EP0375179A3 - Copper plating process for difficult to plate metals - Google Patents

Copper plating process for difficult to plate metals Download PDF

Info

Publication number
EP0375179A3
EP0375179A3 EP19890312444 EP89312444A EP0375179A3 EP 0375179 A3 EP0375179 A3 EP 0375179A3 EP 19890312444 EP19890312444 EP 19890312444 EP 89312444 A EP89312444 A EP 89312444A EP 0375179 A3 EP0375179 A3 EP 0375179A3
Authority
EP
European Patent Office
Prior art keywords
copper plating
difficult
plating process
plate metals
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890312444
Other languages
German (de)
French (fr)
Other versions
EP0375179B1 (en
EP0375179A2 (en
Inventor
Issa Said Mahmoud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0375179A2 publication Critical patent/EP0375179A2/en
Publication of EP0375179A3 publication Critical patent/EP0375179A3/en
Application granted granted Critical
Publication of EP0375179B1 publication Critical patent/EP0375179B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel

Abstract

An acid copper plating bath and process for using with electropositive metals such as aluminium and tungsten is described, wherein the bath contains sulphuric acid, copper sulphate, in solution with levelling, wetting and brightening agents.
EP19890312444 1988-12-21 1989-11-29 Copper plating process for difficult to plate metals Expired - Lifetime EP0375179B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28999388A 1988-12-21 1988-12-21
US289993 1988-12-21

Publications (3)

Publication Number Publication Date
EP0375179A2 EP0375179A2 (en) 1990-06-27
EP0375179A3 true EP0375179A3 (en) 1991-01-30
EP0375179B1 EP0375179B1 (en) 1994-05-25

Family

ID=23114070

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890312444 Expired - Lifetime EP0375179B1 (en) 1988-12-21 1989-11-29 Copper plating process for difficult to plate metals

Country Status (3)

Country Link
EP (1) EP0375179B1 (en)
JP (1) JPH02232390A (en)
DE (1) DE68915519T2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818294A1 (en) * 2000-12-15 2002-06-21 Thomson Csf Electrolyte incorporating a basic inhibiting agent with a amine function for depositing anti-corrosion coatings of copper and its alloys on aluminium and its alloys
JP2010150622A (en) * 2008-12-26 2010-07-08 Hitachi Ltd Plating liquid, conductive body substrate having projecting metallic structure and method of manufacturing the same
CN103668355B (en) * 2013-12-06 2016-05-11 南京三乐电子信息产业集团有限公司 The copper electroplating method on a kind of travelling-wave tubes tungsten helix surface
FR3053352A1 (en) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas ANTI-CORROSION PROTECTIVE COMPOSITION
DE102016113641A1 (en) 2016-07-25 2018-01-25 Christian-Albrechts-Universität Zu Kiel Aluminum-copper connector having a heterostructure and method of making the heterostructure
CN107447239B (en) * 2017-08-21 2018-08-28 安徽省含山县兴建铸造厂 A kind of preparation method of corrosion-resistant damper

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU901363A1 (en) * 1980-06-10 1982-01-30 Предприятие П/Я А-7155 Electrolyte for electrolytic precipitating of copper electrolyte for for electrolytic deposition of copper

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 96, no. 24, 14th June 1982, page 531, abstract no. 207474k, Columbus, Ohio, US; & SU-A-901 363 (V.M. GOLIKOV et al.) 30-01-1982 *
METALOBERFLÄCHE, vol. 33, no. 1, 1979, pages 9-16; M.F.M. EL GHANDOUR et al.: "Einfluss von Harnstoff und anderen Zusätzen, sowie der Herstellungsbedingungen auf die elektrolytische Abscheidung von Kupfer aus Kupfersulfatbädern" *

Also Published As

Publication number Publication date
EP0375179B1 (en) 1994-05-25
JPH02232390A (en) 1990-09-14
JPH0317913B2 (en) 1991-03-11
EP0375179A2 (en) 1990-06-27
DE68915519T2 (en) 1994-12-01
DE68915519D1 (en) 1994-06-30

Similar Documents

Publication Publication Date Title
EP0177686A3 (en) Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby
DE3471697D1 (en) An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath
EP0184756A3 (en) Electrolyte for the electrochemical treatment of metal plates, and process for the manufacture of anodised metal plates, especially for the application as printing plate supports
DE3563076D1 (en) Process for the electrochemical roughening of aluminium printing plate supports in an aqueous mixed electrolyte
FR2604431B1 (en) PROCESS FOR THE PREPARATION OF THE SURFACE OF A CERAMIC SOLID ELECTROLYTE CONDUCTING IONS OF ALKALINE METALS, FOR WETTING BY SAID ALKALINE METAL IN THE MOLTEN STATE
NO171225C (en) Cathode for use in electrolytic refining or electroplating of copper
EP0375179A3 (en) Copper plating process for difficult to plate metals
MX173880B (en) METALLOTHERMAL REDUCTION OF RARE EARTH OXIDES WITH CALCIUM METAL
DE3376124D1 (en) Aqueous electroplating solutions and process for electrolytically plating palladium-silver alloys
JPS53102840A (en) Preliminarily treating method for diffusion welding of stainless steel, aluminum or aluminum alloy
EP0323520A4 (en) Process for electroplating metal plate with aluminum.
ES8307930A1 (en) Process and composition for the electrodeposition of tin and tin alloys
ES481474A1 (en) Electroplating tin or tin alloy
GB2104549B (en) Cathode for use in the electrolytic refining of copper
LU87746A1 (en) A method, bath and cell for the electrodeposition of tin-bismuth alloys
ES8306807A1 (en) Bath and process for the electrodeposition of ruthenium
JPS5726190A (en) Strong acid bath for electroplating gold alloy with low platinum metal content
JPS57145969A (en) Chemical plating method
JPS5719129A (en) Preparation of mold for continuous casting
JPS53131235A (en) Manufacture of one-side plated strip steel sheet
DE3560490D1 (en) Process for the electrochemical roughening of aluminium printing plate supports in an aqueous mixed electrolyte
Tomaszewski et al. New Alkaline Copper Process: a Novel Alternative to Cyanide Copper
GB1167138A (en) Method for Preventing Growth of Metallic Whiskers.
Zhukauskaite Electrocatalysis by a Brightening Agent During the Electro-Deposition of Copper
JPS5662986A (en) Base metal applied with aluminum alloy plating and its production

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

17P Request for examination filed

Effective date: 19901025

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 19920226

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REF Corresponds to:

Ref document number: 68915519

Country of ref document: DE

Date of ref document: 19940630

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19951107

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19951123

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19961028

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Effective date: 19970731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Effective date: 19970801

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971129

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19971129