DE69933380D1 - Hermetische In-Situ-Gehäusungsmethode von Mikrosystemen - Google Patents
Hermetische In-Situ-Gehäusungsmethode von MikrosystemenInfo
- Publication number
- DE69933380D1 DE69933380D1 DE69933380T DE69933380T DE69933380D1 DE 69933380 D1 DE69933380 D1 DE 69933380D1 DE 69933380 T DE69933380 T DE 69933380T DE 69933380 T DE69933380 T DE 69933380T DE 69933380 D1 DE69933380 D1 DE 69933380D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- microsystem
- metal
- metal layer
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000011065 in-situ storage Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 11
- 229910052751 metal Inorganic materials 0.000 abstract 11
- 239000002775 capsule Substances 0.000 abstract 1
- 238000003486 chemical etching Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99125008A EP1108677B1 (de) | 1999-12-15 | 1999-12-15 | Hermetische In-Situ-Gehäusungsmethode von Mikrosystemen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933380D1 true DE69933380D1 (de) | 2006-11-09 |
DE69933380T2 DE69933380T2 (de) | 2007-08-02 |
Family
ID=8239618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933380T Expired - Lifetime DE69933380T2 (de) | 1999-12-15 | 1999-12-15 | Verfahren zum hermetischen Einkapseln von Mikrosystemen vor Ort |
Country Status (7)
Country | Link |
---|---|
US (1) | US6454160B2 (de) |
EP (1) | EP1108677B1 (de) |
JP (1) | JP4777510B2 (de) |
KR (1) | KR100658264B1 (de) |
CN (1) | CN1262468C (de) |
AT (1) | ATE340761T1 (de) |
DE (1) | DE69933380T2 (de) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6798931B2 (en) * | 2001-03-06 | 2004-09-28 | Digital Optics Corp. | Separating of optical integrated modules and structures formed thereby |
US20020185712A1 (en) * | 2001-06-08 | 2002-12-12 | Brian Stark | Circuit encapsulation technique utilizing electroplating |
US6771859B2 (en) * | 2001-07-24 | 2004-08-03 | 3M Innovative Properties Company | Self-aligning optical micro-mechanical device package |
US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
US6798954B2 (en) | 2001-07-24 | 2004-09-28 | 3M Innovative Properties Company | Packaged optical micro-mechanical device |
DE10200869A1 (de) * | 2002-01-11 | 2003-07-31 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
US20030183916A1 (en) * | 2002-03-27 | 2003-10-02 | John Heck | Packaging microelectromechanical systems |
JP2005537661A (ja) * | 2002-08-28 | 2005-12-08 | シリコン・ライト・マシーンズ・コーポレーション | 非シリコン系素子のウエハー段階でのシール |
US20050250253A1 (en) * | 2002-10-23 | 2005-11-10 | Cheung Kin P | Processes for hermetically packaging wafer level microscopic structures |
AU2003286572A1 (en) * | 2002-10-23 | 2004-05-13 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
US20050189621A1 (en) * | 2002-12-02 | 2005-09-01 | Cheung Kin P. | Processes for hermetically packaging wafer level microscopic structures |
DE10256116B4 (de) | 2002-11-29 | 2005-12-22 | Infineon Technologies Ag | Elektronisches Bauteil und Verfahren zur Herstellung desselben |
US20040166606A1 (en) * | 2003-02-26 | 2004-08-26 | David Forehand | Low temperature wafer-level micro-encapsulation |
DE10316777B4 (de) * | 2003-04-11 | 2005-11-24 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
TWI251712B (en) * | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
