''(x,y,z) dans le repère x''',y''',z''' où X'' est le vecteur normal au plan y'',Z'' dans le référentiel machine. d = arctang (X''z/X''y) g = arctang ((sqrt(X''y**2+X''z**2))/X''x)

Figure imgb0003
We deduce that the two angles d and g that we will make with the geometric single crystal according to x and z '''will be obtained by the components X''x, X''y, X''z of X''( x, y, z) in the coordinate system x ''',y''', z '''whereX''is the vector normal to the plane y'',Z''in the machine reference system. d = arctang (X''z / X''y) g = arctang ((sqrt (X''y ** 2 + X''z ** 2)) / X''x)
Figure imgb0003

Le procédé de positionnement pour obtenir l'orientation optimale représentée aux figures 3A et 3B est décrit plus précisément en référence aux figures 5A, 5B et 5C illustrant trois positions successives. En figure 5A, le monocristal est place sur le dispositif de positionnement et ses axes géométriques x,y,z sont alignés avec les axes x''',y''',z''' du dispositif d'alignement et de la machine de découpage.The positioning process for obtaining the optimal orientation shown in FIGS. 3A and 3B is described more precisely with reference to FIGS. 5A, 5B and 5C illustrating three successive positions. In FIG. 5A, the single crystal is placed on the positioning device and its geometric axes x, y, z are aligned with the axes x ''',y''', z '''of the alignment device and the cutting machine.

On effectue alors une rotation autour de l'axe géométrique x''' ou x de la valeur angulaire d pour amener le vecteur X'' dans le plan x''',y''' (figure 5B). Une rotation d'un angle g du monocristal géométrique selon l'axe z''' amène le vecteur X'' dans une position colinéaire avec l'axe x''' (figure 5C). Après ces deux rotations, le monocristal géométrique x,y,z est orienté parallèlement au plan x''',y''' avec un angle g par rapport à la normale X''' au plan de découpage correspondant aux nécessités du procédé utilisé ultérieurement. Le sciage résultant aura bien les angles t et p par rapport aux axes cristallographies y' et z'. Il est bien entendu que la seconde rotation pourra également être effectuée en tournant le support de découpage d une angle -g, le monocristal restant immobile comme cela est réalisé dans le mode d'exécution illustré à la figure 6.One then performs a rotation around the geometric axis x '' 'or x of the angular value d to bring the vector X' 'in the plane x' '', y '' '(Figure 5B). A rotation of an angle g of the geometric single crystal along the z axis '' 'brings the vector X' 'into a collinear position with the x axis' '' (Figure 5C). After these two rotations, the geometric single crystal x, y, z is oriented parallel to the plane x '' ', y' '' with an angle g relative to the normal X '' 'to the cutting plane corresponding to the requirements of the process used later. The resulting sawing will have the angles t and p relative to the crystallographic axes y 'and z'. It is understood that the second rotation may also be carried out by rotating the cutting support by an angle -g, the single crystal remaining stationary as is done in the embodiment illustrated in FIG. 6.

Ce dernier est constitué par un dispositif de positionnement 1 qui permet d'orienter le monocristal 2 hors d'une machine de découpage conformément à une orientation prédéterminée par rapport a un support de découpage se présentant sous forme d'un support 3 sur lequel le monocristal sera fixé après orientation adéquate. Le dispositif de positionnement 1 comprend à cet effet une table ou un châssis 5 avec une partie supérieure 6 et une partie inférieure 7.The latter is constituted by a positioning device 1 which makes it possible to orient the single crystal 2 out of a cutting machine in accordance with a predetermined orientation with respect to a cutting support which is in the form of a support 3 on which the single crystal will be fixed after proper orientation. The positioning device 1 for this purpose comprises a table or a frame 5 with an upper part 6 and a lower part 7.

