DE602005002860D1 - Vorrichtung zum Scannen von Wafern - Google Patents

Vorrichtung zum Scannen von Wafern

Info

Publication number
DE602005002860D1
DE602005002860D1 DE602005002860T DE602005002860T DE602005002860D1 DE 602005002860 D1 DE602005002860 D1 DE 602005002860D1 DE 602005002860 T DE602005002860 T DE 602005002860T DE 602005002860 T DE602005002860 T DE 602005002860T DE 602005002860 D1 DE602005002860 D1 DE 602005002860D1
Authority
DE
Germany
Prior art keywords
scanning wafers
wafers
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005002860T
Other languages
English (en)
Other versions
DE602005002860T2 (de
Inventor
Masahumi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ion Technology Co Ltd
Original Assignee
SEN Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEN Corp filed Critical SEN Corp
Publication of DE602005002860D1 publication Critical patent/DE602005002860D1/de
Application granted granted Critical
Publication of DE602005002860T2 publication Critical patent/DE602005002860T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C15/00—Pavings specially adapted for footpaths, sidewalks or cycle tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C2201/00—Paving elements
    • E01C2201/06—Sets of paving elements
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C5/00—Pavings made of prefabricated single units
    • E01C5/18—Pavings made of prefabricated single units made of rubber units

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE602005002860T 2004-03-31 2005-03-30 Vorrichtung zum Scannen von Wafern Active DE602005002860T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004103434 2004-03-31
JP2004103434A JP4560321B2 (ja) 2004-03-31 2004-03-31 ウエハスキャン装置

Publications (2)

Publication Number Publication Date
DE602005002860D1 true DE602005002860D1 (de) 2007-11-29
DE602005002860T2 DE602005002860T2 (de) 2008-04-10

Family

ID=34880031

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005002860T Active DE602005002860T2 (de) 2004-03-31 2005-03-30 Vorrichtung zum Scannen von Wafern

Country Status (6)

Country Link
US (1) US7217934B2 (de)
EP (1) EP1583133B1 (de)
JP (1) JP4560321B2 (de)
KR (1) KR101096862B1 (de)
DE (1) DE602005002860T2 (de)
TW (1) TWI428952B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100615587B1 (ko) * 2004-11-25 2006-08-25 삼성전자주식회사 이온주입장치의 패러데이 어셈블리
JP4795755B2 (ja) * 2005-08-25 2011-10-19 株式会社日立ハイテクノロジーズ 半導体基板の製造装置
JP2008107226A (ja) * 2006-10-26 2008-05-08 Jeol Ltd 試料作成装置
AT509608B1 (de) 2010-12-23 2011-10-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur kühlung von proben während einer einer ionenstrahlpräparation
JP5707286B2 (ja) * 2011-09-21 2015-04-30 株式会社日立ハイテクノロジーズ 荷電粒子線装置、荷電粒子線装置の調整方法、および試料の検査若しくは試料の観察方法。
WO2015079514A1 (ja) * 2013-11-27 2015-06-04 株式会社ニレコ エッジ位置検出センサ
US9415508B1 (en) * 2015-05-15 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Multi-link substrate scanning device
JP6509089B2 (ja) 2015-09-30 2019-05-08 住友重機械イオンテクノロジー株式会社 イオン注入装置
CN110646834A (zh) * 2018-06-26 2020-01-03 核工业西南物理研究院 应用于高真空装置的全密封精确定位调节机构
US11289311B2 (en) 2018-10-23 2022-03-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for reducing vacuum loss in an ion implantation system
KR20210024319A (ko) 2019-08-21 2021-03-05 삼성전자주식회사 웨이퍼 검사장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5746456A (en) * 1980-09-03 1982-03-16 Hitachi Ltd Ion injector
US4745287A (en) * 1986-10-23 1988-05-17 Ionex/Hei Ion implantation with variable implant angle
JPS63175326A (ja) * 1987-01-14 1988-07-19 Nissin Electric Co Ltd イオン処理装置
JPH01276557A (ja) * 1988-04-28 1989-11-07 Hitachi Ltd 真空装置
JPH0736416B2 (ja) * 1989-01-25 1995-04-19 日新電機株式会社 ウェーハ搬送装置
JP3264983B2 (ja) * 1992-06-09 2002-03-11 東京エレクトロン株式会社 イオン注入装置
US5406088A (en) * 1993-12-22 1995-04-11 Eaton Corporation Scan and tilt apparatus for an ion implanter
JPH0973873A (ja) * 1995-09-05 1997-03-18 Nissin Electric Co Ltd ホルダ駆動装置
JP3077605B2 (ja) * 1996-10-18 2000-08-14 日新電機株式会社 ホルダ駆動装置
JP3239779B2 (ja) * 1996-10-29 2001-12-17 日新電機株式会社 基板処理装置および基板処理方法
JPH10326590A (ja) * 1997-05-27 1998-12-08 Oki Electric Ind Co Ltd イオン注入用ウエハスキャン装置
JP3729604B2 (ja) * 1997-06-16 2005-12-21 住友イートンノバ株式会社 イオン注入装置
US5898179A (en) * 1997-09-10 1999-04-27 Orion Equipment, Inc. Method and apparatus for controlling a workpiece in a vacuum chamber
JPH11245189A (ja) * 1998-02-27 1999-09-14 Nippon Seiko Kk 多段スライド装置
JP3363375B2 (ja) * 1998-03-18 2003-01-08 東京エレクトロン株式会社 基板搬送装置および基板処理装置
KR100298587B1 (ko) * 1999-11-22 2001-11-05 윤종용 이온 주입 장치
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
JP5004052B2 (ja) * 2004-04-05 2012-08-22 アクセリス テクノロジーズ インコーポレーテッド イオンビームの中を通過してワークピースを往復移動させるための方法

Also Published As

Publication number Publication date
DE602005002860T2 (de) 2008-04-10
JP4560321B2 (ja) 2010-10-13
US7217934B2 (en) 2007-05-15
KR20060044679A (ko) 2006-05-16
TWI428952B (zh) 2014-03-01
EP1583133A2 (de) 2005-10-05
EP1583133A3 (de) 2006-07-26
EP1583133B1 (de) 2007-10-17
TW200537547A (en) 2005-11-16
JP2005294331A (ja) 2005-10-20
KR101096862B1 (ko) 2011-12-22
US20050218336A1 (en) 2005-10-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition