ES2151633T3 - Procedimiento y dispositivo para el decapado de un substrato metalico. - Google Patents

Procedimiento y dispositivo para el decapado de un substrato metalico.

Info

Publication number
ES2151633T3
ES2151633T3 ES96203581T ES96203581T ES2151633T3 ES 2151633 T3 ES2151633 T3 ES 2151633T3 ES 96203581 T ES96203581 T ES 96203581T ES 96203581 T ES96203581 T ES 96203581T ES 2151633 T3 ES2151633 T3 ES 2151633T3
Authority
ES
Spain
Prior art keywords
metal substrate
decaping
procedure
plasma
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96203581T
Other languages
English (en)
Inventor
Brande Pierre Vanden
Stephane Lucas
Alain Weymeersch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ArcelorMittal Liege Upstream SA
Original Assignee
Cockerill Sambre SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Sambre SA filed Critical Cockerill Sambre SA
Application granted granted Critical
Publication of ES2151633T3 publication Critical patent/ES2151633T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROCEDIMIENTO Y DISPOSITIVO PARA EL DECAPADO DE UN SUSTRATO METALICO QUE COSISTE EN CREAR CERCA DE LA SUPERFICIE (3) DEL SUSTRATO (4) A LIMPIAR UN PLASMA (2) EN UNA MEZCLA DE HIDROGENO, DE COMPUESTOS HIDROGENADOS Y/O DE UN GAS INERTE, TAL COMO ARGON, DE MANERA A GENERAR RADICALES Y/O IONES, ESTANDO ESTE SUSTRATO (4) POLARIZADO NEGATIVAMENTE RESPECTO A UN ANODO DISPUESTO ENFRENTE DE LA SUPERFICIE A DECAPAR (3) QUE PERMITE ASI A LOS RADICALES Y/O IONES ACTUAR SOBRE ESTA ULTIMA.
ES96203581T 1995-12-20 1996-12-17 Procedimiento y dispositivo para el decapado de un substrato metalico. Expired - Lifetime ES2151633T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9501053A BE1009839A3 (fr) 1995-12-20 1995-12-20 Procede et dispositif pour le nettoyage d'un substrat metallique.

Publications (1)

Publication Number Publication Date
ES2151633T3 true ES2151633T3 (es) 2001-01-01

Family

ID=3889363

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96203581T Expired - Lifetime ES2151633T3 (es) 1995-12-20 1996-12-17 Procedimiento y dispositivo para el decapado de un substrato metalico.

Country Status (8)

Country Link
EP (1) EP0780485B1 (es)
AT (1) ATE195982T1 (es)
BE (1) BE1009839A3 (es)
DE (1) DE69610064T2 (es)
DK (1) DK0780485T3 (es)
ES (1) ES2151633T3 (es)
GR (1) GR3034871T3 (es)
PT (1) PT780485E (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726829B2 (en) * 1997-04-08 2004-04-27 Scimed Life Systems, Inc. Method of manufacturing a stent
DE19753684C1 (de) * 1997-12-03 1999-06-17 Fraunhofer Ges Forschung Einrichtung zur Behandlung von Werkstücken in einem Niederdruck-Plasma
FR2774400B1 (fr) * 1998-02-04 2000-04-28 Physiques Et Chimiques Dispositif electrique pour degraissage, decapage ou passivation plasmachimique de metaux
FR2775986B1 (fr) * 1998-03-10 2000-05-05 Air Liquide Procede et installation de traitement de surface d'une piece metallique
US20010049181A1 (en) * 1998-11-17 2001-12-06 Sudha Rathi Plasma treatment for cooper oxide reduction
US6355571B1 (en) 1998-11-17 2002-03-12 Applied Materials, Inc. Method and apparatus for reducing copper oxidation and contamination in a semiconductor device
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
WO2004074932A2 (en) 2003-02-14 2004-09-02 Applied Materials, Inc. Method and apparatus for cleaning of native oxides with hydroge-containing radicals
DE102009022515B4 (de) 2009-05-25 2015-07-02 Thyssenkrupp Steel Europe Ag Verfahren zum Herstellen eines Stahlflachprodukts und Stahlflachprodukt
CN111041447A (zh) * 2019-12-30 2020-04-21 河海大学常州校区 一种金属微结构的制备方法
EP4084040A1 (en) 2021-04-29 2022-11-02 voestalpine Stahl GmbH Method and devices for plasma treatment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD136047A1 (de) * 1978-02-22 1979-06-13 Karl Steinfelder Einrichtung zur vorbehandlung von metallband zur vakuumbeschichtung
JPS5779169A (en) * 1980-11-06 1982-05-18 Sumitomo Electric Ind Ltd Physical vapor deposition method
JPS60174873A (ja) * 1984-02-20 1985-09-09 Hitachi Cable Ltd 蒸着用金属基板の前処理方法
JPH0768620B2 (ja) * 1991-09-30 1995-07-26 中外炉工業株式会社 金属ストリップの表面清浄化装置
FR2708290B1 (fr) * 1993-07-27 1995-10-20 Lorraine Laminage Traitement de surface d'une tôle d'acier galvanisée à chaud avant sa mise en peinture.

Also Published As

Publication number Publication date
ATE195982T1 (de) 2000-09-15
DE69610064D1 (de) 2000-10-05
GR3034871T3 (en) 2001-02-28
EP0780485A1 (fr) 1997-06-25
DK0780485T3 (da) 2001-01-08
EP0780485B1 (fr) 2000-08-30
PT780485E (pt) 2001-01-31
DE69610064T2 (de) 2001-05-03
BE1009839A3 (fr) 1997-10-07

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