EP0110921A1 - Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication - Google Patents

Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication

Info

Publication number
EP0110921A1
EP0110921A1 EP83901703A EP83901703A EP0110921A1 EP 0110921 A1 EP0110921 A1 EP 0110921A1 EP 83901703 A EP83901703 A EP 83901703A EP 83901703 A EP83901703 A EP 83901703A EP 0110921 A1 EP0110921 A1 EP 0110921A1
Authority
EP
European Patent Office
Prior art keywords
conductor track
conductor
arrangement according
dielectric
conductor tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP83901703A
Other languages
German (de)
English (en)
Inventor
Max E. Reeb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REEB Max E
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0110921A1 publication Critical patent/EP0110921A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/242Tag deactivation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/2417Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2431Tag circuit details
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • G08B13/244Tag manufacturing, e.g. continuous manufacturing processes
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • G08B13/2442Tag materials and material properties thereof, e.g. magnetic material details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H5/00One-port networks comprising only passive electrical elements as network components
    • H03H5/02One-port networks comprising only passive electrical elements as network components without voltage- or current-dependent elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Definitions

  • the invention relates to an identification arrangement in the form of a label-like structure which can be attached to an object and which at least contains an inductive element formed from planar conductor tracks and a capacitive element formed from stacked conductor track parts and a dielectric interposed therebetween, which element forms a closed element with the inductive element Forms resonance circuit, wherein the conductor tracks are arranged in at least two areas superimposed by unfolding, and a method for producing an identification arrangement.
  • Identification arrangements are already known from DE-AS 28 26861, which essentially contain an electrical parallel resonance circuit and are intended to generate characteristic signals in a high-frequency electromagnetic field, which enable their detection. Such passive identification arrangements are used as security elements and as detection sensors in goods security systems, in particular anti-theft systems.
  • label-like identification arrangements are known which are produced by etching out conductor tracks from metal foils of different thicknesses, which are applied to both sides of a flexible, electrically insulating carrier foil.
  • the etched-out conductor tracks form the inductive element, while the capacitive element is formed by pronounced conductor surfaces which are separated from one another by the insulating carrier film lying between them. Since, after the etching, the conductor track areas on both sides of the carrier film have no galvanic connection with one another, such a connection must be made in a suitable manner - 2 -
  • the known manufacturing process also has limitations in that the dielectric layer used there cannot be made arbitrarily thin because it must have a certain minimum stability as a supporting substrate during the etching process. As capacitor coverings, this requires relatively large metal surfaces, which limit the resonance quality of such structures due to eddy current losses and thereby limit any reduction in the size of such arrangements.
  • the invention is based on the idea of arranging conductor tracks by at least partially overlapping and / or crossing each other by folding together a interconnected conductor track structure or one that is separated into at least two parts such that contacting is not necessary in any case, and the required resonant circuit capacity of such a resonance structure is produced by selective insertion of dielectric layers between folded-together conductor track parts in a concentrated or distributed form. Since both the conductor tracks and the dielectric layers can be made very thin, the thickness of a finished identification arrangement is also small, without having to do without sufficient circuit inductance and circuit capacitance.
  • the object of the invention is to provide an identification arrangement and a method for its production which on the one hand enable inexpensive mass production, so that such identification arrangements are suitable for single use, and on the other hand result in sufficiently small tolerances of the resonance frequency and resonance quality and a high degree of reliability due to the lack of pinching contact through an insulating film.
  • interconnect parts forming the capacitive element overlap and are at least partially identical to the interconnects forming the inductive element.
  • the identification arrangement according to the invention is particularly for
  • Security and control systems can be used, such as goods security systems, property security systems, document security systems, access control systems, event control systems (eg parking systems), data security systems and permission control systems.
  • FIG. 1 shows a schematic illustration to explain the continuous production of label-like structures with two levels folded over one another, two label-like identification arrangements involved in the production being shown by way of example;
  • FIG. 2 shows a schematic illustration for explaining the folding process on structures shown in FIG. 1 for finished identification arrangements and a cross section through part of a conductor track structure
  • FIGS. 1 and 2 shows an equivalent circuit diagram of the finished identification arrangements shown in FIGS. 1 and 2;
  • FIG. 4 shows a schematic illustration of an embodiment of a conductor track structure for producing a label-like identification arrangement according to the invention, in which the entire resonant circuit capacitance is represented by the capacitance coating of strip lines;
  • FIG. 5 shows a schematic representation of an embodiment of a fixed conductor track structure for producing a label-like structure according to the invention with conductor tracks essentially superimposed on one another;
  • Fig. 6 is a perspective view of a portion of the tag-like structure according to Fig 5 s when the conductor track structure is cut from a dielectric-coated metal foil.