Le monocristal 2 est porté par deux cylindres de support 8 montés tournant sur la partie supérieure 6 avec leur axe principal orienté parallèlement à l'axe x. Un organe de mesure angulaire, sous forme d'une encodeur 10 permet de mesurer l'angle de rotation d du monocristal autour de l'axe x.The single crystal 2 is carried by two support cylinders 8 mounted rotating on the upper part 6 with their main axis oriented parallel to the x axis. An angular measuring member, in the form of an encoder 10 makes it possible to measure the angle of rotation d of the single crystal around the x axis.

Un plateau rotatif 12 est monté tournant selon l axe z''' sur la partie inférieure 7 du châssis. Un système de mesure angulaire intégré dans le plateau rotatif 12 permet de mesurer l'angle de rotation g autour de l'axe z'''. Le support 3 est maintenu dans une orientation prédéterminée précise sur le plateau rotatif 12.A rotary plate 12 is mounted to rotate along the axis z '' 'on the lower part 7 of the chassis. An angular measurement system integrated in the rotary plate 12 makes it possible to measure the angle of rotation g around the axis z '' '. The support 3 is maintained in a precise predetermined orientation on the rotary plate 12.

Le plateau rotatif 12 est également monté de façon coulissante suivant la direction z''' sur la partie inférieure 7 du châssis afin de pouvoir rapprocher le support 3 du monocristal 2 au moyen d'un mécanisme de levage 14 pour fixer le monocristal 2 sur le support 3. Après fixation, le support 3 et le monocristal 2 peuvent être placés dans la machine de découpage selon une position géométrique prédéterminée de façon que le plan de référence x'''s,y'''s du support 3 corresponde au plan de travail x''',y''' de la machine de découpage et de façon que la perpendiculaire x''' au plan de découpage de la machine soit parallèle à la direction de référence x'''s du support.The turntable 12 is also slidably mounted in the direction z '''on the lower part 7 of the chassis in order to be able to bring the support 3 closer to the single crystal 2 by means of a lifting mechanism 14 to fix the single crystal 2 to the support 3. After fixing, the support 3 and the single crystal 2 can be placed in the cutting machine according to a predetermined geometric position so that the reference plane x ''' s , y''' s of the support 3 corresponds to the plane x ''',y''' of the cutting machine and so that the perpendicular x '''to the cutting plane of the machine is parallel to the reference direction x''' s of the support.

Ainsi le procédé et le dispositif décrits permettent le positionnement d'un monocristal sur un support hors de la machine de découpage de telle manière que le monocristal, une fois monté avec son support sur une machine de découpage, soit découpé avec une orientation donnée des axes cristallins par rapport au plan de sciage. De plus, la position d un monocristal cylindrique est telle que les génératrices de celui-ci se trouvent placées parallèlement à la nappe de fils 17 dans le cas d'une scie à fils ou parallèlement à la direction du mouvement définissant l'épaisseur des tranches s'il s'agit d'une découpe avec came. On mesure pour ceci l'orientation du réseau cristallin par rapport à la forme géométrique du monocristal optiquement ou au moyen de rayons X. Le dispositif de positionnement ou le support de découpage pourront à cet effet avantageusement être agencés pour pouvoir être montés sur un générateur de rayons X de façon que le positionnement du monocristal puisse être effectué et contrôlé simultanément. L'orientation du plan de découpe y'',z'' par rapport au réseau cristallin x',y,'z' étant imposée par l' application ultérieure, les valeurs des deux angles de rotation du monocristal d selon l'axe x et g selon l'axe z''' du dispositif de positionnement sont déterminés mathématiquement. Une fois les deux rotations réalisées selon les valeurs calculées, le monocristal se trouvera dans la position recherchée pour la machine de découpage, à savoir perpendiculairement à l'avance de la découpe ayant en plus son plan de découpe parallèle à celui de la machine. Le dispositif de positionnement permettra la fixation du monocristal soit par bridage soit par collage sur un support préindexé par rapport à la machine de découpage. En outre, l'orientation donnée par le procédé minimise dans le cas de monocristaux cylindriques la longueur de sciage. La machine de découpage ne nécessite donc aucun dispositif de réglage pour assurer une découpe selon les spécifications angulaires requises après le transfert du monocristal sur son support de découpage et de celui-ci dans la machine de découpage. La nappe de fils d'une scie à fils demeure parallèle au monocristal géométrique durant toute la découpe tout en assurant une orientation adéquate des tranches ainsi produites. De même, la lame de scie d'une machine à lames demeure perpendiculaire au monocristal.Thus the method and the device described allow the positioning of a single crystal on a support outside the cutting machine so that the single crystal, once mounted with its support on a cutting machine, is cut with a given orientation of the axes crystalline with respect to the saw plane. In addition, the position of a cylindrical single crystal is such that the generators thereof are placed parallel to the ply of wires 17 in the case of a wire saw or parallel to the direction of movement defining the thickness of the slices if it is a cut with cam. For this, the orientation of the crystal lattice is measured with respect to the geometric shape of the single crystal optically or by means of X-rays. The positioning device or the cutting support can advantageously be arranged for this purpose so that they can be mounted on a generator X-rays so that the positioning of the single crystal can be carried out and controlled simultaneously. The orientation of the cutting plane y '', z '' with respect to the crystal lattice x ', y,' z 'being imposed by the subsequent application, the values of the two angles of rotation of the single crystal d along the x axis and g along the z axis''' of the positioning device are determined mathematically. Once the two rotations carried out according to the calculated values, the single crystal will be in the position sought for the cutting machine, namely perpendicular to the cutting advance having in addition its cutting plane parallel to that of the machine. The positioning device will allow the single crystal to be fixed either by clamping or by gluing on a pre-indexed support relative to the cutting machine. In addition, the orientation given by the method minimizes in the case of cylindrical single crystals the sawing length. The cutting machine therefore does not require any adjustment device to ensure cutting according to the angular specifications required after the transfer of the single crystal onto its cutting support and of the latter into the cutting machine. The wire table of a wire saw remains parallel to the geometrical single crystal throughout the cutting while ensuring an adequate orientation of the slices thus produced. Likewise, the saw blade of a blade machine remains perpendicular to the single crystal.

Il est bien entendu que le mode de réalisation décrit ci-dessus ne présente aucun caractère limitatif et qu'il peut recevoir toutes modifications désirables à l'intérieur du cadre tel que défini par la revendication 1. En particulier, les deux angles de rotation autour des axes x et z''' pourraient être remplacés par des angles pris et calculés par rapport à d'autres référentiels géométriques et cristallographiques, mais qui aboutissent au même résultat que la normale au plan de découpe du monocristal est orientée dans une direction de référence correspondant à la normale au plan de découpage de la machine et qu'un axe géométrique prédéterminé du monocristal et la normale au plan de découpe sont compris dans un plan de référence correspondant au plan de travail de la machine. De même, le plan de découpe pourra être déterminé par d'autres angles que p et t par rapport au reseau cristallin et le décalage du réseau cristallin par rapport à la forme géométrique du monocristal pourra être indiqué par d'autres angles mesurés que a et f.It is understood that the embodiment described above has no limiting character and that it can receive any desirable modifications inside the frame as defined by claim 1. In particular, the two angles of rotation around x and z axes' '' could be replaced by angles taken and calculated with respect to other geometric and crystallographic reference frames, but which lead to the same result as the normal to the cutting plane of the single crystal is oriented in a reference direction corresponding to the normal to the cutting plane of the machine and that a predetermined geometric axis of the single crystal and the normal to the cutting plane are included in a reference plane corresponding to the working plane of the machine. Similarly, the cutting plane can be determined by other angles than p and t relative to the crystal lattice and the shift of the crystal lattice relative to the geometric shape of the single crystal can be indicated by other angles measured than a and f.

