DK0780485T3 - Fremgangsmåde og indretning til at dekapere et metalsubstrat - Google Patents

Fremgangsmåde og indretning til at dekapere et metalsubstrat

Info

Publication number
DK0780485T3
DK0780485T3 DK96203581T DK96203581T DK0780485T3 DK 0780485 T3 DK0780485 T3 DK 0780485T3 DK 96203581 T DK96203581 T DK 96203581T DK 96203581 T DK96203581 T DK 96203581T DK 0780485 T3 DK0780485 T3 DK 0780485T3
Authority
DK
Denmark
Prior art keywords
metal substrate
decapitating
plasma
hydrogen
substrate cleaning
Prior art date
Application number
DK96203581T
Other languages
Danish (da)
English (en)
Inventor
Brande Pierre Vanden
Alain Weymeersch
Stephane Lucas
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Application granted granted Critical
Publication of DK0780485T3 publication Critical patent/DK0780485T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DK96203581T 1995-12-20 1996-12-17 Fremgangsmåde og indretning til at dekapere et metalsubstrat DK0780485T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9501053A BE1009839A3 (fr) 1995-12-20 1995-12-20 Procede et dispositif pour le nettoyage d'un substrat metallique.

Publications (1)

Publication Number Publication Date
DK0780485T3 true DK0780485T3 (da) 2001-01-08

Family

ID=3889363

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96203581T DK0780485T3 (da) 1995-12-20 1996-12-17 Fremgangsmåde og indretning til at dekapere et metalsubstrat

Country Status (8)

Country Link
EP (1) EP0780485B1 (es)
AT (1) ATE195982T1 (es)
BE (1) BE1009839A3 (es)
DE (1) DE69610064T2 (es)
DK (1) DK0780485T3 (es)
ES (1) ES2151633T3 (es)
GR (1) GR3034871T3 (es)
PT (1) PT780485E (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726829B2 (en) * 1997-04-08 2004-04-27 Scimed Life Systems, Inc. Method of manufacturing a stent
DE19753684C1 (de) * 1997-12-03 1999-06-17 Fraunhofer Ges Forschung Einrichtung zur Behandlung von Werkstücken in einem Niederdruck-Plasma
FR2774400B1 (fr) * 1998-02-04 2000-04-28 Physiques Et Chimiques Dispositif electrique pour degraissage, decapage ou passivation plasmachimique de metaux
FR2775986B1 (fr) * 1998-03-10 2000-05-05 Air Liquide Procede et installation de traitement de surface d'une piece metallique
US20010049181A1 (en) * 1998-11-17 2001-12-06 Sudha Rathi Plasma treatment for cooper oxide reduction
US6355571B1 (en) 1998-11-17 2002-03-12 Applied Materials, Inc. Method and apparatus for reducing copper oxidation and contamination in a semiconductor device
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
WO2004074932A2 (en) 2003-02-14 2004-09-02 Applied Materials, Inc. Method and apparatus for cleaning of native oxides with hydroge-containing radicals
DE102009022515B4 (de) 2009-05-25 2015-07-02 Thyssenkrupp Steel Europe Ag Verfahren zum Herstellen eines Stahlflachprodukts und Stahlflachprodukt
CN111041447A (zh) * 2019-12-30 2020-04-21 河海大学常州校区 一种金属微结构的制备方法
EP4084040A1 (en) 2021-04-29 2022-11-02 voestalpine Stahl GmbH Method and devices for plasma treatment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD136047A1 (de) * 1978-02-22 1979-06-13 Karl Steinfelder Einrichtung zur vorbehandlung von metallband zur vakuumbeschichtung
JPS5779169A (en) * 1980-11-06 1982-05-18 Sumitomo Electric Ind Ltd Physical vapor deposition method
JPS60174873A (ja) * 1984-02-20 1985-09-09 Hitachi Cable Ltd 蒸着用金属基板の前処理方法
JPH0768620B2 (ja) * 1991-09-30 1995-07-26 中外炉工業株式会社 金属ストリップの表面清浄化装置
FR2708290B1 (fr) * 1993-07-27 1995-10-20 Lorraine Laminage Traitement de surface d'une tôle d'acier galvanisée à chaud avant sa mise en peinture.

Also Published As

Publication number Publication date
ATE195982T1 (de) 2000-09-15
DE69610064D1 (de) 2000-10-05
GR3034871T3 (en) 2001-02-28
EP0780485A1 (fr) 1997-06-25
ES2151633T3 (es) 2001-01-01
EP0780485B1 (fr) 2000-08-30
PT780485E (pt) 2001-01-31
DE69610064T2 (de) 2001-05-03
BE1009839A3 (fr) 1997-10-07

Similar Documents

Publication Publication Date Title
EP0456479A3 (en) Pattern forming process, apparatus for forming said pattern and process for preparing semiconductor device utilizing said pattern forming process
TW429395B (en) Microchamber
GB9322966D0 (en) Method for making a semiconductor and apparatus for the same
MY123121A (en) A cleaning apparatus and a cleaning method
KR900014636A (ko) 시료처리 방법 및 장치
ATE224584T1 (de) Verfahren und vorrichtung zur reinigung eines plasmareaktors
DK0780485T3 (da) Fremgangsmåde og indretning til at dekapere et metalsubstrat
SG171468A1 (en) Exposure apparatus and method for producing device
ATE148507T1 (de) Vorrichtung und verfahren zum beschichten von substraten mittels plasmaentladung
TW469534B (en) Plasma processing method and apparatus
TW200618104A (en) Post-etch treatment to remove residues
ATE233430T1 (de) Reaktor und verfahren zum behandlung eines halbleitersubstrats
ATE506687T1 (de) Antenne zur erzeugung gleichförmiger prozessraten
MX9709688A (es) Eliminacion de material por medio de radiacion polarizada y aplicacion de radiacion en la parte posterior.
IL132165A (en) Article, method, and apparatus for electrochemical fabrication
AU2003296050A1 (en) Method and apparatus for treating a substrate
TW200501254A (en) Method for removing silicon oxide film and processing apparatus
ES2117775T3 (es) Procedimiento y dispositivo de tratamiento con fundente, por via seca, de superficies metalicas antes de la soldadura o estañado.
EP1324374A3 (en) Etching System for an insulation-film
DE60142685D1 (de) Verfahren zur ätzung von polysilizium mit einer verbesserten homogenität und einer reduzierten ätzratevariation
WO2003010809A1 (fr) Dispositif de traitement au plasma et table de montage de substrat
DE59801367D1 (de) Verfahren und Vorrichtung zum einseitigen Bearbeiten scheibenförmiger Gegenstände
ATE334235T1 (de) Verfahren zum plasmareinigen von mit einer organischen substanz beschichteten materialoberflächen und vorrichtung dafür
DE59812719D1 (de) Verfahren und vorrichtung zur oberflächenbehandlung von substraten
TW358965B (en) Method and apparatus for manufacturing semiconductor devices