  • FIG. 7 shows a perspective view of part of the label-like structure according to FIG. 5 when the conductor track structure is cut out of a pure metal foil;
  • Fig. 8 is a perspective view of part of the label-like structure of FIG. 5 when the conductor track structure from a - 5 - dielectric-coated metal foil is etched out;
  • FIG. 9 shows a perspective view of a part of the label-like structure according to FIG. 5 when the conductor track structure is etched out of a metal foil connected to a processing carrier;
  • FIG. 10 shows a schematic illustration for explaining the positioning process of label-like structures which are produced in a row without gaps in order to dissolve the endless production path into individual label-like identification arrangements according to the invention
  • FIG. 11 shows a schematic illustration to explain the separation of individual label-like identification arrangements from the endless production line, the labels being self-adhering and being able to be rolled up with a release paper web for particularly simple processing by means of automatic roll dispensing devices;
  • FIG. 13 shows a schematic illustration of a particular embodiment of the label-like structure according to the invention according to FIG. 12, which allows the resonance frequency of the finished identification arrangement to be influenced;
  • FIG. 14 shows a schematic illustration of a further embodiment of the label-like structure according to the invention with conductor tracks arranged on a gap and running essentially rectangular;
  • FIG. 15 shows a schematic illustration of a special embodiment of the label-like structure according to the invention according to FIG. 14, which allows the resonance frequency of the completed identification arrangement to be influenced and offers increased insulation of intersecting conductor tracks without additional effort;
  • FIG. 16 shows a schematic illustration of a particular embodiment of the label-like structure according to the invention according to FIG. 14, which allows production with minimal material costs on and;
  • FIG. 17 shows a schematic illustration of a cross section through a label-like structure according to FIG. 12, which is in the process of being folded up, when the required conductor track structure is etched out of a dielectrically coated metal foil;
  • FIG. 18 shows a schematic representation of a cross section through a label-like structure according to FIG. 12, which is in the process of being folded up, if the required conductor track structure is etched out of a metal foil connected to a wrapping material suitable as a processing medium;
  • FIG. 20 shows a schematic illustration to explain the principle of a label-like structure according to the invention which is essentially circular and executable;
  • FIG. 21 shows an equivalent circuit diagram of the conductor track structure shown in FIG. 20;
  • FIG. 22 shows a schematic illustration of the production of embodiments of the invention with essentially circular conductor track structures
  • Fig. 23 is a schematic representation of a further embodiment of the invention with a plurality of substantially circular, superimposed turns of the conductor tracks and simple tuning of the resonance frequency;
  • Fig. '24 is a schematic representation of a further embodiment of the invention with a plurality of substantially circular - 7 - turns of the conductor tracks and tunability of the resonance frequency within particularly wide limits;
  • FIG. 25 shows a schematic representation of a further embodiment of the invention with a plurality of essentially circular, nested windings of the conductor tracks and tunability of the resonance frequency within particularly wide limits;
  • 26 shows a schematic representation of a further embodiment of the invention with essentially circular, superimposed turns of the conductor tracks and electrical connection through the fold line;
  • Fig. 27 is an equivalent circuit diagram of the embodiment of Fig. 26;
  • 29 shows a schematic illustration to explain the adjustment ⁇ of the resonance frequency of embodiments according to the invention with essentially circular conductor tracks by means of an electrically conductive, flat and dielectric-like strip-like matching structure, wherein: this method can also be used with essentially rectangular conductor track configurations.
  • FIGS. 15 and 16 shows a schematic illustration of a modified embodiment of the invention according to FIGS. 15 and 16;
  • FIG. 31 shows a schematic illustration of a further modified embodiment of the invention according to FIGS. 15 and 16;
  • the core of the identification arrangement according to the invention in the manner of a label is an electrical component which represents a parallel resonance circuit with a high ambient field coupling and is formed from an inductive element and a capacitive element, the latter in some preferred embodiments partly along the inductive structure in the manner of a Strip line is formed.
  • This identification arrangement can be used to equip goods labeling, security and control labels, since it can be produced particularly quickly and easily and with the least possible waste of raw material and uses raw materials that can be produced easily and inexpensively.
  • a thin metal foil 1 which can already be coated on one or both sides with a suitable dielectric covering 2, is turned into one two connected substructures 3 and 4 (hereinafter referred to as sheets and, in simple sketches also shown as closed sheets) existing flat conductor track structure 5 is produced and fixed on an adhesive or sealing layer 6 which is applied to a strip-shaped carrier material 7.
  • a high positioning accuracy of the individual sheets on top of one another is achieved in that the conductor track structure 5 fixed on the endlessly formed carrier track 7 runs along a path that is either produced without a dimension, continuously penetrating both the conductor track structure 5 and the carrier track 7, or along one inside Prescribable limits with a sufficiently small dimensional offset, perforation line 8 that only continuously penetrates the carrier track 7 is folded up in such a way that the dielectric coatings are enclosed between the conductor tracks of the folded structure.
  • This perforation is carried out so that the longitudinal rigidity of the carrier web material to support a flowing folding can be used and - if the conductor track structure is also perforated - an electrically good and reliable conductive connection is maintained through the perforation area of the conductor track structure.
  • a dielectrically effective insulating covering 9 is not necessary when folding. If, on the other hand, a pure metal foil 1 without a dielectric covering 2 is used as the starting material, a dielectric insulating foil 9 must be inserted between the two partial sheets according to FIG. 2.
  • Such an insulating film 9 must also be inserted if such a conductor track structure 5 is produced by known etching methods on a carrier 10 which, when folded, is to form the outer envelope of the label-like structure.
  • such an insulating film can be dispensed with if such a conductor track structure 5 is produced on a dielectric film 11 by known etching processes, and the structure is folded up in such a way that the dielectric film 11 is enclosed between the superimposed conductor tracks when they are folded, and thus acts as a capacitor film. .
  • a Thomsonian oscillation circuit is created with an oscillation circuit capacitance which is composed of the transformation of distributed line capacities and concentrated capacitance of the conductor track parts ' 12 against 13.
  • the structure created after the folding can be described by the equivalent circuit in FIG. 3. Corresponding parts and locations are identified there with the same reference numerals as in FIG. 1.
  • capacitor areas are best laid out so that they are elongated in the direction of the winding, since at the same time they enable the greatest possible inductance as part of the coil winding with the smallest possible field distortion and eddy current load. If there is sufficient cover area for superimposed conductor tracks, the distributed one can be constructed
  • Capacitance as a circular capacitance alone is sufficient, so that in this case special capacitor areas can also be omitted entirely in such a way that the turns in the interior of the leaf structures then end openly, as is shown in FIG. 4.
  • the starting point for the invention of the structure described was the problem that in the production of conductor tracks from a flat metallic foil either by punching out or by etching using simple and very fast-working etching processes, the spacing of the conductor tracks, i. that is, the interspaces separating them cannot be made arbitrarily narrow, but on the other hand, in the case of resonance circuits of the described embodiment which are geometrically small in size, the distances between the conductor tracks which are still manageable in terms of punching technology and also fast etching technology are still too much part of the total available claim standing outline area, whereby the metal-free interior of such an oscillating circuit structure and thereby the resonance quality and the ambient field coupling, ie Within a suitable detection system, the sensitivity or field recognizability of such a structure can be very greatly reduced.