Les deux cylindres de support 8 pourraient être remplacés par d'autres moyens pour supporter le monocristal et pour effectuer une rotation du monocristal tel que par exemple un seul support dans ou sur lequel le monocristal est fixé temporairement et qui est monté tournant sur la table ou le châssis. Ce support de rotation pourrait être agencé à une ou à deux extrémités opposées du monocristal. La rotation relative entre le monocristal et le support de découpage autour de l'axe z''' pourrait également être obtenu en effectuant une rotation du monocristal par rapport au support de découpage qui resterait immobile sur la table ou le chassis du dispositif de positionnement. Le plateau rotatif serait alors remplacé par un organe rotatif selon z''' et portant le support temporaire du monocristal.The two support cylinders 8 could be replaced by other means for supporting the single crystal and for performing a rotation of the single crystal such as for example a single support in or on which the single crystal is temporarily fixed and which is mounted to rotate on the table or the chassis. This rotation support could be arranged at one or two opposite ends of the single crystal. The relative rotation between the single crystal and the cutting support around the axis z '''could also be obtained by rotating the single crystal with respect to the cutting support which would remain stationary on the table or the chassis of the positioning device. The rotary table would then be replaced by a rotary member along z '''and carrying the temporary support of the single crystal.

Les organes de mesures angulaires pourraient être électroniques, optiques ou mécaniques.The angular measurement members could be electronic, optical or mechanical.

Le rapprochement ou la mise en contact du monocristal et du support de découpage pourraient être effectués par le bas ou par le haut et en déplaçant soit le support de découpage soit le monocristal.The approximation or bringing into contact of the single crystal and the cutting support could be carried out from the bottom or from the top and by moving either the cutting support or the single crystal.

Les rotations autour des deux axes horizontal et vertical x,z''' pourraient être interverties dans le temps en effectuant d'abord la rotation autour de l'axe z''' et ensuite la rotation autour de l'axe horizontal x.The rotations around the two horizontal and vertical axes x, z '' 'could be inverted over time by first performing the rotation around the z axis' '' and then the rotation around the horizontal x axis.

Le procédé et le dispositif pourraient également être utilisés pour le découpage orienté de monocristaux de toute autre forme géométrique ou de tout autre matériau qu'un monocristal, tel que des ensembles polycristallins à orientation cristalline prédéterminée, des cristaux à mâcles simples ou polysynthétiques, des agrégats cristallins orientés, des alliages, des substances cristallines orientées contenues dans une substance amorphe, par exemple des matériaux polarisants.The method and the device could also be used for the oriented cutting of single crystals of any other geometric shape or of any material other than a single crystal, such as polycrystalline assemblies with predetermined crystal orientation, crystals with simple or polysynthetic rings, aggregates. oriented crystallines, alloys, oriented crystalline substances contained in an amorphous substance, for example polarizing materials.

Claims (11)

Procédé pour l'orientation de monocristaux (2) en vue d'une découpe dans une machine de découpage (17) selon un plan de découpe (y'',z'') prédéterminé, caractérisé par le fait qu'on oriente le monocristal (2) au moyen d'un dispositif de positionnement (1) hors de la machine de découpage selon une orientation prédéterminée par rapport a un support de découpage (3), qu'on fixe le monocristal (2) conformément à ladite orientation prédéterminée sur le support de découpage (3) dont la mise en place dans la machine de découpage (17) est géométriquement définie par rapport au plan de découpage (y''',z''') de la machine, et qu'on dispose le support de découpage (3) après fixation du monocristal dans la machine de découpage (17) selon ladite mise en place géométriquement définie pour obtenir ladite orientation prédéterminée du monocristal (2) dans la machine de découpage.Method for orienting single crystals (2) for cutting in a cutting machine (17) according to a predetermined cutting plane (y '', z ''), characterized in that the single crystal is oriented (2) by means of a positioning device (1) outside the cutting machine in a predetermined orientation relative to a cutting support (3), that the single crystal (2) is fixed in accordance with said predetermined orientation on the cutting support (3), the positioning of which in the cutting machine (17) is geometrically defined with respect to the cutting plane (y '' ', z' '') of the machine, and that the cutting support (3) after fixing the single crystal in the cutting machine (17) according to said geometrically defined positioning to obtain said predetermined orientation of the single crystal (2) in the cutting machine. Procédé selon la revendication 1, caractérisé par le fait que ladite orientation prédéterminée est obtenue en disposant le monocristal (2) sur le dispositif de positionnement (1) de façon qu'un de ses axes géométriques (x) de la forme géométrique (x,y,z) du monocristal soit compris dans un plan de référence correspondant au plan de travail (x''',y''') de la machine de découpage (17) perpendiculaire au plan de découpage (y''',z'''), en effectuant une rotation du monocristal d'un premier angle prédéterminé (d) autour dudit axe géométrique (x) pour amener la normale (x'') au plan de découpe (y'',z'') du monocristal dans ledit plan de référence, et en effectuant une rotation relative entre le support de découpage (3) et le monocristal d'un second angle prédéterminé (g) autour d'un axe (z''' ) perpendiculaire audit plan de référence de façon que la normale (x'') au plan de découpe (y'',z'') soit orientée suivant une direction de référence correspondant à la normale au plan de découpage (y''',z''') de la machine, ledit axe géométrique (x) et la normale (x'') au plan de découpe du monocristal (2) étant compris dans ledit plan de référence.Method according to claim 1, characterized in that the said predetermined orientation is obtained by placing the single crystal (2) on the positioning device (1) so that one of its geometric axes (x) of the geometric shape (x, y, z) of the single crystal is included in a reference plane corresponding to the working plane (x ''',y''') of the cutting machine (17) perpendicular to the cutting plane (y ''',z'''), by rotating the single crystal by a first predetermined angle (d) around said geometric axis (x) to bring the normal (x '') to the cutting plane (y '', z '') of the single crystal in said reference plane, and by performing a relative rotation between the cutting support (3) and the single crystal by a second angle predetermined (g) around an axis (z ''') perpendicular to said reference plane so that the normal (x'') to the cutting plane (y'',z'') is oriented in a reference direction corresponding to the normal to the cutting plane (y ''',z''') of the machine, said geometric axis (x) and the normal (x '') to the cutting plane of the single crystal (2) being included in said reference plane. Procédé selon la revendication 2, caractérisé par le fait que les premier et second angles de rotation (d,g) sont déterminés mathématiquement.Method according to claim 2, characterized in that the first and second angles of rotation (d, g) are determined mathematically. Procédé selon la revendication 3, caractérisé en ce qu'on définit l'orientation du plan de découpe (y'',z'') du monocristal par rapport au réseau cristallin (x',y',z'), en ce qu'on mesure l'orientation du réseau cristallin (x',y',z') par rapport à la forme géométrique (x,y,z) du monocristal, et en ce qu'on calcule les premier et second angles de rotation (d,g) en tenant compte de l'orientation du plan de découpe (y'',z'') par rapport au réseau cristallin (x',y',z') et par rapport à la forme géométrique (x,y,z) du monocristal.Method according to claim 3, characterized in that the orientation of the cutting plane (y '', z '') of the single crystal relative to the crystal lattice (x ', y', z ') is defined, in