DK200301576A - Flowfordelingsenhed og köleenhed med bypassflow - Google Patents
Flowfordelingsenhed og köleenhed med bypassflow Download PDFInfo
- Publication number
- DK200301576A DK200301576A DK200301576A DKPA200301576A DK200301576A DK 200301576 A DK200301576 A DK 200301576A DK 200301576 A DK200301576 A DK 200301576A DK PA200301576 A DKPA200301576 A DK PA200301576A DK 200301576 A DK200301576 A DK 200301576A
- Authority
- DK
- Denmark
- Prior art keywords
- flow
- channel
- flow channel
- cell
- unit
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
- F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
Patentkrav 1. En fordeler til fordeling af et væskeflow over en overflade, som skal køles, hvorved fordeleren omfatter: - en indløbsforgrening (8, 25); - en udløbsforgrening (9, 24); og - mindst en flowcelle (26-29) forbundet mellem forgreningerne, hvorved flowcellen omfatter: - et celleindløb (5) i væskeforbindelse med indløbsforgreningen; - et celleudløb (6) i væskeforbindelse med udløbsforgreningen; - en hovedflowkanal (50) i form af en mæanderformet sekvens af kanalsegmenter (64, 63, 62, 61) til at føre et hovedvæskeflow fra celleindløbet (5) langs overfladen til celleudløbet (6) med et stort antal retningsændringer (51, 52) i hovedflowet; og - en bypassflowkanal (71, 72, 73) der tillader et by-passflow af væske fra celleindløbet til celleudløbet; hvorved - bypassflowkanalen forbinder kanalsegmenterne på hovedf lowkanalen. 2. En fordeler som i krav 1, hvori hovedflowkanalen dannes af vægsegmenter (21) der udgår fra en basis (25) til den overflade, der skal køles, og hvori bypass-flowkanalen dannes af mellemrum mellem vægsegmenterne og den overflade, der skal køles. 3. En fordeler som i krav 1 eller 2, hvori et stort antal flowceller er forbundet mellem forgreningerne, og hvori hver af flowcellerne omfatter en bypassflowka-nal. 4. En enhed, som kan væskekøles, til bortledning af varme fra en varmekilde, hvorved enheden omfatter en plade, som opvarmes af varmekilden og en fordeler som i hvert af de foregående krav til fordeling af et flow af kølevæske over en overflade på pladen. 5. En elektronisk enhed, som kan væskekøles, hvorved enheden omfatter et elektronisk kredsløb indkapslet i et kredsløbsmodul med en ydre overflade, og en fordeler som i hvert af kravene 1 til 3 til fordeling af et flow af kølevæske over overfladen.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200301576A DK176137B1 (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed med bypassflow |
AT04762954T ATE364988T1 (de) | 2003-10-27 | 2004-10-26 | Strömungsverteilungseinheit und kühleinheit mit bypass-strömung |
US10/577,027 US7360582B2 (en) | 2003-10-27 | 2004-10-26 | Flow distributing unit and cooling unit having bypass flow |
PCT/DK2004/000736 WO2005041627A2 (en) | 2003-10-27 | 2004-10-26 | Flow distributing unit and cooling unit having bypass flow |
EP04762954A EP1683404B1 (en) | 2003-10-27 | 2004-10-26 | Flow distributing unit and cooling unit having bypass flow |
DE602004007031T DE602004007031T2 (de) | 2003-10-27 | 2004-10-26 | Strömungsverteilungseinheit und kühleinheit mit bypass-strömung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200301576 | 2003-10-27 | ||
DK200301576A DK176137B1 (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed med bypassflow |
Publications (2)
Publication Number | Publication Date |
---|---|
DK200301576A true DK200301576A (da) | 2005-04-28 |
DK176137B1 DK176137B1 (da) | 2006-09-25 |
Family
ID=34485963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200301576A DK176137B1 (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed med bypassflow |
Country Status (6)
Country | Link |
---|---|
US (1) | US7360582B2 (da) |
EP (1) | EP1683404B1 (da) |
AT (1) | ATE364988T1 (da) |
DE (1) | DE602004007031T2 (da) |
DK (1) | DK176137B1 (da) |
WO (1) | WO2005041627A2 (da) |
Families Citing this family (38)
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WO2005125296A1 (en) * | 2004-06-15 | 2005-12-29 | Tm4 Inc. | Cooling device for electric circuit |
DK1815514T3 (da) * | 2004-11-24 | 2008-08-25 | Danfoss Silicon Power Gmbh | Et flowfordelingsmodul og en stabel flowfordelingsmoduler |
EP1742264A3 (en) * | 2005-07-05 | 2008-05-28 | Danfoss Silicon Power GmbH | A monolithic fluid cooled power module and a method of forming the power module |
US7427566B2 (en) * | 2005-12-09 | 2008-09-23 | General Electric Company | Method of making an electronic device cooling system |
US20070131659A1 (en) * | 2005-12-09 | 2007-06-14 | Durocher Kevin M | Method of making an electronic device cooling system |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9453691B2 (en) | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US20110226448A1 (en) * | 2008-08-08 | 2011-09-22 | Mikros Manufacturing, Inc. | Heat exchanger having winding channels |
US8474516B2 (en) * | 2008-08-08 | 2013-07-02 | Mikros Manufacturing, Inc. | Heat exchanger having winding micro-channels |
US20100294461A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same |
DE102009051864B4 (de) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung für eine elektrische Einrichtung |
KR101209686B1 (ko) * | 2010-12-03 | 2012-12-10 | 기아자동차주식회사 | 하이브리드 및 전기 자동차용 전기장치의 냉각장치 |
WO2012112262A1 (en) | 2011-02-18 | 2012-08-23 | Husky Injection Molding Systems Ltd | Mold-tool system includes one-piece manifold assembly having each inlet in fluid communication with outlets |
US8982558B2 (en) | 2011-06-24 | 2015-03-17 | General Electric Company | Cooling device for a power module, and a related method thereof |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
EP2592633B1 (en) * | 2011-11-14 | 2017-06-14 | Cressall Resistors Limited | Liquid-cooled resistor device |
EP2719985B1 (en) * | 2012-10-09 | 2015-08-26 | Danfoss Silicon Power GmbH | A flow distribution module with a patterned cover plate |
EP2884198B1 (de) * | 2013-12-13 | 2016-11-23 | Eberspächer catem GmbH & Co. KG | Elektrische Heizvorrichtung |
EP2884199B1 (de) * | 2013-12-13 | 2016-11-23 | Eberspächer catem GmbH & Co. KG | Elektrische Heizvorrichtung |
CN104750207A (zh) * | 2013-12-30 | 2015-07-01 | 鸿富锦精密工业(武汉)有限公司 | 散热模组 |
DE102014104194B4 (de) * | 2014-03-26 | 2021-02-25 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
CN105185750B (zh) * | 2015-09-06 | 2019-01-25 | 株洲南车时代电气股份有限公司 | 一种功率模块密封装置 |
US9941036B2 (en) | 2016-02-02 | 2018-04-10 | Raytheon Company | Modular, high density, low inductance, media cooled resistor |
US10059103B2 (en) * | 2016-05-27 | 2018-08-28 | Sii Printek Inc. | Liquid jet head and liquid jet apparatus |
US10249554B2 (en) | 2017-06-20 | 2019-04-02 | General Electric Company | Heat transfer assembly for a heat emitting device |
US10822096B2 (en) | 2018-03-30 | 2020-11-03 | Ge Aviation Systems Llc | Avionics cooling module |
US10405466B1 (en) * | 2018-06-14 | 2019-09-03 | Ford Global Technologies, Llc | Power-module assembly with endcap |
US10533809B1 (en) | 2018-07-06 | 2020-01-14 | Keysight Technologies, Inc. | Cooling apparatus and methods of use |
DE102018217652A1 (de) * | 2018-10-15 | 2020-04-16 | Danfoss Silicon Power Gmbh | Strömungsverteiler zum Kühlen einer elektrischen Baugruppe, ein Halbleitermodul mit einem derartigen Strömungsverteiler und ein Verfahren zu dessen Herstellung |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11350544B2 (en) * | 2020-03-24 | 2022-05-31 | International Business Machines Corporation | Flexible cold plate with parallel fluid flow paths |
EP4150216A4 (en) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS |
US20220026137A1 (en) * | 2020-07-22 | 2022-01-27 | Nidec Corporation | Cooler |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
US11740028B2 (en) * | 2021-06-18 | 2023-08-29 | Dana Canada Corporation | Two-pass heat exchanger with calibrated bypass |
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US3524497A (en) * | 1968-04-04 | 1970-08-18 | Ibm | Heat transfer in a liquid cooling system |
US3909118A (en) * | 1974-03-04 | 1975-09-30 | Textron Inc | Fluid cooled mirror |
JPS6288876U (da) * | 1985-11-22 | 1987-06-06 | ||
US5005640A (en) * | 1989-06-05 | 1991-04-09 | Mcdonnell Douglas Corporation | Isothermal multi-passage cooler |
US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
US5841634A (en) | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
US6307871B1 (en) * | 1998-09-11 | 2001-10-23 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
EP1471775B9 (de) * | 1999-07-23 | 2011-04-13 | OSRAM Opto Semiconductors GmbH | Lichtquelle mit einer Leuchtstoffanordnung und Vergussmasse mit einer Leuchtstoffanordnung |
JP3448737B2 (ja) * | 2000-05-25 | 2003-09-22 | 住友重機械工業株式会社 | ウエハーチャック用冷却板及びウエハーチャック |
US6935411B2 (en) * | 2000-06-08 | 2005-08-30 | Mikros Manufacturing, Inc. | Normal-flow heat exchanger |
DE20208106U1 (de) * | 2002-05-24 | 2002-10-10 | Danfoss Silicon Power Gmbh | Kühlgerät für Halbleiter mit mehreren Kühlzellen |
US20060113063A1 (en) * | 2004-10-15 | 2006-06-01 | Lalit Chordia | Thin-plate microchannel structure |
-
2003
- 2003-10-27 DK DK200301576A patent/DK176137B1/da not_active IP Right Cessation
-
2004
- 2004-10-26 AT AT04762954T patent/ATE364988T1/de not_active IP Right Cessation
- 2004-10-26 US US10/577,027 patent/US7360582B2/en active Active
- 2004-10-26 WO PCT/DK2004/000736 patent/WO2005041627A2/en active IP Right Grant
- 2004-10-26 EP EP04762954A patent/EP1683404B1/en active Active
- 2004-10-26 DE DE602004007031T patent/DE602004007031T2/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE602004007031T2 (de) | 2008-02-14 |
EP1683404A2 (en) | 2006-07-26 |
US20070119574A1 (en) | 2007-05-31 |
DE602004007031D1 (de) | 2007-07-26 |
US7360582B2 (en) | 2008-04-22 |
WO2005041627A3 (en) | 2005-06-30 |
DK176137B1 (da) | 2006-09-25 |
ATE364988T1 (de) | 2007-07-15 |
WO2005041627A2 (en) | 2005-05-06 |
EP1683404B1 (en) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUP | Patent expired |
Expiry date: 20231027 |