  • a field path-favorable conductor path distance of a label measuring 40 x 40 m in outline is smaller than that which can still be realized by punching and rapid etching.
  • superimposed conductor track sections are executed piece by piece with overlap jumping from level to level, so that the gaps to be produced between the conductor tracks turn out to be larger than the clear contour distances of the so-called after the folding - witnessed superimposed trace structure.
  • the overlap of conductor track parts jumping from sheet to sheet is realized in that, for example, conductor track parts 20 and 21 of a sheet 18 overlap conductor track parts 30 and 29 of a sheet 19, ie the track sections 20 and 21 are made wider than the track sections 30 and 29.
  • track sections 28 and 31 of the sheet 19 cover track sections 22 and 23 of the sheet 18
  • conductor track parts 34 and 33 of sheet 19 cover conductor track parts 24 and 25 of sheet 18.
  • conductor track section 26 of sheet 18 covers conductor track section 32 of sheet 19 and covers the conductive track section 27 of sheet 18, which forms the capacitive surface the conductor part 35 of the sheet 19 forming the other capacitive surface.
  • the overlap of the conductor track parts in the direction perpendicular to the folding line or predetermined folding line 8 is made more pronounced than in the direction parallel to the predetermined folding line, so that positioning tolerances in the
  • FIG. 6 to 9 each show examples of parts of a fixed sheet of a structure according to FIG. 5.
  • Such a conductor track structure can be obtained by suitable stamping or etching processes.
  • a stamping method is used to obtain the conductor track structure, this can be cut out according to FIG. 6, for example, from an at least two-layer, film-like material, which consists of a highly conductive metal layer 40 - preferably of aluminum or copper - and a coating produced thereon in a suitable manner 41 with suitable dielectric properties, so that this dielectric covering the conductor tracks after
  • a structure according to FIG. 5 or analogously by etching out the conductor tracks from a dielectrically coated metal foil can be produced in a similar manner, so that after the plane conductor track structure 5 has been produced, this is done on the one hand by means of a continuous, supporting dielectric Layer 11 can be transported and positioned so that the etched conductor tracks 5, as well as all non-metalized zones of the dielectric layer 11, initially adhere to the sealing layer 6, and secondly the remaining dielectric layer 11 subsequently functions in the same way as an inserted one Insulating film or a punched-out dielectric cover on punched-out conductor tracks.
  • Conductor tracks of different sheets are inserted between the sheets 9 at a defined distance from one another before folding them between the sheets.
  • O 5 or in a corresponding manner advantageously takes place in such a way that many such structures are endlessly strung together at a suitable spacing on a band-like endless carrier material 7, and this band either along a defined dimension before being fitted with conductor track structures for positioning the same, or else along a perforation or crease line 8, which is produced directly during or after the assembly with conductor track structures 5 and which penetrates both the conductor track structures and the carrier tape, is folded together in a folding former.
  • Adequate adhesion of the dielectric layers to one another or the metallic surfaces of conductor tracks on inserted dielectric layers can be achieved according to FIGS. 1 and 6 to 9 by means of a suitable pressure-sensitive adhesive 43 to be applied very thinly. Under certain conditions, this can also be omitted if the folded structure is sealed over the entire surface by means of the activatable sealing layer 6 if the conductor track structure is produced by stamping (see FIG. 6). Finally, chemical activation of dielectric surfaces, which may only be maintained during the folding process, can also be used in order to achieve sufficient adhesion of either dielectric surfaces to one another or also metallic surfaces on dielectric surfaces.
  • openings 46 and 47 can be punched into the conductor path structure both symmetrically and longitudinally to the imaginary predetermined bending line and preferably symmetrically to the longitudinal axis 45 of the conductor path structure, as is the case it is shown in Fig. 5.
  • a single opening suitably dimensioned in the direction of the desired bending line, can also be provided, which can also be designed asymmetrically to the longitudinal axis of a corresponding conductor track structure and, under certain conditions, does the same as two or even more such openings.
  • this distance 50 can also take any integer fraction of the length.
  • the film web which is otherwise unprocessed but has already been cut to the processing width, is fed to the punching station at a constant feed rate by means of known film grippers which engage in the openings 46 and 47 and the web by half or all Transport length 48 - in one or preferably two steps - forward to the punching unit.
  • this sealing layer is in sealing contact with one another not only at the edge regions outside the folded-up conductor path structure and within the delimitation length 48, but also within the folded openings 46 and 47. This effectively prevents the zone, which contains the conductor track halves 36 and 37, from being bagged up, in particular when the production track is to be rolled up on a release paper track, broken down into individual labels.
  • Pushing stresses occurring during the arching along the perforation zone within the multilayer arrangement are effectively distributed and diverted by this selective stitching, so that no creases can occur along the perforation edge.
  • This measure is particularly advantageous when the conductor tracks of different sheets according to FIG. 6 or 7 are to be positioned and fixed on one another without the use of a pressure sensitive adhesive 43, i.e. a largely constant spacing geometry is to be achieved and ensured only by sealing the folded-together conductor track structure.
  • openings 46 and 47 result if a light-translucent material is used as the carrier material 7 and thus as the covering material of the finished arrangement.
  • the edge notches 51 and 52 formed by these openings after folding and the translucent contour of the resonance arrangement are used to achieve a precise positioning of the coherent production path for cutting into individual labels.
  • diffuse scattering properties of the enveloping material 7 and an adhesive coating 54, possibly covered by a release paper 53, as well as luminance-integrating properties of disordered glass fibers are used as light receivers and light conductors.
  • the outward-facing edges of the standing indentations 51 and 52 at points 55 and 56 and the presence of the capacitor, consisting of mutually superimposed coatings and 35 at point 57 or the absence of the capacitor at points 58, are monitored by means of transmitted light barriers.
  • the production path is held by hold-down devices and between each two adjacent contours separated, provided that the receiving fiber 67 from point 57 does not receive transmitted light or the receiving fiber 68 from point 58 transmits transmitted light. Then and only then is the production path correctly positioned with respect to its position relative to a cutting knife 66.
  • the openings 46 and 47 can be used as positioning panels if the carrier material web 7 is to be brought into a defined position for the purpose of applying punched-out conductor track structures 5, so that all conductor track structures are always exactly at a distance 48 on the production path to repeat.
  • a flat, spirally arranged conductor track structure can be considered as an inductive structure.
  • Such a structure carries approximately the same currents in all parts of the conductor track structure producing the inductance, so that eddy current losses have a less important significance in the area of the turns, but have a greater significance in the area of the capacitor areas which are thus to be made larger for a sufficient total circuit capacitance.
  • the advantage can be exploited that only in a limited, area-related and narrowly defined area does a sufficiently precise coverage have to be achieved when the flat conductor track structure is folded up, namely in the area of the mutually overlapping capacitor coatings 74 and 75. Larger positioning tolerances can be compensated for relatively easily in this case by appropriately selected boundary coverage. H. less accurate and faster positioning procedures with less control are applicable.
  • the dielectric trimming element 80 interacts with the capacitive trimming surfaces formed by the conductive parts 78 and 79, the shape of which can be chosen with respect to the direction of adjustment of the dielectric trimming element such that the displacement of the same in the setting direction between two superimposed trimming surfaces trimming capacitance formed by the dielectric trimming element changes according to a desired function as a function of the displacement amplitude.
  • the same method can of course also be used in an embodiment according to FIG. 5.
  • the design of a conductor track structure enables the double use of a dielectric alignment tape 80 that is continuously laminated variably into the production track, insofar as this alignment tape additionally includes the conductive tracks of the one sheet forming the inductive element 73 in every possible alignment position from which reliably separates the conductor track piece 8 connecting the inductive element to the capacitor coating 78 of the other sheet.
  • This additional insulation of crossing conductor tracks against one another can be advantageous if such labels are used e.g. should be seen with a deeply embossed needle print.
  • the conductor track structure can also be designed in such a way that not only a part but also all crossings of the conductor tracks are additionally insulated from one another by an alignment tape.
  • OM be to provide the film web, which serves as the starting material, only as narrow as is absolutely necessary for the production of the conductor track structure as a whole. This is described in more detail with reference to FIGS. 17 and 18.
  • the continuous sheet of film in one sheet only extends as far as the boundary contour of the capacitor cover 75, 78.
  • a sufficient geometric fixation of the capacitor coverings in relation to one another in connection with the sealing layer provides the previously mentioned offset openings 77 together with the capacitor coverings 74 and 75 or 79 and 78 dielectric separating layer.
  • Laminators 82. - is already laminated onto the carrier or envelope material 7, provided an etch-resistant, washable or washable material is selected for this. If a laitator is used, an etch-resistant, tight self-sealing layer is used, which is due to the etching center! the adhesion is not significantly degraded and the metal foil is completely sealed on the back, the manufacturing process is further simplified by the fact that before folding out the washed and dried carrier or wrapping sheet and - if necessary - after removing an etching resist cover 83, a contact capacitor foil 84 of defined property is inserted only in the area between the predetermined bending line 8 and the outermost boundary of the capacitor structure.
  • the method of fine adjustment to compensate for frequency-influencing fluctuations in various process parameters and material properties can also be used with such a structure, as shown in FIG. 18, as can the method for edge sealing of the perforation edge and optoelectronically controllable separating position.
  • FIG. 13 shows two suitable openings 46 and 47 in the middle part of the conductor track structure for transport, for edge sealing and for positioning the film or the production track containing the conductor track structure.
  • the conductor track structure can be designed in this way that the outermost turn of the inductive structure extends well into the cutting area of the contour, ie such a label on all sides
  • Metallized edge can have, since the sealing layer adheres to both sides of the conductor path of the inductive structure representing the outermost turn and the wrapping material. thus is indirectly connected to one another at the edge with the interposition of this conductor track.
  • This property of this embodiment of the arrangement according to the invention thus advantageously meets the requirement for encompassing the greatest possible induction flow at least of the outermost turn of the resonance circuit, since the elimination of a special sealing zone outside the outline contour of the folded conductor track structure thus makes good use of the outline dimensions of the finished arrangement allows.
  • Thin, label-like structures with a frequency that can be continuously adjusted or set within wide limits can be produced if an embodiment according to FIG. 19 is selected and the adjustment band 80 is made with a low dielectric constant and is sufficiently thick, and the capacitor areas 78 and 79 have a contour which results in a particularly strong change in the effective capacity when the alignment band 80 is shifted.
  • Fig. 14 shows a schematic representation of a further embodiment of the invention, in which the inductive element forming
  • Conductor tracks are spirally nested one inside the other after folding.
  • the "winding" of the inductive element is probably distributed over two levels. However, the turns 90 of one side or of the one sheet fall when folded into the spaces between the turns 9 on the other sheet.
  • An important property of this embodiment is that the metallization can be used continuously from one punch to the next, i.e. that a coherent "utility tape" can be produced since the outermost turns of the inductive element are separated from those of the neighboring label at the end by separating or dissolving the finished tape into individual labels.
  • the above-described eddy current problems in the area of the conductor tracks are almost completely absent in this embodiment, so that a higher quality can be achieved more easily.
  • the slots 93 and 94 visible in FIG. 14 of the capacitively acting conductor track parts 95 and 96 also have an advantageous reduction in the eddy current load.
  • sealing is simplified at least to the extent that in the "separately unilateral" realization of inductance and capacitance described above, since only in the area of capacitive areas do two dielectric surfaces have to adhere to one another, in the remaining area of the structure - Except for insignificant intersections of conductor tracks - in each case the conductor track structure is sewn on both sides through the sealing layer 6 in the covering material 7. Since this applies in particular to the conductor tracks at the edge, the label edge can be "metallized", i.e.
  • the outermost conductor track parts can lie in the cutting area of the label, so that the outermost turn and thus the overall realizable effective induction surface of such a label can be designed to the maximum and no wasted space due to protruding wrapping material only for the purpose of counter-sealing with the other Side is necessary.
  • FIG. 14 also shows injections 93 and 94 in the capacitively acting conductor track parts 95 and 96, which are also used for a light-controlled positioning of the sealed production track can be.
  • This embodiment also allows the unrestricted use of the production techniques already mentioned, which use bare or dielectric coated or also etch-resistant coated metal foils as starting materials.
  • FIG. 15 shows, by way of example, a folded-up conductor track structure of this embodiment with a special shape, which makes it possible in a simple manner to adjust a matching element to be inserted before folding, in the manner of a dielectric matching strip 80 that can be rolled into the production track in an endlessly variable manner, simultaneously for matching the resonant circuit capacity and as to use a selective, additional insulating layer in the area of intersecting conductor tracks of different sheets in that all the intersection points 99 are arranged distributed essentially in the direction of the production track along a longitudinal edge of such a label.
  • the conductor track structure can be produced from a pure metal foil, provided that a relatively narrow capacitor foil 84, which is to be laminated along the production path, separates at least capacitively effective conductor path parts from one another and overlap at intersection points 99, similar to that in FIG 16 and 7 are illustrated.
  • Such structures can be produced - preferably in the frequency range 10 MHz to 500 MHz - by positioning two or more flat conductor track structures 100 and 101 consisting of circular elements with an insulating interlayer of at least one dielectric layer with variable coverage in the circumferential direction, so that the two capacitors 102 and 103 result and, by simply changing a positioning angle 104 before folding, it is possible to influence the resonance frequency of the finished structure within particularly wide limits.
  • the corresponding equivalent circuit diagram for the conductor track structure shown in FIG. 20 is shown in FIG. 21.
  • Such structures can in turn be produced analogously to the embodiments already described in that, according to FIG.
  • two circular conductor track structures 100 and 101 are placed on a processing substrate 7 equipped with a sealing layer 6, this along with one of the conductor track structures thereon for placing the Conductor formation precisely defined perforation or fold line 8 is folded together and the structures are held at a geometrically defined distance from one another by an inserted dielectric film 9.
  • a dielectric film which is to be inserted in particular, can also be omitted analogously if at least one of the conductor track structures is produced from an already dielectric-coated metal film.
  • the outer edge of such a label-like structure can be made round in that a round punch is made from the production line. In this case, punching waste which is not required can be grated off analogously to FIG. 11, so that, for example, round, self-adhesive coated labels can be produced endlessly in succession on a release paper strip.
  • the method can also be used in the case of circular conductor track structures when folding together conductor tracks that overlap one another in sections in order to achieve a substantial invariance of the resonance frequency with respect to positioning accuracies when folding together.
  • 23 shows an embodiment in which a metallization which exceeds the folding line 8, ie a galvanic connection of the conductor tracks distributed over the two sheets, is replaced by a capacitive coupling of the inductive partial structures, realized by a particularly large area of the outermost conductor tracks 105 and 106 corresponding to the equivalent circuit in FIG. 21.
  • the resonance frequency of the finished structure can be predetermined within wide limits by simply changing a positioning angle 104 before folding.
  • FIG. 24 A corresponding embodiment of the label-like structure according to the invention with an inductance realized essentially in one plane is shown in FIG. 24.
  • this embodiment results in a particularly wide matching limit, since the relative change in capacitance can be made very large A combined inductive-capacitive adjustment is also possible.
  • FIG. 25 A corresponding embodiment of the label-like structure according to the invention with alternately spirally nested windings of the inductive structure distributed on two sheet planes is shown in FIG. 25.
  • embodiments of the label-like structure according to the invention can be modified such that either the "inner” or “outer” capacitance - corresponding to the capacitances 102 and 103 in FIGS. 21, 24 and 25 - can be carried out as essentially unchangeable during the comparison .
  • both capacities - e.g. by suitably designing the contour of the surfaces which generate them - in such a way that they enable the desired adjustment of the resonance frequency of such structures to work essentially together.
  • planar structures can also be used in a similar manner, which consist of a planar conductor track structure 105 which is distributed on two sheet planes but is connected, i.e. have a conductive connection through the perforation or U fold line 8 of the carrier material so that the individual sheets are connected to one another in an electrically conductive manner.
  • the associated replacement circuit is shown in FIG. 27.
  • all of the described embodiments can be produced with an electrically conductive connection through a folding or perforation zone, and also with essentially circular conductor track contours.
  • the resonance frequency after folding can be adjusted by inserting an at least second flat, also circular, metallically conductive adjustment structure 106, which in the manner of a tuner according to FIG. 27 represents a capacitive coupling element whose positioning angle 104 in relation to a reference center point beam 107 to be defined for the folded conductor track structure, the resonance frequency of a of such an entity.
  • an at least second flat, also circular, metallically conductive adjustment structure 106 which in the manner of a tuner according to FIG. 27 represents a capacitive coupling element whose positioning angle 104 in relation to a reference center point beam 107 to be defined for the folded conductor track structure, the resonance frequency of a of such an entity.
  • the tuner itself can be made from a bare metal or also from a dielectric-coated film, depending on whether the conductor track structure is only made from a film coated on one or both sides with dielectric or whether : - for example when using etching processes for the production - the special insertion of continuous dielectric coatings is provided.
