EA201790268A1 - Способ и устройство для экономии электроэнергии и одновременного повышения пропускной скорости в вакуумных установках для нанесения покрытий - Google Patents

Способ и устройство для экономии электроэнергии и одновременного повышения пропускной скорости в вакуумных установках для нанесения покрытий

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Publication number
EA201790268A1
EA201790268A1 EA201790268A EA201790268A EA201790268A1 EA 201790268 A1 EA201790268 A1 EA 201790268A1 EA 201790268 A EA201790268 A EA 201790268A EA 201790268 A EA201790268 A EA 201790268A EA 201790268 A1 EA201790268 A1 EA 201790268A1
Authority
EA
Eurasian Patent Office
Prior art keywords
segments
reactor
gas
spray
simultaneous increase
Prior art date
Application number
EA201790268A
Other languages
English (en)
Other versions
EA035334B1 (ru
Inventor
Герд Клайдайтер
Томас Криш
Йорг Фиуковски
Олаф Гавер
Original Assignee
Гренцебах Машиненбау Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Гренцебах Машиненбау Гмбх filed Critical Гренцебах Машиненбау Гмбх
Publication of EA201790268A1 publication Critical patent/EA201790268A1/ru
Publication of EA035334B1 publication Critical patent/EA035334B1/ru

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/32779—Continuous moving of batches of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889—Connection or combination with other apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899—Multiple chambers, e.g. cluster tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)

Abstract

Устройство и способ экономии электроэнергии и одновременного повышения пропускной скорости в вакуумных установках для нанесения покрытий, состоящих из последовательности распылительных сегментов (3) и газовых разделительных сегментов (2) с одной сплошной подложечной плоскостью (1), характеризующиеся следующими признаками: а) каждый распылительный сегмент (3) состоит из ванны (12) реактора с расположенным внутри транспортирующим устройством (11), причем фланец (6) реактора установлен в непосредственной близости над подложечной плоскостью (1), причем катодный опорный блок (5) с мишенями (8) и впускные каналы (10) для газа находятся в непосредственной близости от подложки с отбойными щитками (9) в крышке (4) реактора; b) газовые разделительные сегменты (2) в области подложечной плоскости (1) снабжены проходящим по всей длине газового разделительного сегмента (2) сводом (14) туннеля; с) вакуумирование распылительных сегментов (3) и/или газовых разделительных сегментов (2) осуществляется с помощью одного или нескольких вакуумных насосов (15), причем отводимый при этом воздух собирается в изменяющемся в объеме воздухосборнике (25).
EA201790268A 2014-08-11 2015-08-05 Вакуумная установка для нанесения покрытий и способ нанесения покрытий EA035334B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014011877.0A DE102014011877B4 (de) 2014-08-11 2014-08-11 Verfahren und Vorrichtung zur Energieeinsparung und gleichzeitigen Erhöhung der Durchlaufgeschwindigkeit bei Vakuum-Beschichtungsanlagen
PCT/DE2015/000397 WO2016023533A2 (de) 2014-08-11 2015-08-05 Verfahren und vorrichtung zur energieeinsparung und gleichzeitigen erhöhung der durchlaufgeschwindigkeit bei vakuum-beschichtungsanlagen

Publications (2)

Publication Number Publication Date
EA201790268A1 true EA201790268A1 (ru) 2017-06-30
EA035334B1 EA035334B1 (ru) 2020-05-28

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EA201790268A EA035334B1 (ru) 2014-08-11 2015-08-05 Вакуумная установка для нанесения покрытий и способ нанесения покрытий

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Country Link
US (1) US9960020B2 (ru)
EP (1) EP3180456B1 (ru)
JP (1) JP6353602B2 (ru)
KR (1) KR101924739B1 (ru)
CN (1) CN106574364B (ru)
DE (1) DE102014011877B4 (ru)
EA (1) EA035334B1 (ru)
ES (1) ES2731237T3 (ru)
HU (1) HUE044236T2 (ru)
PL (1) PL3180456T3 (ru)
WO (1) WO2016023533A2 (ru)

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
DE102016012460A1 (de) * 2016-10-19 2018-04-19 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen
DE102018102693B4 (de) 2018-02-07 2024-06-27 VON ARDENNE Asset GmbH & Co. KG Dehydratationsnetzwerk, Vakuumanordnung und Verfahren

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JPH05311403A (ja) * 1992-05-11 1993-11-22 Shin Meiwa Ind Co Ltd 成膜装置のガス再生装置
US5407551A (en) 1993-07-13 1995-04-18 The Boc Group, Inc. Planar magnetron sputtering apparatus
US5705044A (en) * 1995-08-07 1998-01-06 Akashic Memories Corporation Modular sputtering machine having batch processing and serial thin film sputtering
DE19736318C2 (de) * 1997-08-21 2000-12-21 Leybold Systems Gmbh Vorrichtung zum Beschichten von plattenförmigen Substraten mit dünnen Schichten mittels Kathodenzerstäubung
JP4187323B2 (ja) * 1998-10-13 2008-11-26 Ｔｄｋ株式会社 真空成膜処理装置および方法
JP4796688B2 (ja) * 2000-08-31 2011-10-19 アルバック・クライオ株式会社 希ガス回収方法及び希ガス回収装置
DE10122310B4 (de) 2001-05-08 2007-08-02 Von Ardenne Anlagentechnik Gmbh Längserstreckte Vakuumbeschichtungsanlage
DE10322935A1 (de) * 2003-05-21 2004-12-16 Unaxis Deutschland Holding Gmbh Mit einem Spalt versehene Trennwand zwischen zwei hintereinander angeordneten Prozesskammern
DE10352143B4 (de) * 2003-11-04 2009-06-25 Von Ardenne Anlagentechnik Gmbh Längserstreckte Vakuumanlage zur ein- oder beidseitigen Beschichtung flacher Substrate
ATE360180T1 (de) * 2004-03-15 2007-05-15 Applied Materials Gmbh & Co Kg Vakuumbehandlungsanlage mit umsetzbarem wartungsventil
DE102005001353B4 (de) * 2005-01-11 2010-01-07 Von Ardenne Anlagentechnik Gmbh Pumpkanal einer längserstreckten Vakuumbeschichtunganlage
TWI304241B (en) * 2005-02-04 2008-12-11 Advanced Display Proc Eng Co Vacuum processing apparatus
US20110308458A1 (en) * 2010-06-21 2011-12-22 Semes Co., Ltd. Thin Film Deposition Apparatus
DE102012110334B3 (de) 2012-10-29 2013-11-28 Von Ardenne Anlagentechnik Gmbh Planarmagnetron

Also Published As

Publication number Publication date
HUE044236T2 (hu) 2019-10-28
JP6353602B2 (ja) 2018-07-04
ES2731237T3 (es) 2019-11-14
PL3180456T3 (pl) 2019-10-31
DE102014011877B4 (de) 2021-08-05
US9960020B2 (en) 2018-05-01
EP3180456A2 (de) 2017-06-21
KR20170024035A (ko) 2017-03-06
EA035334B1 (ru) 2020-05-28
US20170213708A1 (en) 2017-07-27
CN106574364A (zh) 2017-04-19
KR101924739B1 (ko) 2019-02-27
EP3180456B1 (de) 2019-05-01
WO2016023533A2 (de) 2016-02-18
JP2017524071A (ja) 2017-08-24
WO2016023533A3 (de) 2016-04-07
DE102014011877A1 (de) 2016-02-11
CN106574364B (zh) 2019-08-02

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