EP0208315B1 - Method for simultaneously machining both sides of disc-shaped work pieces, especially semiconductor wafers - Google Patents

Method for simultaneously machining both sides of disc-shaped work pieces, especially semiconductor wafers Download PDF

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Publication number
EP0208315B1
EP0208315B1 EP86109420A EP86109420A EP0208315B1 EP 0208315 B1 EP0208315 B1 EP 0208315B1 EP 86109420 A EP86109420 A EP 86109420A EP 86109420 A EP86109420 A EP 86109420A EP 0208315 B1 EP0208315 B1 EP 0208315B1
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EP
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Prior art keywords
openings
workpiece
plastic
disc
carrier
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EP86109420A
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German (de)
French (fr)
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EP0208315A1 (en
Inventor
Gerhard Dr. Dipl.-Ing. Brehm (Tu)
Ingo Haller
Otto Dipl.-Ing. Rothenaicher (Fh)
Karl-Heinz Ing. Grad. Langsdorf
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Siltronic AG
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Wacker Siltronic AG
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Definitions

  • the invention relates to a method for two-sided abrasive machining of disc-shaped workpieces, in particular semiconductor wafers, in which the workpieces, v .. 'I's is loaded than the workpiece having carrier disk in the openings staggered by engaging at its outer periphery drive unit in rotation, lesser thickness , with the addition of an abrasive suspension, are subjected to a circular movement between flat structures moving over their top and bottom sides.
  • Carrier washers are used, which are either entirely made of metal, e.g. Sheet steel, are made or consist entirely of plastic.
  • the metal carrier disks are characterized by long service lives, but cause damage to the edge of the wafer, such as edge chipping, in the course of the machining process, in particular in the case of the semiconductor wafers, which are often brittle and sensitive to mechanical loads, so that a large part of the machined disks can no longer be used. Such problems do not occur with the carrier disks made of plastic. However, the service life is short, since in particular the outer circumference of the carrier disks can withstand the mechanical loads caused by the drive unit, e.g. a planetary gear that cannot withstand long.
  • carrier disks made of hard material are described, in the at least one opening of which workpiece holders made of softer material are inserted, which in turn have an opening for receiving the workpieces.
  • the workpiece holders are free in the openings.
  • the object of the invention was to provide a further method which permits treatment on both sides, such as lapping or polishing of disk-shaped workpieces, with little mechanical stress on the workpiece edge and at the same time a long service life of the carrier disks used.
  • carrier disks which consist of a base plate provided with circular to polygonal openings with plastic surface structures fixed in these openings and which have openings for receiving the workpiece or workpieces to be machined at least the outer circumference of the carrier disks is made of a material with a tensile strength of at least 100 N / mm 2 , while in the area that comes into contact with the outer circumference of the workpiece, a plastic with a modulus of elasticity of 1.0 to 8x104 N / mm 2 is provided.
  • This process can be carried out in the customary machines, for example for polishing or lapping disk-shaped workpieces on both sides, under the conditions familiar to the person skilled in the art. It is particularly suitable for the machining of disks made of crystalline material such as semiconductor wafers made of e.g. silicon, germanium, gallium arsenide, gallium phosphide, indium phosphide or wafers made of oxidic material such as e.g. Gallium gadolinium garnet. In addition, it can also be used for the machining of disc-shaped workpieces made of other brittle materials such as Glass can be applied.
  • crystalline material such as semiconductor wafers made of e.g. silicon, germanium, gallium arsenide, gallium phosphide, indium phosphide or wafers made of oxidic material such as e.g. Gallium gadolinium garnet.
  • oxidic material such as e.g. Gallium gadolinium garnet.
  • Suitable materials are those which have sufficient mechanical stability in relation to the mechanical stresses caused by the drive, especially tensile and compressive loads.
  • Suitable materials such as metals such as aluminum or in particular various steels, generally have a tensile strength of at least 100 N / mm 2 , preferably at least 1000 N / mm 2.
  • care must be taken to ensure that the material selected is erosive from the one used acting suspension, that is, as a rule, attacked as little as possible by the polishing or lapping agent in order to increase the service life of the carrier disks and to largely exclude contamination of the workpieces to be machined.