  • special matching characteristics can be achieved in that the tuner is produced from a metal foil which is equipped on both sides with insulating coverings 109 and 110 which differ in terms of both the thickness and the dielectric properties, as illustrated in FIG. 26.
  • an influencing of the resonance frequency can be made possible by a dielectric matching element on the flat conductor track structure before folding - preferably in the manner of an endlessly into the production track adjustment tape 80 to be laminated. It is possible to achieve a suitable adjustment curve by simultaneously adjusting at least two capacities by suitably positioning the conductor track structure on the production track with respect to the direction of travel, as shown in FIG. 28.
  • 29 shows a modified type of use of an additional, metallic conductor track piece isolated from circular conductor track shapes 100 and 101 as a frequency-influencing comparison tuner, which is made from a pure metal foil 108 or from a metal foil 108 provided on at least one side with a dielectric coating 109 can, depending on whether the folded conductor track structure is bare to the outside or covered by a dielectric coating.
  • Frequency adjustment is also possible here by changing the positioning angle 104 of the capacitively effective adjustment tuner.
  • Fr, equilibrium adjustment can also be used analogously in the case of rectangular embodiments of such labels if, instead of a round curved one, an essentially loan linear.ausgedehntes Porterbahnstü 'ck is used as a compensating element which allows to influence the resonance frequency by changing a linear positioning measurement.
  • the described arrangements according to the invention are produced from conductor track structures that are either punched out of a pure metal foil or that are obtained by etching on a carrier material that cannot be used as a capacitor dielectric, then with a suitable arrangement of conductor track crossings 99 and capacitively effective areas 111 30, the functions of the capacitor dielectric and an insulating medium between interconnect crossings are realized by a suitable first tape 84 to be continuously applied to the assembly line equipped with interconnect structures, while the function of a matching element is carried out continuously by a suitable second one, either onto the assembly line applied tape 84 or on the uncovered capacitor covering 111 tape 112 to be applied.
  • Capacitor film 84 which also separates crossovers 99 from one another, is applied in a track-fixed manner to the conductor track structure which has not yet been " folded up " , and then the adjustment band 112 which can be applied in the direction of adjustment 113 in a variable manner is placed.
  • a capacitor film 84 can first be connected in a special operation with a matching band 112 of suitable dielectric properties to form a uniform structure such that at least two adjacent zones of different thicknesses and dielectric properties are formed along the web direction. If this two-layer tape is placed in a variable manner in the direction of adjustment 113 on the production line equipped with guideway structures, so that the zone of reduced thickness in each If the separation of intersecting conductor tracks ensures, and the zone of greater thickness and its track position relative to the track in cooperation with the contour of capacitive conductor track surfaces 111 influences the effective capacitance, such a connected structure from parts 84 and 112 also provides the insulation of Conductor crossings, the production of a resonant circuit capacitance and the influencing of the resonance frequency of an identification arrangement thus completed.
  • a band-shaped capacitor film 84 can also be folded over on one side along a fold line 114 before being applied to the conductor track structure in such a way that a band-shaped material of constant dielectric properties is formed which has two zones 116 and 115 of single and double thickness. Placing such a capacitor dielectric folded over on one side on the conductor track structure in the same way permits the isolation of conductor track crossings, the production of a resonant circuit capacitance and the influencing of the resonance frequency of an identification arrangement which has been manufactured in this way, if such a folded capacitor foil between capacitively effective
  • Conductor track surfaces 111 are introduced in the direction of adjustment 113 in a variable manner.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electromagnetism (AREA)
  • Computer Security & Cryptography (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Burglar Alarm Systems (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Le dispositif d'identification en forme d'étiquette pouvant être appliquée sur un objet, présente au moins un élément inductif formé de bandes conductrices (5) planes et un élément capacitif (12, 13) constitué par des parties de bande conductrice superposées, avec un diélectrique interposé, formant, avec l'élément inductif, un circuit résonant fermé. Les bandes conductrices (5) sont disposées sur au moins deux surfaces (3, 4) superposées obtenues par repliement. Les parties de bande conductrice (12, 13) constituant l'élément capacitif, se recouvrent et sont identiques, au moins partiellement, aux parties de bande conductrice formant l'élément inductif. Pour la fabrication de ce dispositif, les bandes conductrices sont disposées sur une bande de support sans fin (7) et le repliage de ces bandes est obtenu par pliage en déplaçant la bande de support le long d'une ligne de perforation ou de pliage (8).
EP83901703A 1982-06-07 1983-06-07 Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication Withdrawn EP0110921A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823221500 DE3221500A1 (de) 1982-06-07 1982-06-07 Identifizierungsanordnung in form eines an einem gegenstand anbringbaren gebildes und verfahren zur herstellung
DE3221500 1982-06-07

Publications (1)

Publication Number Publication Date
EP0110921A1 true EP0110921A1 (fr) 1984-06-20

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EP83901703A Withdrawn EP0110921A1 (fr) 1982-06-07 1983-06-07 Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication

Country Status (6)

Country Link
US (2) US4792790A (fr)
EP (1) EP0110921A1 (fr)
JP (1) JPS59501030A (fr)
DE (1) DE3221500A1 (fr)
DK (1) DK49084D0 (fr)
WO (1) WO1983004448A1 (fr)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294290A (en) * 1982-06-07 1994-03-15 Reeb Max E Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits
DK163151C (da) * 1983-11-16 1992-06-22 Minnesota Mining & Mfg Maerkeplade med lc resonanskredsloeb til anvendelse i elektronisk genstandsovervaagningssystem, fremgangsmaade til fremstilling af maerkeplader, samt elektronisk genstandsovervaagningssystem hvori maerkepladen anvendes.