TW593127B (en) * | 2003-08-18 | 2004-06-21 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
DE10353767B4 (de) * | 2003-11-17 | 2005-09-29 | Infineon Technologies Ag | Vorrichtung zur Häusung einer mikromechanischen Struktur und Verfahren zur Herstellung derselben |
US6946728B2 (en) * | 2004-02-19 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | System and methods for hermetic sealing of post media-filled MEMS package |
KR100575363B1 (ko) * | 2004-04-13 | 2006-05-03 | 재단법인서울대학교산학협력재단 | 미소기계소자의 진공 실장방법 및 이 방법에 의해 진공실장된 미소기계소자 |
US8124434B2 (en) | 2004-09-27 | 2012-02-28 | Qualcomm Mems Technologies, Inc. | Method and system for packaging a display |
US7368803B2 (en) * | 2004-09-27 | 2008-05-06 | Idc, Llc | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
US7424198B2 (en) | 2004-09-27 | 2008-09-09 | Idc, Llc | Method and device for packaging a substrate |
US7573547B2 (en) | 2004-09-27 | 2009-08-11 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
US7668415B2 (en) * | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
US7701631B2 (en) | 2004-09-27 | 2010-04-20 | Qualcomm Mems Technologies, Inc. | Device having patterned spacers for backplates and method of making the same |
US7184202B2 (en) * | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
US7344907B2 (en) * | 2004-11-19 | 2008-03-18 | International Business Machines Corporation | Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale |
WO2006081636A1 (en) * | 2005-02-04 | 2006-08-10 | Interuniversitair Microelektronica Centrum (Imec) | Method for encapsulating a device in a microcavity |
JP5014589B2 (ja) * | 2005-05-19 | 2012-08-29 | ローム株式会社 | Memsパッケージ |
JP5008834B2 (ja) * | 2005-05-19 | 2012-08-22 | ローム株式会社 | Mems素子およびその製造方法 |
JP4791766B2 (ja) * | 2005-05-30 | 2011-10-12 | 株式会社東芝 | Mems技術を使用した半導体装置 |
US20060273065A1 (en) * | 2005-06-02 | 2006-12-07 | The Regents Of The University Of California | Method for forming free standing microstructures |
FR2888832B1 (fr) * | 2005-07-22 | 2007-08-24 | Commissariat Energie Atomique | Conditionnement d'un composant electronique |
CN100422071C (zh) * | 2005-10-27 | 2008-10-01 | 中国科学院上海微***与信息技术研究所 | 微机械加速度计器件的圆片级封装工艺 |
DE102005053722B4 (de) | 2005-11-10 | 2007-08-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile |
CN100445195C (zh) * | 2006-01-13 | 2008-12-24 | 中国科学院上海微***与信息技术研究所 | 一种圆片级微机械器件或光电器件的低温气密性封装方法 |
FR2897503B1 (fr) * | 2006-02-16 | 2014-06-06 | Valeo Sys Controle Moteur Sas | Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante |
CN100434354C (zh) * | 2006-04-07 | 2008-11-19 | 美新半导体(无锡)有限公司 | 具有y形通孔的圆片级气密性封装工艺 |
WO2007120885A2 (en) | 2006-04-13 | 2007-10-25 | Qualcomm Mems Technologies, Inc. | Mems devices and processes for packaging such devices |
DE102006031772A1 (de) | 2006-07-10 | 2008-01-17 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Sensorelements sowie Sensorelement |
FR2903678B1 (fr) * | 2006-07-13 | 2008-10-24 | Commissariat Energie Atomique | Microcomposant encapsule equipe d'au moins un getter |
US20080042223A1 (en) * | 2006-08-17 | 2008-02-21 | Lu-Lee Liao | Microelectromechanical system package and method for making the same |
US20080075308A1 (en) * | 2006-08-30 | 2008-03-27 | Wen-Chieh Wei | Silicon condenser microphone |
US20080083957A1 (en) * | 2006-10-05 | 2008-04-10 | Wen-Chieh Wei | Micro-electromechanical system package |