  • the use of plastics with sufficient tensile strength for example some types of bakelite or fiber-reinforced materials, is not excluded.
  • plastics that come into contact with the outer circumference of the workpiece materials can be used which, due to their elasticity, ensure a low mechanical load on the workpiece circumference and, due to their mechanical stability, at the same time ensure secure storage of the workpiece during the machining process.
  • plastics with a modulus of elasticity of 1.0 to 8.10 4 N / mm2 are therefore suitable, in particular materials based on polyvinyl chloride, polypropylene, polyethylene or polytetrafluoroethylene.
  • influences on the mechanical stability resulting from the geometry of the area of the carrier disk consisting of plastic are also to be taken into account.
  • Carrier disks suitable for carrying out the method according to the invention which typically have a thickness of approximately 150-850 11 m, for example for the machining of semiconductor wafers depending on the thickness of the workpiece, can be designed in various ways. Both the metal and the plastic parts of these carrier disks can be inexpensively punched out in the desired shape Produce metal, preferably steel sheets and plastic, preferably polyvinyl chloride films of the appropriate thickness.
  • a possible embodiment which can advantageously also be used for lapping on both sides, consists of a base plate provided with circular to polygonal openings with plastic surface structures fixed in these openings, which are provided with openings for receiving the workpiece or workpieces to be machined.
  • the fixation can be achieved, for example, by gluing the plastic parts punched out to fit the metal base plate.
  • Another possibility is to first open the openings of the base plate e.g. after the injection molding process with a plastic film, preferably made of polypropylene, and then punch the desired opening out of this film. If necessary, the fixation can be further improved by recesses, for example groove-shaped or serrated, machined into the openings in the base plate.
  • these openings can also have a polygonal, for example prismatic, square or hexagonal cross section.
  • the principle applies that it is advisable to leave a margin for the inserted workpiece. In general it has e.g. Proven for round workpieces if they are surrounded by a gap of 0.1-2 mm width in the rest position.
  • carrier disks described here by way of example can be used without problems in conventional machines for double-sided polishing or lapping, the usual conditions familiar to the person skilled in the art, e.g. as far as the abrasive suspension used, temperature, processing pressure and the like are concerned, can be maintained or adjusted. If necessary, the carrier disks must be subjected to a comparative treatment, for example by lapping, before the first use in order to compensate for any differences in thickness between metal and plastic components. However, thickness differences of up to ⁇ 5% of the total thickness can usually be tolerated.
  • lapping and / or polishing on both sides, in particular of semiconductor wafers significantly reduces losses on wafers damaged in the edge region and thereby achieve service lives for carrier wafers which correspond to those of all-metal carrier wafers.
  • a commercially available apparatus for double-sided polishing of semiconductor wafers was loaded with 27 silicon wafers (diameter 76.2 mm, wafer thickness 450 pm), 3 wafers each in the openings of one of a total of 9 externally toothed carrier disks made of sheet steel and driven by planetary gears (thickness 380 ⁇ m, tensile strength 2000 N / mm 2 ) were inserted.
  • polishing agent a commercially available SiO 2 sol was supplied as the polishing agent and a temperature of approximately 40 ° C. was maintained; the polishing pressure was 0.5 bar (based on cm 2 disc area).
  • the disks were removed and examined microscopically in the edge region at a magnification of 40 to 100 times. All of the windows were clearly damaged and could no longer be used.
  • Carrier disks were used in the manner according to the invention, which were made of sheet steel (thickness 380 .mu.m, tensile strength 2000 N / mm 2 ) and had round, punched-out openings (inside diameter approx. 85 mm). These openings had been cast using the injection molding process with a polypolylene film (thickness approx. 380 ⁇ m, modulus of elasticity approx. 1.2. 10 3 N / mm 2 ), from which a circular opening with a diameter of approx. 77 mm had then been punched out. The fixation was improved in that the film was additionally interlocked with the carrier disk over 12 tooth-shaped recesses evenly distributed over the inner circumference of its openings.
  • the disks were also removed and examined under the microscope in the edge region. At 40- to 100-fold magnification, no damage was found, so that all the panes could be used again.