US4583099A (en) * 1983-12-27 1986-04-15 Polyonics Corporation Resonant tag circuits useful in electronic security systems
AT405697B (de) * 1984-04-23 1999-10-25 Lichtblau G J Deaktivierbarer resonanzschaltkreis
US4658264A (en) * 1984-11-09 1987-04-14 Minnesota Mining And Manufacturing Company Folded RF marker for electronic article surveillance systems
SE450057B (sv) * 1984-11-20 1987-06-01 Saab Automation Ab Identitetsbrickor for identifiering av foremal
DE3508369A1 (de) * 1985-03-08 1986-09-11 Max-E. Dipl.-Ing. 7336 Uhingen Reeb Etikettartiges gebilde und verfahren zu seiner herstellung
US4714874A (en) * 1985-11-12 1987-12-22 Miles Inc. Test strip identification and instrument calibration
DE3616723A1 (de) * 1986-05-17 1987-11-19 Philips Patentverwaltung Mikrowellenbaustein
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
CH673744A5 (fr) * 1987-05-22 1990-03-30 Durgo Ag
US5230764A (en) * 1987-10-13 1993-07-27 Philipp Moll Process and device for producing garments or individual parts thereof
US5165987A (en) * 1987-12-23 1992-11-24 Swiss Aluminium Ltd. Adapting frequency band of oscillating circuit made from a metal-plastic-metal sandwich foil and sandwich foil for implementing the process
US5006856A (en) * 1989-08-23 1991-04-09 Monarch Marking Systems, Inc. Electronic article surveillance tag and method of deactivating tags
CH680483A5 (fr) * 1989-10-20 1992-08-31 Kobe Properties Ltd
US5103210A (en) * 1990-06-27 1992-04-07 Checkpoint Systems, Inc. Activatable/deactivatable security tag for use with an electronic security system
US5062916A (en) * 1990-08-01 1991-11-05 W. H. Brady Co. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US5628921A (en) * 1991-02-14 1997-05-13 Beckett Technologies Corp. Demetallizing procedure
US5142270A (en) * 1991-05-22 1992-08-25 Checkpoint Systems Inc. Stabilized resonant tag circuit and deactivator
US5241299A (en) * 1991-05-22 1993-08-31 Checkpoint Systems, Inc. Stabilized resonant tag circuit
US5218189A (en) * 1991-09-09 1993-06-08 Checkpoint Systems, Inc. Binary encoded multiple frequency rf indentification tag
US5182544A (en) * 1991-10-23 1993-01-26 Checkpoint Systems, Inc. Security tag with electrostatic protection
US5252918A (en) * 1991-12-20 1993-10-12 Halliburton Company Apparatus and method for electromagnetically detecting the passing of a plug released into a well by a bridge circuit
US5276431A (en) * 1992-04-29 1994-01-04 Checkpoint Systems, Inc. Security tag for use with article having inherent capacitance
US5594342A (en) * 1992-06-01 1997-01-14 Conductus, Inc. Nuclear magnetic resonance probe coil with enhanced current-carrying capability
US6045652A (en) * 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5381137A (en) * 1992-10-26 1995-01-10 Motorola, Inc. RF tagging system and RF tags and method
US5323856A (en) * 1993-03-31 1994-06-28 Halliburton Company Detecting system and method for oil or gas well
US5495250A (en) * 1993-11-01 1996-02-27 Motorola, Inc. Battery-powered RF tags and apparatus for manufacturing the same
US5444223A (en) * 1994-01-11 1995-08-22 Blama; Michael J. Radio frequency identification tag and method
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
AU2412495A (en) * 1995-04-20 1996-11-07 Daniel Pastor Undetectable device for activating a detection system, and m ethod for making same
JP3337865B2 (ja) * 1995-04-22 2002-10-28 ソニーケミカル株式会社 合成ループアンテナ
DK0919049T3 (da) 1996-08-06 2000-08-28 Meto International Gmbh Resonanssvingningskreds til elektronisk sikring af varer
DE19705723A1 (de) * 1996-08-06 1998-02-12 Esselte Meto Int Gmbh Sicherungselement für die elektronische Artikelsicherung
US6621410B1 (en) 1996-08-26 2003-09-16 Rf Code, Inc. System for item and orientation identification
US6362737B1 (en) 1998-06-02 2002-03-26 Rf Code, Inc. Object Identification system with adaptive transceivers and methods of operation
DE19708180A1 (de) * 1996-11-04 1998-05-07 Esselte Meto Int Gmbh Sicherungselement für die elektronische Artikelüberwachung
AU718414B2 (en) * 1996-11-04 2000-04-13 Meto International Gmbh Identification element and method of manufacturing the same
AU723358B2 (en) * 1996-11-04 2000-08-24 Meto International Gmbh Security element for electronic article surveillance
DE19722327A1 (de) 1997-05-28 1998-12-03 Arsoma Druckmaschinen Gmbh Verfahren zur Herstellung eines mehrlagigen Etiketts und Vorrichtung zur Durchführung des Verfahrens
US6692672B1 (en) 1997-06-02 2004-02-17 Avery Dennison Corporation EAS marker and method of manufacturing same
US6144269A (en) * 1997-06-10 2000-11-07 Fuji Electric Co., Ltd. Noise-cut LC filter for power converter with overlapping aligned coil patterns
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
EP1032926A4 (fr) * 1997-11-21 2007-08-22 Avery Dennison Corp Etiquette sae (surveillance d'article electronique) et son procede de fabrication
DK1057150T3 (da) 1997-12-22 2003-02-10 Bent Thorning Bensen As Fremgangsmåde og indretning til detektering af et fluidum
US6094133A (en) * 1998-01-22 2000-07-25 Sensor Technos Co., Ltd. Method of displaying information by using an LC resonance tag
US6820320B2 (en) 1998-07-06 2004-11-23 Tdk Corporation Process of making an inductor device