US7894622B2 (en) | 2006-10-13 | 2011-02-22 | Merry Electronics Co., Ltd. | Microphone |
US8007286B1 (en) | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US8143631B2 (en) | 2008-03-06 | 2012-03-27 | Metrospec Technology Llc | Layered structure for use with high power light emitting diode systems |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US8410720B2 (en) | 2008-04-07 | 2013-04-02 | Metrospec Technology, LLC. | Solid state lighting circuit and controls |
US20090323170A1 (en) * | 2008-06-30 | 2009-12-31 | Qualcomm Mems Technologies, Inc. | Groove on cover plate or substrate |
US7875482B2 (en) * | 2009-03-19 | 2011-01-25 | Robert Bosch Gmbh | Substrate with multiple encapsulated pressures |
US8379392B2 (en) | 2009-10-23 | 2013-02-19 | Qualcomm Mems Technologies, Inc. | Light-based sealing and device packaging |
FR2955999B1 (fr) * | 2010-02-04 | 2012-04-20 | Commissariat Energie Atomique | Procede d'encapsulation d'un microcomposant par un capot renforce mecaniquement |
JP5204171B2 (ja) * | 2010-08-25 | 2013-06-05 | 株式会社東芝 | 電気部品およびその製造方法 |
FR2970111B1 (fr) | 2011-01-03 | 2013-01-11 | Commissariat Energie Atomique | Procede de fabrication d'un micro-contacteur actionnable par un champ magnetique |
CN102738093A (zh) * | 2011-04-06 | 2012-10-17 | 苏州文迪光电科技有限公司 | 陶瓷基片 |
CN102303842A (zh) * | 2011-08-15 | 2012-01-04 | 上海先进半导体制造股份有限公司 | 与半导体工艺兼容的盖板预封装方法 |
DE102011112476A1 (de) * | 2011-09-05 | 2013-03-07 | Epcos Ag | Bauelement und Verfahren zum Herstellen eines Bauelements |
EP2597067A1 (de) * | 2011-11-23 | 2013-05-29 | Micro Crystal AG | Herstellungsverfahren einer Vorrichtung zur Verkapselung |
SE537584C2 (sv) * | 2011-12-15 | 2015-06-30 | Silex Microsystems Ab | Tunnfilmskapsling |
CN103072941B (zh) * | 2013-01-14 | 2015-09-23 | 北京大学 | 基于表面牺牲层工艺的mems器件自封装制备方法 |
US10196745B2 (en) | 2014-10-31 | 2019-02-05 | General Electric Company | Lid and method for sealing a non-magnetic package |
US10131540B2 (en) | 2015-03-12 | 2018-11-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications |
AU2015387246B2 (en) * | 2015-03-16 | 2019-01-31 | Halliburton Energy Services, Inc. | Geometric shaping of radio-frequency tags used in wellbore cementing operations |
DE102017125140B4 (de) * | 2017-10-26 | 2021-06-10 | Infineon Technologies Ag | Verfahren zum Herstellen eines hermetisch abgedichteten Gehäuses mit einem Halbleiterbauteil |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
US11626343B2 (en) * | 2018-10-30 | 2023-04-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with enhanced thermal dissipation and method for making the same |
CN111792621B (zh) * | 2020-07-06 | 2024-04-16 | 中国科学院上海微***与信息技术研究所 | 一种圆片级薄膜封装方法及封装器件 |
Family Cites Families (23)
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US4696851A (en) * | 1985-03-25 | 1987-09-29 | Olin Corporation | Hybrid and multi-layer circuitry |
US4727633A (en) * | 1985-08-08 | 1988-03-01 | Tektronix, Inc. | Method of securing metallic members together |
US4661886A (en) * | 1985-10-03 | 1987-04-28 | Burroughs Corporation | Magnetically sealed multichip integrated circuit package |
US5829128A (en) * | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
JP2631287B2 (ja) * | 1987-06-30 | 1997-07-16 | 日本メクトロン 株式会社 | 混成多層回路基板の製造法 |