that 'we measure the orientation of the crystal lattice (x', y ', z') relative to the geometric shape (x, y, z) of the single crystal, and in that we calculate the first and second angles of rotation ( d, g) taking into account the orientation of the cutting plane (y '', z '') with respect to the crystal lattice (x ', y', z ') and with respect to the geometric shape (x, y , z) of the single crystal. Procédé selon la revendication 4, caractérisé par le fait que l'orientation du reseau cristallin (x',y',z') par rapport à la forme géométrique (x,y,z) est déterminée optiquement ou au moyen de rayons X.Method according to claim 4, characterized in that the orientation of the crystal lattice (x ', y', z ') by relation to the geometric shape (x, y, z) is determined optically or by means of X-rays. Procédé selon l'une des revendications 2 à 5, caractérisé en ce qu'on utilise un monocristal (2) dont la forme géométrique est sensiblement cylindrique circulaire, ledit axe géométrique (x) correspondant à l'axe principal du monocristal et en ce qu'on dispose le monocristal sur deux cylindres tournants parallèles (8) du dispositif de positionnement (1), les axes des deux cylindres (8) étant parallèles audit plan de référence.Method according to one of claims 2 to 5, characterized in that a single crystal (2) is used whose geometric shape is substantially circular cylindrical, said geometric axis (x) corresponding to the main axis of the single crystal and in that 'the single crystal is placed on two parallel rotating cylinders (8) of the positioning device (1), the axes of the two cylinders (8) being parallel to said reference plane. Dispositif pour la mise en oeuvre du procédé selon l'une des revendications précédentes, caractérisé par le fait qu'il comprend un dispositif de positionnement (1) destiné à orienter le monocristal (2) hors de la machine de découpage conformément à une orientation prédéterminée par rapport à un support de découpage (3) sur lequel le monocristal est destiné à être fixé et dont la mise en place dans la machine de découpage est géométriquement définie et dont les axes principaux (X'''s,Y'''s) sont parallèles aux axes (x''',y''') de la machine de découpage.Device for implementing the method according to one of the preceding claims, characterized in that it comprises a positioning device (1) intended to orient the single crystal (2) out of the cutting machine in accordance with a predetermined orientation relative to a cutting support (3) on which the single crystal is intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes (X ''' s , Y''' s ) are parallel to the axes (x ''',y''') of the cutting machine. Dispositif selon la revendication 7, caractérisé par le fait qu'il comprend des premiers moyens (8) pour supporter le monocristal (2) dans une orientation telle qu'un des axes géométriques (x) de la forme géométrique (x,y,z) du monocristal est compris dans un plan de référence correspondant au plan de travail (x''',y''') de la machine de découpage et pour effectuer une rotation du monocristal (2) d'un premier angle prédéterminé (d) autour dudit axe géométrique (x) pour amener la normale (x'') au plan de découpe (y'',x'') du monocristal dans ledit plan de référence et des seconds moyens (12) pour effectuer une rotation relative entre le support de découpage (3) et le monocristal (2) d'un second angle prédéterminé (g) autour d'un axe (z''') perpendiculaire audit plan de référence de façon que la normale (x'') au plan de découpe (y',z') soit orientée suivant une direction de référence correspondant à la normale au plan de découpage (y''',z''') de la machine.Device according to claim 7, characterized in that it comprises first means (8) for supporting the single crystal (2) in an orientation such that one of the geometric axes (x) of the geometric shape (x, y, z ) of the single crystal is included in a reference plane corresponding to the work plane (x ''',y''') of the cutting and for performing a rotation of the single crystal (2) by a first predetermined angle (d) around said geometric axis (x) to bring the normal (x '') to the cutting plane (y '', x '') of the single crystal in said reference plane and second means (12) for carrying out a relative rotation between the cutting support (3) and the single crystal (2) by a second predetermined angle (g) about an axis (z ''') perpendicular to said reference plane so that the normal (x'') to the cutting plane (y', z ') is oriented in a reference direction corresponding to the normal to the cutting plane (y''', z ''') of the machine. Dispositif selon la revendication 8, caractérisé par le fait qu'il comprend des troisièmes moyens (14) pour effectuer un mouvement de translation relatif entre le monocristal (2) et le support de découpage (3) destinés à rapprocher le support de découpage (3) et le monocristal (2) en vue de fixer ce dernier sur le support de découpage, dans ladite orientation