Description

Die Erfindung betrifft ein Verfahren zum beidseitigen abtragenden Bearbeiten von scheibenförmigen Werkstücken, insbesondere Halbleiterscheiben, bei welchem die Werkstücke, v..'Iche in die Öffnungen einer durch eine an ihrem Außenumfang angreifende Antriebseinheit in Drehung versetzten, geringere Dicke als das Werkstück aufweisenden Trägerscheibe eingelegt sind, unter Zusatz einer abtragend wirkenden Suspension einer kreisenden Bewegung zwischen über ihre Ober- und Unterseite bewegten Flächengebilden unterworfen werden.The invention relates to a method for two-sided abrasive machining of disc-shaped workpieces, in particular semiconductor wafers, in which the workpieces, v .. 'I's is loaded than the workpiece having carrier disk in the openings staggered by engaging at its outer periphery drive unit in rotation, lesser thickness , with the addition of an abrasive suspension, are subjected to a circular movement between flat structures moving over their top and bottom sides.

Ein solches Verfahren, welches beispielsweise beim beidseitigen Polieren oder Läppen von Halbleiterscheiben eingesetzt werden kann, ist z.B. in der US-PS 36 91 694 oder in einem im IBM Technical Disclosure Bulletin, Vol. 15, No. 6, November 1972, Seite 1760-1761 veröffentlichten Artikel (Verfasser: F. E. Goetz und J. R. Hause) beschrieben. Dabei kommen Trägerscheiben zum Einsatz, die entweder ganz aus Metall, z.B. Stahlblech, gefertigt sind oder aber ganz aus Kunststoff bestehen.Such a method, which can be used, for example, when polishing or lapping semiconductor wafers on both sides, is e.g. in US-PS 36 91 694 or in one in the IBM Technical Disclosure Bulletin, Vol. 15, No. 6, November 1972, pages 1760-1761 published articles (author: F. E. Goetz and J. R. Hause). Carrier washers are used, which are either entirely made of metal, e.g. Sheet steel, are made or consist entirely of plastic.

Die Trägerscheiben aus Metall zeichnen sich zwar durch lange Standzeiten aus, verursachen aber im Verlauf des Bearbeitungsvorganges insbesondere bei den vielfach spröden und gegenüber mechanischen Belastungen empfindlichen Halbleiterscheiben Beschädigungen am Scheibenrand wie etwa Randausbrüche, so daß ein großer Teil der bearbeiteten Scheiben nicht mehr weiterverwendet werden kann. Solche Probleme treten bei den aus Kunststoff gefertigten Trägerscheiben nicht auf. Dafür sind aber die Standzeiten gering, da insbesondere der Außenumfang der Trägerscheiben den mechanischen Belastungen durch die Antriebseinheit, z.B. ein Planetengetriebe, nicht lange standzuhalten vermag.The metal carrier disks are characterized by long service lives, but cause damage to the edge of the wafer, such as edge chipping, in the course of the machining process, in particular in the case of the semiconductor wafers, which are often brittle and sensitive to mechanical loads, so that a large part of the machined disks can no longer be used. Such problems do not occur with the carrier disks made of plastic. However, the service life is short, since in particular the outer circumference of the carrier disks can withstand the mechanical loads caused by the drive unit, e.g. a planetary gear that cannot withstand long.

In der älteren EP-A-197 214 sind Trägerscheiben aus hartem Material beschrieben, in deren zumindest eine Öffnung Werkstückhalter aus demgegenüber weicherem Material eingelegt werden, welche ihrerseits eine Öffnung zur Aufnahme der Werkstücke besitzen. Die Werkstückhalter liegen dabei frei in den Öffnungen.In the older EP-A-197 214 carrier disks made of hard material are described, in the at least one opening of which workpiece holders made of softer material are inserted, which in turn have an opening for receiving the workpieces. The workpiece holders are free in the openings.

Aufgabe der Erfindung war es, ein weiteres Verfahren anzugeben, welches eine beidseitig abtragende Behandlung wie Läppen oder Polieren von scheibenförmigen Werkstücken unter geringer mechanischer Beanspruchung des Werkstückrandes bei gleichzeitiger hoher Standzeit der eingesetzten Trägerscheiben gestattet.The object of the invention was to provide a further method which permits treatment on both sides, such as lapping or polishing of disk-shaped workpieces, with little mechanical stress on the workpiece edge and at the same time a long service life of the carrier disks used.

Gelöst wird die Aufgabe durch ein Verfahren, welches dadurch gekennzeichnet ist, daß Trägerscheiben eingesetzt werden, welche aus einer mit kreisförmigen bis polygonalen Öffnungen versehenen Grundplatte mit in diesen Öffnungen fixierten Flächengebilden aus Kunststoff bestehen, welche mit Öffnungen zurAufnahme des oder der abtragend zu bearbeitenden Werkstücke versehen sind, wobei zmindest der Außenumfang der Trägerscheiben aus einem Werkstoff mit einer Zugfestigkeit von mindestens 100 N/mm2 gefertigt ist, während im mit dem Außenumfang des Werkstückes in Kontakt kommenden Bereich ein Kunststoff mit einem Elastizitätsmodul von 1,0 bis 8x104 N/mm2 vorgesehen ist.The object is achieved by a method which is characterized in that carrier disks are used which consist of a base plate provided with circular to polygonal openings with plastic surface structures fixed in these openings and which have openings for receiving the workpiece or workpieces to be machined at least the outer circumference of the carrier disks is made of a material with a tensile strength of at least 100 N / mm 2 , while in the area that comes into contact with the outer circumference of the workpiece, a plastic with a modulus of elasticity of 1.0 to 8x104 N / mm 2 is provided.

Dieses Verfahren kann in den üblichen, beispielsweise zum beidseitigen Polieren oder Läppen von scheibenförmigen Werkstücken gebraüchlichen Maschinen unter den dem Fachmann geläufigen Bedingungen durchgeführt werden. Es eignet sich insbesondere für das abtragende Bearbeiten von Scheiben aus kristallinem Material wie Halbleiterscheiben aus beispielsweise Silizium, Germanium, Galliumarsenid, Galliumphosphid, Indiumphosphid oder Scheiben aus oxydischem Material wie z.B. Gallium-Gadolinium-Granat. Daneben kann es auch für das abtragende Bearbeiten von scheibenförmigen Werkstücken aus anderen spröden Werkstoffen wie z.B. Glas angewendet werden.This process can be carried out in the customary machines, for example for polishing or lapping disk-shaped workpieces on both sides, under the conditions familiar to the person skilled in the art. It is particularly suitable for the machining of disks made of crystalline material such as semiconductor wafers made of e.g. silicon, germanium, gallium arsenide, gallium phosphide, indium phosphide or wafers made of oxidic material such as e.g. Gallium gadolinium garnet. In addition, it can also be used for the machining of disc-shaped workpieces made of other brittle materials such as Glass can be applied.

Geeignete Werkstoffe sind dabei solche, die eine gegenüber den durch den Antrieb verursachten mechanischen Beanspruchungen, vor allem Zug- und Druckbelastungen, ausreichende mechanische Stabilität aufweisen. Geeignete Materialien, wie z.B. Metalle wie Aluminium oder insbesondere verschiedene Stähle, besitzen allgemein eine Zugfestigkeit von mindestens 100 N/ mm2, vorzugsweise mindestens 1000 N/mm2. In diesem Zusammenhang ist darauf zu achten, daß der gewählte Werkstoff von der jeweils eingesetzten abtragend wirkenden Suspension, d.h. in der Regel von dem Polier- oder Läppmittel, möglichst wenig angegriffen wird, um die Lebensdauer der Trägerscheiben zu erhöhen und eine Kontamination der zu bearbeitenden Werkstücke weitestgehend auszuschließen. Grundsätzlich ist auch die Verwendung von Kunststoffen ausreichender Zugfestigkeit, also z.B. mancher Bakelitarten oder faserverstärkter Materialien, nicht ausgeschlossen.Suitable materials are those which have sufficient mechanical stability in relation to the mechanical stresses caused by the drive, especially tensile and compressive loads. Suitable materials, such as metals such as aluminum or in particular various steels, generally have a tensile strength of at least 100 N / mm 2 , preferably at least 1000 N / mm 2. In this connection, care must be taken to ensure that the material selected is erosive from the one used acting suspension, that is, as a rule, attacked as little as possible by the polishing or lapping agent in order to increase the service life of the carrier disks and to largely exclude contamination of the workpieces to be machined. In principle, the use of plastics with sufficient tensile strength, for example some types of bakelite or fiber-reinforced materials, is not excluded.

Als Kunststoffe, die mit dem Außenumfang des Werkstückes in Kontakt kommen, können solche Materialien eingesetzt werden, die durch ihre Elastizität eine geringe mechanische Belastung des Werkstückumfanges und durch ihre mechanische Stabilität zugleich während des Bearbeitungsvorganges eine sichere Lagerung des Werkstückes gewährleisten. Grundsätzlich geeignet sind daher Kunststoffe mit einem Elastizitätsmodul von 1,0 bis 8.104 N/mm2, also insbesondere Materialien auf Polyvinylchlorid-, Polypropylen-, Polyethylen- oder Polytetrafluorethylenbasis. Dabei sind jedoch auch gegebenenfalls aus der Geometrie des aus Kunststoff bestehenden Bereiches der Trägerscheibe resultierende Einflüsse auf die mechanische Stabilität zu berücksichtigen.As plastics that come into contact with the outer circumference of the workpiece, materials can be used which, due to their elasticity, ensure a low mechanical load on the workpiece circumference and, due to their mechanical stability, at the same time ensure secure storage of the workpiece during the machining process. Basically, plastics with a modulus of elasticity of 1.0 to 8.10 4 N / mm2 are therefore suitable, in particular materials based on polyvinyl chloride, polypropylene, polyethylene or polytetrafluoroethylene. However, influences on the mechanical stability resulting from the geometry of the area of the carrier disk consisting of plastic are also to be taken into account.

Zur Durchführung des erfindungsgemäßen Verfahrens geeignete Trägerscheiben, welche beispielsweise für das abtragende Bearbeiten von Halbleiterscheiben je nach Dicke des Werkstückes typisch eine Dicke von etwa 150-850 11m aufweisen, können in verschiedener Weise gestaltet sein. Sowohl die Metall-, als auch die Kunststoffteile dieser Trägerscheiben lassen sich günstig in der gewünschten Form durch Stanzen aus Metall-, bevorzugt Stahlblechen und Kunststoff-, bevorzugt Polyvinylchloridfolien entsprechender Dicke herstellen.Carrier disks suitable for carrying out the method according to the invention, which typically have a thickness of approximately 150-850 11 m, for example for the machining of semiconductor wafers depending on the thickness of the workpiece, can be designed in various ways. Both the metal and the plastic parts of these carrier disks can be inexpensively punched out in the desired shape Produce metal, preferably steel sheets and plastic, preferably polyvinyl chloride films of the appropriate thickness.