US5196377A (en) * | 1990-12-20 | 1993-03-23 | Cray Research, Inc. | Method of fabricating silicon-based carriers |
US5336928A (en) * | 1992-09-18 | 1994-08-09 | General Electric Company | Hermetically sealed packaged electronic system |
DE69333551T2 (de) * | 1993-02-04 | 2005-06-23 | Cornell Research Foundation, Inc. | Einzelmaskenprozess zum Herstellen von Mikrostrukturen, Einkristallherstellungsverfahren |
US5651900A (en) * | 1994-03-07 | 1997-07-29 | The Regents Of The University Of California | Microfabricated particle filter |
US5548099A (en) * | 1994-09-13 | 1996-08-20 | Martin Marietta Corporation | Method for making an electronics module having air bridge protection without large area ablation |
US5535296A (en) * | 1994-09-28 | 1996-07-09 | Optobahn Corporation | Integrated optoelectronic coupling and connector |
WO2004100260A1 (ja) * | 1995-05-19 | 2004-11-18 | Kouta Noda | 高密度多層プリント配線版、マルチチップキャリア及び半導体パッケージ |
JPH09148467A (ja) * | 1995-11-24 | 1997-06-06 | Murata Mfg Co Ltd | 動作素子の真空封止の構造およびその製造方法 |
US5832585A (en) * | 1996-08-13 | 1998-11-10 | National Semiconductor Corporation | Method of separating micro-devices formed on a substrate |
US5863812A (en) * | 1996-09-19 | 1999-01-26 | Vlsi Technology, Inc. | Process for manufacturing a multi layer bumped semiconductor device |
JP3959763B2 (ja) * | 1996-11-19 | 2007-08-15 | Tdk株式会社 | 微小機械素子の製造方法 |
JPH10148643A (ja) * | 1996-11-19 | 1998-06-02 | Tdk Corp | 加速度センサ及びその製造方法 |
FR2770339B1 (fr) * | 1997-10-27 | 2003-06-13 | Commissariat Energie Atomique | Structure munie de contacts electriques formes a travers le substrat de cette structure et procede d'obtention d'une telle structure |
TW421980B (en) * | 1997-12-22 | 2001-02-11 | Citizen Watch Co Ltd | Electronic component device, its manufacturing process, and collective circuits |
US6164837A (en) * | 1998-12-30 | 2000-12-26 | Mcdonnell Douglas Corporation | Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing |
US6300168B1 (en) * | 1999-01-07 | 2001-10-09 | Sony Corp | Method of manufacturing a semiconductor device |
US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
US6356686B1 (en) * | 1999-09-03 | 2002-03-12 | International Business Machines Corporation | Optoelectronic device encapsulant |
-
1999
- 1999-12-15 DE DE69933380T patent/DE69933380T2/de not_active Expired - Lifetime
- 1999-12-15 EP EP99125008A patent/EP1108677B1/de not_active Expired - Lifetime
- 1999-12-15 AT AT99125008T patent/ATE340761T1/de not_active IP Right Cessation
-
2000
- 2000-11-30 US US09/726,015 patent/US6454160B2/en not_active Expired - Lifetime
- 2000-12-12 KR KR1020000075400A patent/KR100658264B1/ko not_active IP Right Cessation
- 2000-12-15 JP JP2000381733A patent/JP4777510B2/ja not_active Expired - Fee Related
- 2000-12-15 CN CNB001356712A patent/CN1262468C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE340761T1 (de) | 2006-10-15 |
KR20010077941A (ko) | 2001-08-20 |
US20010004085A1 (en) | 2001-06-21 |
CN1305944A (zh) | 2001-08-01 |
CN1262468C (zh) | 2006-07-05 |
EP1108677B1 (de) | 2006-09-27 |
JP4777510B2 (ja) | 2011-09-21 |
KR100658264B1 (ko) | 2006-12-14 |
EP1108677A1 (de) | 2001-06-20 |
JP2001237334A (ja) | 2001-08-31 |
DE69933380T2 (de) | 2007-08-02 |
US6454160B2 (en) | 2002-09-24 |
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