US6345434B1 (en) * 1998-07-06 2002-02-12 Tdk Corporation Process of manufacturing an inductor device with stacked coil pattern units
DE19857583A1 (de) 1998-12-14 2000-06-15 Meto International Gmbh Sicherungselement für die elektronische Artikelsicherung und Verfahren zur Herstellung eines Sicherungselementes
US6597175B1 (en) 1999-09-07 2003-07-22 Halliburton Energy Services, Inc. Electromagnetic detector apparatus and method for oil or gas well, and circuit-bearing displaceable object to be detected therein
DE19951561A1 (de) * 1999-10-27 2001-05-03 Meto International Gmbh Sicherungselement für die elektronischen Artikelsicherung
DE10019410B4 (de) * 2000-04-19 2005-07-14 Daimlerchrysler Ag Flexibler Flachleiter
US6612889B1 (en) * 2000-10-27 2003-09-02 Science Applications International Corporation Method for making a light-emitting panel
AU2001297814A1 (en) * 2000-12-22 2002-07-08 Bent Thorning Bensen A/S Sensing device, method of its production, and use
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
DE10121172A1 (de) * 2001-04-30 2002-10-31 Hans-Hermann Spies Urkunde , insbesondere Geldschein
US6693541B2 (en) 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
US6492009B1 (en) 2001-09-20 2002-12-10 Graphic Packaging Corporation Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process
JP2003188882A (ja) * 2001-10-12 2003-07-04 Hiroyuki Shinoda 通信装置、通信デバイス、基板実装方法および触覚センサ
US20040200801A1 (en) * 2001-11-19 2004-10-14 Lai Laurence M.C. Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process
DE10242143A1 (de) * 2002-09-04 2004-03-25 Telegärtner Karl Gärtner GmbH Elektrische Steckbuchse
US6925701B2 (en) * 2003-03-13 2005-08-09 Checkpoint Systems, Inc. Method of making a series of resonant frequency tags
US7205894B1 (en) 2004-06-22 2007-04-17 Savage Paul A Missing golf club reminder and wireless golf bag alarm system
DE102005016511B4 (de) * 2005-04-11 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat
JP2006304184A (ja) * 2005-04-25 2006-11-02 Lintec Corp アンテナ回路、icインレット、icタグ及びicカードならびにicタグの製造方法及びicカードの製造方法
CA2505565C (fr) * 2005-04-28 2008-09-16 Camco Inc. Dispositif et methode de commande d'un seche-linge
DE102008047013A1 (de) * 2008-09-11 2010-03-25 Smartrac Ip B.V. Antennenmodul zur Herstellung eines Transponders sowie Transponder
DE102008064535A1 (de) 2008-12-19 2010-06-24 Telegärtner Karl Gärtner GmbH Elektrischer Verbindungsstecker
JP5505505B2 (ja) 2010-07-29 2014-05-28 株式会社村田製作所 共振回路及びアンテナ装置
CN102544739B (zh) * 2011-05-20 2015-12-16 深圳光启高等理工研究院 一种具有高介电常数的超材料
DE102011111506B4 (de) * 2011-08-31 2017-05-18 Leonhard Kurz Stiftung & Co. Kg Kunststofffolie und Touchsensor
JP5917192B2 (ja) * 2012-02-27 2016-05-11 日立マクセル株式会社 共振チェッカー、および共振チェッカーを備えている商品パッケージ
WO2014031878A1 (fr) * 2012-08-22 2014-02-27 California Institute Of Technology Système de transfert d'énergie sans fil à trois bobines pour implants oculaires
US8973252B2 (en) 2012-09-27 2015-03-10 Toyota Motor Engineering & Manufacturing North America, Inc. Folded planar Litz wire and method of making same
FR3002686B1 (fr) * 2013-02-28 2016-09-09 Inst Polytechnique Grenoble Procede de realisation d'une structure radiofrequence
DE102013204151B4 (de) * 2013-03-11 2016-12-15 Continental Automotive Gmbh Steuervorrichtung zum Betreiben einer Werkzeugmaschine und Werkzeugmaschine
DE102014104446A1 (de) 2014-03-28 2015-10-01 Telegärtner Karl Gärtner GmbH Elektrischer Steckverbinder
DE102014104449A1 (de) 2014-03-28 2015-10-01 Telegärtner Karl Gärtner GmbH Elektrischer Steckverbinder
US9633947B2 (en) * 2015-01-29 2017-04-25 Globalfoundries Inc. Folded ballistic conductor interconnect line
RU2650356C1 (ru) * 2016-11-01 2018-04-11 Владимир Дмитриевич Шкилев Способ создания идентификационной метки
CN111259510A (zh) * 2018-11-30 2020-06-09 北京铂阳顶荣光伏科技有限公司 刻划机加工精度补偿方法及光伏芯片
CN110672181A (zh) * 2019-11-09 2020-01-10 中国舰船研究设计中心 测深尺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2774060A (en) * 1953-06-15 1956-12-11 Richard B Thompson Detecting means for stolen goods
US2943966A (en) * 1953-12-30 1960-07-05 Int Standard Electric Corp Printed electrical circuits
US2849298A (en) * 1955-05-03 1958-08-26 St Regis Paper Co Printed circuitry laminates and production thereof
US3215574A (en) * 1963-03-25 1965-11-02 Hughes Aircraft Co Method of making thin flexible plasticsealed printed circuits
US3526573A (en) * 1969-06-11 1970-09-01 Westinghouse Electric Corp Flexible flame retardant foil-clad laminates
US3766452A (en) * 1972-07-13 1973-10-16 L Burpee Instrumented token
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
DE3143208C2 (de) * 1981-10-30 1984-07-05 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in Form eines an einem Gegenstand anbringbaren etikettartigen Streifens und Verfahren zu deren Herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8304448A1 *

Also Published As

Publication number Publication date
DK49084A (da) 1984-02-03
US4792790A (en) 1988-12-20
DK49084D0 (da) 1984-02-03
JPS59501030A (ja) 1984-06-07
DE3221500A1 (de) 1983-12-08
WO1983004448A1 (fr) 1983-12-22
US4935093A (en) 1990-06-19

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