Eine mögliche Ausführungsform, welche mit Vorteil auch beim beidseitigen Läppen eingesetzt werden kann, besteht aus einer mit kreisförmigen bis polygonalen Öffnungen versehenen Grundplatte mit in diesen Öffnungen fixierten Flächengebilden aus Kunststoff, welche mit Öffnungen zur Aufnahme des oder der abtragend zu bearbeitenden Werkstücke versehen sind. Die Fixierung kann dabei beispielsweise dadurch erreicht werden, daß die paßgerecht ausgestanzten Kunststoffteile mit der metallenen Grundplatte verklebt werden. Eine andere Möglichkeit besteht darin, die Öffnungen der Grundplatte zunächst z.B. nach dem Spritzgußverfahren mit einer Kunststoffolie, bevorzugt aus Polypropylen, auszugießen und aus dieser Folie dann die gewünschte Öffnung auszustanzen. Gegebenenfalls kann die Fixierung durch in die Öffnungen der Grundplatte eingearbeitete, beispielsweise nut- oder zackenförmige Ausnehmungen weiterverbessert werden. Desweiteren können diese Öffnungen auch polygonalen beispielsweise prismatischen, quadrätischen oder hexagonalen Querschnitt aufweisen. Für die Maße der in den Kunststoff eingearbeiteten Öffnungen gilt der Grundsatz, daß zweckmäßig ein Spielraum für das eingelegte Werkstück belassen wird. Allgemein hat es sich z.B. bei runden Werkstücken bewährt, wenn diese in Ruhelage von einem Spalt von 0,1-2 mm Breite umgeben sind.A possible embodiment, which can advantageously also be used for lapping on both sides, consists of a base plate provided with circular to polygonal openings with plastic surface structures fixed in these openings, which are provided with openings for receiving the workpiece or workpieces to be machined. The fixation can be achieved, for example, by gluing the plastic parts punched out to fit the metal base plate. Another possibility is to first open the openings of the base plate e.g. after the injection molding process with a plastic film, preferably made of polypropylene, and then punch the desired opening out of this film. If necessary, the fixation can be further improved by recesses, for example groove-shaped or serrated, machined into the openings in the base plate. Furthermore, these openings can also have a polygonal, for example prismatic, square or hexagonal cross section. For the dimensions of the openings worked into the plastic, the principle applies that it is advisable to leave a margin for the inserted workpiece. In general it has e.g. Proven for round workpieces if they are surrounded by a gap of 0.1-2 mm width in the rest position.

Die hier beispielhaft beschriebene mögliche Ausführungsform von Trägerscheiben läßt sich problemlos in den gebraüchlichen Maschinen zum beidseitigen Polieren oder Läppen einsetzen, wobei für den eigentlichen Bearbeitungsvorgang die üblichen, dem Fachmann geläufigen Bedingungen, z.B. was die eingesetzte abtragende Suspension, Temperatur, Bearbeitungsdruck und dergleichen betrifft, beibehalten oder angepaßt werden können. Gegebenenfalls sind vor dem ersten Einsatz die Trägerscheiben einer vergleichmäßigenden Behandlung, beispielsweise durch Läppen, zu unterziehen, um etwaige Dickeunterschiede zwischen Metall- und Kunststoffbestandteilen auszugleichen. Zumeist können jedoch Dikkeunterschiede bis zu ±5% der Gesamtdicke toleriert werden.The possible embodiment of carrier disks described here by way of example can be used without problems in conventional machines for double-sided polishing or lapping, the usual conditions familiar to the person skilled in the art, e.g. as far as the abrasive suspension used, temperature, processing pressure and the like are concerned, can be maintained or adjusted. If necessary, the carrier disks must be subjected to a comparative treatment, for example by lapping, before the first use in order to compensate for any differences in thickness between metal and plastic components. However, thickness differences of up to ± 5% of the total thickness can usually be tolerated.

Mit Hilfe des erfindungsgemäßen Verfahrens gelingt es beim beidseitigen Läppen und/oder Polieren, insbesondere von Halbleiterscheiben, Verluste an im Randbereich beschädigten Scheiben deutlich verringern und dabei Standzeiten für Trägerscheiben zu erreichen, die denen von Ganzmetallträgerscheiben entsprechen.With the aid of the method according to the invention, lapping and / or polishing on both sides, in particular of semiconductor wafers, significantly reduces losses on wafers damaged in the edge region and thereby achieve service lives for carrier wafers which correspond to those of all-metal carrier wafers.

Beispiel AExample A

Eine handelsübliche Apparatur zum beidseitigen Polieren von Halbleiterscheiben wurde mit 27 Siliciumscheiben (Durchmesser 76,2 mm, Scheibendicke 450 pm) beladen, wobei jeweils 3 Scheiben in die Öffnungen je einer von insgesamt 9 aufgelegten, außenverzahnten, und mittels Planetengetriebe angetriebenen Trägerscheiben aus Stahlblech (Dicke 380 um, Zugfestigkeit 2000 N/ mm2) eingelegt wurden.A commercially available apparatus for double-sided polishing of semiconductor wafers was loaded with 27 silicon wafers (diameter 76.2 mm, wafer thickness 450 pm), 3 wafers each in the openings of one of a total of 9 externally toothed carrier disks made of sheet steel and driven by planetary gears (thickness 380 µm, tensile strength 2000 N / mm 2 ) were inserted.

Während des 30-minütigen Poliervorganges wurde als Poliermittel ein handelsübliches Si02 -Sol zugeführt und eine Temperatur von ca. 40°C eingehalten; der Polierdruck betrug 0,5 bar (bezogen auf cm2 Scheibenfläche). Die beiden mit Poliertüchern aus Polyesterfilz belegten Polierplatten rotierten gegensinnig mit je 50 UPM; die Drehzahl der Trägerscheiben betrug 20 UPM.During the 30-minute polishing process, a commercially available SiO 2 sol was supplied as the polishing agent and a temperature of approximately 40 ° C. was maintained; the polishing pressure was 0.5 bar (based on cm 2 disc area). The two polishing plates covered with polishing cloths made of polyester felt rotated in opposite directions with 50 RPM each; the speed of the carrier disks was 20 rpm.

Nach Beendigung des Polierens wurden die Scheiben entnommen und im Randbereich mikroskopisch bei 40- bis 100-facher Vergrößerung untersucht. Sämtliche Scheiben wiesen deutliche Beschädigungen auf und konnten nicht mehr weiter verwendet werden.After the polishing was finished, the disks were removed and examined microscopically in the edge region at a magnification of 40 to 100 times. All of the windows were clearly damaged and could no longer be used.

Nach 50 Polierfahrten wurde die Trägerscheibe wegen des Verschleißes der Außenverzahnung ausgewechselt.After 50 polishing runs, the carrier washer was replaced due to wear on the external teeth.