prédéterminee.Device according to claim 8, characterized in that it comprises third means (14) for effecting a relative translational movement between the single crystal (2) and the cutting support (3) intended to bring the cutting support (3 ) and the single crystal (2) in order to fix the latter on the cutting support, in said predetermined orientation. Dispositif selon la revendication 9, caractérisé par le fait que les premiers moyens comprennent deux supports cylindriques parallèles (8) montés de façon tournant sur un châssis (5) du dispositif de positionnement (1) et agencés de façon à supporter le monocristal (2), et un premier organe de mesure angulaire (10) susceptible de déterminer le premier angle de rotation prédéterminé (d), par le fait que les seconds moyens comprennent un plateau rotatif (12) monté de façon tournante par rapport audit châssis (5) et dont le plan principal est parallèle aux axes desdits supports cylindriques (8), ce plateau rotatif (12) étant agencé de façon à maintenir le support de découpage (3) dans une position géométriquement définie, un second organe de mesure angulaire étant prévu pour déterminer ledit second angle de rotation prédéterminé (g), par le fait que les troisièmes moyens comprennent un mécanisme de translation (14) permettant le rapprochement du support de découpage (3) et du monocristal (2) et par le fait que le support de découpage (3) est conformé de façon que son positionnement dans la machine de découpage s'effectue selon une position géométrique correspondant à la position géométrique définie sur ledit plateau rotatif de façon que le plan de référence et la direction de référence correspondent au plan de travail (x''',y''') et à la normale (x''') au plan de découpage de la machine.Device according to claim 9, characterized in that the first means comprise two parallel cylindrical supports (8) rotatably mounted on a frame (5) of the positioning device (1) and arranged to support the single crystal (2) , and a first angular measurement member (10) capable of determining the first predetermined angle of rotation (d), by the fact that the second means comprise a rotary plate (12) mounted so as to rotate relative to said chassis (5) and the main plane of which is parallel to the axes of said cylindrical supports (8), this rotary plate (12) being arranged so as to maintain the cutting support (3) in a geometrically defined position, a second measuring member being provided to determine said second predetermined angle of rotation (g), by the fact that the third means comprise a translation mechanism (14) allowing the cutting support (3) and the single crystal (2) to be brought together and thereby that the cutting support (3) is shaped so that its positioning in the cutting machine takes place in a geometric position corresponding to the geometric position defined on said rotary table so that the reference plane and the reference direction correspond at the work plan (x ''',y''') and at normal (x ''') at the cutting plane of the machine. Dispositif selon l'une des revendications 7 à 10, caractérisé en ce que le support de découpage (3) ou le dispositif de positionnement (1) sont agencés de façon à pouvoir être montés sur un générateur de rayons X.Device according to one of Claims 7 to 10, characterized in that the cutting support (3) or the positioning device (1) are arranged so that they can be mounted on an X-ray generator.
EP96105699A 1995-04-22 1996-04-11 Method for orienting monocrystals for cutting in a cutting machine and device for performing the method Expired - Lifetime EP0738572B1 (en)

Applications Claiming Priority (6)

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CH113695 1995-04-22
CH113695A CH690423A5 (en) 1995-04-22 1995-04-22 Monocrystal positioning procedure for cutting, e.g. for optical applications or semi-conductors
CH113595A CH690422A5 (en) 1995-04-22 1995-04-22 Monocrystal positioning procedure for cutting, e.g. for optical applications or semi-conductors
CH113595 1995-04-22
CH1136/95 1995-04-22
CH1135/95 1995-04-22

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US5875769A (en) * 1996-03-29 1999-03-02 Shin-Etsu Handotai Co., Ltd. Method of slicing semiconductor single crystal ingot
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EP0802029A3 (en) * 1996-04-16 2000-06-28 HCT Shaping Systems SA Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method
CN102581976A (en) * 2012-03-14 2012-07-18 浙江昀丰新能源科技有限公司 Crystal processing orientation device
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CN112760617B (en) * 2020-12-30 2023-04-07 上海埃延半导体有限公司 Non-metal reaction chamber for chemical vapor deposition and use method thereof

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US5720271A (en) 1998-02-24
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DE69631353T2 (en) 2004-12-09
DE69631353D1 (en) 2004-02-26

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