DK1921910T3 - Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort - Google Patents

Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort

Info

Publication number
DK1921910T3
DK1921910T3 DK07021365.7T DK07021365T DK1921910T3 DK 1921910 T3 DK1921910 T3 DK 1921910T3 DK 07021365 T DK07021365 T DK 07021365T DK 1921910 T3 DK1921910 T3 DK 1921910T3
Authority
DK
Denmark
Prior art keywords
combined
power module
circuit board
circuit
circuit arrangement
Prior art date
Application number
DK07021365.7T
Other languages
English (en)
Inventor
Marco Lederer
Rainer Popp
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1921910T3 publication Critical patent/DK1921910T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK07021365.7T 2006-11-08 2007-11-02 Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort DK1921910T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006052620A DE102006052620B4 (de) 2006-11-08 2006-11-08 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist.

Publications (1)

Publication Number Publication Date
DK1921910T3 true DK1921910T3 (da) 2012-10-29

Family

ID=39049020

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07021365.7T DK1921910T3 (da) 2006-11-08 2007-11-02 Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort

Country Status (7)

Country Link
US (1) US7821791B2 (da)
EP (1) EP1921910B1 (da)
JP (1) JP2008124455A (da)
KR (1) KR20080042006A (da)
CN (1) CN101179900B (da)
DE (1) DE102006052620B4 (da)
DK (1) DK1921910T3 (da)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006052620B4 (de) 2006-11-08 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist.
US8279640B2 (en) 2008-09-24 2012-10-02 Teco-Westinghouse Motor Company Modular multi-pulse transformer rectifier for use in symmetric multi-level power converter
US7830681B2 (en) 2008-09-24 2010-11-09 Teco-Westinghouse Motor Company Modular multi-pulse transformer rectifier for use in asymmetric multi-level power converter
US7940537B2 (en) * 2008-12-31 2011-05-10 Teco-Westinghouse Motor Company Partial regeneration in a multi-level power inverter
US8223515B2 (en) * 2009-02-26 2012-07-17 TECO—Westinghouse Motor Company Pre-charging an inverter using an auxiliary winding
US8575479B2 (en) 2009-06-30 2013-11-05 TECO—Westinghouse Motor Company Providing a transformer for an inverter
US8976526B2 (en) 2009-06-30 2015-03-10 Teco-Westinghouse Motor Company Providing a cooling system for a medium voltage drive system
US8130501B2 (en) 2009-06-30 2012-03-06 Teco-Westinghouse Motor Company Pluggable power cell for an inverter
US8254076B2 (en) 2009-06-30 2012-08-28 Teco-Westinghouse Motor Company Providing modular power conversion
US8711530B2 (en) * 2009-06-30 2014-04-29 Teco-Westinghouse Motor Company Pluggable power cell for an inverter
US8601190B2 (en) 2011-06-24 2013-12-03 Teco-Westinghouse Motor Company Providing multiple communication protocols for a control system having a master controller and a slave controller
US9363930B2 (en) 2013-03-11 2016-06-07 Teco-Westinghouse Motor Company Passive two phase cooling solution for low, medium and high voltage drive systems
DE102013212446A1 (de) * 2013-06-27 2015-01-15 Zf Friedrichshafen Ag Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung zur Ansteuerung einer Last
US9153374B2 (en) 2013-06-28 2015-10-06 Teco-Westinghouse Motor Company Cooling arrangements for drive systems
US9368905B2 (en) 2014-07-22 2016-06-14 Cooper Technologies Company Potting compound chamber designs for electrical connectors
US9516794B2 (en) * 2014-10-31 2016-12-06 Transistor Devices, Inc. Modular scalable liquid cooled power system
CA3013026C (en) 2015-11-06 2024-01-02 Eaton Intelligent Power Limited Potting compound chamber designs for electrical connectors
DE102022123895B4 (de) 2022-09-19 2024-07-18 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zum Fügen einer Modulbank und Treiberplatine zu einer Leistungszelle

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702224B2 (ja) * 1989-05-22 1998-01-21 マツダ株式会社 金属基板を有する集積回路
DE19630173C2 (de) * 1996-07-26 2001-02-08 Semikron Elektronik Gmbh Leistungsmodul mit Halbleiterbauelementen
DE19942770A1 (de) * 1999-09-08 2001-03-15 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
JP3476142B2 (ja) * 2001-05-24 2003-12-10 日本電気株式会社 結露防止構造を備えた電子デバイス
US6417747B1 (en) * 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
DE10249205B3 (de) * 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
DE10306643B4 (de) * 2003-02-18 2005-08-25 Semikron Elektronik Gmbh Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
JP4186826B2 (ja) * 2004-01-28 2008-11-26 株式会社デンソー プリント基板の取り付け構造
DE102004018476B4 (de) * 2004-04-16 2009-06-18 Infineon Technologies Ag Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung
DE102004021122B4 (de) 2004-04-29 2007-10-11 Semikron Elektronik Gmbh & Co. Kg Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
DE102005024900B4 (de) 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. Leistungsmodul
DE102006006424B4 (de) * 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
DE102006006423B4 (de) * 2006-02-13 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und zugehöriges Herstellungsverfahren
DE102006006425B4 (de) * 2006-02-13 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
DE102006021412B3 (de) * 2006-05-09 2007-11-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE102006052620B4 (de) 2006-11-08 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist.

Also Published As

Publication number Publication date
US20090021922A1 (en) 2009-01-22
KR20080042006A (ko) 2008-05-14
JP2008124455A (ja) 2008-05-29
CN101179900A (zh) 2008-05-14
US7821791B2 (en) 2010-10-26
DE102006052620A1 (de) 2008-05-15
DE102006052620B4 (de) 2009-07-09
EP1921910B1 (de) 2012-08-08
EP1921910A3 (de) 2009-11-25
CN101179900B (zh) 2011-04-20
EP1921910A2 (de) 2008-05-14

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