Beispiel BExample B

In derselben Apparatur wurden erneut 27 Siliciumscheiben derselben Spezifikation poliert. Dabei wurden in der erfindungsgemäßen Weise Trägerscheiben eingesetzt, die aus Stahlblech (Dicke 380 um, Zugfestigkeit 2000 N/mm2) gefertigt waren, und die runde, ausgestanzte Öffnungen (Innendurchmesser ca. 85 mm) aufwiesen. Diese Öffnungen waren nach dem Spritzgußverfahren mit einer Polypolylenfolie (Dicke ca. 380 pm, Elastizitätsmodul ca. 1.2 . 103 N/mm2) ausgegossen worden aus der dann eine kreisrunde Öffnung mit ca. 77 mm Durchmesser ausgestanzt worden war. Die Fixierung wurde dadurch verbessert, daß die Folie mit der Trägerscheibe über 12 gleichmäßig über den Innenumfang von deren Öffnungen verteilte zackenförmige Ausnehmungen zusätzlich verzahnt war.27 silicon wafers of the same specification were polished again in the same apparatus. Carrier disks were used in the manner according to the invention, which were made of sheet steel (thickness 380 .mu.m, tensile strength 2000 N / mm 2 ) and had round, punched-out openings (inside diameter approx. 85 mm). These openings had been cast using the injection molding process with a polypolylene film (thickness approx. 380 μm, modulus of elasticity approx. 1.2. 10 3 N / mm 2 ), from which a circular opening with a diameter of approx. 77 mm had then been punched out. The fixation was improved in that the film was additionally interlocked with the carrier disk over 12 tooth-shaped recesses evenly distributed over the inner circumference of its openings.

Nach dem unter ansonsten genau gleichen Bedingungen durchgeführten Poliervorgang wurden die Scheiben ebenfalls entnommen und unter dem Mikroskop im Randbereich untersucht. Bei 40- bis 100-facher Vergrößerung konnten keinerlei Beschädigungen festgestellt werden, so daß sich sämtliche Scheiben weiterverwenden ließen.After the polishing process, which was otherwise carried out under exactly the same conditions, the disks were also removed and examined under the microscope in the edge region. At 40- to 100-fold magnification, no damage was found, so that all the panes could be used again.

Nach 50 Polierfahrten ohne Wechsel der fixierten Folie machte der Verschleiß an der Außenverzahnung einen Wechsel der Trägerscheibe erforderlich.After 50 polishing runs without changing the fixed film, the wear on the external toothing made it necessary to change the carrier disc.

Claims (5)

1. Method for the double-sided abrasive machining of both sides of disc-shaped workpieces, especially semiconductor wafers, in which method the workpieces which are laid in the openings of a carrier disc which is caused to rotate by a drive unit acting on its outside circumference and which has a smaller thickness than the workpiece and are subjected to a rotary motion between flat bodies moved across their upper side and lower side, with an abrasively acting suspension added, characterized in that carrier discs are employed which are composed of a base plate provided with circular to polygonal openings and having plastic flat bodies fixed in said openings, which bodies are provided with openings for receiving the workpiece or workpieces to be abrasively machined, at least the outside circumference of the carrier discs being manufactured from a material having a tensile strength of at least 100 N/mm2, while a plastic having a modulus of elasticity of 1.0 to 8x 104 N/ mm2 is provided in the region which comes into contact with the outside circumference of the workpiece.
2. Method according to Claim 1, characterized in that a metal is employed as material with a tensile strength of at least 100 N/mm2.
3. Method according to Claims 1 or 2, characterized in that steel is selected as material.
4. Method according to one or more of Claims 1 to 3, characterized in that the plastic is selected from the group comprising polyvinyl chloride, polyethylene, polypropylene, polytetrafluoroethylene.
5. Carrier disc for carrying out the method according to one or more of Claims 1 to 4, characterized by a round metal base plate provided with circular to polygonal openings and also plastic flat bodies fixed in said openings and provided with openings suitable for receiving the workpiece to be abrasively machined.
EP86109420A 1985-07-12 1986-07-10 Method for simultaneously machining both sides of disc-shaped work pieces, especially semiconductor wafers Expired - Lifetime EP0208315B1 (en)

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DE3524978 1985-07-12
DE19853524978 DE3524978A1 (en) 1985-07-12 1985-07-12 METHOD FOR DOUBLE-SIDED REMOVAL MACHINING OF DISK-SHAPED WORKPIECES, IN PARTICULAR SEMICONDUCTOR DISCS

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EP0208315B1 true EP0208315B1 (en) 1990-09-26

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DE3674486D1 (en) 1990-10-31
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US4739589A (en) 1988-04-26
EP0208315A1 (en) 1987-01-14

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