DK1955369T3 - Anordning og fremgangsmåde til at holde et substrat - Google Patents

Anordning og fremgangsmåde til at holde et substrat

Info

Publication number
DK1955369T3
DK1955369T3 DK06838362.9T DK06838362T DK1955369T3 DK 1955369 T3 DK1955369 T3 DK 1955369T3 DK 06838362 T DK06838362 T DK 06838362T DK 1955369 T3 DK1955369 T3 DK 1955369T3
Authority
DK
Denmark
Prior art keywords
holding
substrate
Prior art date
Application number
DK06838362.9T
Other languages
English (en)
Inventor
Ricardo I Fuentes
Original Assignee
Materials And Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials And Technologies Corp filed Critical Materials And Technologies Corp
Application granted granted Critical
Publication of DK1955369T3 publication Critical patent/DK1955369T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
DK06838362.9T 2005-11-23 2006-11-22 Anordning og fremgangsmåde til at holde et substrat DK1955369T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73912805P 2005-11-23 2005-11-23
PCT/US2006/045353 WO2007062199A2 (en) 2005-11-23 2006-11-22 Device and method for holding a substrate

Publications (1)

Publication Number Publication Date
DK1955369T3 true DK1955369T3 (da) 2013-01-28

Family

ID=38067946

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06838362.9T DK1955369T3 (da) 2005-11-23 2006-11-22 Anordning og fremgangsmåde til at holde et substrat

Country Status (9)

Country Link
US (1) US9011064B2 (da)
EP (1) EP1955369B1 (da)
JP (1) JP4943448B2 (da)
CN (1) CN101366110B (da)
CA (1) CA2630807A1 (da)
DK (1) DK1955369T3 (da)
ES (1) ES2401845T3 (da)
HK (1) HK1125741A1 (da)
WO (1) WO2007062199A2 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK2073939T3 (da) * 2006-10-16 2012-10-22 Materials And Technologies Corp Anordning til våd bearbejdning ved anvendelse af en fluidmenisk
CN102007081A (zh) * 2008-02-22 2011-04-06 材料及技术公司 单侧高生产量湿蚀刻和湿处理设备与方法
CN102059225A (zh) * 2010-11-23 2011-05-18 南通富士通微电子股份有限公司 清洗机圆片保护装置
CN103600954B (zh) 2013-10-11 2015-10-07 京东方科技集团股份有限公司 一种掩模板搬运治具
CN107492508A (zh) * 2016-06-12 2017-12-19 奇勗科技股份有限公司 一种基板处理设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107023A (ja) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp 被処理物の回転保持装置
US5669977A (en) * 1995-12-22 1997-09-23 Lam Research Corporation Shape memory alloy lift pins for semiconductor processing equipment
WO1999016936A1 (en) 1997-09-30 1999-04-08 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
CN1272956A (zh) 1997-09-30 2000-11-08 塞米图尔公司 在微电子元件的制造过程中用于控制工件表面暴露于处理液的装置和方法
JP2001110771A (ja) * 1999-10-08 2001-04-20 Ebara Corp 基板洗浄装置及び基板処理装置
JP3958572B2 (ja) 2001-12-26 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US7078344B2 (en) * 2003-03-14 2006-07-18 Lam Research Corporation Stress free etch processing in combination with a dynamic liquid meniscus

Also Published As

Publication number Publication date
EP1955369B1 (en) 2012-10-24
EP1955369A4 (en) 2011-11-02
ES2401845T3 (es) 2013-04-25
WO2007062199A3 (en) 2007-12-27
JP4943448B2 (ja) 2012-05-30
CN101366110B (zh) 2011-04-13
CA2630807A1 (en) 2007-05-31
EP1955369A2 (en) 2008-08-13
CN101366110A (zh) 2009-02-11
US9011064B2 (en) 2015-04-21
US20070116551A1 (en) 2007-05-24
HK1125741A1 (en) 2009-08-14
WO2007062199A2 (en) 2007-05-31
JP2009517866A (ja) 2009-04-30

Similar Documents

Publication Publication Date Title
SG121162A1 (en) Apparatus and method for procesing a substrate
EP1962329A4 (en) SUBSTRATE SUPPORT DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
SG10201801998TA (en) Substrate holding device, exposure apparatus, and device manufacturing method
HK1110701A1 (en) Substrate holding apparatus, exposure apparatus and device manufacturing method
GB2462734B (en) Substrate inspection apparatus
GB2433916B (en) Method and apparatus for supporting and clamping a substrate
DK1828997T3 (da) Fremgangsmåde og indretning til modtagelse af elektroniske apparater
DK1809151T3 (da) Indretning og fremgangsmåde til opvarmning af en væske
HK1164542A1 (zh) 基板保持裝置、具備其之曝光裝置、元件製造方法
SG128607A1 (en) Method and apparatus for transporting a substrate using non-newtonian fluid
GB2416908B (en) Array substrate for lcd and fabrication method thereof
GB2445699B8 (en) Apparatus and method for finding a device
DK1789945T3 (da) A method for testing electronic devices
SG121045A1 (en) Method and device for packaging a substrate
DK1673979T3 (da) Fremgangsmåde og anordning til rengöring af en overtræksmaskine
EP1960530A4 (en) SYSTEM AND METHOD FOR SUPPORTING A BIOCHIP DEVICE
DE602005002860D1 (de) Vorrichtung zum Scannen von Wafern
EP1976806A4 (en) METHOD AND DEVICE FOR PROCESSING A SUBSTRATE
DK1955055T3 (da) Indretning og fremgangsmåde til at sikre rotation af en beholder under eftersyn
DK1955369T3 (da) Anordning og fremgangsmåde til at holde et substrat
NO322006B2 (no) Anordning og fremgangsmåte for brønnintervenering
TWI346829B (en) Inspection device for tft array substrate
DK1426293T3 (da) Fremgangsmåde og indretning til emballering af flade genstande
DE602006000340D1 (de) Ein Substratverarbeitungssystem und ein Substratverarbeitungsverfahren
DK1426294T3 (da) Fremgangsmåde og indretning til emballering af flade genstande